REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) Changes to paragraphs 3.1 and 3.5.1 to add "QD" requirements. Update boilerplate to reflect current requirements. -rrp 02-05-29 APPROVED R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Charles E. Besore STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http://www.dscc.dla.mil CHECKED BY Ray Monnin APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, HIGH SPEED DIFFERENTIAL VOLTAGE COMPARATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-06-03 REVISION LEVEL A SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. 1 OF 5962-87674 9 5962-E421-02 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87674 01 C X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 Circuit function LM160 High-speed differential comparator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter C G P Descriptive designator GDIP1-T14 or CDIP2-T14 MACY1-X8 GDIP1-T8 or CDIP2-T8 Terminals Package style 14 8 8 Dual-in-line Can Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) ........................................................... Peak output current (IOP) ..................................................... Differential input voltage (VID) ............................................ Input voltage (VIN) ............................................................... Storage temperature range ................................................. Lead temperature (soldering, 10 seconds) ......................... Junction temperature (TJ) ................................................... Power dissipation (PD) ........................................................ Thermal resistance, junction-to-case (JC) .......................... Thermal resistance, junction-to-ambient (JA): Case C ............................................................................ Case G ............................................................................ Case P ............................................................................ 8.0 V dc 20 mA 5.0 V dc VCC+ VIN VCC-65C to +150C +260C +175C 550 mW 1/ See MIL-STD-1835 76C/W 166C/W 125C/W 1.4 Recommended operating conditions. Supply voltage: VCC+ ................................................................................ +4.5 V to +6.5 V VCC- ................................................................................. -4.5 V to -6.5 V Ambient operating temperature range (TA) ......................... -55C to +125C 1/ Must withstand the added PD due to short circuit test; e.g., IOS. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-87674 A REVISION LEVEL A SHEET 2 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 -- List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MILPRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MILPRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the qualifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections and logic diagram. The terminal connections and logic diagram shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-87674 A REVISION LEVEL A SHEET 3 TABLE I. Electrical performance characteristics. Test Logical "1" output voltage Symbol VOH Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type 1,2,3 01 VCC = 4.5 V, Limits Min 2.4 Unit Max V IOUT = -320 A Logical "0" output voltage VOL VCC = 4.5 V, IOUT = 6.4 mA 1,2,3 01 0.4 V Input bias current IIB VCC = 5 V, VIN = 5 V 1,2,3 01 20 A Positive supply current ICC+ VCC = 6.5 V 1,2,3 01 32 mA Negative supply current ICC- VCC = 6.5 V 1,2,3 01 -16 mA Short circuit current IOS VCC = 4.5 V 1,2,3 01 -15 -52 mA Input offset voltage VIO VCC = 5.0 V 1,2,3 01 -5 5 mV Input offset current IIO VCC = 5.0 V 1,2,3 01 -3 3 A Unbalanced input current 1/ IIN1 VCC = 5 V, VIN1 = 0 V, VIN2 = 5 V 1,2,3 01 -1 mA IIN2 VCC = 5 V, VIN1 = 5 V, VIN2 = 0 V -1 Supply voltage 1/ VCC 1,2,3 01 4.5 Supply breakdown voltage 1/ BVCC 1,2,3 01 8.0 V Common mode input voltage range 1/ VCM 1,2,3 01 4.0 V Differential input voltage range 1/ VDIFF 1,2,3 01 5.0 V Response time tresp 9 01 VCC = 6.5 V VCC = +5.0 V, 2/ 3/ TA = +25C 4/ 6.5 V ns 25 20 1/ Parameter tested go-no-go only. 2/ Guaranteed parameter if not tested. 3/ Measured from the 50 percent point of a 30 mVP-P, 10 MHz sinusoidal input to the 50 percent point of the output. 4/ Measured from the 50 percent point of a 2 VP-P, 10 MHz sinusoidal input to the 50 percent point of the output. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-87674 A REVISION LEVEL A SHEET 4 Case C FIGURE 1. Terminal connections and logic diagram. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-87674 A REVISION LEVEL A SHEET 5 Case G FIGURE 1. Terminal connections and logic diagram - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-87674 A REVISION LEVEL A SHEET 6 Case P FIGURE 1. Terminal connections and logic diagram - Continued. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-87674 A REVISION LEVEL A SHEET 7 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. 3.5.1 Certification/compliance mark. A compliance indicator "C" shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator "C" shall be replaced with a "Q" or "QML" certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufacturer's QM plan, the "QD" certification mark shall be used in place of the "Q" or "QML" certification mark. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-87674 A REVISION LEVEL A SHEET 8 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Interim electrical parameters (method 5004) Final electrical test parameters (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) Subgroups (in accordance with MIL-STD-883, method 5005, table I) 1 1*, 2, 3, 9 1, 2, 3, 9 1, 2, 3 * PDA applies to subgroup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883. (2) TA = +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone (614) 692-0547. 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MILHDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-87674 A REVISION LEVEL A SHEET 9 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 02-05-29 Approved sources of supply for SMD 5962-87674 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN 1/ 5962-8767401CA 5962-8767401GA 5962-8767401PA Vendor CAGE number OC7V7 3/ 27014 OC7V7 3/ Vendor similar PIN 2/ LM160 LM160J-14/883 LM160H/883 LM160 LM160J/883 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. 3/ Not available from an approved source of supply. Vendor CAGE number Vendor name and address 27014 National Semiconductor 2900 Semiconductor Dr PO BOX 58090 Santa Clara, CA 95052-8090 OC7V7 Qualified Parts Laboratory, Inc. 3605 Kifer Road Santa Clara, CA 95051 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.