Touch Sensing Software Evaluation Board
Users Guide
Document Number:TSSEVBUG
Rev. 6
7/2010
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© Freescale Semiconductor, Inc. 2009. All rights reserved.
Document Number: TSSEVBUG
Rev. 6
7/2010
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
Freescale Semiconductor iii
Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://www.freescale.com
The following revision history table summarizes changes contained in this document.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Revision
Number
Revision
Date Description of Changes
Rev. 1 07/2009 Launch Release.
Rev. 2 09/2009 Updated BOM, schematics, and silk screen.
Rev. 3 10/2009 Updated GPIO port allocation table.
Rev. 4 11/2009 Added Section 2.1.10, “Overlays” and Section 2.3.8.1, “Using the TSSEVB IIC
Communication Module” sections.
Rev. 5 12/2009 Added Section 2.1.1, “TSSEVB Modules” and Section 3.1.1, “Re-Programming
MC9S08JM60 Comm MCU on the TSSEVB” sections.
Rev. 6 7/2010 Edits done
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
iv Freescale Semiconductor
Chapter 1
Before You Begin
1.1 About This Book . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 Reference Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.3 Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.4 Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Chapter 2
System Overview
2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2.1 TSSEVB Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2.2 Microcontroller Unit (MCU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.2.3 General-Purpose I/O and Peripheral Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2.2.4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5
2.2.5 Buzzer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.2.6 Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.2.7 LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.2.8 TSSEVB Electrodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
2.2.9 RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.2.10 Overlays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.3 Schematic and Bill of Materials (BOM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7
2.3.1 TSSEVB Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-15
2.3.2 TSSEVB Silk Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
2.4 Header and Jumper Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
2.4.1 USB Power Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-17
2.4.2 External Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
2.4.3 Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-18
2.4.4 MC9S08LG32 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-19
2.4.5 Test Points . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-19
2.4.6 BDM Header . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
2.4.7 Comm PORT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
2.4.8 IIC Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-20
2.4.8.1 Using the TSSEVB IIC Communication Module . . . . . . . . . . . . . . . . . 2-21
Chapter 3
TSSEVB Interfaces
3.1 MC9S08JM60 Comm MCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1.1 Re-Programming MC9S08JM60 Comm MCU on the TSSEVB . . . . . . . . . . . . 3-1
3.2 IIC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
Freescale Semiconductor v
3.3 USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.4 SCI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.5 OSBDM MCU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.6 Additional BDM Connector for MC9S08LG32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
Freescale Semiconductor 1-1
Chapter 1
Before You Begin
1.1 About This Book
This guide describes the hardware of the Touch Sensing Software Evaluation Board (TSSEVB). The
TSSEVB provides all the necessary components to evaluate and use the Touch Sensing Software (TSS).
TSSEVB is built around Freescale's TSS library. The Freescale MC9S08LG32 microcontroller unit uses
the TSS library.
This TSSEVB Users Guide is written for software, hardware, and system engineers, who are developing
their products or software applications using the TSS library to integrate capacitive sensing.
Table 1-1 shows the summary of chapters in this guide.
Table 1-1. TSSEVBUG Summary
1.2 Reference Material
Use this book in conjunction with:
•Touch Sensing Software Users Guide (document TSSUG)
•Touch Sensing Software API Reference Manual (document TSSAPIRM)
•Touch Sensing Software EVB Quick Start Guide (document TSSEVBQSG)
1.3 Conventions
This guide uses the following notations:
• Courier monospaced type indicates commands, command parameters, code examples, expressions,
datatypes, and directives.
• Italic type indicates replaceable command parameters.
• All source code examples are in C.
Chapter Title Description
Before You Begin Lists the prerequisites of reading this book.
System Overview Provides information about the microcontroller part and its surrounding.
TSSEVB Interfaces Describes the board design and ways to interface with the board.
