TLP2761 Photocouplers GaAAs Infrared LED & Photo IC TLP2761 1. Applications * Factory Networking * High-Speed Digital Interfacing for Instrumentation and Control Devices * I/O Interface Boards 2. General The Toshiba TLP2761 consists of a high-output GaAAs light-emitting diode coupled with integrated high gain, high-speed photodetectors. It is housed in the SO6L package. This photocoupler guarantees operation at up to 125 and on supplies from 2.7 V to 5.5 V. Since TLP2761 has guaranteed 1 mA low supply current (ICCL/ICCH), and 1.6 mA (Ta = 125 ) low threshold input current (IFHL), it contributes to energy saving of devices. It can drive directly from a microcomputer for a low input current. The TLP2761 has an internal Faraday shield that provides a guaranteed common-mode transient immunity of 20 kV/s. 3. Features (1) Inverter logic type (Totem pole output) (2) Package: SO6L (3) Operating temperature: -40 to 125 (4) Supply voltage: 2.7 to 5.5 V (5) Data transfer rate: 15 MBd (typ.) (NRZ) (6) Threshold input current: 1.3 mA (max) (@Ta = 105 ) : 1.6 mA (max) (@Ta = 125 ) (7) Supply current: 1.0 mA (max) (8) Common-mode transient immunity: 20 kV/s (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065, EN60950-1, EN 62368-1 (Note 1) Note 1: When a VDE approved type is needed, please designate the Option (D4) (D4). Start of commercial production (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 1 2015-01 2017-12-26 Rev.9.0 TLP2761 4. Packaging (Note) TLP2761 TLP2761(LF4) 11-4N1A Note: 11-4N101A Lead-formed product: (LF4) 5. Pin Assignment 1: Anode 2: N.C. 3: Cathode 4: GND 5: VO (Output) 6: VCC 6. Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between pin 6 and pin 4. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 2 2017-12-26 Rev.9.0 TLP2761 7. Principle of Operation 7.1. Truth Table Input LED Output H ON L L OFF H 7.2. Mechanical Parameters Characteristics Min Unit Creepage distances 8.0 mm Clearance distances 8.0 Internal isolation thickness 0.4 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics LED Symbol Input forward current Note Rating Unit IF 10 mA (Ta 110 ) IF/Ta -0.13 mA/ (Ta 110 ) IFP/Ta 1 A (Ta 110 ) IFPT/Ta -25 mA/ PD 20 mW PD/Ta -0.5 mW/ VR 5 V Detector Output current IO 10 mA Output voltage VO 6 V Supply voltage VCC 6 Output power dissipation PO 20 mW PO/Ta -0.5 mW/ Topr -40 to 125 Input forward current derating Input forward current (pulsed) Input forward current derating (pulsed) IFP Peak transient input forward current Peak transient input forward current derating IFPT Input power dissipation Input power dissipation derating (Ta 110 ) Input reverse voltage Output power dissipation derating (Ta 110 ) Common Operating temperature Storage temperature Lead soldering temperature Isolation voltage (Note 1) (Note 2) 40 mA -1.0 mA/ Tstg -55 to 125 (10 s) Tsol 260 AC, 60 s, R.H. 60 % BVS (Note 3) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width (PW) 1 ms, duty = 50 % Note 2: Pulse width (PW) 1 s, 300 pps Note 3: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 3 2017-12-26 Rev.9.0 TLP2761 9. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit Input on-state current IF(ON) (Note 1) 2 Input off-state voltage VF(OFF) 0 6 mA 0.8 V Supply voltage VCC (Note 2) 2.7 3.3/5.0 5.5 Operating temperature Topr (Note 2) -40 125 Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note: A ceramic capacitor (0.1 F) should be connected between pin 6 and pin 4 to stabilize the operation of a highgain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor should be placed within 1 cm of each pin. Note 1: The rise and fall times of the input on-current should be less than 0.5 s. Note 2: Denotes the operating range, not the recommended operating condition. 