Absolute Maximum Ratings (Note 3)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
(Note 2)
Supply Voltage g22V
Power Dissipation (Note 4) 600 mW
Input Voltage (Equal to Power Supply Voltage)
Storage Temperature Range b65§Ctoa
150§C
Junction Temperature
N Package a150§C
H Package a175§C
Steady State Output Current g100 mA
Pulsed Output Current (50 ms On/1 sec. Off) g400 mA
Lead Temperature Soldering (10 seconds)
Metal Can 300§C
Plastic 260§C
ESD Rating (Note 6) 2 kV
Operating Ratings (Note 3)
Temperature Range
LH0002 b55§Ctoa
125§C
LH0002C 0§Ctoa
85§C
Thermal Resistance (Note 5)
iJA, H Package a125§C/W
iJC, H Package a75§C/W
iJA, N Package a120§C/W
Electrical Characteristics (Note 1)
Parameter Conditions Min Typ Max Units
Voltage Gain RSe10 kX,R
Le1.0 kX,V
IN eg10V 0.95 0.97
Input Impedance RSe200 kX,V
IN eg1.0V, RLe1.0 kX180 400 kX
Output Impedance VIN eg1.0V, RLe50X,R
Se10 kX6.0 10 X
Output Voltage Swing RLe1.0 kX,V
IN eg12V g10 g11 V
Output Voltage Swing VSeg15V, VIN eg12V, RSe50X,R
Le100X,T
Ae25§Cg10 V
DC Output Offset Voltage RSe300X,R
Le1.0 kXg10 g30 mV
DC Input Bias Current RSe10 kX,R
Le1.0 kXg6.0 g10 mA
Harmonic Distortion VIN e5.0 Vrms, f e1.0 kHz 0.1 %
Rise Time RLe50X,DVIN e100 mV 7.0 12 ns
Positive Supply Current RSe10 kX,R
Le1.0 kXa6.0 a10 mA
Negative Supply Current RSe10 kX,R
Le1.0 kXb6.0 b10 mA
Note 1: Specification applies for TAe25§C with a12V on Pins 1 and 2; b12V on Pins 6 and 7 for the metal can package and a12V on Pins 1 and 2; b12V on
Pins 4 and 5 for the dual-in-line package, unless otherwise specified. The parameter guarantees for LH0002C apply over the temperature range of 0§Ctoa
85§C,
while parameters for the LH0002 are guaranteed over the temperature range b55§Ctoa
125§C unless otherwise specified.
Note 2: Refer to RETS0002X for LH0002 military specifications.
Note 3: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.
The guaranteed specifications apply only for the test conditions listed.
Note 4: The maximum power dissipation is a function of maximum junction temperature (TJMax), total thermal resistance (iJA), and ambient temperature (TA). The
maximum allowable power dissipation at any ambient is PDe(TJMax bTA)/iJA.
Note 5: For operating at elevated temperatures, the device must be derated based on the thermal resistance iJA and TJMax. TJeTAaPDiJA.
Note 6: Human body model, 1.5 kXin series with 100 pF.
2