Before You Begin
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1-2 Freescale Semiconductor
1.4 Acronyms and Abbreviations
BOM Bill of Material
CPU Central Processing Unit
Comm MCU Communication Microcontroller Unit
EGT Electrode Graphing Tool
FLL Frequency-Locked Loop
GPIO General-Purpose Input/Output
IIC Inter-Integrated Circuit
ICS Internal Clock Source
LG MCU MC9S08LG32 Microcontroller Unit
MCU Microcontroller Unit
OSBDM Open Source Background Debug Module
PC Personal Computer
PCB Printed Circuit Board
QFN Quad Flat Non-lead package
RAM Random Access Memory
Rx Receiver
SCI Serial Communication Interface
SPI Serial Peripheral Interface
TSSEVB Touch Sensing Software Evaluation Board
Tx Transmitter
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
Freescale Semiconductor 2-1
Chapter 2
System Overview
2.1 Introduction
This chapter describes the basic components, functionality, and power supply options of TSSEVB. It also
includes the schematic and Bill of Materials (BOM) for the TSSEVB. For more information on how to set
the Freescale Touch Sensing Software primitives and the development environment, refer to the Touch
Sensing Software API Reference Manual (document TSSAPIRM).
Features of TSSEVB:
• TSSEVB includes a demonstration application that allows you to start testing TSS within minutes.
• TSSEVB includes a Communication MCU (MC9S08JM60 Comm MCU) that serves as a bridge
between the application and the PC to evaluate the Electrode Graphing Tool (EGT) along with TSS.
• TSSEVB includes all the decoding structures supported by TSS along with special electrodes, such
as different size electrodes and multiplexed electrodes supported by TSS.
• The EVB also contains a custom on-board display that allows you to explore the software
development combining the integrated LCD driver with TSS. The LCD contains special segments
to be used with TSS.
• TSSEVB includes an MC9S08LG32 device from the S08 family of 8-bit microcontrollers. The LG
family offers improved performance and flexible pin functionality for a wide range of industrial
and automotive applications, such as electric metering, home appliances, HVAC systems, and entry
level instrument clusters.
• TSSEVB includes an OSBDM module that allows programming of the MC9S08LG32 MCU and
the MC9S08JM60 Comm MCU. There is no need to use an external BDM module to load
applications into the MC9S08LG32 MCU.
• TSSEVB can be powered using three different sources:
— Through the USB port
— Through the mini USB port
— By connecting the board to the voltage converter included in the TSSEVB kit.
2.1.1 TSSEVB Modules
Figure 2-1 shows the front view of TSSEVB and the main modules present.
System Overview
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
2-2 Freescale Semiconductor
Figure 2-1. TSSEVB front view
Figure 2-2 shows the back view of TSSEVB and the main modules present.
Figure 2-2. TSSEVB back view
2.1.2 Microcontroller Unit (MCU)
MC9S08LG32 drives liquid crystal displays (LCD) with up to 296 segments. The 5V segment LCD MCU,
MC9S08LG32 offers improved performance and flexible pin functionality for a wide range of industrial
System Overview
Touch Sensing Software Evaluation Board Users Guide, Rev. 6
Freescale Semiconductor 2-3
and automotive applications, such as electric metering, home appliances, HVAC systems, and entry level
instrument cluster. The MC9S08LG32 has 32 KB of on-chip programmable flash memory and 2 KB of
RAM available.
The MC9S08LG32 provides an LCD driver module, configurable up to 8 × 37 or 4 × 41. The LCD driver
module remains active even in low-power modes. It also includes an internal regulated charge pump for
contrast control. All LCD pins are multiplexed with GPIOs.
TSSEVB uses the MC9S08LG32 Inter-Integrated Circuit (IIC) module to establish communication with
the MC9S08JM60 Comm MCU when the TSSEVB is used along with EGT. To use the IIC module with
the EGT, jumpers on headers J10 and J11 respectively must be properly configured. For more information
on jumper configurations, refer to Section 2.3, “Header and Jumper Connections.”
The EVB includes two MC9S08JM60 MCUs, one is open source BDM that is used to program and debug,
while the other is used to communicate with the EGT GUI on a PC.
The MC9S08LG32 includes a Serial Communication Interface (SCI) module. The SCI module can be
connected to both MC9S08JM60 MCUs included in the TSSEVB and you can select either by changing
the position on J1 and J2 jumpers. The SCI module is included in the TSSEVB for future demo
applications.
