www.ti.com
FEATURES
Seemechanicaldrawingsfordimensions.
DCTPACKAGE
(TOP VIEW)
DCUPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
1VCC
8
COM
27
INH Y1
3 6
GND Y2
45
GND A
3 6 Y2GND
8
1VCC
COM
5
GND 4A
27Y1INH
GND 5
4A
3 6 Y2GND
27Y1INH
8VCC
1
COM
DESCRIPTION/ORDERING INFORMATION
SN74LVC2G53SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
•Available in the Texas Instruments •Low On-State Resistance, Typically 96.5 ΩNanoFree™ Package (V
CC
= 4.5 V)•1.65-V to 5.5-V V
CC
Operation •Latch-Up Performance Exceeds 100 mA PerJESD 78, Class II•High On-Off Output Voltage Ratio
•ESD Protection Exceeds JESD 22•High Degree of Linearity
– 2000-V Human-Body Model (A114-A)•High Speed, Typically 0.5 ns (V
CC
= 3 V,C
L
= 50 pF) – 200-V Machine Model (A115-A)– 1000-V Charged-Device Model (C101)
This dual analog multiplexer/demultiplexer is designed for 1.65-V to 5.5-V V
CC
operation.
The SN74LVC2G53 can handle both analog and digital signals. The device permits signals with amplitudes ofup to 5.5 V (peak) to be transmitted in either direction.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing foranalog-to-digital and digital-to-analog conversion systems.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74LVC2G53YZPR _ _ _C4_0.23-mm Large Bump – YZP (Pb-free)SSOP – DCT Reel of 3000 SN74LVC2G53DCTR C53_ _ _–40 °C to 85 °C
Reel of 3000 SN74LVC2G53DCURVSSOP – DCU C53_Reel of 250 SN74LVC2G53DCUT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.DCU: The actual top-side marking has one additional character that designates the assembly/test site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, •= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2007, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
Y2
A
INH
Y1
COM
5
2
7
6
1
SW
SW
NOTE A: For simplicity, the test conditions shown in Figures 1 through 4 and 6 through 10 are for the demultiplexer configuration. Signals can
be passed from COM to Y1 (Y2) or from Y1 (Y2) to COM.
COM Y
SN74LVC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
FUNCTION TABLE
CONTROL
ONINPUTS
CHANNELINH A
L L Y1L H Y2H X None
LOGIC DIAGRAM (POSITIVE LOGIC)
SIMPLIFIED SCHEMATIC, EACH SWITCH (SW)
2
Submit Documentation Feedback
www.ti.com
Absolute Maximum Ratings
(1)
Recommended Operating Conditions
(1)
SN74LVC2G53SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range
(2)
–0.5 6.5 VV
I
Input voltage range
(2) (3)
–0.5 6.5 VV
O
Switch I/O voltage range
(2) (3) (4)
–0.5 V
CC
+ 0.5 VI
IK
Control input clamp current V
I
< 0 –50 mAI
I/OK
I/O port diode current V
I/O
< 0 or V
I/O
> V
CC
±50 mAI
T
On-state switch current V
I/O
= 0 to V
CC
±50 mAContinuous current through V
CC
or GND ±100 mADCT package 220θ
JA
Package thermal impedance
(5)
DCU package 227 °C/WYZP package 102T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltages are with respect to ground, unless otherwise specified.(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(4) This value is limited to 5.5 V maximum.(5) The package thermal impedance is calculated in accordance with JESD 51-7.
