1
®
FN3980.18
HIN202, HIN206, HIN207,
HIN208, HIN211, HIN213
+5V Powered RS-232
T ransmitters/Receivers with 0.1Microfarad
External Capacitors
The HIN202, HIN206, HIN207, HIN208 , HIN211, HIN213
family of RS-232 transmitters/receivers interface circuits
meet all ElA RS-232E and V.28 specifications, and are
particularly suited fo r those applications where ±12V is not
available. They require a single +5V power supply and
f eature onboard charge pump voltage converters which
generate +10V and -10V supplies from the 5V supply. The
famil y of devices offers a wide variety of RS-232
transmitter/receiver combinations to accommodate various
applications (see Selection Table).
The HIN206, HIN211 and HIN213 feature a low power
shutdown mode to conserve energy in battery powered
applications. In addition, the HIN213 provides two active
receivers in shutdown mode allowing for easy “wakeup”
capability.
The drivers feature true TTL/CMOS input compatibility, slew
rate-limited output, and 300Ω power-off source impedance.
The receivers can handle up to ±30V input, and have a 3kΩ
to 7kΩ input impedance. The receivers also feature
hysteresis to greatly improve noise rejection.
Applications
• Any System Requiring RS-232 Communications Port
- Computer - Portable, Mainframe, Laptop
- Peripheral - Printers and Terminals
- Instrumentation
- Modems
Features
• Pb-Free Plus Anneal Available (RoHS Compliant)
(See Ordering Info)
• Meets All RS-232E and V.28 Specifications
• Requires Only 0.1µF or Greater External Capacitors
• High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . .120kbit/s
• Two Receivers Active in Shutdown Mode (HIN213)
• Requires Only Single +5V Power Supply
• Onboard Voltage Doubler/Inverter
• Low Power Consumption (Typ) . . . . . . . . . . . . . . . . . 5mA
• Low Power Shutdown Function (Typ) . . . . . . . . . . . . .1µA
• Three-State TTL/CMOS Receiver Outputs
• Multiple Drivers
-±10V Output Swing for +5V lnput
-300Ω Power-Off Source Impedance
- Output Current Limiting
- TTL/CMOS Compatible
-30V/µs Maximum Slew Rate
• Multiple Receivers
-±30V Input Voltage Range
-3kΩ to 7kΩ Input Impedance
- 0.5V Hysteresis to Imp rove Noise Rejection
Selection Table
PART
NUMBER POWER SUPPLY
VOLTAGE
NUMBER OF
RS-232
DRIVERS
NUMBER OF
RS-232
RECEIVERS
NUMBER OF
0.1µF
EXTERNAL
CAPACITORS
LOW POWER
SHUTDOWN/TTL
THREE-STATE
NUMBER OF
RECEIVERS
ACTIVE IN
SHUTDOWN
HIN202 +5V 2 2 4 Capacitors No/No 0
HIN206 +5V 4 3 4 Capacitors Yes/Yes 0
HIN207 +5V 5 3 4 Capacitors No/No 0
HIN208 +5V 4 4 4 Capacitors No/No 0
HIN211 +5V 4 5 4 Capacitors Yes/Yes 0
HIN213 +5V 4 5 4 Capacitors Yes/Yes 2
Data Sheet July 27, 2005
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2001-2005. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
2
Ordering Information
PART NO. TEMP.
RANGE (°C) PACKAGE PKG.