MC9S08LG32 is packaged in an 80-pin quad flat non-lead package (QFN).
2.1.3 General-Purpose I/O and Peripheral Ports
MC9S08LG32 has nine I/O ports that include a total of up to 69 GPIO pins. Most of these pins are shared
with the on-chip peripherals such as timer systems, external interrupts, or keyboard interrupts. When these
modules are not controlling the port pins, they revert to GPIO control. Immediately after reset, all 69 GPIO
pins are configured as high-impedance general-purpose inputs with internal pull-up devices disabled. The
port allocation of the general-purpose I/O and on-chip peripheral functions on the EVB are listed in
Table 2-1 along with a brief description.
Table 2-1. GPIO Port Allocation
MCU Port TSSEVB Functionality I/O Description
PTA0/LCD21 LCD21 I/O LCD Control pin
PTA1/SCL/LCD22 ER9 I Rotary Structure Electrode
PTA2/SDA/ADC0/LCD23 EGR1 I Different Size Electrode
PTA3/KBI4/TX2/ADC1/LCD24 OSBDM_TX/COM_TX O SCI Transmitter (future use)
PTA4/KBI5/RX2/ADC2/LCD25 OSBDM_RX/COM_RX I SCI Receiver (future use)
PTA5/KBI6/TPM2CH0/ADC3/LCD26 ETK_6 I Numeric Keyboard Electrode
PTA6/KBI7/TPM2CH1/ADC4/LCD27 Buzzer O Buzzer
PTA7/TCLK/ADC5/LCD28 ETK_5 I Numeric Keyboard Electrode
PTB0/LCD29 ESLIDER1 I Slider Structure Electrode
PTB1/LCD30 ESLIDER2 I Slider Structure Electrode
System Overview
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PTB2/LCD31 ESLIDER7 I Slider Structure Electrode
PTB3/LCD32 ESLIDER8 I Slider Structure Electrode
PTB4/LCD37 ESLIDER3 I Slider Structure Electrode
PTB5/LCD38 ESLIDER4 I Slider Structure Electrode
PTB6/LCD39 ESLIDER5 I Slider Structure Electrode
PTB7/LCD40 ESLIDER6 I Slider Structure Electrode
PTC0/LCD16 LCD16 I/O LCD Control pin
PTC1/LCD17 LCD17 I/O LCD Control pin
PTC2/LCD18 LCD18 I/O LCD Control pin
PTC3/LCD19 LCD19 I/O LCD Control pin
PTC4/LCD20 LCD20 I/O LCD Control pin
PTC5/BKGD/MS MAIN_BKGD I/O MCU Programming pin
PTC6/RESET MAIN_RST I/O MCU Reset pin
PTD0/LCD0 LCD0 I/O LCD Control pin
PTD1/LCD1 LCD1 I/O LCD Control pin
PTD2/LCD2 LCD2 I/O LCD Control pin
PTD3/LCD3 LCD3 I/O LCD Control pin
PTD4/LCD4 LCD4 I/O LCD Control pin
PTD5/LCD5 LCD5 I/O LCD Control pin
PTD6/LCD6 LCD6 I/O LCD Control pin
PTD7/LCD7 LCD7 I/O LCD Control pin
PTE0/LCD8, LCD8 I/O LCD Control pin
PTE1/LCD9 LCD9 I/O LCD Control pin
PTE2/LCD10, LCD10 I/O LCD Control pin
PTE3/LCD11 LCD11 I/O LCD Control pin
PTE4/LCD12 LCD12 I/O LCD Control pin
PTE5/LCD13 LCD13 I/O LCD Control pin
PTE6/LCD14 LCD14 I/O LCD Control pin
PTE7/LCD15 LCD15 I/O LCD Control pin
PTF0/TX1/KBI3/TPM2CH2/ADC12 ERL1 I Electrode with LED
PTF1/RX1/TPM1CH0/ADC13 ERL2 I Electrode with LED
PTF2/SPSCK/TPM1CH1/IRQ/ADC14 ERL3 I Electrode with LED
PTF3/SS/KBI0/TPM2CH5 ES3 I Different Size Electrode
Table 2-1. GPIO Port Allocation (continued)
MCU Port TSSEVB Functionality I/O Description
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Freescale Semiconductor 2-5
2.1.4 Power Supply
Power can be supplied to TSSEVB either through the USB connections by setting J4 or through an external
power supply.
