AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 1 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
1A DROPOUT POSITIVE ADJUSTABLE OR FIXED-MODE REGULATOR
Description
AP1117 is a low dropout positive adjustable or fixed-mode regulator
with 1A output current capability. The product is voltage specifically
designed to provide well-regulated supply for low IC applications such
as high-speed bus termination and low current 3.3V logic supply.
AP1117 is also well suited for other applications such as VGA cards.
AP1117 is guaranteed to have lower than 1.4V dropout at full load
current making it ideal to provide well-regulated outputs of 1.25 to 5.0
with 6.4V to 18V input supply. AP1117 is available both in commercial
temperature grade (AP1117) and in industrial temperature range
(AP1117I) (TO252 and SOT223).
Features
• 1.4V Maximum Dropout at Full Load Current
• Fast Transient Response
• Output Current Limiting
• Built-in Thermal Shutdown
• Good Noise Rejection
• 3-Terminal Adjustable or Fixed 1.5V, 1.8V,2.5V, 3.3V, 5.0V
• Operating Junction Temperature range
0°C TJ +125°C (All packages)
-40°C TJ +125°C (see ordering information)
• Lead-Free Packages: SOT223, TO252, SOT89-3, TO263 and
TO220-3
Totally Lead-Free; RoHS Compliant (Notes 1 & 2)
• SOT223, TO252, SOT89-3, TO263 and TO220-3: Available in
“Green” Molding Compound (No Br, Sb)
Halogen and Antimony Free. “Green” Device (Note 3)
Applications
• PC Peripheral
• Communication
• Consumer Equipment
Pin Assignments
SOT89-3
Adj (GND)
VOUT
VIN
1
3
2
Tab is VOUT
( Top View )
SOT223
VIN
VOUT
Adj (GND)
Tab is VOUT
( Top View )
3
2
1
TO220-3
Tab is VOUT
3VIN
2
1
VOUT
Adj (GND)
( Front View )
TO252 and TO263
3
2
1
VIN
VOUT
Tab is VOUT
( Top View )
Adj (GND)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free.
3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 2 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Typical Applications Circuit
( 5V/3.3V fixed output )
( 5V/2.5V ADJ output )
)
R
R
(1 VV
1
2
REFo
+×=
Pin Descriptions
Pin Number I/O Pin Name Function
1 I Adj (GND)
A resistor divider from this pin to the VOUT pin and ground sets the output voltage (Ground only for
Fixed-Mode).
2 O VOUT The output of the regulator. A minimum of 4.7µF capacitor (ESR 0.5) must be connected from
this pin to ground to insure stability.
3 I VIN
The input pin of regulator. Typically a large storage capacitor is connected from this pin to ground to
insure that the input voltage does not sag below the minimum dropout voltage during the load
transient response. This pin must always be 1.3V higher than VOUT in order for the device to regulate
properly. A minimum of 4.7µF c apacitor (ESR 0.5) must be connected from this pin to ground to
insure stability.
Functional Block Diagram
3
Thermal
Shutdown 1
2VOUT
Adj
1.25V +
+
CURRENT
LIMIT
VIN
-
+
+
1
GND
(FIXED)
-
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 3 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Rating Unit
VIN DC Supply Voltage -0.3 to +18 V
TMJ Maximum Junction Temperature +150 °C
PD
Power Dissipation
SOT89-3
SOT223
TO220-3
TO252
TO263
Internally limited by maximum junction
temperature of +150°C (Note 4)
mW
TST Storage Temperature -65 to +150 °C
Notes: 4. AP1117 contains an internal thermal limiting circuit that is designed to protect the regulator in the event that the maximum junction temperature
exceeded. When activated, typically at +150°C, the regulator output switches off and then back on as the die cools.
Recommended Operating Conditions (@TA = +25°C, unless otherwise specified.)