10. Electrical Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VCC = 2.7 to 5.5 V) Characteristics Symbol Input forward voltage Test Circuit Note Test Condition Min Typ. Max Unit 1.35 1.50 1.65 V -2.0 mV/ VF IF = 2 mA, Ta = 25 VF/Ta IF = 2 mA Input reverse current IR VR = 5 V, Ta = 25 10 A Input capacitance Ct V = 0 V, f = 1 MHz, Ta = 25 20 pF 0.1 V 0.12 0.4 Fig.13.1.2 IO = -20 A, VF = 0.8 V, VCC = 3.3 V 3.2 3.29 IO = -20 A, VF = 0.8 V, VCC = 5 V 4.9 4.99 IO = -3.2 mA, VF = 0.8 V, VCC = 3.3 V 2.3 3.15 IO = -3.2 mA, VF = 0.8 V, VCC = 5 V 4.0 4.87 Input forward voltage temperature coefficient Low-level output voltage VOL Fig.13.1.1 IF = 2 mA, IO = 20 A IF = 2 mA, IO = 3.2 mA High-level output voltage VOH Low-level supply current ICCL Fig.13.1.3 IF = 2 mA 0.65 1.0 High-level supply current ICCH Fig.13.1.4 IF = 0 mA 0.65 1.0 Threshold input current (H/L) IFHL IO = 3.2 mA, VO < 0.4 V, Ta = -40 to 105 1.3 IO = 3.2 mA, VO < 0.4 V, Ta = -40 to 125 1.6 Min Typ. Max Unit 0.4 pF 1014 5000 Vrms AC, 1 s in oil 10000 DC, 60 s in oil 10000 Note: mA All typical values are at VCC = 5 V, Ta = 25 , unless otherwise noted. 11. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Total capacitance (input to output) CS Isolation resistance Isolation voltage RS BVS Note Test Condition (Note 1) VS = 0 V, f = 1 MHz (Note 1) VS = 500 V, R.H. 60 % (Note 1) AC, 60 s 1x 1012 Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 4 2017-12-26 Rev.9.0 TLP2761 12. Switching Characteristics (Note) (Unless otherwise specified, Ta = -40 to 125 , VCC = 2.7 to 5.5 V) Characteristics Symbol Propagation delay time (H/L) tpHL Propagation delay time (L/H) tpLH Pulse width distortion Propagation delay skew (device to device) Note Test Circuit Min Typ. Max Unit (Note 1), Fig.13.- IF = 0 2 mA, RT = 1.68 k, (Note 3) 1.5 CL = 15 pF 49 80 ns (Note 1), (Note 3) IF = 2 0 mA, RT = 1.68 k, CL = 15 pF 49 80 IF = 2 mA, RT = 1.68 k, CL = 15 pF 0 25 |tpHL-tpLH| (Note 1), (Note 3) Test Condition tpsk (Note 1), (Note 2), (Note 3) IF = 2 mA, RT = 1.68 k, CL = 15 pF -30 30 Fall time tf (Note 1), (Note 3) IF = 0 2 mA, RT = 1.68 k, CL = 15 pF 3 Rise time tr (Note 1), (Note 3) IF = 2 0 mA, RT = 1.68 k, CL = 15 pF 3 Common-mode transient immunity at output high CMH (Note 3) Fig.13.- VCM = 1000 Vp-p, 1.6 IF = 0 mA, VCC = 3.3 V / 5 V, Ta = 25 , RT = 1.68 k 20 25 Common-mode transient immunity at output low CML (Note 3) 20 25 VCM = 1000 Vp-p, IF = 2 mA, VCC = 3.3 V / 5 V, Ta = 25 , RT = 1.68 k kV/s Note: All typical values are at Ta = 25 . Note 1: f = 5 MHz, duty = 50 %, input current tr = tf = 5 ns, CL is approximately 15 pF which includes probe and stray wiring capacitance. Note 2: The propagation delay skew, tpsk, is equal to the magnitude of the worst-case difference in tpHL and/or tpLH that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc). Note 3: RT = R1 + R2 = 1.68 k Recommendation input resistance conditions : R1 = R2 = 840 (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 5 2017-12-26 Rev.9.0 TLP2761 13. Test Circuits and Characteristics Curves 13.1. Test Circuits Fig. 13.1.1 VOL Test Circuit Fig. 13.1.2 VOH Test Circuit Fig. 13.1.3 ICCL Test Circuit Fig. 13.1.4 ICCH Test Circuit Fig. 13.1.5 Switching Time Test Circuit and Waveform Fig. 13.1.6 Common-Mode Transient Immunity Test Circuit and Waveform (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 6 2017-12-26 Rev.9.0 TLP2761 13.2. Characteristics Curves (Note) Fig. 13.2.1 IF - VF Fig. 13.2.2 IF - Ta Fig. 13.2.3 VOL - Ta Fig. 13.2.4 VOL - Ta Fig. 13.2.5 VOH - Ta Fig. 13.2.6 VOH - Ta (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 7 2017-12-26 Rev.9.0 TLP2761 Fig. 13.2.7 ICCL - Ta Fig. 13.2.8 ICCH - Ta Fig. 13.2.9 IFHL - Ta Fig. 13.2.10 tpHL, tpLH, |tpHL-tpLH| - Ta Fig. 13.2.11 tpHL, tpLH, |tpHL-tpLH| - Ta Fig. 13.2.12 tpHL, tpLH, |tpHL-tpLH| - IF (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 8 2017-12-26 Rev.9.0 TLP2761 Fig. 13.2.13 tpHL, tpLH, |tpHL-tpLH| - IF Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 9 2017-12-26 Rev.9.0 TLP2761 14. Soldering and Storage 14.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. Fig. 14.1.1 An Example of a Temperature Profile When Lead(Pb)-free Solder Is Used * When using soldering flow Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 14.