• To supply power to the TSSEVB through a USB connection, set the J4 jumper to the selected USB
connection.
PTF4/MISO/KBI1/TPM2CH4 ER2 I Rotary Structure Electrode
PTF5/MOSI/KBI2/TPM2CH3 ER1 I Rotary Structure Electrode
PTF6/XTAL LED_ER2 O Electrode’s LED
PTF7/XTAL LED_ER1 O Electrode’s LED
PTG0/LCD33 EMUX1 I Multiplexed Electrode
PTG1/LCD34 EMUX2 I Multiplexed Electrode
PTG2/LCD35 LED_ER3 O Electrode’s LED
PTG3/LCD36 ER8 I Rotary Structure Electrode
PTG4/LCD41 EMUX3 I Multiplexed Electrode
PTG5/LCD42 EMUX4 I Multiplexed Electrode
PTG6/LCD43 LED_ER4 O Electrode’s LED
PTG7/LCD44 NC - —
PTH0/KBI4/ADC6 ETK_4 I Numeric Keyboard Electrode
PTH1/KBI5/ADC7 ETK_3 I Numeric Keyboard Electrode
PTH2/KBI6/ADC8 ETK_2 I Numeric Keyboard Electrode
PTH3/KBI7/ADC9 ETK_1 I Numeric Keyboard Electrode
PTH4/RX1/KBI2/TPM1CH1/ADC10 ES1 I Different Size Electrode
PTH5/TX1/KBI3/TPM1CH0/ADC11 ES2 I Different Size Electrode
PTH6/TPM2CH5/KBI0/ADC15 ERL4 I Electrode with LED
PTH7/KBI1/TPM2CH4 ER7 I Rotary Structure Electrode
PTI0/RX2 ER6 I Rotary Structure Electrode
PTI1/TMRCLK/TX2 ER5 I Rotary Structure Electrode
PTI2/TPM2CH3/MISO ER4 I Rotary Structure Electrode
PTI3/TPM2CH2/MOSI ER3 I Rotary Structure Electrode
PTI4/TPM2CH1/SDA/SPSCK JM2_SDA I/O IIC module pin used for
communication with the EGT
PTI5/TPM2CH0/SCL/SS JM2_SCL I/O IIC module pin used for
communication with the EGT
Table 2-1. GPIO Port Allocation (continued)
MCU Port TSSEVB Functionality I/O Description
System Overview
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2-6 Freescale Semiconductor
— To supply power to the board from the OSBDM, place the J4 jumper on the 1–2 positions.
— To supply power to the board from the MC9S08JM60 Comm MCU, place the jumper on the
2–3 positions.
• To supply power to the TSSEVB externally, plug the voltage converter included in the TSSEVB
kit to the board's barrel connector. When using the external power supply, the voltage from the
USB_BDM is automatically disconnected from the board. Refer to section Section 2.3, “Header
and Jumper Connections,” for more information about how to configure the jumpers.
2.1.5 Buzzer
TSSEVB provides a piezoelectric speaker connected to the PTA6 pin of the MC9S08LG32
microcontroller. This speaker can be easily used with any touch sensing application.
2.1.6 Clock
TSSEVB uses the Internal Clock Source (ICS) of MC9S08LG32 to provide timing to the board. The ICS
module contains a Frequency-Locked Loop (FLL) to increase the bus frequency using the internal clock
as reference. For more information on the ICS module, refer to the MC9S08LG32 Reference Manual
(document MC9S08LG32RM).
2.1.7 LCD
TSSEVB provides a custom LCD with special segments that can be used to represent each of the electrodes
featured in the board. Depending on the application, these segments can change their functionality. When
running the application demo, the LCD allows you to visualize the performance of the electrodes working
along with the TSS. You can use the application demo code provided with the TSSEVB documentation as
a guideline to configure and use the LCD on any application. The LCD can display up to 4 characters
besides the special segments.