Symbol Parameter Min Max Unit
TOP Operating Junction Temperature Range AP1117 0 +125
°C
AP1117I -40 +125
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Parameter Conditions Min Typ Max Unit
Reference Voltage AP1117-ADJ TA = +25°C, (VIN-OUT) = 1.5V
IO = 10mA 1.225 1.250 1.275 V
Output Voltage
AP1117-1.5 IOUT = 10mA, TA = +25°C,
3V VIN 12V 1.470 1.500 1.530 V
AP1117-1.8 IOUT = 10mA, TA = +25°C,
3.3V VIN 12V 1.764 1.800 1.836 V
AP1117-2.5 IOUT = 10mA, TA = +25°C,
4V VIN 12V 2.450 2.500 2.550 V
AP1117-3.3 IOUT = 10mA, TA = +25°C,
4.8V VIN 12V 3.235 3.300 3.365 V
AP1117-5.0 IOUT = 10mA, TA = +25°C,
6.5V VIN 12V 4.900 5.000 5.100 V
Line Regulation AP1117-XXX IO = 10mA,VOUT +1.5V < VIN < 12V,
TA = 25°C — — 0.2 %
Load Regulation
AP1117-ADJ VIN = 3.3V,VADJ = 0, 0mA < IO < 1A,
TA = +25°C (Notes 5, 6) — — 1 %
AP1117-1.5 VIN = 3V, 0mA < IO < 1A,
TA = +25°C (Notes 5, 6) — 12 15 mV
AP1117-1.8 VIN = 3.3V, 0mA < IO < 1A,
TA = +25°C (Notes 5, 6) — 15 18 mV
AP1117-2.5 VIN = 4V, 0mA < IO < 1A,
TA = +25°C (Notes 5, 6) — 20 25 mV
Notes: 5. See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction
temperature by low duty cycle pulse testing. Load regulation is measured at the output lead = 1/18” from the package.
6. Line and load regulation are guaranteed up to the maximum power dissipation of 15W. Power dissipation is determined by the difference between input
and output differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range.
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 4 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Electrical Characteristics (cont.) (@TA = +25°C, unless otherwise specified.)
Parameter Conditions Min Typ Max Unit
Load Regulation
(cont.)
AP1117-3.3 VIN = 5V, 0 IOUT 1A,
TA = +25°C (Notes 5, 6) — 26 33 mV
AP1117-5.0 VIN = 8V, 0 IOUT 1A,
TA = +25°C (Notes 5, 6) — 40 50 mV
Dropout Voltage
(VIN-VOUT) AP1117-ADJ/1.5/1.8
2.5/3.3/5.0 IOUT = 800mA, ΔVOUT = 1%
VOUT 0°C TJ +125°C — 1.2 1.3 V
Dropout Voltage
(VIN-VOUT)
AP1117-ADJ/1.5/1.8
2.5/3.3/5.0 IOUT = 1A,
ΔVOUT = 1% VOUT
0°C TJ +125°C — 1.3 1.4 V
AP1117I-ADJ/1.5/1.8
2.5/3.3/5.0 -40°C TJ +125°C
Current Limit AP1117-ADJ/1.5/1.8
2.5/3.3/5.0 (VIN-VOUT) = 5V 1. 1 — — A
Minimum Load Current
(Note 7) AP1117-XXX 0°C TJ +125°C — 5 10 mA
Thermal Regulation TA = +25°C, 30ms pulse — 0.008 0.040 %/W
Ripple Rejection F = 180Hz, COUT = 25µF Tantalum, IOUT = 1A —
AP1117-XXX VIN = VOUT +3V — 60 70 dB
Temperature Stability IO = 10mA — 0.5 %
JA Thermal Resistance
Junction-to-Ambient JA
SOT89-3: Control Circuitry/Power Transistor (Note 8)
SOT223: Control Circuitry/Power Transistor (Note 9)
TO252: Control Circuitry/Power Transistor (Note 8)
TO220-3: Control Circuitry/Power Transistor (Note 8)
TO263: Control Circuitry/Power Transistor (Note 8)
—
—
—
—
—
164
107
73
78
60
—
—
—
—
—
°C/W
JC Thermal Resistance
Junction-to-Case
SOT89-3: Control Circuitry/Power Transistor (Note 8)
SOT223: Control Circuitry/Power Transistor (Note 9)
TO252: Control Circuitry/Power Transistor (Note 8)
TO220-3: Control Circuitry/Power Transistor (Note 8)
TO263: Control Circuitry/Power Transistor (Note 8)
—
—
—
—
—
42
15
12
3.5
3.5
—
—
—
—
—
°C/W
Notes: 7. Quiescent current is defined as the minimum output current required in maintaining regulation. At 12V input/output differential the device is guaranteed
to regulate if the output current is greater than 10mA.
8. Test conditions for SOT89-3, TO220-3, TO252 and TO263: Devices mounted on FR-4 substrate, single sided PC board, 2oz copper,with minimum
recommended pad layout, no air flow. The case point of JC is located on the thermal tab.
9. Test conditions for SOT223: Devices mounted on FR-4 substrate, single sided PC board, 2oz copper, with 5mm x 5mm thermal pad layout, no air flow.
The case point of JC is located on the thermal tab.
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 5 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Typical Performance Characteristics
0
2.0
0250 500 750 1000
OUTP UT CURRENT (mA)
Dr opout Voltage vs. Ou tp u t Curr ent
1.8
1.6
1.4
1.2
1.0
0.8
0.2
0.4
0.6
D
R
O
P
O
U
T
V
O
L
T
A
G
E (V)
T = 25°C
J
T = 125°C
J
-40 0 25 50 75 100 125
I = 800mA
LOAD
TEMP ER ATURE ( °C)
Load R egulation vs. Temperatur e
0.20
0
-0.20
-0.40
-0.80
-1
O
UT
P
UT V
O
LT
A
G
E DEVI
A
TI
O
N (
%
)
-40 -25 0 25 50 75 100 125 150
2
TEMP ERATURE (°C)
Percent Change in Output V oltage vs. Temperature
1.5
1
0.5
0
-0.5
-1
-2
-1.5
O
U
T
P
U
T
V
O
L
T
A
G
E
C
H
AN
G
E
(
%
)
0.8
1
246 8 10 12
INPUT VOLTAGE (V)
Li ne R egulat ion
0.6
0.4
0.2
0
O
U
T
P
U
T
V
O
L
T
A
G
E
D
E
VIA
T
I
O
N (
%
)
7.5
0 20 40 60 80 100 120 140 160 180 200
C = 1µF
C = 10µF Tantalum
IN
OUT
TIME (µs)
Line Tr ansient Respon se
6.5
5.5
40
20
0
-20
-40
O
UT
P
UT V
O
LTA
G
E DEVIAT I
O
N (mV)
INPUT VOLTAGE (V)
010
20 30 40 50 60 70 80 90 100
-1
0
1
2
-20
-10
0
10
20
30
C = 1µF
C = 10µF Tantalum
Preload = 100mA
IN
OUT
TIME (µs)
Load Tr an si ent Res po nse
L
O
A
D
C
U
R
R
ENT (
A
)
OUTPUT VOLTAGE DEVIATION (mV)
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 6 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Application Information
Load Regulation
For improved load regulation the AP1117-ADJ should have the upper feedback resistor, R1, connected as close as possible to VOUT and the
lower resistor, R2, connected as close as possible to the load GND return. This helps reduce any parasitic resistance in series with the load.
Stability and Decoupling Capacitors
Input Capacitors
To ensure stable operation, the input supply must be low impedance up to a frequency of a few MHz. This requires a closely placed input
decoupling capacitor of 4.7µF minimum. This can be either ceramic or solid tantalum. The ESR of this capacitor must be less than 0.5.
Output Capacitor
The AP1117 also requires a closely placed output capacitor as part of the device frequency compensation. As part of its improved performance
over industry standard 1117, the AP1117 is suitable for use with MLCC (Multi-Layer Ceramic Chip) capacitors. A minimum output capacitor of
4.7µF ceramic X7R or 4.7µF solid tantalum is required. Aluminum electrolytic can be used but a minimum of 47µF is required. When using
Aluminum electrolytic it is still recommended to also use a 1µF MLCC in parallel. The ESR of the output capacitors must be less than 0.5.
The AP1117 is stable when using the correct value of MLCC capacitors. When using MLCC capaci tors X7R dielectric is recommended. Do not
use Y5V dielectrics.
Capacitor Track Length
Both input and output capacitors must be placed close to the AP1117. PCB traces not longer than 10mm are recommended between the
AP1117 and the capacitors.
Thermal Considerations
Thermal protection circuitry will shut down the regulator should the junction temperature exceed typically +150°C at the sense point.
The AP1117 is pin compatible with similar ‘1117 regulators and offers extended temperature range and improved regulation specifications.
AP1117 series regulators have internal thermal limiting circuitry designed to protect the device during overload conditions. For continuous normal
load conditions however, the maximum junction temperature rating of +125°C must not be exceeded.
It is important to give careful consideration to all sources of thermal resistance from junction to ambient. For the SOT223 and TO252 packages,
which are designed to be surface mounted, additional heat sources mounted near the device must also be considered. Heat sinking is
accomplished using the heat spreading capability of the PCB and its copper traces. The JC (junction to tab) of the TO252 and SOT223 are
+12°C/W and +15°C/W respectively.
Thermal resistances from tab to ambient can be as low as 30°C/W . The total thermal resistance from junction to am bient (JA) can be as low as
+42 ~ +46°C/W. This requires a reasonable sized PCB with at least one layer of copper to spread the heat across the board and couple it into
the surrounding air. Datasheet specifications using 2 oz copper and a 5mm x 5mm pad with TA = +27°C, no air flo w yielded JA (junction to tab)
of +73°C/W and +107°C/W for TO252 and SOT223 respectively.
The thermal resistance for each application will be affected by thermal interactions with other comp onents on the board. Some experimentation
will be necessary to determine the actual value. See graphs of power dissipation and thermal pictures of different size PCB copper area for
guidance.
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 7 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
4003002001000600500 800700 900
COPPER AREA (m m )
2
1.6
0.6
1.5
1.4
1.3
0.9
0.8
0.7
1.2
1.1
1.0
160
60
150
140
130
90
80
70
120
110
100
P (W)
D
θ
JA
(°
C
/W)
P vs. Copper area
1oz Cu on FR4
D
θ
JA
vs. Copper area
1oz Cu on Fr4
Ordering Information
Temperature Package V
OUT
Lead Free Packing
Blank : Commercial
I : Industrial D : TO252
E : SOT223
K : TO263
T : TO220-3
Y : SOT89-3
Blank : AD J
15 : 1.5V
18 : 1.8V
25 : 2.5V
33 : 3.3V
50 : 50V
L : Lead Free
G : Green U : Tube
13 : Tape & Reel
AP1117
X
X
XX X
X
-
Device Junction
Temperature
Range
Package
Code Packaging
(Note 10)
Tube 13” Tape and Reel
Quantity Part
Number
Suffix Quantity Part Number
Suffix
AP1117DXXL-13 0 to +125°C D TO252 NA NA 2500/Tape & Reel -13
AP1117DXXG-13 0 to +125°C D TO252 NA NA 2500/Tape & Reel -13
AP1117IDXXG-13 -40 to +125°C D TO252 NA NA 2500/Tape & Reel -13
AP1117EXXL-13 0 to +125°C E SOT223 NA NA 2500/Tape & Reel -13
AP1117EXXG-13 0 to +125°C E SOT223 NA NA 2500/Tape & Reel -13
AP1117IEXXG-13 -40 to +125°C E SOT223 NA NA 2500/Tape & Reel -13
AP1117KXXL-13 0 to +125°C K TO263 NA NA 800/Tape & Reel -13
AP1117KXXG-13 0 to +125°C K TO263 NA NA 800/Tape & Reel -13
AP1117TXXL-U 0 to +125°C T TO220-3 50 -U NA NA
AP1117TXXG-U 0 to +125°C T TO220-3 50 -U NA NA
AP1117YXXL-13 0 to +125°C Y SOT89-3 NA NA 2500/Tape & Reel -13
AP1117YXXG-13 0 to +125°C Y SOT89-3 NA NA 2500/Tape & Reel -13
Notes: 10. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
Pb
Lead-Free
Pb
Lead-Free
Pb
Lead-Free
Pb
Lead-Free
Pb
Lead-Free
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 8 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Marking Information
(1) SOT223
Y W X
17X-VV
Logo
X : Internal code
( Top View )
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week;
z repersents 52 and 53 week
Temperature Range
Part Number
Blank : Commercial I : Industrial
1117 for ADJ
17-VV: 15 for 1.5V
18 for 1.8V
25 for 2.5V
33 for 3.3V
50 for 5.0V
1117I for ADJ
17I-VV: 15 for 1.5V
18 for 1.8V
25 for 2.5V
33 for 3.3V
50 for 5.0V
(2) TO252
(3) SOT89-3
Identification Code Output Version
DA AP1117-ADJ
DB AP1117-1.5V
DC AP1117-1.8V
DD AP1117-2.5V
DE AP1117-3.3V
DF AP1117-5.0V
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 9 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Marking Information (cont.)
(4) TO263
1117-VV
X : Internal code
YY : Year : 01~09
( Top View )
YY WW X XWW : Week : 01~52, 52 represents
Logo G : Green
Part Number
VV: 15 for 1.5V
18 for 1.8V
25 for 2.5V
33 for 3.3V
50 for 5.0V
Blank for ADJ
52 and 53 week
L : Lead Free
(5) TO220-3 ( Top View )
17 - VV
Logo
YY WWX X
Part Number
1117 for ADJ
17-VV : 15 for 1.5V
18 for 1.8V
25 for 2.5V
33 for 3.3V
50 for 5.0V X : Internal code
WW : Week : 01~52, 52 represents
YY : Year : 01~09
52 and 53 week
G : Green
L : Lead Free
Package Outline Dimensions (All dimensions in mm.)
(1) Package Type: SOT223
SOT223
Dim Min Max Typ
A 1.55 1.65 1.60
A1 0.010 0.15 0.05
b1 2.90 3.10 3.00
b2 0.60 0.80 0.70
C 0.20 0.30 0.25
D 6.45 6.55 6.50
E 3.45 3.55 3.50
E1 6.90 7.10 7.00
e — — 4.60
e1 — — 2.30
L 0.85 1.05 0.95
Q 0.84 0.94 0.89
All Dimensions in mm
A1
A
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 10 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Package Outline Dimensions (cont.) (All dimensions in mm.)
(2) Package Type: TO252
(3) Package Type: SOT89-3
(4) Package Type: TO263
TO252
Dim Min Max Typ
A 2.19 2.39 2.29
A1 0.00 0.13 0.08
A2 0.97 1.17 1.07
b 0.64 0.88 0.783
b2 0.76 1.14 0.95
b3 5.21 5.46 5.33
c2 0.45 0.58 0.531
D 6.00 6.20 6.10
D1 5.21 − −
e − − 2.286
E 6.45 6.70 6.58
E1 4.32 − −
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08
L4 0.64 1.02 0.83
a 0° 10° −
All Dimensions in mm
SOT89
Dim Min Max
A 1.40 1.60
B 0.44 0.62
B1 0.35 0.54
C 0.35 0.44
D 4.40 4.60
D1 1.62 1.83
E 2.29 2.60
e 1.50 Typ
H 3.94 4.25
H1 2.63 2.93
L 0.89 1.20
All Dimensions in mm
TO263
Dim Min Max
A 4.07 4.82
A1 0.00 0.25
b 0.51 0.99
b2 1.15 1.77
c 0.356 0.73
c2 1.143 1.65
D 8.39 9.65
D1 6.55 ⎯
E 9.66 10.66
E1 6.23 ⎯
e 2.54 Typ
H 14.61 15.87
L 1.78 2.79
L1 ⎯ 1.67
L2 ⎯ 1.77
a 0° 8°
All Dimensions in mm
b3
E
2X b2
D
L4
Ac2
e
A1
L
L3
3X b a
H
A2 E1
EH
D1
B1 B
e
C
L
A
D
8° (4X)
H
1
R0.200
E
D
b2 b
e
c2
A
H
See Detail B
7°±1°
c
E1 D1
A1
Gauge Plane
L
L3
a
Detail B
Seating
Plane
L2
L1
12K
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 11 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Package Outline Dimensions (cont.) (All dimensions in mm.)
(5) Package Type: TO220-3
Suggested Pad Layout
(1) Package Type: SOT223
(2) Package Type: TO252
TO220-3
Dim Min Max
A 3.55 4.85
b 0.51 1.14
b1 1.14 1.78
C 0.31 1.14
D 14.20 16.50
D1 5.84 6.86
E 9.70 10.70
e 2.79 2.99
e1 4.83 5.33
F 0.51 1.40
J1 2.03 2.92
L 12.72 14.72
L1 3.66 6.35
P 3.53 4.09
Q 2.54 3.43
All Dimensions in mm
Dimensions Value (in mm)
X1 3.3
X2 1.2
Y1 1.6
Y2 1.6
C1 6.4
C2 2.3
Dimensions Value (in mm)
Z 11.6
X1 1.5
X2 7.0
Y1 2.5
Y2 7.0
C 6.9
E1 2.3
AF
C
D
E
L
b
e1
b1
D1
Q
L1
J1
e
SEATING PLANE
ØP
X2
C1
C2
X1
Y2
Y1
X2
CZ
X1
Y1
E1
Y2
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 12 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
Suggested Pad Layout (cont.)
(3) Package Type: SOT89-3
(4) Package Type: TO263
Dimensions Value (in mm)
X 0.900
X1 1.733
X2 0.416
Y 1.300
Y1 4.600
Y2 1.475
Y3 0.950
Y4 1.125
C 1.500
Dimensions Value (in mm)
C 5.08
X 1.10
X1 10.41
Y 3.50
Y1 7.01
Y2 15.99
Y1
X1
Y2
Y
C
X (3 x)
Y3 Y4
X2 (2x)
X1
Y
Y2
C
X
Y1
AP1117/AP1117I
Document number: DS31009 Rev. 22 - 2 13 of 13
www.diodes.com July 2012
© Diodes Incorporated
AP1117/AP1117I
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated p roducts for any unintended or una uthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign p atents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