DWG. #
HIN202CB 0 to 70 16 Ld SOIC (W) M16.3
HIN202CB-T 0 to 70 16 Ld SOIC (W)
Tape and Reel M16.3
HIN202CBZ
(See Note)
0 to 70 16 Ld SOIC (W)
(Pb-free)
M16.3
HIN202CBZ-T
(See Note)
0 to 70 16 Ld SOIC (W)
Tape and Reel
(Pb-free)
M16.3
HIN202CBN 0 to 70 16 Ld SOIC (N) M16.15
HIN202CBN-T 0 to 70 16 Ld SOIC (N)
Tape and Reel M16.15
HIN202CBNZ
(See Note)
0 to 70 16 Ld SOIC (N)
(Pb-free)
M16.15
HIN202CBNZ-T
(See Note) 0 to 70 16 Ld SOIC (N)
Tape and Reel
(Pb-free)
M16.15
HIN202CP 0 to 70 16 Ld PDIP E16.3
HIN202IB -40 to 85 16 Ld SOIC (W) M16.3
HIN202IBZ
(See Note) -40 to 85 16 Ld SOIC (W)
(Pb-free) M16.3
HIN202IBN -40 to 85 16 Ld SOIC (N) M16.15
HIN202IBN-T -40 to 85 16 Ld SOIC (N)
Tape and Reel M16.15
HIN202IBNZ
(See Note) -40 to 85 16 Ld SOIC (N)
(Pb-free) M16.15
HIN202IBNZ-T
(See Note) -40 to 85 16 Ld SOIC (N)
Tape and Reel
(Pb-free)
M16.15
HIN206CB 0 to 70 24 Ld SOIC M24.3
HIN207CA 0 to 70 24 Ld SSOP M24.209
HIN207CAZ
(See Note) 0 to 70 24 Ld SSOP
(Pb-free) M24.209
HIN207CAZ-T
(See Note) 0 to 70 24 Ld SSOP
Tape and Reel
(Pb-free)
M24.209
HIN207CB 0 to 70 24 Ld SOIC M24.3
HIN207CB-T 0 to 70 24 Ld SOIC
Tape and Reel M24.3
HIN208CB 0 to 70 24 Ld SOIC M24.3
HIN208CB-T 0 to 70 24 Ld SOIC
Tape and Reel M24.3
HIN208CBZ
(See Note) 0 to 70 24 Ld SOIC
(Pb-free) M24.3
HIN208CBZ-T
(See Note) 0 to 70 24 Ld SOIC
Tape and Reel
(Pb-free)
M24.3
HIN211CA 0 to 70 28 Ld SSOP M28.209
HIN211CA-T 0 to 70 28 Ld SSOP
Tape and Reel M28.209
HIN211CAZ
(See Note) 0 to 70 28 Ld SSOP
(Pb-free) M28.209
HIN211CAZ-T
(See Note) 0 to 70 28 Ld SSOP
Tape and Reel
(Pb-free)
M28.209
HIN211CB 0 to 70 28 Ld SOIC M28.3
HIN211CB-T 0 to 70 28 Ld SOIC
Tape and Reel M28.3
HIN211CBZ
(See Note) 0 to 70 28 Ld SOIC
(Pb-free) M28.3
HIN211CBZ-T
(See Note) 0 to 70 28 Ld SOIC
Tape and Reel
(Pb-free)
M28.3
HIN213CA 0 to 70 28 Ld SSOP M28.209
HIN213CA-T 0 to 70 28 Ld SSOP
Tape and Reel M28.209
HIN213CAZ
(See Note) 0 to 70 28 Ld SSOP
(Pb-free) M28.209
HIN213CAZ-T
(See Note) 0 to 70 28 Ld SSOP
Tape and Reel
(Pb-free)
M28.209
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
Ordering Information (Continued)
PART NO. TEMP.
RANGE (°C) PACKAGE PKG.
DWG. #
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
3
Pin Descriptions
PIN FUNCTION
VCC Power Supply Input 5V ±10%, (5V ±5% HIN207).
V+ Internally generated positive supply (+10V nominal).
V- Internally generated negative supply (-10V nominal).
GND Ground Lead. Connect to 0V.
C1+ External capacitor (+ terminal) is connected to this lead.
C1- External capacitor (- terminal) is connected to this lead.
C2+ External capacitor (+ terminal) is connected to this lead.
C2- External capacitor (- terminal) is connected to this lead.
TIN Transmitter Inputs. These lead s accept TTL/CMOS levels . An in ternal 400kΩ pull-up resistor to V CC is conne ct ed t o ea ch lead.
TOUT Transmitter Outputs. These are RS-232 levels (nominally ±10V).
RIN Receiver In puts. These inputs accept RS-232 input levels. An int ernal 5kΩ pull-do w n resist or to GND is conne ct ed t o ea ch input .
ROUT Receiver Outputs. These are TTL/CMOS levels.
EN, EN Receiver enable Input. With EN = 5V (HIN213 EN = 0V), the receiver outputs are placed in a high impedance state.
SD, SD Shutdown Input. With SD = 5V (HIN213 SD = 0V), the charge pump is disabled, the receiver outputs are in a high impedance state
(except R4 and R5 of HIN213) and the transmitters are shut off.
NC No Connect. No connections are made to these leads.