MIN MAX UNIT
V
CC
Supply voltage 1.65 5.5 VV
I/O
I/O port voltage 0 V
CC
VV
CC
= 1.65 V to 1.95 V V
CC
×0.65V
CC
= 2.3 V to 2.7 V V
CC
×0.7V
IH
High-level input voltage, control input VV
CC
= 3 V to 3.6 V V
CC
×0.7V
CC
= 4.5 V to 5.5 V V
CC
×0.7V
CC
= 1.65 V to 1.95 V V
CC
×0.35V
CC
= 2.3 V to 2.7 V V
CC
×0.3V
IL
Low-level input voltage, control input VV
CC
= 3 V to 3.6 V V
CC
×0.3V
CC
= 4.5 V to 5.5 V V
CC
×0.3V
I
Control input voltage 0 5.5 VV
CC
= 1.65 V to 1.95 V 20V
CC
= 2.3 V to 2.7 V 20∆t/ ∆v Input transition rise/fall time ns/VV
CC
= 3 V to 3.6 V 10V
CC
= 4.5 V to 5.5 V 10T
A
Operating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3Submit Documentation Feedback
www.ti.com
Electrical Characteristics
Switching Characteristics
SN74LVC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
I
S
= 4 mA 1.65 V 13 30V
I
= V
CC
or GND,
I
S
= 8 mA 2.3 V 10 20V
INH
= V
ILr
on
On-state switch resistance Ω(see Figure 1
I
S
= 24 mA 3 V 8.5 17and Figure 2 )
I
S
= 32 mA 4.5 V 6.5 13I
S
= 4 mA 1.65 V 86.5 120V
I
= V
CC
to GND,
I
S
= 8 mA 2.3 V 23 30V
INH
= V
ILr
on(p)
Peak on-state resistance Ω(see Figure 1
I
S
= 24 mA 3 V 13 20and Figure 2 )
I
S
= 32 mA 4.5 V 8 15I
S
= 4 mA 1.65 V 7V
I
= V
CC
to GND,
I
S
= 8 mA 2.3 V 5Difference of on-state resistance V
C
= V
IH∆r
on
Ωbetween switches (see Figure 1
I
S
= 24 mA 3 V 3and Figure 2 )
I
S
= 32 mA 4.5 V 2V
I
= V
CC
and V
O
= GND or ±1I
S(off)
Off-state switch leakage current V
I
= GND and V
O
= V
CC
, 5.5 V µA±0.1
(1)V
INH
= V
IH
(see Figure 3 )
±1V
I
= V
CC
or GND, V
INH
= V
IL
,I
S(on)
On-state switch leakage current 5.5 V µAV
O
= Open (see Figure 4 )
±0.1
(1)
±1I
I
Control input current V
C
= V
CC
or GND 5.5 V µA±0.1
(1)
I
CC
Supply current V
C
= V
CC
or GND 5.5 V 1 µA∆I
CC
Supply-current change V
C
= V
CC
– 0.6 V 5.5 V 500 µAC
ic
Control input capacitance 5 V 3.5 pFY 6.5Switch input/outputC
io(off)
5 V pFcapacitance
COM 10C
io(on)
Switch input/output capacitance 5 V 19.5 pF
(1) T
A
= 25 °C
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 5 )
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VFROM TO
±0.15 V ±0.2 V ±0.3 V ±0.5 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN MAX MIN MAX MIN MAX MIN MAX
t
pd
(1)
COM or Y Y or COM 2 1.2 0.8 0.6 nst
en
(2)
3.3 9 2.5 6.1 2.2 5.4 1.8 4.5INH COM or Y nst
dis
(3)
3.2 10.9 2.3 8.3 2.3 8.1 1.6 8t
en
(2)
2.9 10.3 2.1 7.2 1.9 5.8 1.3 5.4A COM or Y nst
dis
(3)
2.1 9.4 1.4 7.9 1.1 7.2 1 5
(1) t
PLH
and t
PHL
are the same as t
pd
. The propagation delay is the calculated RC time constant of the typical on-state resistance of theswitch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).(2) t
PZL
and t
PZH
are the same as t
en
.(3) t
PLZ
and t
PHZ
are the same as t
dis
.
4
Submit Documentation Feedback
www.ti.com
Analog Switch Characteristics
Operating Characteristics
SN74LVC2G53SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
T
A
= 25 °C
FROM TOPARAMETER TEST CONDITIONS V
CC
TYP UNIT(INPUT) (OUTPUT)
1.65 V 35C
L
= 50 pF, R
L
= 600 Ω,
2.3 V 120f
in
= sine wave
3 V 190(see Figure 6 )
4.5 V 215Frequency response
COM or Y Y or COM MHz(switch on)
1.65 V >300C
L
= 5 pF, R
L
= 50 Ω,
2.3 V >300f
in
= sine wave
3 V >300(see Figure 6 )
4.5 V >3001.65 V –58C
L
= 50 pF, R
L
= 600 Ω,
2.3 V –58f
in
= 1 MHz (sine wave)
3 V –58(see Figure 7 )
4.5 V –58Crosstalk
(1)
COM or Y Y or COM dB(between switches)
1.65 V –42C
L
= 5 pF, R
L
= 50 Ω,
2.3 V –42f
in
= 1 MHz (sine wave)
3 V –42(see Figure 7 )
4.5 V –421.65 V 35C
L
= 50 pF, R
L
= 600 Ω,
2.3 V 50Crosstalk
INH COM or Y f
in
= 1 MHz (square wave) mV(control input to signal output)
3 V 70(see Figure 8 )
4.5 V 1001.65 V –60C
L
= 50 pF, R
L
= 600 Ω,
2.3 V –60f
in
= 1 MHz (sine wave)
3 V –60(see Figure 9 )
4.5 V –60Feedthrough attenuation
COM or Y Y or COM dB(switch off)
1.65 V –50C
L
= 5 pF, R
L
= 50 Ω,
2.3 V –50f
in
= 1 MHz (sine wave)
3 V –50(see Figure 9 )
4.5 V –501.65 V 0.1C
L
= 50 pF, R
L
= 10 k Ω,
2.3 V 0.025f
in
= 1 kHz (sine wave)
3 V 0.015(see Figure 10 )
4.5 V 0.01Sine-wave distortion COM or Y Y or COM %1.65 V 0.15C
L
= 50 pF, R
L
= 10 k Ω,
2.3 V 0.025f
in
= 10 kHz (sine wave)
3 V 0.015(see Figure 10 )
4.5 V 0.01
(1) Adjust f
in
voltage to obtain 0 dBm at input.
