TCD2000P
2002-03-08
1
TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device)
TCD2000P
The TCD2000P is a high sensitive and low dark current 480−elements
color linear image sensor which includes CCD drive circuit, clamp
circuit and sample & hold circuit.
The CCD drive circuit consists of the pulse generator. therefore it is
possible to easy drive by applying simple pulses. The sensor is designed
for scanner.
FEATURES
Number of Image Sensing Elements
: 480 elements (160×3 color sequential)
Image Sensing Element Size : 11µm×33µm on 33µm centers
Photo Sensing Region : High sensitive pn photodiode
Clock : 3 Input pulses 5V
Internal Circuit : Sample & Hold circuit, Clamp circuit
Package : 20 pin
Color Filter : Red, Green, Blue
MAXIMUM RATINGS
CHARACTERISTIC SYMBOL RATING UNIT
Master Clock Voltage VφM
Clock Pulse Voltage Vφ
Shift Pulse Voltage VSH
−0.3~8 V
Reference Voltage VREF
Power Supply Voltage (Analog) VAD
VDD1
Power Supply Voltage (Digital)
VDD2
−0.3~15 V
Sample & Hold Switch Voltage VSP −0.3~15 V
Operating Temperature Topr 0~60 °C
Storage Temperature Tstg −25~85 °C
Note 1: All voltage are with respect to SS terminals (Ground).
Weight: 1.0g (Typ.)
(TOP VIEW)
PIN CONNECTION
TCD2000P
2002-03-08
2
CIRCUIT DIAGRAM
PIN NAMES
φM Master Clock VAD Power (Analog)
φ1 Clock (Phase 1) VDD1 Power (Digital, 12V)
φ2 Clock (Phase 2) VDD2 Power (Digital, 12V)
SH Shift Gate SS Ground (Analog)
OS Signal Output SS1 Ground (Digital, 12V)
DOS Compensation Output SS2 Ground (Digital, 12V)
VREF Reference Voltage Input VSP Sample and Hold Switch
NC Non Connection
TCD2000P
2002-03-08
3
OPTICAL / ELECTRICAL CHARACTERISTICS
(Ta = 25°C VREF = VAD = VDD1 = VDD2 = 12V, VφM = Vφ = VSH = 5V (PULSE), fφ = 1.0MHz,
tINT (INTEGRATION TIME) = 10ms, LIGHT SOURCE = A LIGHT SOURCE+CM500S FILTER,
LOAD RESISTANCE = 100Ω)
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT NOTE
RB 3.7 5.3 6.9
RG 8.4 12.0 15.6
Sensitivity
RR 4.6 6.6 8.7
V / lx·s
PRNU (1) ― 10 20 % (Note 2)
Photo Response Non Uniformity
PRNU (3) ― 3 12 mV (Note 3)
Saturation Output Voltage VSAT 1.2 2.0 ― V (Note 4)
Saturation Exposure SE ― 0.17 ― lx·s (Note 5)
Dark Signal Voltage VDRK ― 12 25 mV (Note 6)
Dark Signal Non Uniformity DSNU ― 5 10 mV (Note 6)
Analog Current Dissipation IAD ― 12 18 mA
IDD1 ― ― 1 mA
Digital Current Dissipation
IDD2 ― 13.5 20 mA
Input Current of VREF IREF ― ― 1 mA
Total Transfer Efficiency TTE 92 ― ― %
Output Impedance ZO ― 0.5 1.0 kΩ
DC Signal Output Voltage VOS 4.5 6.0 7.5 V (Note 7)
DC Compensation Output Voltage VDOS 4.5 6.0 7.5 V (Note 7)
DC Differential Error Voltage |VOS−VDOS| 0 ― 100 mV
Note 2: PRNU (1) is measured at 50% of SE (Typ.)
Definition of PRNU : PRNU = χ
χ∆ 100 (%)
Where χis average of total signal outputs and χ∆ is the maximum deviation from χunder uniform illumination.
Note 3: PRNU (3) is defined as maximum voltage with next pixel where measured 5% of SE (Typ.)
Note 4: VSAT is defined as minimum Saturation Output Voltage of all effective pixels.
Note 5: Definition of SE : SE = R
SAT
V (lx·s)
Note 6: VDRK is defined as average dark signal voltage of all effective pixels.
DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage.
TCD2000P
2002-03-08
4
Note 7: DC signal output voltage and DC compensation output voltage are defined as follows:.