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 10 2017-12-26 Rev.9.0 TLP2761 15. Land Pattern Dimensions (for reference only) Unit: mm TLP2761 TLP2761(LF4) Fig. 15.1 Lead Forming Option (standard) Fig. 15.2 Lead Forming Option (LF4) 16. Marking (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 11 2017-12-26 Rev.9.0 TLP2761 17. EN60747-5-5 Option (D4) Specification * Part number: TLP2761 (Note 1) * The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP2761(D4-TP,E D4: EN60747 option TP: Tape type E: [[G]]/RoHS COMPATIBLE (Note 2) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP2761(D4-TP,E TLP2761 Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Fig. 17.1 EN60747 Isolation Characteristics (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 12 2017-12-26 Rev.9.0 TLP2761 Fig. 17.2 Insulation Related Specifications (Note) Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 17.3 Marking on Packing for EN60747 Fig. 17.4 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 13 2017-12-26 Rev.9.0 TLP2761 Fig. 17.5 Measurement Procedure (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 14 2017-12-26 Rev.9.0 TLP2761 18. Embossed-Tape Packing (TP) Specification for Mini-Flat Photocouplers 18.1. Applicable Package Package Name Product Type SO6L / SO6L(LF4) Long creepage mini flat coupler 18.2. Product Naming Conventions When placing an order, please specify the part number, tape type and quantity as shown in the following example. Example) TLP2761(TP,E Part number: TLP2761 Tape type: TP (12mm pitch) [[G]]/RoHS COMPATIBLE: E (Note) Note: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 18.3. Tape Dimensions Specification Specification Division Packing Amount (A unit per reel) TP / TP4 1500 18.3.1. Orientation of Device in Relation to Direction of Feed Device orientation in the carrier cavities as shown in the following figure. Fig. 18.3.1.1 Orientation of Device in Relation to Direction of Tape Movement 18.3.2. Empty Device Recesses Characteristics Standard Occurrences of 2 or more successive empty cavities Single empty cavity Remarks 0 device Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel Not including leader and trailer 18.3.3. Tape Leader and Trailer The start of the tape has 14 or more empty holes. The end of the tape has 34 or more empty holes and more than 30mm only for a cover tape. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 15 2017-12-26 Rev.9.0 TLP2761 18.3.4. Tape Dimensions Tape material: Plastic (for protection against static electricity) Table Symbol Tape Dimensions (unit: mm, tolerance: 0.1) Dimension Dimension (standard) (LF4) Remark A 10.4 11.55 B 4.24 4.24 D 7.5 7.5 Center line of embossed cavity and sprocket hole E 1.75 1.75 Distance between tape edge and sprocket hole center F 12.0 16.0 Cumulative error +0.1/10 pitch, -0.3/10 pitch G 4.0 4.0 Cumulative error +0.1/10 pitch, -0.3/10 pitch K 2.7 K0 2.8 2.4 2.4 (c)2015-2017 Toshiba Electronic Devices & Storage Corporation Internal space 16 2017-12-26 Rev.9.0 TLP2761 18.3.5. Reel Specification Material: Plastic (for protection against static electricity) Reel Forms Table Reel Dimensions (unit: mm) Symbol Dimension A 330 2 B 100 1 C 13 0.5 E 2.0 0.5 U 4.0 0.5 W1 17.4 1.0 W2 21.4 1.0 18.4. Packing (Note) 1 reel/carton (unit: mm) Note: Taping reel diameter: 330 mm 18.5. Label Format (1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. (2) Reel: The label provides the part number, the taping name, quantity, lot number, etc. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 17 2017-12-26 Rev.9.0 TLP2761 19. Ordering Information (Example of Item Name) Item Name Packaging VDE Option Packing (MOQ) TLP2761(E Magazine (125 pcs) TLP2761(TP,E Tape and reel (1500 pcs) TLP2761(D4,E EN60747-5-5 Magazine (125 pcs) TLP2761(D4-TP,E EN60747-5-5 Tape and reel (1500 pcs) TLP2761(LF4,E LF4, Wide forming Magazine (125 pcs) TLP2761(TP4,E LF4, Wide forming Tape and reel (1500 pcs) TLP2761(D4-LF4,E LF4, Wide forming EN60747-5-5 Magazine (125 pcs) TLP2761(D4-TP4,E LF4, Wide forming EN60747-5-5 Tape and reel (1500 pcs) (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 18 2017-12-26 Rev.9.0 TLP2761 Package Dimensions Unit: mm TLP2761 Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N1A (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 19 2017-12-26 Rev.9.0 TLP2761 Package Dimensions Unit: mm TLP2761(LF4) Weight: 0.126 g (typ.) Package Name(s) TOSHIBA: 11-4N101A (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 20 2017-12-26 Rev.9.0 TLP2761 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". * TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT ("UNINTENDED USE"). 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No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. (c)2015-2017 Toshiba Electronic Devices & Storage Corporation 21 2017-12-26 Rev.9.0