Rev.3.01, May 10, 2006, page 1 of 6
HD74LS47
BCD-to-Seven-Segment Decoder / Driver (with 15 V Outputs)
REJ03D0410-0301
Rev.3.01
May 10, 2006
HD74LS47 features active-low outputs designed for driving incandescent indicators directly. This device has full
ripple-blanking input / output controls and a lamp test. Display pattern s for BCD input counts above 9 are unique
symbols to authenticate input conditions. This circuit incorporates automatic leading and / or trailing-edge zero-
blanking control (RBI and RBO). Lamp test (LT) of these types may be performed at any time when the BI / RBO
node is at a high level. It contains an overriding blanking input (BI) which can be used to control the lamp intensity of
pulsing or to inhibit the outputs. Inputs an d outputs are entirely compatible for use with TTL or DTL logic outputs.
Features
• Ordering Information
Part Name Package Type Package Code
(Previous Code) Package
Abbreviation Taping Abbreviation
(Quantity)
HD74LS47P DILP-16 pin PRDP0016AE-B
(DP-16FV) P —
HD74LS47FPEL SOP-16 pin (JEITA) PRSP0016DH-B
(FP-16DAV) FP EL (2,000 pcs/reel)
Note: Please consult the sales office for the above packa ge availability.
Pin Arrangement
(Top view)
V
CC
GND
B
C
LT
BI/RBO
RBI
D
A
f
g
b
a
c
d
e
15
161
2
3
4
5
6
7
14
89
10
11
12
13
Outputs
Inputs
Inputs
B
C
D
A
RBI
BI/RBO
LT
f
g
d
e
c
b
a
HD74LS47
Rev.3.01, May 10, 2006, page 2 of 6
Function Table
Inputs Outputs
Decimal or
Function LT RBI D C B A BI/
RBO a b c d e f g
Note
0 H H L L L L H ON ON ON ON ON ON OFF
1 H X L L L H H OFF ON ON OFF OFF OFF OFF
2 H X L L H L H ON ON OFF ON ON OFF ON
3 H X L L H H H ON ON ON ON OFF OFF ON
4 H X L H L L H OFF ON ON OFF OFF ON ON
5 H X L H L H H ON OFF ON ON OFF ON ON
6 H X L H H L H OFF OFF ON ON ON ON ON
7 H X L H H H H ON ON ON OFF OFF OFF OFF
8 H X H L L L H ON ON ON ON ON ON ON
9 H X H L L H H ON ON ON OFF OFF ON ON
10 H X H L H L H OFF OFF OFF ON ON OFF ON
11 H X H L H H H OFF OFF ON ON OFF OFF ON
12 H X H H L L H OFF ON OFF OFF OFF ON ON
13 H X H H L H H ON OFF OFF ON OFF ON ON
14 H X H H H L H OFF OFF OFF ON ON ON ON
15 H X H H H H H OFF OFF OFF OFF OFF OFF OFF
1
BI X X X X X X L OFF OFF OFF OFF OFF OFF OFF 2
RBI H L L L L L L OFF OFF OFF OFF OFF OFF OFF 3
LT L X X X X X H ON ON ON ON ON ON ON 4
H; high level, L; low level, X, irrelevant
Notes: 1. The blanking input (BI) must be open or held at a high logic level when output functions 0 through 15 are
desired. The ripple-blanking input (RBI) must be open or high if blanking of a decimal zero is not desired.
2. When a low logic level is applied directly to the blanking input (BI), all segment outputs are off regardless of
the level of any other input.
3. When ripple-blanking input (RBI) and inputs A, B, C, and D are a low level with the lamp test input hi gh, all
segment outputs go off and the ripple-blank ing output (RBO) goes to a low level (respons e condition).
4. When a blanking input / ripple blanking output (BI / RBO) is open or h eld high and a low is applied to the
lamp-test input, all segment outputs are on.
