DS90LV027
www.ti.com
SNLS003C –JUNE 1998–REVISED APRIL 2013
DS90LV027 LVDS Dual High Speed Differential Driver
Check for Samples: DS90LV027
1FEATURES DESCRIPTION
The DS90LV027 is a dual LVDS driver device
23• Ultra Low Power Dissipation optimized for high data rate and low power
• Operating Range above 155 Mbps applications. The DS90LV027 is a current mode
• Flow-through pinout simplifies PCB layout driver allowing power dissipation to remain low even
at high frequency. In addition, the short circuit fault
• Conforms to TIA/EIA-644 Standard current is also minimized. The device is in a 8-lead
• 8-Lead SOIC Package Saves Space SOIC package. The DS90LV027 has a flow-through
• VCM ±1V center around 1.2V design for easy PCB layout. The differential driver
outputs provides low EMI with its low output swings
• Low Differential Output Swing Typical 340 mV typically 340 mV. Perfect for high speed transfer of
• Power Off Protection (outputs in high clock and data. Pair with any of TI's LVDS receivers.
impedance)
Connection Diagram
Figure 1. Dual-In-Line
See Package Number D (R-PDSO-G8)
Functional Diagram
Truth Table(1)
Input/Output
DI DO+ DO−
L L H
H H L
DI > 0.8V and DI < 2.0V X X
(1) H = Logic high level
L = Logic low level
X = indeterminant
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2TRI-STATE is a registered trademark of Texas Instruments.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1998–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS90LV027
SNLS003C –JUNE 1998–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
Supply Voltage (VCC)−0.3V to +6V
Input Voltage (DI) −0.3V to (VCC + 0.3V)
Output Voltage (DO±) −0.3V to +3.9V
Maximum Package Power Dissipation @ +25°C
D Package 1190 mW
Derate D Package 9.5 mW/°C above +25°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range
Soldering (4 sec.) +260°C
ESD Rating (2)
(HBM 1.5 kΩ, 100 pF) ≥4.5 kV
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. Electrical Characteristics specifies conditions of device operation.
(2) ESD Rating: HBM (1.5 kΩ, 100 pF) ≥4.5 kV
Recommended Operating Conditions Min Typ Max Units
Supply Voltage (VCC) 3.0 3.3 3.6 V
Temperature (TA) 0 25 70 °C
Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2) (3)
Symbol Parameter Conditions Pin Min Typ Max Units
DIFFERENTIAL DRIVER CHARACTERISTICS
VOD Output Differential Voltage RL= 100Ω(Figure 2)DO+, 250 340 450 mV
DO−
ΔVOD VOD Magnitude Change 0 10 35 mV
VOH Output High Voltage 1.43 1.6 V
VOL Output Low Voltage 0.9 1.09 V
VOS Offset Voltage 0.9 1.25 1.6 V
ΔVOS Offset Magnitude Change 0 5 25 mV
IOZD TRI-STATE®Leakage VOUT = VCC or GND 0 ±1 ±10 μA
IOXD Power-off Leakage VOUT = 3.6V or GND, VCC = 0V 0 ±1 ±10 μA
IOSD Output Short Circuit Current −4−6 mA
VIH Input High Voltage DI 2.0 VCC V
VIL Input Low Voltage GND 0.8 V
IIH Input High Current VIN = 3.6V or 2.4V ±1 ±10 μA
IIL Input Low Current VIN = GND or 0.5V ±1 ±10 μA
VCL Input Clamp Voltage ICL =−18 mA −1.5 −0.8 V
ICC Power Supply Current No Load VIN = VCC or GND VCC 1 4 mA
RL= 100Ω8 11 mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD.
(2) All typicals are given for: VCC = +3.3V and TA= +25°C.
(3) The DS90LV027 is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers
outputs.
2Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV027
DS90LV027
www.ti.com
SNLS003C –JUNE 1998–REVISED APRIL 2013
Switching Characteristics
Over Supply Voltage and Operating Temperature Ranges, unless otherwise specified. (1) (2)
Symbol Parameter Conditions Min Typ Max Units
DIFFERENTIAL DRIVER CHARACTERISTICS
tPHLD Differential Propagation Delay High to Low RL= 100Ω, CL= 5 pF 1.5 3.4 6 ns
(Figure 3 and Figure 4)
tPLHD Differential Propagation Delay Low to High 1.5 3.5 6 ns
tSKD Differential Skew |tPHLD −tPLHD| 0 0.1 1.9 ns
tTLH Transition Low to High Time 0 1 3 ns
tTHL Transition High to Low Time 0 1 3 ns
(1) CLincludes probe and fixture capacitance.
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO= 50Ω, tr≤6 ns, tf≤6 ns (10%-90%).
PARAMETER MEASUREMENT INFORMATION
Figure 2. Differential Driver DC Test Circuit
Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit
Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms
Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS90LV027
DS90LV027
SNLS003C –JUNE 1998–REVISED APRIL 2013
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APPLICATION INFORMATION
Table 1. Device Pin Descriptions
Pin # Name Description
2, 3 DI TTL/CMOS driver input pins
6, 7 DO+ Non-inverting driver output pin
5, 8 DO−Inverting driver output pin
4 GND Ground pin
1 VCC Positive power supply pin,
+3.3V ± 0.3V
4Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS90LV027
DS90LV027
www.ti.com
SNLS003C –JUNE 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 4
Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: DS90LV027
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
DS90LV027M ACTIVE SOIC D 8 95 TBD Call TI Call TI 0 to 70 90LV
027M
DS90LV027M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 90LV
027M
DS90LV027MX ACTIVE SOIC D 8 TBD Call TI Call TI 0 to 70 90LV
027M
DS90LV027MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 90LV
027M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Apr-2013
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS90LV027MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS90LV027MX/NOPB SOIC D 8 2500 349.0 337.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 2
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