HT-380 Series Top View LED (PCB type) Features Package Outline Dimensions (Unit: mm Tolerance:+/-0.1) Chip LED ( 1.6x1.6x0.4 ) Super compact Electrical / Optical Characteristics Part Number Cathode Line 0.40.08 1.6 0.35 Pin6 Pin5 Pin4 1.1 1.6 Die2 G 0.45 Die2 Die3 Die1 Pin4 Pin5 Pin6 HT-380FCH 0.8 Die1 B 0.225 0.4 Full color Emitting color Pin1 Pin2 Pin3 Resin 0.4 Die3 R Pin3 Pin2 Pin1 Material C O Forward Voltage(VF) Wavelength (nm) typ. Luminous Intensity (mcd)* typ. max. Ultra Bright Orange AllnGaP 1.9 Green lnGaN Blue lnGaN I F ( mA ) Viewing Angle 2 _12 D P min. typ. 2.4 622 636 17 70 120 20 120 3.3 3.9 527 520 40 110 200 20 120 3.3 3.9 470 468 40 45 90 20 120 *Per NIST standards Polarity PCB Forward Current vs. Forward Voltage Relative Intensity vs. Forward Current 150 30 120 24 Forward Current vs. Ambient Temperature 30 0 -30 90 NB/NG 60 30 NG 12 NB 6 12 18 24 15 NB/NG 10 1.6 2.0 0.5 30 500 490 480 NB 470 460 4 8 12 Forward Current (mA) 0.8 0.125 60 -20 0 20 40 60 80 100 Ambient Temperature (OC) Dominant Wavelength vs. Forward Current Dominant Wavelength vs. Forward Current 650 540 530 NG 520 510 500 0 B 0 3.6 (Unit:mm) 0.5 0 3.2 Dominant Wavelength (nm) 0.5 2.8 550 Dominant Wavelength (nm) 0.3 100% 2.4 Forward Voltage (V) 510 Dominant Wavelength (nm) 50% -60 0 30 Dominant Wavelength vs. Forward Current Recommended Soldering Pattern R R 20 6 Forward Current (mA) 60 -30 0 G -60 0 25 5 0 50% 18 30 B 100% USD/UD Forward Current (mA) Directive Characteristics Forward Current (mA) Relative Intensity (%) USD/UD USD/UD 16 20 640 630 USD 620 UD 610 600 0 4 8 12 Forward Current (mA) 16 20 0 20 40 60 80 100 Forward Current (mA) 0.6 G 100% 50% 0 50% 100% Absolute Maximum Ratings o Symbol AllnGaP InGaN Unit Power Dissipation PD 72 78 mW DC Forward Current IF 30 20 mA Pulsed Forward Current I FP* 100 80 mA Reverse Voltage VR 5 Operating Temperature T OP -30 to 80 Storage Temperature T ST -40 to 85 Item C V o C o C * 0.1msec pulse, 10% duty cycle. 30 31 HT-380 Series Top View LED (PCB type) Features Package Outline Dimensions (Unit: mm Tolerance:+/-0.1) Chip LED ( 1.6x1.6x0.4 ) Super compact Electrical / Optical Characteristics Part Number Cathode Line 0.40.08 1.6 0.35 Pin6 Pin5 Pin4 1.1 1.6 Die2 G 0.45 Die2 Die3 Die1 Pin4 Pin5 Pin6 HT-380FCH 0.8 Die1 B 0.225 0.4 Full color Emitting color Pin1 Pin2 Pin3 Resin 0.4 Die3 R Pin3 Pin2 Pin1 Material C O Forward Voltage(VF) Wavelength (nm) typ. Luminous Intensity (mcd)* typ. max. Ultra Bright Orange AllnGaP 1.9 Green lnGaN Blue lnGaN I F ( mA ) Viewing Angle 2 _12 D P min. typ. 2.4 622 636 17 70 120 20 120 3.3 3.9 527 520 40 110 200 20 120 3.3 3.9 470 468 40 45 90 20 120 *Per NIST standards Polarity PCB Forward Current vs. Forward Voltage Relative Intensity vs. Forward Current 150 30 120 24 Forward Current vs. Ambient Temperature 30 0 -30 90 NB/NG 60 30 NG 12 NB 6 12 18 24 15 NB/NG 10 1.6 2.0 0.5 30 500 490 480 NB 470 460 4 8 12 Forward Current (mA) 0.8 0.125 60 -20 0 20 40 60 80 100 Ambient Temperature (OC) Dominant Wavelength vs. Forward Current Dominant Wavelength vs. Forward Current 650 540 530 NG 520 510 500 0 B 0 3.6 (Unit:mm) 0.5 0 3.2 Dominant Wavelength (nm) 0.5 2.8 550 Dominant Wavelength (nm) 0.3 100% 2.4 Forward Voltage (V) 510 Dominant Wavelength (nm) 50% -60 0 30 Dominant Wavelength vs. Forward Current Recommended Soldering Pattern R R 20 6 Forward Current (mA) 60 -30 0 G -60 0 25 5 0 50% 18 30 B 100% USD/UD Forward Current (mA) Directive Characteristics Forward Current (mA) Relative Intensity (%) USD/UD USD/UD 16 20 640 630 USD 620 UD 610 600 0 4 8 12 Forward Current (mA) 16 20 0 20 40 60 80 100 Forward Current (mA) 0.6 G 100% 50% 0 50% 100% Absolute Maximum Ratings o Symbol AllnGaP InGaN Unit Power Dissipation PD 72 78 mW DC Forward Current IF 30 20 mA Pulsed Forward Current I FP* 100 80 mA Reverse Voltage VR 5 Operating Temperature T OP -30 to 80 Storage Temperature T ST -40 to 85 Item C V o C o C * 0.1msec pulse, 10% duty cycle. 30 31