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
4
Pinouts HIN202 (PDIP, SOIC)
TOP VIEW HIN206 (SOIC)
TOP VIEW
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
V-
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
SD
EN
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
VCC
+5V
2
V+
16
T1OUT
T2OUT
T1IN
T2IN
T1
T2
11
10
14
7
+5V400kΩ
+5V400kΩ
R1OUT R1IN
R1
1312
5kΩ
R2OUT R2IN
R2
89
5kΩ
+10V T O -10V
V OLTAGE INVERTER 0.1µF
6
V-
C2+
C2-
+
0.1µF
4
5
+5V TO 10V
V OLTAGE INVERTER
C1+
C1-
+
0.1µF
1
3+0.1µF
+
GND
15
9
VCC
+5V TO 10V
VOLTAGE DOUBLER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
18 1
19 24
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
45
5kΩ
R2OUT R2IN
R2
2322
5kΩ
R3OUT R3IN
R3
1617
5kΩ
EN 20 21 SD
GND
8
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
5
HIN207 (SOIC, SSOP)
TOP VIEW HIN208 (SOIC)
TOP VIEW
Pinouts (Continued)
T3OUT
T1OUT
T2OUT
R1IN
R1OUT
T2IN
T1IN
GND
VCC
C1+
V+
C1-
T4OUT
R2OUT
T5IN
T5OUT
T4IN
R3OUT
V-
C2-
C2+
R2IN
T3IN
R3IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
T2OUT
T1OUT
R2IN
R2OUT
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T3OUT
R3OUT
T4IN
T4OUT
T3IN
R4OUT
V-
C2-
C2+
R3IN
T2IN
R4IN
1
2
3
4
5
6
7
8
9
10
11
12
16
17
18
19
20
21
22
23
24
15
14
13
9
VCC
+5V TO 10V
VOLTAGE DOUB LER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
18 1
19 24
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
45
5kΩ
R2OUT R2IN
R2
2322
5kΩ
R3OUT R3IN
R3
1617
5kΩ
T5OUT
T5IN
T5
21 20
+5V400kΩ
GND
8
9
VCC
+5V TO 10V
VOLTAGE DOUB LER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T4OUT
T4IN
T1IN
T2IN
T3IN
T1
T2
T3
T4
+5V
+0.1µF
+0.1µF
+
0.1µF
5
18
2
1
19 24
21 20
10
12 11
15
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
13
14
R1OUT R1IN
R1
76
5kΩ
R2OUT R2IN
R2
34
5kΩ
R3OUT R3IN
R3
2322
5kΩ
R4OUT R4IN
R4
1617
5kΩ
GND
8
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
6
HIN211 (SOIC, SSOP)
TOP VIEW HIN213 (SSOP)
TOP VIEW
NOTE: R4 and R5 active in shutdown.
Pinouts (Continued)
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T4OUT
R3OUT
SD
EN
R4IN
T4IN
R5OUT
R5IN
V-
C2-
C2+
R3IN
R4OUT
T3IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
T3OUT
T1OUT
T2OUT
R2IN
R2OUT
T2IN
T1IN
R1OUT
R1IN
GND
VCC
C1+
V+
C1-
T4OUT
R3OUT
SD
EN
R4IN
T4IN
R5OUT
R5IN
V-
C2-
C2+
R3IN
R4OUT
T3IN
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
11
VCC
+5V TO 10V
VOLTAGE DOUB LER
+10V TO -10V
VOLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
20 1
12
14 13
17
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
15
16
R1OUT R1IN
R1
9
5kΩ
R2OUT R2IN
R2
45
5kΩ
R3OUT R3IN
R3
2726
5kΩ
R4OUT R4IN
R4
2322
5kΩ
R5OUT R5IN
R5
1819
5kΩ
EN 24
8
T4OUT
T4IN
T4
21 28
+5V400kΩ
SD
25
GND
10
11
VCC
+5V TO 10V
VOLTA GE DOUBLER
+10V T O -10V
V OLTAGE INVERTER
T1OUT
T2OUT
T3OUT
T1IN
T2IN
T3IN
T1
T2
T3
+5V
+0.1µF
+0.1µF
+
0.1µF
7
6
2
3
20 1
12
14 13
17
V+
V-
C1+
C1-
C2+
C2-
+5V400kΩ
+5V400kΩ
+5V400kΩ
+
0.1µF
15
16
R1OUT R1IN
R1
9
5kΩ
R2OUT R2IN
R2
45
5kΩ
R3OUT R3IN
R3
2726
5kΩ
R4OUT R4IN
R4
2322
5kΩ
R5OUT R5IN
R5
1819
5kΩ
EN 24
8
T4OUT
T4IN
T4
21 28
+5V400kΩ
25 SD
GND
10
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
7
Absolute Maximum Ratings Thermal Info rmation
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) <VCC < 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . (VCC -0.3V) <V+ < 12V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . .-12V < V- < (GND +0.3V)
Input Voltages
TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V)
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V)
ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V)
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Class 1