a
543210 6 7 8 9 101112131415
b
d
c
f
e
g
HD74LS47
Rev.3.01, May 10, 2006, page 3 of 6
Block Diagram
Blanking Input or
Ripple Blanking
Output (BI/RBO)
Lamp Test
Input (LT)
Ripple Blanking
Input (RBI)
Outputs
Inputs
A
B
C
D
a
b
c
d
e
f
g
Absolute Maximum Ratings
Item Symbol Ratings Unit
Supply voltage VCC 7 V
Input voltage VIN 7 V
Output current
(tw ≤ 1ms,duty cycle ≤ 10%) IO(peak) 200 mA
Output current (off) IO(off) 1 mA
Power dissipation PT 400 mW
Operating temperature Tupr –20 to +75 °C
Storage temperature Tstg –65 to +150 °C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
HD74LS47
Rev.3.01, May 10, 2006, page 4 of 6
Recommended Operating Conditions
Item Symbol Min Typ Max Unit
Supply voltage VCC 4.75 5.00 5.25 V
Output voltage (off) VO(off) — — 15 V
Input current (on) IO(on) — — 24 mA
IOH — — –50 µA
Output current IOL — — 3.2 mA
Operating temperature Topr –20 25 75 °C
Electrical Characteristics
(Ta = –20 to +75 °C)
Item Symbol min. typ.* max. Unit Condition
VIH 2.0 — — V
Input voltage VIL — — 0.8 V
VOH 2.4 — — V
VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH
= –50 µA
— — 0.4 IOL = 1.6 mA
BI / RBO VOL — — 0.5
V IOL = 3.2 mA VCC = 4.75 V,
VIH = 2 V, VIL = 0.8 V
— — 0.4 IO(on) = 12 mA
Output
voltage
a to g VO(on) — — 0.5
V IO(on) = 24 mA VCC = 4.75 V,
VIH = 2 V, VIL = 0.8 V
Output
current a to g IO(off) — — 250 µA VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V,
VO(off) = 15 V
I
IH — — 20 µA VCC = 5.25 V, VI = 2.7 V
All input
except
BI / RBO — — –0.4 mA
BI / RBO
IIL
— — –1.2 mA
VCC = 5.25 V, VI = 0.4 V Input current
I
I — — 0.1 mA VCC = 5.25 V, VI = 7 V
Short-circuit
output current BI / RBO IOS –0.3 — –2 mA VCC = 5.25 V
Supply current** ICC — 7 13 mA VCC = 5.25 V
Input clamp voltage VIK — — –1.5 V VCC = 4.75 V, IIN = –18 mA
Notes: * VCC = 5 V, Ta = 25°C
** ICC is measured with all outputs ope n and inputs at 4.5 V.
Switching Characteristics
(VCC = 5 V, Ta = 25°C)
Item Symbol Input min. typ. max. Unit Condition
A — — 100
Turn-on time ton RBI — — 100 ns
A — — 100 Turn-off time toff RBI — — 100 ns CL = 15 pF, RL = 665 Ω
HD74LS47
Rev.3.01, May 10, 2006, page 5 of 6
Testing Method
Test Circuit
4.5V
A
B
C
D
LT
RBI
BI/RBO
Input
P.G.
Z
out
= 50Ω
See Function Table
Output
V
CC
a
b
d
c
e
f
g
R
L
C
L
Note: CL includes probe and jig capacitance.
Waveform
t
off
t
on
V
OH
V
OL
0 V
3 V
V
OH
V
OL
t
on
t
off
10%
90%
1.3 V
1.3 V 1.3 V
1.3 V 1.3 V
1.3 V
10%
90%
Input
In phase output
Out of phase output
t
TLH
t
THL
Note: Input pulse: tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz, duty cycle 50%.
Testing Table
Inputs Outputs
Item RBI D C B A a b c d e f g
4.5 V GND GND GND IN OUT — — OUT OUT OUT —
4.5 V GND GND 4.5 V IN — — OUT — OUT — —
4.5 V GND 4.5 V 4.5 V IN OUT OUT — OUT OUT OUT OUT
ton
toff IN GND GND GND GND OUT OUT OUT OUT OUT OUT —
HD74LS47
Rev.3.01, May 10, 2006, page 6 of 6
Package Dimensions
7.62
MaxNomMin
Dimension in Millimeters
Symbol
Reference
19.2
6.3
5.06
A1
Z
b3
D
E
A
bp
c
θ
e
L
e1
0.51
0.56
1.30
0.19 0.25 0.31
2.29 2.54 2.79
0° 15°
20.32
7.4
0.40 0.48
1.12
2.54
1
p
1
3
1 8
16 9
e
b
A
LA
Z
e c
E
D
b
0.89
θ
( Ni/Pd/Au plating )
P-DIP16-6.3x19.2-2.54 1.05g
MASS[Typ.]
DP-16FVPRDP0016AE-B
RENESAS CodeJEITA Package Code Previous Code
0.80
0.15
1.27
7.50 8.00
0.400.34
A1
10.5
MaxNomMin
Dimension in Millimeters
Symbol
Reference
2.20
0.900.700.50
5.50
0.200.100.00
0.46
0.250.200.15
7.80
8°0°
0.12
1.15
10.06
L1
Z
HE
y
x
θ
c
bp
A2
E
D
b1
c1
e
L
A
*1
*2
E
81
16 9
xM
p
*3
y
F
Index mark
b
D
E
H
Z
A
Terminal cross section
( Ni/Pd/Au plating )
p
c
b
1
1
Detail F
L
L
A
θ
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
e
P-SOP16-5.5x10.06-1.27 0.24g
MASS[Typ.]
FP-16DAVPRSP0016DH-B
RENESAS CodeJEITA Package Code Previous Code
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0
