UBA2024 Half-bridge power IC for CFL lamps Rev. 5 -- 16 September 2010 Product data sheet 1. General description The UBA2024 is a family of high-voltage monolithic Integrated Compact Fluorescent Lamp (CFL) drivers for a large range of lamp powers. Specific versions are optimized for 230 V and 110 V mains supplies. The product family integrates full CFL controller functionality with high voltage half-bridge transistors. All products in the UBA2024 family are pin-to-pin compatible enabling a single application design covering a wide range of power ratings. The IC features a soft start function, an adjustable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers. 2. Features and benefits The common feature set includes: high power efficiency a high integration level with low component counts enabling small form factor electronic ballast integrated bootstrap diode soft start function minimum glow time control integrated low-voltage supply adjustable operating frequency as a result of the embedded oscillator an accurate 50 % duty cycle provided by an embedded oscillator signal integrated half-bridge power transistors an internal drive function with a high-voltage level shifter up to 550 V (300 V for the UBA2024BP and UBA2024BT) 3. Applications Driver for any kind of half-bridge configured load up to 23 W, provided that the maximum junction temperature is not exceeded Designed for electronically self-ballasted CFL lamps UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 4. Ordering information Table 1. Ordering information Type number Package Name Description Version UBA2024P[1] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 UBA2024T[1] SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 UBA2024AP[2] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 UBA2024AT[3] SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 UBA2024BP[4] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1 UBA2024BT[4] SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 [1] For this type number, RDS(on) = 9 and ISAT = 900 mA. [2] For this type number, RDS(on) = 6 and ISAT = 1350 mA. [3] For this type number, RDS(on) = 6.4 and ISAT = 1200 mA. [4] For this type number, RDS(on) = 2 and ISAT = 2500 mA. 5. Block diagram (6) 4 (3) 11 VDD CONTROL VDD SW FS 6* (7)** HS 8 (1) SWEEP AND GLOW TIME CONTROL VDD(stop) HIGH VOLTAGE LEVEL SHIFTER HIGH SIDE DRIVER (5) 14 RC HV 7 (8) OSCILLATOR DIVIDE-BY-2 OUT LS DEAD TIME LOW SIDE DRIVER SGND 1,2,3,5,9,10,13 (2) (4) 12 PGND mdb029 Fig 1. Block diagram UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 2 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 6. Pinning information 6.1 Pinning UBA2024P UBA2024AP UBA2024BP SW 1 8 RC SGND 2 7 VDD FS 3 6 HV PGND 4 5 OUT SGND 1 14 OUT SGND 2 13 SGND SGND 3 HV 4 SGND 5 VDD 6 RC 7 12 PGND UBA2024T UBA2024AT 11 FS UBA2024BT 014aaa657 Fig 2. 10 SGND 9 SGND 8 SW 014aaa804 Pinning diagram SOT97-1 Fig 3. Pinning diagram SOT108-1 6.2 Pin description Table 2. UBA2024 Product data sheet Pin description Symbol Pin SOT97-1 Pin SOT108-1 Description SW 1 8 sweep timing input SGND 2 1, 2, 3, 5, 9, 10, 13 signal ground FS 3 11 high-side floating supply output PGND 4 12 power ground OUT 5 14 half-bridge output HV 6 4 high-voltage supply VDD 7 6 internal low-voltage supply output RC 8 7 internal oscillator input All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 3 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 7. Functional description 7.1 Supply voltage The UBA2024 does not require an external low-voltage supply as the mains supply voltage applied to pin HV powers it. The IC derives its own low supply voltage from this for its internal circuitry. 7.2 Start-up state With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitors on the bootstrap pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to ground. The start-up state is defined until VDD = VDD(startup). 