03 GENE-APL7 SubCompact Boards 3.5" SubCompact Board with Intel(R) Pentium(R) N4200/ Celeron(R) N3350 Processor SoC Features LVDS Intel(R) Pentium(R) N4200/ Celeron(R) N3350 Processor SoC DDR3L 1866 MHz SODIMM x 1, up to 8 GB VGA/LVDS1/LVDS2 (LVDS1 Co-design with eDP COM SATA 6.0 Gb/s x 1, GPIO x 8 USB 3.0 x 2, USB 2.0 x 8, COM x 12 USB USB3.0 mSATA x 1 (Full size), Mini Card x 1 (Full size) with uSIM DC 12V Only, AT/ATX Mode COM x 2 VGA LAN Specifications SATA 3 System Form Factor 3.5'' SubCompact Board CPU Intel(R) Pentium(R) N4200/ Celeron(R) N3350 Processor SoC CPU Frequency Up to 2.5 GHz Chipset Intel(R) Pentium(R) N4200/ Celeron(R) N3350 Processor SoC Memory Type DDR3L 1866MHz, SODIMM x 1 Max. Memory Capacity Up to 8GB BIOS AMI Wake on LAN Yes Watchdog Timer 255 Levels Power Requirement 12V Only Power Supply Type AT/ ATX Power Consumption (Typical) Packing List * GENE-APL7 Optional Accessories Part Number Description QTY 1700050207 (TF)USB CABLE.1*5P Pitch=1.25mm Housinh. 20cm. for PFM-945C 8 1701090150 (TF)Flat Cable.D-Sub 9(M).9P Housing.9P 1.25mm pitch Housing. 15cm 10 Intel(R) N4200,DDR3L 1600MHz 8GB,1.61A@+12V 1709100254 (TF)PHONE JACK Cable. 3P AUDIO JACK. 1*10P 1.25mm HOUSING(F). 25cm 1 Dimension (L x W) 5.75" x 4" (146 mm x 101.7 mm) 1702150155 (TF)Power Cable. 15P SATA(F). 2P 2.0mm Housing(PH). 15cm 1 Operating Temperature 32F ~ 140F (0C ~ 60C) 170204010R (TF)Power Cable. Double 4P 5.08mm Housing(M). 10cm 1 Storage Temperature -40F ~ 176F (-40C ~ 85C) 1709150151 1 Operating Humidity 0% ~ 90% relative humidity, non-condensing (TF)CRT CABLE. 1*13P Pitch=1.25mm Housing. 15cm (VGA D-SUB connector co-layout with internal pin header by option) MTBF (Hours) 126,000 GENE-APL7-HSK01 Heatsink 1 Certification CE/FCC Display VGA/LCD Controller Intel(R) Pentium(R) N4200/ Celeron(R) N3350 Processor SoC Video Output VGA/LVDS1 (Option: LVDS2/eDP) Backlight inverter supply Max 12V, 2A I/O Ethernet Realtek RTL-8111E, RJ-45 x 2 Audio High Definition Audio Interface (Option 2W Amp) USB Port Rear I/O: USB 3.0 x 2 Internal: USB2.0 x 8 Serial Port Rear I/O: COM x 2 (COM2 is RS-232/422/485) Internal: COM x 4 (Option to COM x 10) COM2-5 support 5V/12V/RI Parallel Port -- HDD Interface SATA 3.0 x 1 FDD Interface -- SSD mSATA x 1 (Full, optioal for mini-card) Expansion Slot Mini-card x 1 (Full size) DIO 8-bit SIM Micro SIM x 1 (Option) TPM -- Touch -- 03-15 www.aaeon.com Note: All specifications are subject to change without notice. GENE-APL7 Block Diagram DDR3L SO-DIMM RJ-45 GbE RJ-45 GbE GbE Ethernet Channel 0 DDI Port 0 DP to VGA DDI Port 1 DP to LVDS PCIe[x1] PCIe[x1]/USB 2.0 mSATA (Full size) PCIe[x1]/mSATA/USB 2.0 Intel(R) Apollo Lake SoC USB 3.0 18/24bit 2CH LVDS USB 3.0 * 2 USB 2.0 USB HUB LVDS 1nd SATA III SATA_P0 Micro SIM USB 2.0 * 7 2nd 18/24bit 2CH LVDS EDP DP to LVDS Mini Card (Full size) LVDS EDP Port 0 PCIe[x1] GbE Ethernet VGA USB 2.0 USB 2.0 * 1 USB 2.0 I2S I2S_P0 HD Audio Audio Codec SPI BIOS Audio Connector Audio Amplifier (Opon) SPK*2 LPC Super I/O COM1~6 (COM2 support RS-232/422/485) FAN Dimension Super I/O (Opon) HW Monitor DIO 8bit COM7~12 Unit: mm Ordering Information Part Number CPU Fan/Fanless Display LVDS Storage LAN USB RS-232 RS-232/422/485 Expansion Slot Power Power Temp Others GENE-APL7-A10-0001 N3350 w/o HS VGA/LVDS 24bit,2CH SATA x 1 mSATA x 1 (full size) GbE x 2 USB 3.0 x 2 USB2.0 x 8 5 1 MiniCard x 1 (Full) 12V 0C ~ 60C Audio, DIO x 8 GENE-APL7-A10-0002 N3350 w/o HS VGA/LVDS/ LVDS2 24bit,2CH SATA x 1 mSATA x 1 (full size) GbE x 2 USB 3.0 x 2 USB2.0 x 8 11 1 MiniCard x 1 (Full) 12V 0C ~ 60C Micro SIM, DIO x 8, Audio, 2W AMP Note: All specifications are subject to change without notice. www.aaeon.com 03-16