Operating Conditions
Temperature Range
HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
HIN2XXIX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to 85°C
Thermal Resistance (Typical, Note 1) θJA (°C/W)
16 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 90
16 Ld SOIC (N) Package . . . . . . . . . . . . . . . . . . . . . 110
16 Ld SOIC (W) Package. . . . . . . . . . . . . . . . . . . . . 100
24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75
24 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 135
28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100
Maximum Junction Temperature (Plastic Package) . . . . . . . .150°C
Maximum Storage Temperature Range. . . . . . . . . . .-65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300°C
(SOIC and SSOP - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF;
TA = Operating Temperature Range
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
SUPPLY CURRENTS
Power Supply Current, ICC No Load,
TA = 25°C HIN202 - 8 15 mA
HIN206, HIN207, HIN208,
HIN211, HIN213 -1120mA
Shutdown Supply Current, ICC(SD) TA = 25°C HIN206, HIN211 - 1 10 µA
HIN213 - 15 50 µA
LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS
Input Logic Low, VlL TIN, EN, SD, EN, SD --0.8V
Input Logic High, VlH TIN 2.0 - - V
EN, SD, EN, SD 2.4 - - V
Transmitter Input Pullup Current, IPTIN = 0V - 15 200 µA
TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA
(HIN202, IOUT = 3.2mA) -0.10.4V
TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1mA 3.5 4.6 - V
TTL/CMOS Receiver Output Leakage EN = VCC, EN = 0, 0V < ROUT < VCC -0.05±10 µA
RECEIVER INPUTS
RS-232 Input Voltage Range, VIN -30 - +30 V
Receiver Input Impedance, RIN TA = 25°C, VIN = ±3V 3.0 5.0 7.0 kΩ
Receiver Input Low Threshold, VIN (H-L) VCC = 5V,
TA = 25°C Active Mode 0.8 1.2 - V
Shutdown Mode
HIN213 R4 and R5 0.6 1.5 - V
Receiver Input High Threshold, VIN (L-H) VCC = 5V,
TA = 25°C Active Mode - 1.7 2.4 V
Shutdown Mode
HIN213 R4 and R5 -1.52.4V
Receiver Input Hysteresis, VHYST VCC = 5V
No Hysteresis in Shutdown Mode 0.2 0.5 1.0 V
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
8
TIMING CHARACTERISTICS
Baud Rate 1 Transmitter
Switching RL = 3kΩ120 - - kbps
Output Enable Time, tEN HIN206, HIN2 11, HIN 213 - 400 - ns
Output Disable Time, tDIS HIN206, HIN211, HI N213 - 200 - ns
Transmitter, Receiver Propagation Delay, tPD HIN213 SD = 0V, R4, R5 - 0.5 40 µs
HIN213 SD = VCC, R1 - R5 - 0.5 10 µs
HIN202, HIN206, HIN207, HIN208, HIN211 - 0.5 10 µs
Transition Region Slew Rate, SRTRL = 3kΩ, CL = 2500pF Measured from
+3V to -3V or -3V to +3V, 1 Transmitter
Switching (Note 2)
3-30V/µs
TRANSMITTER OUTPUTS
Output Voltage Swing, TOUT Transmitter Outputs, 3kΩ to Ground ±5±9±10 V
Output Resistance, TOUT VCC = V+ = V- = 0V, VOUT = ±2V 300 - - Ω
RS-232 Output Short Circuit Current, ISC TOUT Shorted to GND - ±10 - mA
NOTE:
2. Guaranteed by design.
Electrical Specifications Test Conditions: VCC = +5V ±10%, (VCC = +5V ±5%, HIN207); C1-C4 = 0.1µF;
TA = Operating Temperature Range (Continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
+
-C1 +
-C3 +
-C2 +
-C4
S1 S2 S5 S6
S3 S4 S7 S8
VCC GND
RC
OSCILLATOR
VCC
GND
V+ = 2VCC GND
V- = - (V+)
C1+
C1-C2-
C2+
V OLTAGE INVERTER
VOLTAGE DOUBLER
FIGURE 1. CHARGE PUMP
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
9
Detailed Description
The HIN202, HIN206, HIN207, HIN208 , HIN211, HIN213
family of RS-232 transmitters/receivers are powered by a
single +5V power supply feature low power consumption,
and meet all ElA RS232C and V.28 specifications. The circuit
is divided into three sections: The charge pump, transmitter,
and receiver.