7.3 Sweep mode The IC enters the sweep mode when the voltage on pin VDD VDD(startup). The capacitor on pin SW is charged by ISW and the half-bridge circuit starts oscillating. The circuit enters the start-up state again when the voltage on pin VDD VDD(stop). The sweep time (tsweep) is determined by the charge current (Ich(sw)) and the external capacitor (CSW). Typical the total sweep time set by CSW is: t sweep = C SW nF 10.3 ms (1) During the sweep time the current flowing through the lamp electrodes performs some preheating of the filaments. See Figure 5. 7.4 Reset A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage Vfloat(UVLO). 7.5 Oscillation The oscillation is based upon the 555-timer function. A self oscillating circuit is made with the external resistor ROSC and the capacitor COSC (see Figure 4). To realize an accurate 50 duty cycle, an internal divider is used. This reduces the bridge frequency to half the oscillator frequency. The output voltage of the bridge will change at the falling edge of the signal on pin RC. The design equation for the half-bridge frequency is: 1 f osc = ---------------------------------------k R OSC C OSC (2) An overview of the oscillator signal, internal LS and HS drive signals and the output is given in Figure 4. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 4 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps VRC 0 time HS drive 0 time LS drive 0 time VOUT half bridge 0 time 014aaa658 Fig 4. Oscillator, drivers and output signals When entering the sweep mode (VSW = 0 V), the bridge oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal frequency (bridge), set by ROSC and COSC. During the sweep mode the amplitude of the RC oscillator on pin RC, will swing between Vtrip(osc)low and VSW + 0.4Vtrip(osc)high. The amplitude of the RC oscillator will continue to increase until VSW + 0.4Vtrip(osc)high = Vtrip(osc)high, this determines the end of the sweep time. The voltage on pin SW however will continue to rise until it reaches supply voltage level. During this continuous decrease in frequency, the circuit approaches the resonance frequency of the load, and this causes a high voltage across the load, which ignites the lamp. The sweep to resonance time should be much larger than the settling time of the supply voltage on pin HV, to guarantee that the full high-voltage is present at the moment of ignition. See Figure 5. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 5 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps VHV time 0 VDD VDD(startup) time VSW VDD 0.6 Vtrip(osc)high 0 time fosc 2.5nom nom 0 Vlamp Vign time minimum glow time control VgloA Vnom time 0 tsweep 014aaa659 Fig 5. 7.6 Start-up frequency behavior Glow time control The inherent glow time of cold-started CFL lamps reduces the switching lifetime of the electrodes. To make this glow phase as short as possible, the maximum power is given to the lamp during the glow time via a special control. See Figure 5. 7.7 Non-overlap time The non-overlap time is defined as the time when both MOSFETs are not conducting. The non-overlap time is fixed internally. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 6 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VHV voltage on pin HV normal operation Min Max Unit UBA2024P - 373 V UBA2024AP - 373 V UBA2024T - 373 V UBA2024AT - 373 V UBA2024BP - 187 V UBA2024BT - 187 V - 550 V mains transients during 0.5 s UBA2024P UBA2024AP - 550 V UBA2024T - 550 V UBA2024AT - 550 V UBA2024BP - 300 V UBA2024BT - 300 V VHV VHV + 14 V low voltage; DC supply 0 14 V supply current low voltage; peak value is internally limited; Tamb = 25 C 0 5 mA VPGND voltage on pin PGND referenced to SGND 1 +1 V VRC voltage on pin RC IRC 1 mA 0 VDD V VSW voltage on pin SW ISW 1 mA 0 VDD V SR slew rate pin OUT; repetitive Tj junction temperature Tamb ambient temperature Tstg storage temperature VFS voltage on pin FS VDD supply voltage IDD VESD electrostatic discharge voltage 4 +4 V/ns 40 +150 C 40 +150 C 55 +150 C UBA2024P: pins HV and VDD - 1000 V UBA2024AP: pin HV - 1000 V UBA2024T: pin HV - 1000 V UBA2024AT: pin HV - 1000 V UBA2024BP: pin HV - 1000 V UBA2024BT: pin HV - 1000 V - 2500 V pin FS - 200 V pins HV, VDD, SW, RC, and OUT - 250 V [1] human body model: [2] pins SW, RC, FS, and OUT machine model: [3] [1] The maximum junction temperature must not be exceeded. [2] In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 7 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps [3] In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 k series resistor and a 0.75 H inductor. 9. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter thermal resistance from junction to ambient Rth(j-a) thermal resistance from junction to case Rth(j-c) [1] Conditions Typ Unit SO14 package 95 K/W DIP8 package 95 K/W SO14 package 8 K/W DIP8 package 16 K/W [1] in free air [1] in free air In accordance with IEC 60747-1 10. Characteristics Table 5. Characteristics Tj = 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit High-voltage supply VHV VFS voltage on pin HV voltage on pin FS mains transients during 0.5 s; IHV 30 A UBA2024P 0 - 550 V UBA2024AP 0 - 550 V UBA2024T 0 - 550 V UBA2024AT 0 - 550 V UBA2024BP 0 - 250 V UBA2024BT 0 - 250 V UBA2024P 0 - 564 V UBA2024AP 0 - 564 V UBA2024T 0 - 564 V UBA2024AT 0 - 564 V UBA2024BP 0 - 264 V UBA2024BT 0 - 264 V VHV = 100 V; Rosc = ; VSW = VDD; VRC = 0 V 11.7 12.5 13.3 V VHV = 100 V; Rosc = ; VSW = VDD; VRC = 0 V - - 0.39 mA 10 11 12 V mains transients during 0.5 s; IHV 30 A Low-voltage supply VDD supply voltage Start-up state IHV current on pin HV VDD(startup) start-up supply voltage VDD(stop) stop supply voltage 8 8.5 9 V VDD(hys) hysteresis of supply voltage 2 2.5 3 V UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 8 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps Table 5. Characteristics ...continued Tj = 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit UBA2024P - 9.7 11 UBA2024T - 9.7 11 UBA2024AP - 6.5 7.4 UBA2024AT - 7.0 8.0 UBA2024BP - 2.0 2.35 UBA2024BT - 2.0 2.35 UBA2024P - 8.5 9.4 UBA2024T - 8.5 9.4 UBA2024AP - 5.7 6.3 UBA2024AT - 6.2 6.9 UBA2024BP - 2.3 2.55 UBA2024BT - 2.3 2.55 HS; IF = 200 mA - - 2.2 V LS; IF = 200 mA - - 2.0 V bootstrap diode; IF = 1 mA 0.7 1.0 1.3 V UBA2024P 900 - - mA UBA2024AP 1350 - - mA UBA2024T 900 - - mA UBA2024AT 1200 - - mA UBA2024BP 2500 - - mA UBA2024BT 2500 - - mA UBA2024P 900 - - mA UBA2024AP 1350 - - mA UBA2024T 900 - - mA UBA2024AT 1200 - - mA UBA2024BP 2500 - - mA UBA2024BT 2500 - - mA 1 1.35 1.7 s 3.6 4.2 4.8 V Output stage Ron on-state resistance HS transistor; VHV = 310 V; ID = 100 mA HS transistor; VHV = 160 V; ID = 100 mA LS transistor; ID = 100 mA VF IDsat forward voltage drain saturation current HS; VDS = 30 V; Tj 125 C; VHV = 310 V HS; VDS = 30 V; Tj 125 C; VHV = 160 V LS; VDS = 30 V; Tj 125 C tno non-overlap time Vfloat(UVLO) undervoltage lockout floating voltage UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 9 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps Table 5. Characteristics ...continued Tj = 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC. Symbol Parameter Conditions Min Typ Max Unit IFS current on pin FS VHV = 310 V; VFS = 12.2 V UBA2024P, UBA2024T 10 14 18 A UBA2024AP, UBA2024AT 10 14 18 A 10 14 18 A VHV = 160 V; VFS = 12.2 V UBA2024BP, UBA2024BT Internal oscillator fosc oscillator frequency fosc/fosc relative oscillator frequency variation kH high-level trip point factor Vtrip(osc)hig high oscillator trip voltage VSW = 0 V - 150 - kHz VSW = VDD - - 60 kHz operating; nominal; ROSC = 100 k; COSC = 220 pF; VSW = VDD 40.05 41.32 42.68 kHz ROSC = 100 k; COSC = 220 pF; 20 C Tj +150 C - 2 - % 0.382 0.395 0.408 4.58 4.94 5.29 0.030 0.033 0.036 Vtrip(osc)low = kL VDD 0.367 0.413 0.458 V ROSC = 100 k; COSC = 220 pF 1.065 1.1 1.35 V Vtrip(osc)high = kH VDD V h kL low-level trip point factor Vtrip(osc)low low oscillator trip voltage Kosc oscillator constant Sweep function Ich(sweep) sweep charge current VSW = 0 V 215 280 345 nA tsweep sweep time CSW = 33 nF; VDD = 12.2 V 0.28 0.35 0.45 s UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 10 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 11. Application information 1.8 mH LFILT RFUS AC mains supply (230 V) D1 