Qt Be 5etett (CUD Nihon Inter Electronics Corporation 1A Avg. 400 Volts { FRD \_ MiexATKH MAXIMUM RATINGS EC11FS4 MOUTLINE DRAWING(mm) . T . Rating symbol EC11FS4 Unit ,< 07 we LE 9 EE Repetitive Peak Reverse Voltage Vv RRM 400 Vv Sn crotitte Rook Revecevantaet | Virsa 440 Non-repetitive Peak Reverse Voltage Surge Forward Current Ipsum 20 (SOHZ HAE WE Lb 2 LdE< Da) Half Sine Wave, lcycle, Non-repetitive Vv YH WE ti AL ahi | Glass-Epoxy 0.76 (ail ee 808 aheliTa=25C) A Average Substrate mounted * I . Half Sine Wave, Resistive Load Rectified Alumina 1.0 (aisle, -akive sone whtrTa=26'C) A Output Current | Substrate mounted * : Half Sine Wave, Resistive Load BE ah WG nes we . RMS Foeward Current Ipcems) 1.57 A af a 2 Wei ahi A Cc se oh Bs Dono S 128/03 2.9 102 Poze: eH oso DE RING Sm oH Tat INSTANTANEOUS FORWARD CURRENT a o 0.8 IWS TANTAREGIS Remo FIG.4 12 FORWARD YOLIAVE 1 We ivy 16 es w R- Pe Ae es ! AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE i Mumina Substrata Mownted{Salder ng Land=2=2am) 6 Bor fsa c ta E ge BSE ser of | 5 RHA ee a i = . ge AgcT 120 Pl | = = BET Bo DSSS RS 64 ans > EB aye 6.2 2 @ 25 40 7s 100 125 AMBIENT TEMPERATURE 221 aes we (Cc) 159 = a 5s & "3 g Rog a & = 2 me & & (w) & Ce o aa rs ATERAGE FORWARD CURRENT {1 eH WM BR CAD FIG.5 4-3 BRB SURGE CURRENT RATINGS fSBOHZ, Halt Sina Wave, Nor-Repetitive,No Load a oe = = o & a Bois 2 & z (a) & 195 Mm tf fe oak ie & lal . _ AK ce Operating Junction Temperature Range Tiw 40 +150 ~ S fk ff & & & WW _ An 9 L Jot Storage Temperature Range Tstg 40~ +150 C oT MBAPPROX. NET WEIGHT:0.06g MS AHH ELECTRICAL CHARACTERISTICS Characteristic Symbol Test Condition Min. | Typ. | Max. | Unit ia 4 xf ti Fil _ ory Peak Reverse Current " Iku Vam=Verm Tj=25'C _ _ 20 v2 A mm OK - 7 We =_ =9Ory Peak Forward Voltage Vem Tim=1A Tj=25 C ~ 7 1.25 Vv cd le] (Se By IB : 9n _ Reverse Recovery Time ter Tem=1A -di/dt=50A/ 4s Ta=25C 30 ns Me BE te CHE GB JA] DE ML) Glass-Epoxy Substrate mounted * _ _ 157 | C/W Thermal Resistance (Junction to Rthg-a) , Ambient) Alumina Substrate mounted * _ 108 | C/W * Soldering Land = 2X2 mm eo ME - ttt FIG. FIG.2 FIG.3 MEE os EBD RR * we | OME R- HBR eZ B FORWARD CURRENT VS. VOLTAGE wan AVERAGE FORWARD POWER DISSIPATION aa i AVERAGE FORWARD CURRENT VS. AMBIENT TEMPERATURE Leoncuc oe mmece cupuc TOR ae | Glass-Epoxy Subst-ate Mounted( Soldering Land=2e2ma} 1? ECIIFSA 22 Bee N * : Es Sek we Ager 6c a os pro + SEK uly a bE RSS rn oe he - (aA) = t PSS 02-4 + ~ bea + oe o as 50 25 100 25 $0 AMBIENT TEMPERATURE iC) Qe 2 eC)