2.1.8 TSSEVB Electrodes
The TSSEVB provides all the decoding structures supported by the Touch Sensing Software, and also
provides some special electrodes. The TSSEVB features the following electrodes structures.
• Rotary structure formed by 8 electrodes plus one electrode in the middle of the structure.
• Slider structure formed by 8 electrodes.
• Keyboard structure formed by 6 electrodes.
• 4 electrodes with an LED in the middle.
• 4 multiplexed electrodes.
• 4 electrodes of different sizes for user evaluation.
System Overview
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Freescale Semiconductor 2-7
2.1.9 RESET
RESET is a dedicated pin with a pull-up device built in. This pin is connected to the 6-pin BDM connector,
therefore a development system can directly reset the MCU system. The reset switch (SW10) is active low
and provides a way to apply a reset to the MCU. The reset switch is connected directly to the RESET signal
of the MC9S08LG32 MCU. A 5.1 kΩ pull-up resistor to VDD on the RESET signal allows normal
operation preventing spurious reset detections. When the reset switch is pressed the RESET signal is
grounded, and the MCU recognizes a reset.
2.1.10 Overlays
TSSEVB includes two detachable overlays provided by KEE Group. These overlays have an adhesive that
can be used to place the overlay over the electrodes. These overlays can be used to test different dielectric
constants placed over the electrodes. The overlays can be placed, and removed many times while retaining
adherence.
2.2 Schematic and Bill of Materials (BOM)
This section contains the 13192-EVB schematic and BOM.
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2.2.1 TSSEVB Bill of Materials
Table 2-2. TSSEVB Bill of Materials
Item BOM.Qty Manufacturers.Mfr. Name Manufacturers.Mfr. Part
Number BOM.Ref Des
1 4 NIC COMPONENTS CORP NTC-T106M16TRAF C9,C12,C14,C15
2 17 KEMET C0603C104K3RAC C1,C2,C3,C4,C5,C6,C8,C16,C17,C1
9,C22,C25,C27,C29,C34,C35,C36
3 2 KEMET C0603C474K4PAC C20,C28
4 4 PANASONIC ECJ1VB0J106M C7,C18,C26,C33
5 2 KEMET C0805C103KARACTU C11,C13
6 2 AVX TACL475K010R C21,C30
7 5 AVX 06033A300KAT2A C10,C23,C24,C31,C32
8 4 PANASONIC EXCML20A390U L1,L2,L3,L4
9 4 KEYSTONE
ELECTRONICS
5005 TP1,TP2,TP3,TP4
10 4 SAMTEC TSM-103-01-S-SV J1,J2,J4,J5
11 1 SAMTEC TSM-105-01-S-DV-A-P J9
12 3 SAMTEC TSM-103-01-S-DV-P-TR J6,J7,J13
13 2 SAMTEC TSM-102-01-SM-SV-P-TR J10,J11
14 1 CUI STACK PJ-002A-SMT J3
15 2 MOLEX 0675031340 J8,J12
16 2 ABRACON CORP ABLS-4.000MHZ-B2-T Y1,Y2
17 1 TEXAS INSTRUMENTS SN74LVC1T45DBVR U9
18 1 MICREL MIC2026-1YM U8
19 2 FREESCALE
SEMICONDUCTOR
MC9S08JM60CLD U5,U7
20 1 NATIONAL
SEMICONDUCTOR
LM2940CS-5.0/NOPB U3
21 1 ST MICROELECTRONICS LD1085D2T33R U4
22 1 FREESCALE
SEMICONDUCTOR
MC9S08LG32CLK U1
23 4 LITE ON LTST-C190TBKT D5,D6,D7,D8
24 2 KINGBRIGHT AP1608MGC D9,D11
25 8 KINGBRIGHT AP1608SYCK D10,D12,D13,D14,D15,D16,D17,D19
26 1 S-TEK INC GD-5892P DS1
27 4 KOA SPEER RK73H1JTTD5101F R1,R53,R71,R76
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28 9 KOA SPEER RK73B1JTTD103J R50,R51,R52,R54,R55,R56,R58,R69