T
A
= 25 °C
V
CC
= 1.8 V V
CC
= 2.5 V V
CC
= 3.3 V V
CC
= 5 VPARAMETER TEST CONDITIONS UNITTYP TYP TYP TYP
C
pd
Power dissipation capacitance C
L
= 50 pF, f = 10 MHz 9 10 10 12 pF
5Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
VI = VCC or GND
VO
ron +VI*VO
IS
W
VI - VO
GND
V
Y1
IS
(On)
VCC
VIL
Y2
A
VA
VINH
INH
COM
VIL or VIH
S
1
2
VA
VIL
VIH
S
1
2
100
10
1
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
VCC = 1.65 V
VCC = 2.3 V
VCC = 3.0 V
VCC = 4.5 V
VI - V
ron -Ω
SN74LVC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
Figure 1. On-State Resistance Test Circuit
Figure 2. Typical r
on
as a Function of Input Voltage (V
I
) for V
I
= 0 to V
CC
6
Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
VI
VO
GND
Y1
(Off)
VCC
VIH
Y2
A
VA
VINH
INH
COM
VIL or VIH
S
1
2
VA
VIL
VIH
S
1
2
A
Condition 1: VI = GND, VO = VCC
Condition 2: VI = VCC, VO = GND
SN74LVC2G53SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
Figure 3. Off-State Switch Leakage-Current Test Circuit
Figure 4. On-State Switch Leakage-Current Test Circuit
7Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VM
th
tsu
FromOutput
UnderTest
CL
(seeNote A)
LOADCIRCUIT
S1
VLOAD
Open
GND
RL
RL
DataInput
TimingInput
VI
0V
VI
0V
0V
tw
Input
VOLTAGEWAVEFORMS
SETUP ANDHOLDTIMES
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
INVERTING ANDNONINVERTINGOUTPUTS
VOLTAGEWAVEFORMS
PULSEDURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0V
Input
Output
Waveform1
S1atV
(seeNoteB)
LOAD
Output
Waveform2
S1atGND
(seeNoteB)
VOL
VOH
tPZL
TPZH
tPLZ
tPHZ
V /2
LOAD
0V
V +V
OL D
V -V
OH D
»0V
VI
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
LOW- ANDHIGH-LEVEL ENABLING
Output
Output
t /t
PLH PHL
t /t
PLZ PZL
t /t
PHZ PZH
Open
VLOAD
GND
TEST S1
NOTES: A.C includesprobeandjigcapacitance.
L
B.Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10Mhz,Z =50£ W
O
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E.t andt arethesameast .
PLZ PHZ dis
F.t andt arethesameast .
PZL PZH en
G.t andt arethesameast .