OPERATING CONDITION
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT
“H” Level 4.5 5.0 5.5
Master Clock Pulse Voltage
“L” Level
VφM
0 ― 0.5
V
“H” Level 4.5 5.0 5.5
Clock Pulse Voltage
“L” Level
Vφ1
Vφ2 0 ― 0.5
V
“H” Level Vφ−0.5 Vφ V
φ
Shift Pulse Voltage
“L” Level
VSH
0 ― 0.5
V
“H” Level 4.5 5.0 13.0
Sample and Hold Switch Voltage*
“L” Level
VSP
0 ― 0.5
V
Reference Voltage VREF 11.4 12.0 13.0 V
Power Supply Voltage (Analog) VAD 11.4 12.0 13.0 V
VDD1 11.4 12.0 13.0
Power Supply Voltage (Digital)
VDD2 11.4 12.0 13.0
V
(*) Supply “H” Level to VSP terminal when sample−and−hold circuit is used, when sample−and−hold circuit is not
used supply “L” Level to VSP terminal.
CLOCK CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC SYMBOL MIN TYP. MAX UNIT
Master Clock Pulse Frequency fφM ― 2.0 6.0 MHz
Clock Pulse Frequency fφ ― 1.0 3.0 MHz
Master Clock Pulse Capacitance CφM ― 10 20 pF
Clock Capacitance Cφ ― 100 200 pF
Shift Gate Capacitance CSH ― 50 100 pF
TCD2000P
2002-03-08
5
TIMING CHART
TCD2000P
2002-03-08
6
TIMING REQUIREMENTS
TCD2000P
2002-03-08
7
CHARACTERISTIC SYMBOL MIN
TYP.
(Note 2) MAX UNIT
t1 60 300 ― ns
Pulse Timing of SH and φ1, φ2
t5 0 300 ― ns
SH Pulse Rise Time, Fall Time t2, t4 0 50 ― ns
SH Pulse Width t3 300 1000 ― ns
Pulse Timing of SH and φM t6 20 50 ― ns
φ1, φ2 Pulse Rise Time, Fall Time t9, t10 0 20 ― ns
t11, t13 20 100 ― ns
Pulse Timing of φ1, φ2 and φM
t8, t12, t14 40 100 ― ns
φM Pulse Rise Time, Fall Time t7, t15, t16 0 20 ― ns
φM Pulse Width t17, t18 80 250 ― ns
Video Data Delay Time (Note 3) t19 ― 45 ― ns
S / H Video Data Delay Time t20, t21 ― 70 ― ns
Note 2: TYP. is the case of fφ=1MHz.
Note 3: Load Resistance is 100kΩ.
ELEMENT SHAPE
Unit: mm
TCD2000P
2002-03-08
8
TYPICAL DRIVE CIRCUIT
TCD2000P
2002-03-08
9
CAUTION
1. Window Glass
The dust and stain on the glass window of the package degrade optical performance of CCD sensor.
Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and
allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or
thermal shock because the glass window is easily to damage.
2. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown.
CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static
electricity is sometimes detected. In handing the device, it is necessary to execute the following static
electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system
due to static electricity.
a. Prevent the generation of static electricity due to friction by making the work with bare hands or by
putting on cotton gloves and non-charging working clothes.
b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the
work room.
c. Ground the tools such as soldering iron, radio cutting pliers of or pincer.
It is not necessarily required to execute all precaution items for static electricity.
It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed
range.
3. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and
PRNU of CCD sensor.
4. Lead Frame Forming
Since this package is not strong against mechanical stress, you should not reform the lead frame.
We recommend to use a IC-inserter when you assemble to PCB.
5. Soldering
Soldering by the solder flow method cannot be guaranteed because this method may have deleterious
effects on prevention of window glass soiling and heat resistance.
Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260°C, or
within three seconds for lead temperatures of up to 350°C.
TCD2000P
2002-03-08
10
PACKAGE DIMENSIONS
Note1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE.
Note2: TOP OF CHIP TO BOTTOM OF PACKAGE.
Note3: TOP OF CHIP TO OF PACKAGE.
Note4: GLASS THICKNESS (n=1.5)
Note5: No. 1 SENSOR ELEMENT (S1) TO CENTER OF No. 1 PIN.
Weight: 1.0g (Typ.)
TCD2000P
2002-03-08
11
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
• The products described in this document are subject to the foreign exchange and foreign trade laws.
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
• The information contained herein is subject to change without notice.
000707EB
A
RESTRICTIONS ON PRODUCT USE