D2 max. 550 V HV SW 11 W/150 mA FS VDD CHB2 47 nF CFS 10 nF CBUF 4.7 uF 33 D3 CLA 1.5 nF CHB1 47 nF D4 OUT 3.1 mH LLA ROSC 110 K UBA2024 CVDD 10 nF RC CDV 100 pF CSW 33 nF COSC 180 pF SGND PGND mdb033 Fig 6. Schematic of 230 V standard compact fluorescent lamp application using UBA2024 LFILT HV maximum 300 V 1.5 mH D1 D2 4.7 D4 D3 FS CHB1 150 nF RFUS AC mains supply (120 V) VDD CFS 10 nF CBUS 33 F 24 W/300 mA LR CFL 0.66 mH CHB2 150 nF CRS CDVDT 820 pF ROSC 26.1 k RC OUT UBA2024B SW CSW 470 nF PGND RSW 4.7 M COSC 1.2 nF CVDD 10 nF SGND 10 nF 001aam620 Fig 7. Schematic of 120 V standard compact fluorescent lamp application using UBA2024B UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 11 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 12. Package outline DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.02 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. Fig 8. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT97-1 050G01 MO-001 SC-504-8 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Package outline SOT97-1 (DIP8) UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 12 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 8o o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. Fig 9. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Package outline SOT108-1 (SO14) UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 13 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 13. Revision history Table 6. Revision history Document ID Release date Data sheet status Change notice Supersedes UBA2024 v.5 20100916 Product data sheet - UBA2024_4 Modifications: * Latest NXP template applied. * Legal page updated. * UBA2024BP and UBA2024BT added to Table 1 "Ordering information". * Section 1 "General description" and Section 2 "Features and benefits" updated. * Section 8 "Limiting values" and Section 10 "Characteristics" updated. * Application information updated. * Figure 7 "Schematic of 120 V standard compact fluorescent lamp application using UBA2024B" added. UBA2024_4 20090917 Product data sheet - UBA2024_3 UBA2024_3 081016 Product data sheet - UBA2024_2 UBA2024_2 040203 Product data sheet - UBA2024_1 UBA2024_1 030813 Product data sheet - - UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 14 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 14. Legal information 14.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term `short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 14.2 Definitions Draft -- The document is a draft version only. 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NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). 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Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 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Export might require a prior authorization from national authorities. UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 15 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond 14.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 15. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com UBA2024 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 5 -- 16 September 2010 (c) NXP B.V. 2010. All rights reserved. 16 of 17 UBA2024 NXP Semiconductors Half-bridge power IC for CFL lamps 16. Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 7.5 7.6 7.7 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 15 16 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 4 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Sweep mode. . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Oscillation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Glow time control . . . . . . . . . . . . . . . . . . . . . . . 6 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics . . . . . . . . . . . . . . . . . . 8 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 11 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'. (c) NXP B.V. 2010. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 16 September 2010 Document identifier: UBA2024