,R70
29 5 VENKEL COMPANY CR0603-10W-102JT R26,R27,R28,R29,R46
30 3 BOURNS CR0805-J/-000ELF R45,R61,R75
31 35 BOURNS CR0603-JW-105ELF R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,
R12,R13,R14,R15,R16,R17,R18,R19
,R20,R21,R22,R23,R24,R25,R30,R3
1,R32,R33,R34,R35,R36,R37,R38,R
39,R40
32 5 VISHAY
INTERTECHNOLOGY
CRCW060333R0JNEA R47,R57,R59,R72,R73
33 14 VENKEL COMPANY CR0603-10W-471JT R41,R42,R43,R44,R48,R49,R62,R63
,R64,R65,R66,R67,R68,R77
34 1 ON SEMICONDUCTOR BC847ALT1G Q1
35 1 SEMTECH CORP SRV05-4.TCT U6
36 1 VISHAY
INTERTECHNOLOGY
BAT54W-V-GS08 D18
37 2 FAIRCHILD MMBT3904K Q2,Q4
38 1 FAIRCHILD MMBT3906K Q3
39 1 CUI STACK CCV-084B16 LS1
40 1 E SWITCH TL1015BF160QG SW10
41 1 LITE ON LTST-C230TBKT —
Table 2-2. TSSEVB Bill of Materials (continued)
Item BOM.Qty Manufacturers.Mfr. Name Manufacturers.Mfr. Part
Number BOM.Ref Des
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2.2.2 TSSEVB Silk Screen
Figure 2-3. TSSEVB Silk Screen
2.3 Header and Jumper Connections
2.3.1 USB Power Selection
1. To supply power to the TSSEVB with the USB OSBDM source, place the jumper on 1–2 position.
Figure 2-4. Jumper Placement for USB OSBDM Source
2. To supply power to the TSSEVB with the USB COMM source, place the jumper on 2–3 position.
Figure 2-5. Jumper Placement for USB COMM Source
J4
USB POWER SEL
J4
USB POWER SEL
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2.3.2 External Power Supply
External power supply can be applied to J3. A minimum of 6.25 V must be applied. When J3 is plugged,
the USB power options are disabled.
Figure 2-6. Jumper Placement for External Power Supply
2.3.3 Voltage Selection
The system can be operated at 5 V or 3.3 V. Place a jumper on J5 for voltage selection.
1. To supply 5 V to the TSSEVB, place the jumper on 1–2 position.
Figure 2-7. Jumper Placement for 5 V
2. To supply 3.3 V to the TSSEVB, place the jumper on 2–3 position.
Figure 2-8. Jumper Placement for 3.3 V
Input voltage: +6.25 V to +26 V
2.0 mm – 2.1 mm, center-positive, +V
input
PWR
J3
J5
V_SEL
J5
V_SEL
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2.3.4 MC9S08LG32 UART
The MC9S08LG32 MCU can communicate through the SCI protocol with the MC9S08JM60 Comm
MCU or the OSBDM MCU. You can select the communication device placing a jumper on J1 for the
MC9S08LG32 transmitter pin and J2 for the MC9S08LG32 receiver pin.
1. To select the MC9S08JM60 Comm MCU as communication device for the Tx SCI signal of the
MC9S08LG32 MCU, place the jumper on position 1–2 on J1.
2. To select the OSBDM MCU as a communication device for the Tx SCI signal of the MC9S08LG32
MCU, place the jumper on position on 2-3 on J1.
3. To select the MC9S08JM60 Comm MCU as a communication device for the Rx SCI signal of the
MC9S08LG32 MCU, place the jumper on position 1-2 on J2.
4. To select the MC9S08JM60 Comm MCU as a communication device for the Rx SCI signal of the
MC9S08LG32 MCU, place the jumper on position 2-3 on J2.
2.3.5 Test Points
TSSEVB includes several test points for electrical test. Table 2-3 lists all the test points.
