CHIP CARD MODULES Contactless Chip Card Module Specification MOA2 Product Specification Revision 3.0 PUBLIC Philips Semiconductors January 2004 28730 Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 Contents 1 GENERAL INFORMATION ..................................................................................................3 1.1 1.2 2 Definition of a Chip Card Module...................................................................................................................... 3 Use of the Chip Card Module............................................................................................................................. 3 SPECIFICATIONS ..............................................................................................................4 2.1 2.2 2.3 2.4 2.5 2.6 2.7 Chip .................................................................................................................................................................... 4 Dimensions ......................................................................................................................................................... 4 Materials ............................................................................................................................................................. 5 Operating- and Processing Temperature............................................................................................................. 5 Package Drawing ................................................................................................................................................ 6 Splicing Specification......................................................................................................................................... 7 Leader/Trailer Specification ............................................................................................................................... 8 3 PACKING .........................................................................................................................9 4 QUALITY........................................................................................................................ 10 4.1 4.2 4.3 4.4 Qualification and Reliability............................................................................................................................. 10 Lot Acceptance Testing .................................................................................................................................... 10 Complaint Procedure ........................................................................................................................................ 10 Product-/Process-Change Notification ............................................................................................................. 11 5 SECURITY ...................................................................................................................... 12 6 DEFINITIONS .................................................................................................................. 13 7 LIFE SUPPORT APPLICATIONS ........................................................................................ 14 Page 2 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 1 GENERAL INFORMATION 1.1 Definition of a Chip Card Module A chip card module is a packaged chip, which is electrically connected with a metal lead-frame and encapsulated with a mould cap. The chip card module is used, e.g. for further lamination into contactless Smart Cards according to ISO 14443. It can also be incorporated into e.g. disc-shaped data carriers. The chip card module is best suited for automated high volume ISO chip card production or RF transponder production. 1.2 Use of the Chip Card Module The chip card module is designed for connection to a coil and incorporation into a Smart Card (by lamination etc.) or RF transponder. Specific processing information for coil-module interconnection and packaging is given in this specification. Page 3 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 2 SPECIFICATIONS 2.1 Chip For details on functionality and electrical characteristics of the IC see Addendum and respective Functional Specification. 2.2 Dimensions Package Name PLLMC-05 Outline Code SOT500AA1 Super 35 mm Leadframe Format Pitch: 9.5 0.02 mm 3 rows -matrix Package Size proposed punching outline: 5.15 mm x 8.10 mm Encapsulation Size 4.80 0.05 mm x 5.10 0.05 mm Overall Thickness max. 0.4 mm (excluding punching burr and plating) Size of Antenna Connection Area approx. 5.0 mm x 1.4 mm Fig. 1: Module for Contactless Chip Card ICs: PLLMC-05 (SOT500AA1) Page 4 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 2.3 Materials Material Name Description Leadframe Basic material Thickness of basic material Plating material Thickness of overall plating CuSn6 100 +0/-10 m Ag 1 - 2 m Encapsulation Material Technology Colour epoxy based filled mould compound Transfer moulding black 2.4 Operating- and Processing Temperature Allowable Storage & Operating Temperature Range Depends on IC type - see respective Addendum to this specification Processing Parameters for Inlet and Card Production Welding Parameters Soldering Parameters Card Lamination max. 25 ms @ 500 C on contact leads max. 3 s @ 390 C on contact leads 150C for 30 minutes at a standard lamination pressure for contactless smart card plastic materials (e.g. PVC, PET, ABS...) Page 5 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 2.5 Package Drawing Fig.2: Drawing of the SOT500AA1 package. Page 6 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 2.6 Splicing Specification Fig. 3: Dimensions of splicing area Splicing joints per 10 meters: <10 Minimum distance between two joints: 1 m Type of Splicing Tape: Polyimide Film Tape Thermo stability: Tear proof at 190C temperature and 1 N tractive force in 30 s All modules within the splicing area are failure marked (reject hole). Page 7 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 2.7 Leader/Trailer Specification Fig. 4: Dimensions and design of Leader / Trailer tape Material: CuSn6, Ag plated Length: min. 2.1 m Format: Super 35 mm Typical Thickness: 100 m Page 8 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 3 PACKING For all packing issues (reel type and -packing, transport packing, labelling) see separate "General Specification for Packages in Super 35 mm Reel Format". Page 9 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 4 QUALITY 4.1 Qualification and Reliability Requirements and test conditions for (re-)qualifications and reliability testing of Chip Card Modules are detailed in Philips Specifications SNW-FQ-611 (General Quality Specification for Integrated Circuits). 4.2 Lot Acceptance Testing Lot acceptance testing is performed on every lot prior to shipment. Inspection- and test requirements are detailed in the General Quality Specification. The number of tests per lot depending on the lot size can be seen below. DESCRIPTION Mechanical/Visual Electrical REQUIREMENTS Lot-size Accepted 1 K to 10 K 0/125 10 K to 35 K 0/200 35 K to 150 K 0/315 4.3 Complaint Procedure Customers complaints should be sent to the contact person in the local Sales Office, who will forward the complaint directly to the responsible Quality Centre. Return shipments of security relevant products require special agreements for handling and transport between customer and Philips Semiconductors. 4.3.1 Information needed for complaint processing: For fast complaint handling, the documentation supplied with the rejects must include the following information: * customer name * customer contact * Philips Semiconductors part number * lot size * quantity tested * quantity rejected * quantity returned * date code * inspection and test reference number * purchase order reference * test temperature * test equipment * location of failure (incoming inspection, qualification testing, assembly or field) Page 10 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 4.3.2 Analysis After verification of the defect, the defective products are analyzed for the root cause and if applicable, an 8D procedure is performed to solve the problem. Note: For products with enabled security modes/features a detailed electrical and physical analysis may not be practicable. 4.4 Product-/Process-Change Notification The customer will be notified of major changes of the product, which will affect form, fitting, function or reliability of the product. The CPCN will be sent to the customer in written form at least 90 calendar days before implementation of the change unless otherwise specified. Major changes are defined and categorised in detail in the Philips Semiconductors Specification SNW-SQ-650A (Customer Product-/Process Change Notification Procedure). Page 11 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 5 SECURITY For security relevant products special requirements at production, for handling, transport and storage are installed. The security is ensured based on Philips Specification PVV-0-0-2/784 (Security Management System). Page 12 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 6 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics section of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Page 13 of 15 Public Philips Semiconductors Product Specification Revision 3.0 Contactless Chip Card Module Specification - MOA2 7 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. Page 14 of 15 Public Philips Semiconductors - a worldwide company Contact Information For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2002 SCA74 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without any notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Philips Semiconductors