1
SURMOUNTTM PIN Diode
RoHS Compliant
Rev. V4
MA4SPS302
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and prod uct information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Features
Surface Mount
No Wire Bonding Require d
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
High Average and Peak Power Ha ndling
RoHS Compliant
Description
This device is a Silicon-Glass PIN diode chip
fabricated with M/A-COM Tech’s patented HMICTM
process. This device features two silicon pedestals
embedded in a low loss, low dispersion glass. The
diode is formed on the top of one pedestal and
connections to the backside of the device are
facilitated by making the pedesta l sidewalls
electrically conductive. Selective backside
metallization is applied producing a surface mount
device. This vertical conic topolo gy provides for
exceptional heat transfer from the active area. The
topside is fully encapsulated with silicon nitride and
has an additional polymer layer for scratch and
impact protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and as sembly.
Parameter Absolute Maximum
Forward Current 600mA
Reverse Voltage | -100V |
Operating Temperature -55°C to +125°C
Storage Temperature -55 °C to +150°C
Junction Temperature +175°C
Dissipated Power
( RF & DC ) 800mW
Mounting Temperature +260°C for 30 secon ds
Absolute Maximum Ratings
TAMB = 25°C (unless otherwise specified)
MA4SPS302
1. Backside metal: 0.1 µM thick.
2. Yellow hatched areas indicate backsid e ohmic gold
DIM INCHES MM
Min. Max. Min. Max.
A 0.052 0.056 1.321 1.422
B 0.020 0.024 0.508 0.610
C 0.004 0.006 0.102 0.152
D 0.018 0.020 0.457 0.508
E 0.014 0.016 0.356 0.406
2
SURMOUNTTM PIN Diode
RoHS Compliant
Rev. V4
MA4SPS302
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and prod uct information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Electrical Specifications @ TAMB = +25°C
1. Total Capacitance, CT, is equivalent to the sum of Junction Capacitance and Pa rasitic Capacitance.
CT = CJ (Junction Capacitance) + CPAR (Parasitic Capacitance)
2. Series resistance RS is equivalent to the total diode resistance:
RS = RJ (Junction Capacitance Junction Resistance) + RO (Ohmic Resistan ce)
3 RS and CT are measured on an HP4291A Impedance Analyzer with die mounted in an ODS-186 package
with conductive silver epoxy.
Symbol Conditions Units Min Typ Max
CT1 -40V, 1MHz pF 0.40 0.45
CT1,3 -40V, 1GHz pF 0.36
RS2,3 10mA, 100MHz W 1.3 2.2
VF 10mA V 0.84 1.00
VR -10µA V -70 -100
IR -70 V nA 100 1000
RqJL4 IH=1A, IL=10mA °C/W 125
TL +10mA / -6mA ns 460
0
1
2
3
0 100 200 300 400 500 600 700 800 900 1000
Frequency (MHz)
500uA
1mA
2mA
10mA
50mA
0.000
0.100
0.200
0.300
0.400
0.500
0.600
0 100 200 300 400 500 600 700 800 900 1000
Frequency (MHz)
0V
-5V
-40V
Rs vs. Forward Current and Frequency CT vs. Reverse Voltage and Frequency
3
SURMOUNTTM PIN Diode
RoHS Compliant
Rev. V4
MA4SPS302
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and prod uct information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
MA4SPS302 ADS SPICE Model & Schematic
MA4SPS302 Schematic
MA4SPS302 SPICE Model
PinDiodeModel
NLPINM1
Ffe=1.0
Af=1.0
Kf=0.0
Imax=1.0E+6 A/m^2
Fc=0.5
M=0.5
Vj=0.7 V
Cj0=0.50 pF
Rs=0.1 Ohm
Tau=0.20 usec
Cmin=0.40 pF
Rr=20 K Ohm
Wi=6.5 um
Un=900 cm^2/V-sec
Vi=0.0 V
Is=1.0E-14 A
wPmax=0.8 W
wBv=100 V
N
otes : Rs = 2 * Rvia + Rp
Rp Cp
Ls
Rvia
Rvia
+
_
4
SURMOUNTTM PIN Diode
RoHS Compliant
Rev. V4
MA4SPS302
• North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
• India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and prod uct information.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Handling
All semiconductor chips should be handled with ca re to avoid damage or contamination from perspiratio n and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasio n and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn,
60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but
could result in an increase in series and thermal resistance.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit
trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die.
The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce
thermal and/or mechanical stresses to the die . It is also not recommended to reflow solder by causing heat to
flow through the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can
be visually inspected through the die after attach is completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538 , “Surface Mounting Instructions“. Application Note M541 “Bonding and Handling
Procedures for Chip Diode Devices” provides handling and assembly recommendations.
Ordering Information
The MA4SPS302 SURMOUNT are packaged in gel packs.
Part Number
Gel Pack
MA4SPS302