Charge Pump
An equivalent circuit of the charge pump is illustrated in
Figure 1. The charge pump contains two sections: the
voltage doubler and the voltage inverter. Each section is
driven by a two phase , internally generated clock to generate
+10V and -10V. The nominal clock frequency is 125kHz.
During pha se one of the clock, capacitor C1 is charged to
VCC. During phase two , the voltage on C1 is added to VCC,
producing a signal across C3 equal to twice VCC. During
phase two, C2 is also charged to 2VCC, and then during
phase one, it is in verted with respect to ground to produce a
signal across C4 equal to -2VCC. The charge pump accepts
input voltages up to 5.5V. The output impedance of the
voltage doub ler section (V+) is appro ximately 200Ω, and the
output impedance of the voltage inverter section (V-) is
approximately 450Ω. A typical application uses 0.1µF
capacitors for C1-C4, however, the value is not critical.
Increasing the values of C1 and C2 will lower the output
impedance of the voltage doubler and inverter, increasing
the values of the reservoir capacitors, C3 and C4, lowers the
ripple on the V+ and V- supplies.
During shutdown mode (HIN206 and HIN211, SD = VCC,
HIN213, SD = 0V) the charge pump is turned off, V+ is
pulled down to VCC, V- is pulled up to GND, and the supp l y
current is reduced to less than 10µA. The transmitter outputs
are disabled and the receiver outputs (e xcept for HIN213, R4
and R5) are placed in the high impedance state.
Transmitters
The transmitters are TTL/CMOS compatible inverters which
translate the inputs to RS-232 outputs. The input logic
threshold is about 26% of VCC, or 1.3V f or VCC = 5V. A logic
1 at the input results in a voltage of between -5V and V- at
the output, and a logic 0 results in a voltage between +5V
and (V+ - 0.6V). Each transmitter input has an internal
400kΩ pullup resistor so any unused input can be left
unconnected and its output rema ins in its low state. The
output voltage swing meets the RS-232C specifications of
±5V minimum with the worst case conditions of: all
trans mi tte rs drivin g 3k Ω min imum load impedance,
VCC = 4.5V, and maximum allowab le operating temperature.
The transmitters have an internally limited output slew rate
which is less than 30V/µs. The ou tp u ts are short circuit
protected and can be shorted to ground indefinitel y. The
powered do wn output impedance is a minimum of 300Ω with
±2V applied to the outputs and VCC = 0V.
Receivers
The receiver inputs accept up to ±30V while presenting the
required 3kΩ to 7kΩ input impedance ev en if the power is off
(VCC = 0V). The receivers have a typical input threshold of
1.3V which is within the ±3V limits, known as the transition
region, of the RS-232 specifications. The receiver output is
0V to VCC. The output will be low whenever the input is
greater than 2.4V and high whenever the input is floating or
driven between +0.8V and -30V. The receivers feature 0.5V
hysteresis (except during shutdown) to improve noise
rejection. The receiver Enable line (EN on HIN206 and
HIN211, EN on HIN213) when unasserted, disables the
receiver outputs, placing them in the high impedance mode.
The receiver outputs are also placed in the high impedance
state when in shutdown mode (except HIN213 R4 and R5).
HIN213 Operation in Shutdown
The HIN213 features two receivers, R4 and R5, which
remain active in shutdown mode. During normal operation
the receivers propagation delay is typically 0.5µs. This
propagation delay may increase slightly du ring shutdown.
When enter ing shut down mode, receivers R4 and R5 are
not valid for 80µs after SD = VIL. When exiting shutdown
mode, all receiver outputs will be invalid until the charge
pump circuitry reaches normal operating voltage. This is
typically less than 2ms when using 0.1µF capacitors.