PLH PHL pd
H. Allparametersandwaveformsarenotapplicabletoalldevices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8V 0.15V±
2.5V 0.2V±
3.3V 0.3V±
5V 0.5V±
1k W
500 W
500 W
500 W
VCC RL
2 V´CC
2 V´CC
2 V´CC
2´VCC
VLOAD CL
30pF
30pF
50pF
50pF
0.15V
0.15V
0.3V
0.3V
VD
VCC
VCC
VCC
VCC
VI
V /2
CC
V /2
CC
V /2
CC
V /2
CC
VM
t /t
r f
£2ns
£2ns
£2.5ns
£2.5ns
INPUTS
SN74LVC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
Figure 5. Load Circuit and Voltage Waveforms
8
Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
VO
GND
Y1
(On)
VCC
VIL
Y2
A
VA
VINH
INH
COM
VIL or VIH
S
1
2
VA
VIL
VIH
S
1
2
50 Ω
0.1 µF
fin
RL/CL: 600 Ω/50 pF
RL/CL: 50 Ω/5 pF
RLCL
VCC/2
VCC
VO1
GND
Y1
VCC
VIL
Y2
VIL or VIH
50 Ω
0.1 µF
fin
CL
50 pF
VCC/2
Rin
600 Ω
RL
600 Ω
VO2
CL
50 pF
VCC/2
RL
600 Ω
VA
VIL
VIH
TEST CONDITION
20log10(VO2/VI)
20log10(VO1/VI)
A
VA
VINH
INH
COM
SN74LVC2G53SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
Figure 6. Frequency Response (Switch On)
Figure 7. Crosstalk (Between Switches)
9Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
VO
GND
Y1
(On)
VCC
Y2
VIL or VIH
S
1
2
VA
VIL
VIH
S
1
2
50 Ω
VCC/2
Rin
600 Ω
VCC/2
CL
50 pF
RL
600 Ω
A
VA
VINH
INH
COM
VCC
VO
GND
Y1
(Off)
VCC
VIL
Y2
VIL or VIH
S
1
2
50 Ω
0.1 µF
fin
RL/CL: 600 Ω/50 pF
RL/CL: 50 Ω/5 pF
RLCL
VCC/2
RL
VCC/2
A
VA
VINH
INH
COM
S
1
2
VA
VIL
VIH
SN74LVC2G53
SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
Figure 8. Crosstalk (Control Input, Switch Output)
Figure 9. Feedthrough (Switch Off)
10
Submit Documentation Feedback
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
VO
GND
Y1
(On)
VCC
VIL
Y2
VIL or VIH
S
1
2
VA
VIL
VIH
S
1
2
600 Ω
10 µF
fin
RL
10 kΩCL
50 pF
VCC/2
VCC = 1.65 V, VI = 1.4 VP-P
VCC = 2.30 V, VI = 2.0 VP-P
VCC = 3.00 V, VI = 2.5 VP-P
VCC = 4.50 V, VI = 4.0 VP-P
10 µF
A
VA
VINH
INH
COM
SN74LVC2G53SINGLE-POLE DOUBLE-THROW (SPDT) ANALOG SWITCH2:1 ANALOG MULTIPLEXER/DEMULTIPLEXER
SCES324M – JULY 2001 – REVISED FEBRUARY 2007
Figure 10. Sine-Wave Distortion
11Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74LVC2G53DCTR ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C53
Z
SN74LVC2G53DCTRE4 ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C53
Z
SN74LVC2G53DCTRG4 ACTIVE SM8 DCT 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C53
Z
SN74LVC2G53DCUR ACTIVE US8 DCU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 85 (53 ~ C53R)
CZ
SN74LVC2G53DCURE4 ACTIVE US8 DCU 8 TBD Call TI Call TI -40 to 85
SN74LVC2G53DCURG4 ACTIVE US8 DCU 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 C53R
SN74LVC2G53DCUT ACTIVE US8 DCU 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 (53 ~ C53R)
CZ
SN74LVC2G53DCUTE4 ACTIVE US8 DCU 8 TBD Call TI Call TI -40 to 85
SN74LVC2G53DCUTG4 ACTIVE US8 DCU 8 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM C53R
SN74LVC2G53YZPR ACTIVE DSBGA YZP 8 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 (C47 ~ C4N)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 2
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC2G53DCUR US8 DCU 8 3000 180.0 9.0 2.05 3.3 1.0 4.0 8.0 Q3
SN74LVC2G53DCURG4 US8 DCU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
SN74LVC2G53DCUTG4 US8 DCU 8 250 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3
SN74LVC2G53YZPR DSBGA YZP 8 3000 178.0 9.2 1.02 2.02 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Nov-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC2G53DCUR US8 DCU 8 3000 182.0 182.0 20.0
SN74LVC2G53DCURG4 US8 DCU 8 3000 202.0 201.0 28.0
SN74LVC2G53DCUTG4 US8 DCU 8 250 202.0 201.0 28.0
SN74LVC2G53YZPR DSBGA YZP 8 3000 220.0 220.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 1-Nov-2013
Pack Materials-Page 2
MECHANICAL DATA
MPDS049B – MAY 1999 – REVISED OCTOBER 2002
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
ÇÇÇÇÇ
0,60
0,20
0,25
0°– 8°
0,15 NOM
Gage Plane
4188781/C 09/02
4,25
5
0,30
0,15
2,90 3,75
2,70
8
4
3,15
2,75
1
0,10
0,00
1,30 MAX
Seating Plane
0,10
M
0,13
0,65
PIN 1
INDEX AREA
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion
D. Falls within JEDEC MO-187 variation DA.
D: Max =
E: Max =
1.918 mm, Min =
0.918 mm, Min =
1.858 mm
0.858 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated