SPEC NO: DSAB9134 REV NO: V.2 DATE:OCT/29/2002 PAGE: 1 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN:S.J.HOU
3.2X1.6mm SMD CHIP LED LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.0079") unless otherwise noted.
3. Specifications are subject to change without notice.
Features
!3.2mmX1.6mm SMT LED, 1.1mm THICKNESS.
!LOW POWER CONSUMPTION.
!WIDE VIEWING ANGLE.
!IDEAL FOR BACKLIGHT AND INDICATOR.
!VARIOUS COLORS AND LENS TYPES AVAILABLE.
!PACKAGE :2000PCS / REEL.
Package Dimensions
PRELIMINARY SPEC APK3216SURCK HYPER RED
Description
The Hyper Red source color devices are made
with DH InGaAlP on GaAs substrate Light Emitting
Diode.
SPEC NO: DSAB9134 REV NO: V.2 DATE:OCT/29/2002 PAGE: 2 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN:S.J.HOU
Electrical / Optical Characteristics at TA=25°°
°°
°C
Absolute Maximum Ratings at TA=25°°
°°
°C
Selection Guide
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
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SPEC NO: DSAB9134 REV NO: V.2 DATE:OCT/29/2002 PAGE: 3 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN:S.J.HOU
Hyper Red APK3216SURCK
SPEC NO: DSAB9134 REV NO: V.2 DATE:OCT/29/2002 PAGE: 4 OF 4
APPROVED:J.Lu CHECKED:Allen Liu DRAWN:S.J.HOU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APK3216SURCK
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