TOUT
V- < VTOUT < V+
300Ω
400kΩ
TXIN
GND < TXIN < VCC
V-
V+
VCC
FIGURE 2. TRANSMITTER
ROUT
GND < VROUT < VCC
5kΩ
RXIN
-30V < RXIN < +30V
GND
VCC
FIGURE 3. RECEIVER
TIN
VOL
VOL
tPLH
tPHL
AVERAGE PROPAGATION DELAY = tPHL + tPLH
2
OR
RIN
TOUT
OR
ROUT
FIGURE 4. PROPAGATION DELAY DEFINITION
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
10
Application Information
The HIN2XX may be used for all RS-232 data terminal and
communication links. It is particula rly useful in applications
where ±12V power supplies are not available for
conventional RS-232 interface circuits. The applications
presented represent typical interface configurations.
A simple duplex RS-232 port with CTS/RTS handshaking is
illustrated in Figure 9. Fixed output signals such as DTR
(data ter m inal ready) and DSRS (data signaling rate select)
is generated by driving them through a 5kW resistor
connected to V+.
In applications requiring four RS-232 inputs and outputs
(Figure 10), note that each circuit requires two charge pump
capacitors (C1 and C2) but can share common reservoir
capacitors (C3 and C4). The benefit of sharing common
reservoir capacitors is the elimination of two capacitors and
the reduction of the charge pump source impedance which
effectively increases the output swing of the transmitters.
Typical Performance Curves
FIGURE 5. V- SUPPLY VOLTAGE vs VCC FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD
12
10
8
6
4
2
03.5 4.0 4.5 6.0
VCC
V- SUPPLY VOLTAGE (V)
5.0 5.53.0
0.1µF
35
|ILOAD| (mA)
V+ (VCC = 4V)
V+ (VCC = 5V)
V- (VCC = 5V)
V- (VCC = 4V)
TA = 25°C
TRANSMITTER OUTPUTS
OPEN CIRCUIT
302520151050
SUPPLY VOLTAGE (|V|)
0
12
10
8
6
4
2
Test Circuits (HIN202)
FIGURE 7. GENERAL TEST CIRCUIT FIGURE 8. PO WER-OFF SOURCE RESIST ANCE
CONFIGURATION
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
+4.5V TO
+5.5V INPUT
3kΩ
T1 OUTPUT
RS-232 ±30V INPUT
TTL/CMOS OUTPUT
TTL/CMOS INPUT
TTL/CMOS INPUT
TTL/CMOS OUTPUT
+
-
0.1µF
C3
+
-
0.1µF
C1
+
-
0.1µF
C2
+
-
0.1µF C4
3kΩ
OUTPUT
RS-232
±30V INPUT
T2
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
C1+
V+
C1-
C2+
C2-
V-
R2IN
T2OUT
VCC
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
GND
T2OUT
T1OUT
VIN = ±2V A
ROUT = VIN/I
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
11
-
+
-
+
-
+
CTR (20) DATA
TERMINAL READY
DSRS (24) DATA
SIGNALING RATE
RS-232
INPUTS AND OUTPUTS
TD (2) TRANSMIT DATA
RTS (4) REQUEST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR T O SE ND
SIGNAL GROUND (7)15
8
13
7
14
16
-
+
6
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN202
C1
0.1µF
C2
0.1µF
TD
RTS
RD
CTS
SELECT
+5V
INPUTS
OUTPUTS
TTL/CMOS
FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING
-
+
RS-232
INPUTS AND OUTPUTS
DTR (20) DATA TERMINAL READY
DSRS (24) DATA SIGNALING RATE SELECT
DCD (8) DATA CARRIER DETECT
R1 (22) RING INDICATOR
SIGNAL GROUND (7)15
8
13
7
14
2
-
+
4
R2 R1
T2
T1
9
12
10
11
3
1HIN202
C1
0.1µF
DTR
DSRS
DCD
R1
+5V
INPUTS
OUTPUTS
TTL/CMOS
-
+-
+
TD (2) TRANSMIT DATA
RTS (4) REQ U EST TO SEND
RD (3) RECEIVE DATA
CTS (5) CLEAR T O SEND
8
13
7
14
15
R2 R1
T2
T1
9
12
10
11
4
5
3
1
HIN202
C1
0.1µFC2
0.1µF
TD
RTS
RD
CTS
INPUTS
OUTPUTS
TTL/CMOS
-
+
5C2
0.1µF
16
C3
0.2µF
6
26
V- V+
-
+
C4
0.2µF
16 VCC
VCC
FIGURE 10. COMBINING TWO HIN202s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
12
Die Characteristics
DIE DIMENSIONS:
160 mils x 140 mils
METALLIZATION:
Type: Al
Thickness: 10kÅ ±1kÅ
SUBSTRATE POTENTIAL
V+
PASSIVATION:
Type: Nitride over Silox
Nitride Thickness: 8kÅ
Silox Thickness: 7kÅ
TRANSIST OR COUNT:
238
PROCESS:
CMOS Metal Gate
Metallization Mask Layout HIN211
T3OUT
T1OUT
T2OUT
R2IN
R2OUT T2IN T1IN R1OUT R1IN GND
VCC
C1+
V+
C1-
C2+
C2-
V-
R5IN
R5OUT
T3IN
T4IN
R4OUT
R4IN
ENSHD
T4OUT
R3IN
R3OUT
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
13
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in JE-
DEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and are measured with the leads constrained to be perpendic-
ular to datum .