Table 2-3. Test Points on the TSSEVB
Test Point Signal
TP1 GND test point
TP2 GND test point
TP3 Vin test point
TP4 V_Main test point
J1
Tx
J1
Tx
J2
Rx
J2
Rx
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2.3.6 BDM Header
BDM has the ability to program either the MC9S08LG32 MCU or the MC9S08JM60 Comm MCU.
1. To choose the MC9S08LG32 MCU as a programming target, place jumpers on position 5–3 and
6–4 on J6.
Figure 2-9. Jumper Placement for the MC9S08LG32 MCU
2. To choose the MC9S08JM60 Comm MCU as a programming target, place jumpers on position 3–1
and 4–2 on J6.
Figure 2-10. Jumper Placement for the MC9S08JM60 Comm MCU
2.3.7 Comm PORT
The communication port provides access to the communication modules of the MC9S08JM60 Comm
MCU. Table 2-4 shows the MC9S08JM60 Comm MCU peripherals.
2.3.8 IIC Communication
When using the Electrode Graphing Tool, the communication between the MC9S08LG32 MCU and the
MC9S08JM60 Comm MCU is required. The communication is achieved through the IIC module from
each MCUs. J10 and J11 connect the IIC modules from both MCUs.
1. To connect the SCL signals of the MC9S08LG32 MCU and the MC9S08JM60 Comm MCU, place
the jumper on J10.
Table 2-4. MC9S08JM60 Comm MCU Peripherals
MISO1 1 2 RX1
MOSI1 3 4 TX1
SPSCK1 5 6 SCL
SS1 7 8 SDA
VIN 9 10 GND
J6
BDM Header
J6
BDM Header
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Figure 2-11. Jumper Placement for SCL Signals
2. To connect the SDA signals of the MC9S08LG32 MCU and the MC9S08JM60 Comm MCU, place
the jumper on J11.
Figure 2-12. Jumper Placement for SDA Signals
2.3.8.1 Using the TSSEVB IIC Communication Module
You can use the TSSEVB board to monitor the capacitance variations on the electrodes form your
application. The TSSEVB features a Communication MCU that communicates every TSS application with
the Electrode Graphing Tool Software. This section discusses the steps required to use the TSSEVB
communication module as a bridge between your application and the Electrode Graphing Tool (EGT)
software.
2.3.8.1.1 Setting Up the Software
1. Add the EGT communication files to your application. To do so, you must follow the steps
described in "Application Setup" section of the Touch Sensing Software Electrode Graphing Tool
Users Guide (document TSSEGTUG).
2. To access the EGT communication files, first install the EGT software. After the software is
installed, the EGT communication files can be found at the following path:
C:\Program Files\Freescale\Electrode Graphing Tool x.x\Example\
TSSEVB_EGT_Example\Sources\EGT
2.3.8.1.2 Setting Up the Hardware
This section describes the steps required to connect the TSS application to the TSSEVB Communication
module.
1. Remove the jumpers located in connectors J10 (SCL) and J11 (SDA) from TSSEVB.
2. Select the appropriated voltage on connector J5 depending on the voltage supplied to your
application.
3. Set the connector J4 jumper to position 2-3 (USB2).
4. Connect the I2C lines from your application to connector J10 and J11 as shown in Figure 2-13. You
must also have a ground (GND) connection between the TSS application hardware and the
TSSEVB. The TSSEVB Communication module provides the pull-up resistors for the I2C
communication.
J10
SCL
J11
SDA
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Figure 2-13. Connections Between the TSS Application Hardware and the TSSEVB Board
5. After you have set all the connections, turn on the TSS application hardware and the TSSEVB
board, then launch the EGT software. The GUI should start showing the electrodes capacitance
measurements. For more information regarding the use of the EGT software, refer to the Touch
Sensing Software Electrode Graphing Tool Users Guide (document TSSEGTUG).
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Chapter 3
TSSEVB Interfaces
3.1 MC9S08JM60 Comm MCU
TSSEVB includes a MC9S08JM60 Comm MCU that works as a bridge between MC9S08LG32 and the
PC when using the EGT.
