SPECIFICATIONS Burn-In & Test Socket Burn-In Socket Series BGA Type, Open Top, Type 2 0.80 mm [.031"] Pitch 90 Pos. Mechanical Durability: 10'000 cycles min. Actuation force: 2.5kgf max. Electrical Current Rating: 1Amp/pin min. Dielectric Withstanding Voltage: 650V A.C for 60 sec. Insulation Resistance: 1000M min. Contact Resistance: 150m max. Hast: Pass 85 at 85% RH, 50 hours duration Temperature cycling: Pass -55 to 125, 1000 cycles Bake : Pass 150 for 168 hours Physical Cover & Base & Lid: Thermoplastic, UL 94V-0 Contact: Copper alloy Contact Plating: See "ORDERING INFORMATION" Operating Temperature: 150 max. DRAWING ORDERING I N FO R M ATIO N PRODUCT NO.: 2 Q 0 0 * * 3 7 - 3 3 2 * - 1 0 F Pin Counts 0072=72 Pos. 0090=90 Pos. LF Code F=Lead Free Tail Plating Pick-up Design 3=Au 0=None Contact Plating 2Q009037-3325-10F 2Q009037-3324-10F 2Q009037-3321-10F 2Q007237-332A-10F 2Q007237-3321-10F P/N 90 90 90 72 72 POS. 12.0x8.0 11.5x11.0 12.5x10.0 19.5x11.5 12.5x10.0 CHIP SPEC. Package 7=15" Gold Plating 1=Soft Tray Chip/Burn-in Board Chip Spec. 3=BGA/PGA 1=12.5x10.0 4=11.5x11.0 5=12.0x8.0 A=10.5x11.5 Pitch 3=0.80 mm Design Type 2=Type #2 All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.