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SMQ MELF PIN Diode
MA4P7418-1072T
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
1
V3
Designed for Automated Assembly
Features
♦ RoHS Compliant
♦ Rectangular MELF SMQ Ceramic Package
♦ Low Rs for Low Series Loss
♦ Long τL for Low Intermodulation Distortion
♦ Low Cj for High Series Isolation
♦ High Average Incident Power Handling
Description and Applications
The MA4P7418-10720T is a surface mount PIN
diode in a Metal Electrode Leadless Faced
(MELF) package. The device incorporates
M/A-COM Technology Solutions time proven
HIPAX technology to produce a low inductance
ceramic package with no ribbons or whisker
wires. Incorporated in the package is a fully pas-
sivated PIN diode chip that is full face bonded on
both the cathode and anode to maximize the sur-
face contact area for low electrical and thermal
resistance. The MA4P7418-10720T has been
comprehensively characterized both electrically
and mechanically to ensure repeatable and
predictable performance. The diode is well suited
for use in low loss, low distortion, high power
switching circuits. The low thermal resistance of
this device provides excellent high average
performance at RF power incident levels up to
200 watts CW. This device is designed to meet
the most rigorous electrical and mechanical
requirements.
SMQ MELF PIN diodes are designed for high
volume tape and reel assembly. The rectangular
package design provides a highly efficient means for
automatic pick and place assembly techniques. The
parallel flat surfaces are suitable for key jaw or
vacuum pickup techniques. All solderable surfaces
are tin plated and compatible with reflow and vapor
phase soldering methods.
Absolute Maximum Ratings1 @ +25°C
Parameter Absolute Maximum
Operating Temperature -65°C to +125°C
Storage Temperature -65°C to +200°C
Diode Junction Temperature +175°C
Diode Mounting Temperature +265°C for 10 seconds
Forward D.C. Current +150mA
Reverse D.C. Voltage -1100V
Power Dissipation @ +25°C
De-rate linearly by to 0W
@ +175C by –76.6 mW/°C
Using Infinite Heat Sink
11.5 W
C.W. Thermal Resistance (ϴjc)
Using Infinite Heat Sink 13 °C/W
1. Exceeding any of these limits may cause permanent
damage.
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