The MC9S08JM60 Comm MCU is loaded with the firmware that allows:
• Communication with the MC9S08LG32 microcontroller through the IIC protocol
• Communication with the PC through the USB protocol
TSSEVB offers the possibility to connect the MC9S08LG32 MCU with the MC9S08JM60 Comm MCU
using the SCI module. In the communication port, all the communication modules of the MC9S08JM60
Comm MCU (SCI, IIC, and SPI) are mapped.
3.1.1 Re-Programming MC9S08JM60 Comm MCU on the TSSEVB
If the firmware loaded from factory of the MC9S08JM60 Comm MCU is lost or somehow corrupted, you
can reload the firmware back into the MC9S08JM60 Comm MCU.
To re-program the MC9S08JM60 Comm MCU:
1. Ensure that you have installed the latest version of CodeWarrior Development Studio, available on
the Freescale web site at www.frescale.com.
2. Download the latest version of the TSSEVB USB Bridge file from the Freescale web site at
www.frescale.com/touchsensing.
3. Connect the PC to the MC9S08JM60 Comm MCU USB connector. To locate the MC9S08JM60
Comm MCU USB connector, refer to Section Section 2.1.1.
4. Select the MC9S08JM60 Comm MCU as target of the OSBDM by setting jumpers on position 1–3
and 2–4 from connector J6 on the TSSEVB. Figure 3-1 shows the required configuration of
connector J6.
Figure 3-1. MC9S08JM60 Comm MCU programming configuration
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5. Open the TSSEVB USB Bridge file using CodeWarrior Development Studio. From the
CodeWarrior main menu, select Project > Debug to compile and download the firmware into the
MC9S08JM60 Comm MCU.
3.2 IIC Interface
The MC9S08JM60 Comm MCU connects to the MC9S08LG32 MCU through the IIC protocol. The
communication between the MC9S08JM60 Comm MCU and the MC9S08LG32 MCU is needed when
you are using EGT. The MC9S08JM60 Comm MCU acts like a bridge between the MC9S08LG32 MCU
with TSS and the PC. The MC9S08JM60 Comm MCU includes the firmware that allows communication
with the MC9S08LG32 MCU. The TSSEVB board allows you to use the IIC module of the MC9S08JM60
Comm MCU for your own application. To do so, you must configure J10 and J11 jumpers from the
TSSEVB board and you can connect with the IIC module of the MC9S08JM60 Comm MCU module
through the communication header.
3.3 USB Interface
When the MC9S08JM60 Comm MCU is acting like a bridge, it communicates with the PC using the USB
protocol. The bridge program is loaded to the MC9S08JM60 Comm MCU by default, but the
MC9S08JM60 Comm MCU can be re-programmed using the OSBDM and the appropriate jumper
configuration on the TSSEVB board. The MC9S08JM60 Comm MCU uses the USB module of
MC9S08JM to achieve the communication with the PC.
3.4 SCI Interface
The MC9S08JM60 Comm MCU can communicate with MC9S08LG32 through the Serial
Communication Interface (SCI) protocol. To connect both MCUs, configure the jumpers on header J1 and
J2 respectively. The communication through SCI is not currently implemented and may be used in a future
demo application.
3.5 OSBDM MCU
An Open Source Background Debug Module (OSBDM) interface is available on TSSEVB. The OSBDM
interfaces to the MCU, which provides an interface for programming the on-chip flash. The BDM
connector provides the ability to connect a debug interface for development and accessing memory data.
The BDM has the ability to program MC9S08LG32 or the MC9S08JM60 Comm MCU on the board. This
is accomplished by setting the J6 connectors appropriately. The BDM interface can also be used for
traditional debugging. Debugging is accomplished using the CodeWarrior IDE for HCS08.
3.6 Additional BDM Connector for MC9S08LG32
The connector for an external BDM is also included in the TSSEVB board. This enables you to use an
external BDM to program MC9S08LG32. To enable the external BDM, leave the jumpers on J6 either
disconnected, or connected to the Communications MCU between 1-3 and 2-4.
