MOA2 - Philips Semiconductors / NXP Semiconductors

CHIP CARD MODULES

Contactless Chip Card Module

Specification

MOA2

January 2004

28730

Product Specification

Revision 3.0

PUBLIC

Philips

Semiconductors

Philips Semiconductors Product Specification Revision 3.0

Contactless Chip Card Module Specification – MOA2

Page 2 of 15 Public

Contents

1 GENERAL INFORMATION ..................................................................................................3

1.1 Definition of a Chip Card Module...................................................................................................................... 3

1.2 Use of the Chip Card Module............................................................................................................................. 3

2 SPECIFICATIONS..............................................................................................................4

2.1 Chip .................................................................................................................................................................... 4

2.2 Dimensions ......................................................................................................................................................... 4

2.3 Materials ............................................................................................................................................................. 5

2.4 Operating- and Processing Temperature............................................................................................................. 5

2.5 Package Drawing................................................................................................................................................ 6

2.6 Splicing Specification......................................................................................................................................... 7

2.7 Leader/Trailer Specification ............................................................................................................................... 8

3 PACKING .........................................................................................................................9

4 QUALITY........................................................................................................................10

4.1 Qualification and Reliability............................................................................................................................. 10

4.2 Lot Acceptance Testing .................................................................................................................................... 10

4.3 Complaint Procedure ........................................................................................................................................ 10

4.4 Product-/Process-Change Notification ............................................................................................................. 11

5 SECURITY......................................................................................................................12

6 DEFINITIONS..................................................................................................................13

7 LIFE SUPPORT APPLICATIONS ........................................................................................14

Philips Semiconductors Product Specification Revision 3.0

Contactless Chip Card Module Specification – MOA2

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1 GENERAL INFORMATION

1.1 Definition of a Chip Card Module

A chip card module is a packaged chip, which is electrically connected with a metal lead-frame and

encapsulated with a mould cap.

The chip card module is used, e.g. for further lamination into contactless Smart Cards according to ISO

14443. It can also be incorporated into e.g. disc-shaped data carriers. The chip card module is best suited

for automated high volume ISO chip card production or RF transponder production.

1.2 Use of the Chip Card Module

The chip card module is designed for connection to a coil and incorporation into a Smart Card (by lamination

etc.) or RF transponder. Specific processing information for coil-module interconnection and packaging is

given in this specification.

Philips Semiconductors Product Specification Revision 3.0

Contactless Chip Card Module Specification – MOA2

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2 SPECIFICATIONS

2.1 Chip

For details on functionality and electrical characteristics of the IC see Addendum and respective Functional

Specification.

2.2 Dimensions

Package Name PLLMC-05

Outline Code SOT500AA1

Leadframe Format

Super 35 mm

Pitch: 9.5 ± 0.02 mm

3 rows -matrix

Package Size proposed punching outline: 5.15 mm x 8.10 mm

Encapsulation Size 4.80 ± 0.05 mm x 5.10 ± 0.05 mm

Overall Thickness max. 0.4 mm (excluding punching burr and plating)

Size of Antenna Connection Area approx. 5.0 mm x 1.4 mm

Fig. 1: Module for Contactless Chip Card ICs: PLLMC-05 (SOT500AA1)

Philips Semiconductors Product Specification Revision 3.0

Contactless Chip Card Module Specification – MOA2

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2.3 Materials

Material Name Description

Leadframe

Basic material CuSn6

Thickness of basic material 100 +0/-10 µm

Plating material Ag

Thickness of overall plating 1 - 2 µm

Encapsulation

Material epoxy based filled mould compound

Technology Transfer moulding

Colour black

2.4 Operating- and Processing Temperature

Allowable Storage & Operating Temperature

Range

Depends on IC type – see respective Addendum to

this specification

Processing Parameters for Inlet and Card

Production

Welding Parameters max. 25 ms @ 500 °C on contact leads

Soldering Parameters max. 3 s @ 390 °C on contact leads

Card Lamination 150°C for 30 minutes

at a standard lamination pressure for contactless

smart card plastic materials

(e.g. PVC, PET, ABS…)

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2.5 Package Drawing

Fig.2: Drawing of the SOT500AA1 package.

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2.6 Splicing Specification

Fig. 3: Dimensions of splicing area

 Splicing joints per 10 meters: <10

 Minimum distance between two joints: 1 m

 Type of Splicing Tape: Polyimide Film Tape

 Thermo stability: Tear proof at ≤ 190°C temperature and ≤ 1 N tractive force in ≤ 30 s

 All modules within the splicing area are failure marked (reject hole).

Philips Semiconductors Product Specification Revision 3.0

Contactless Chip Card Module Specification – MOA2

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2.7 Leader/Trailer Specification

Fig. 4: Dimensions and design of Leader / Trailer tape

 Material: CuSn6, Ag plated

 Length: min. 2.1 m

 Format: Super 35 mm

 Typical Thickness: 100 µm

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3 PACKING

For all packing issues (reel type and –packing, transport packing, labelling) see separate "General

Specification for Packages in Super 35 mm Reel Format".

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4 QUALITY

4.1 Qualification and Reliability

Requirements and test conditions for (re-)qualifications and reliability testing of Chip Card Modules are

detailed in Philips Specifications SNW-FQ-611 (General Quality Specification for Integrated Circuits).

4.2 Lot Acceptance Testing

Lot acceptance testing is performed on every lot prior to shipment. Inspection- and test requirements are

detailed in the General Quality Specification. The number of tests per lot depending on the lot size can be

seen below.

DESCRIPTION REQUIREMENTS

Lot-size Accepted

Mechanical/Visual 1 K to 10 K 0/125

Electrical 10 K to 35 K 0/200

35 K to 150 K 0/315

4.3 Complaint Procedure

Customers complaints should be sent to the contact person in the local Sales Office, who will forward the

complaint directly to the responsible Quality Centre.

Return shipments of security relevant products require special agreements for handling and transport

between customer and Philips Semiconductors.

4.3.1 Information needed for complaint processing:

For fast complaint handling, the documentation supplied with the rejects must include the following

information:

• customer name

• customer contact

• Philips Semiconductors part number

• lot size

• quantity tested

• quantity rejected

• quantity returned

• date code

• inspection and test reference number

• purchase order reference

• test temperature

• test equipment

• location of failure (incoming inspection, qualification testing, assembly or field)

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4.3.2 Analysis

After verification of the defect, the defective products are analyzed for the root cause and if applicable, an 8-

D procedure is performed to solve the problem.

Note: For products with enabled security modes/features a detailed electrical and physical analysis may not

be practicable.

4.4 Product-/Process-Change Notification

The customer will be notified of major changes of the product, which will affect form, fitting, function or

reliability of the product. The CPCN will be sent to the customer in written form at least 90 calendar days

before implementation of the change unless otherwise specified. Major changes are defined and categorised

in detail in the Philips Semiconductors Specification SNW-SQ-650A (Customer Product-/Process Change

Notification Procedure).

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5 SECURITY

For security relevant products special requirements at production, for handling, transport and storage are

installed. The security is ensured based on Philips Specification PVV-0-0-2/784 (Security Management

System).

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6 DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and

operation of the device at these or at any other conditions above those given in the Characteristics section of the

specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

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7 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of

these products can reasonably be expected to result in personal injury. Philips customers using or selling

these products for use in such applications do so on their own risk and agree to fully indemnify Philips for

any damages resulting from such improper use or sale.

Philips Semiconductors - a worldwide company

Contact Information

For additional information please visit http://www.semiconductors.philips.com.Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without any notice. No

liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual

property rights.

Philips

Semiconductors