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal po sitions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX 12 3 N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1 Be
D
D1
A
A2
L
A1
-A-
0.010 (0.25) C AMBS
E16.3 (JEDEC MS-001-BB ISSUE D)
16 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.210 - 5.33 4
A1 0.015 - 0.39 - 4
A2 0.115 0.195 2.93 4.95 -
B 0.014 0.022 0.356 0.558 -
B1 0.045 0.070 1.15 1.77 8, 10
C 0.008 0.014 0.204 0.355 -
D 0.735 0.775 18.66 19.68 5
D1 0.005 - 0.13 - 5
E 0.300 0.325 7.62 8.25 6
E1 0.240 0.280 6.10 7.11 5
e 0.100 BSC 2.54 BSC -
eA0.300 BSC 7.62 BSC 6
eB- 0.430 - 10.92 7
L 0.115 0.150 2.93 3.81 4
N16 169
Rev. 0 12/93
14
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm
(0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H0.25(0.010) BM M
α
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.3859 0.3937 9.80 10.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N16 167
α0° 8° 0° 8° -
Rev. 1 6/05
15
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H0.25(0.010) BM M
α
M16.3 (JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.3977 0.4133 10.10 10.50 3
E 0.2914 0.2992 7.40 7.60 4
e 0.050 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N16 167
α0° 8° 0° 8° -
Rev. 1 6/05
16
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010) BM M
α
M24.3 (JEDEC MS-013-AD ISSUE C)
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.020 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.5985 0.6141 15.20 15.60 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.010 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N24 247
α0o8o0o8o-
Rev. 0 12/93
17
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004) C
H
µ
0.25(0.010) BM M
α
0.25
0.010
GAUGE
PLANE
A2
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.078 - 2.00 -
A1 0.002 - 0.05 - -
A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.312 0.334 7.90 8.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N24 247
α0o8o0o8o-
Rev. 1 3/95
18
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Small Outline Plastic Packages (SOIC)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010) BM M
α
M28.3 (JEDEC MS-013-AE ISSUE C)
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0926 0.1043 2.35 2.65 -
A1 0.0040 0.0118 0.10 0.30 -
B 0.013 0.0200 0.33 0.51 9
C 0.0091 0.0125 0.23 0.32 -
D 0.6969 0.7125 17.70 18.10 3
E 0.2914 0.2992 7.40 7.60 4
e 0.05 BSC 1.27 BSC -
H 0.394 0.419 10.00 10.65 -
h 0.01 0.029 0.25 0.75 5
L 0.016 0.050 0.40 1.27 6
N28 287
α0o8o0o8o-
Rev. 0 12/93
19
All Intersil U.S. products are manuf a ctured, ass embled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reser ves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
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For information regarding Intersil Corporation and its products, see www.intersil.com
HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
“B” dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H0.25(0.010) BM M
α
0.25
0.010
GAUGE
PLANE
A2
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A - 0.078 - 2.00 -
A1 0.002 - 0.05 - -
A2 0.065 0.072 1.65 1.85 -
B 0.009 0.014 0.22 0.38 9
C 0.004 0.009 0.09 0.25 -
D 0.390 0.413 9.90 10.50 3
E 0.197 0.220 5.00 5.60 4
e 0.026 BSC 0.65 BSC -
H 0.292 0.322 7.40 8.20 -
L 0.022 0.037 0.55 0.95 6
N28 287
α0° 8° 0° 8° -
Rev. 2 6/05
