LM2937ES-10/NOPB - Texas Instruments High-Performance Analog

LM2937

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SNVS100E –MARCH 2000–REVISED APRIL 2013

LM2937 500 mA Low Dropout Regulator

Check for Samples: LM2937

1FEATURES DESCRIPTION

The LM2937 is a positive voltage regulator capable of

2• Fully Specified for Operation Over −40°C to supplying up to 500 mA of load current. The use of a

+125°C PNP power transistor provides a low dropout voltage

• Output Current in Excess of 500 mA characteristic. With a load current of 500 mA the

• Output Trimmed for 5% Tolerance Under all minimum input to output voltage differential required

for the output to remain in regulation is typically 0.5V

Operating Conditions (1V ensured maximum over the full operating

• Typical Dropout Voltage of 0.5V at Full Rated temperature range). Special circuitry has been

Load Current incorporated to minimize the quiescent current to

• Wide Output Capacitor ESR Range, up to 3Ωtypically only 10 mA with a full 500 mA load current

when the input to output voltage differential is greater

• Internal Short Circuit and Thermal Overload than 3V.

Protection

• Reverse Battery Protection The LM2937 requires an output bypass capacitor for

stability. As with most low dropout regulators, the

• 60V Input Transient Protection ESR of this capacitor remains a critical design

• Mirror Image Insertion Protection parameter, but the LM2937 includes special

compensation circuitry that relaxes ESR

requirements. The LM2937 is stable for all ESR

below 3Ω. This allows the use of low ESR chip

capacitors.

Ideally suited for automotive applications, the LM2937

will protect itself and any load circuitry from reverse

battery connections, two-battery jumps and up to

+60V/−50V load dump transients. Familiar regulator

features such as short circuit and thermal shutdown

protection are also built in.

Connection Diagrams

Front View Front View

Figure 1. TO-220 Plastic Package Figure 2. SOT-223 Plastic Package

See Package Number NDE0003B See Package Number DCY0004A

Top View Side View

Figure 3. DDPAK/TO-263 Surface-Mount Package Figure 4. DDPAK/TO-263 Surface-Mount Package

See Package Number KTT0003B See Package Number KTT0003B

1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

LM2937

SNVS100E –MARCH 2000–REVISED APRIL 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings(1)(2)

Continuous 26V

Input Voltage Transient (t ≤100 ms) 60V

Internal Power Dissipation(3) Internally Limited

Maximum Junction Temperature 150°C

Storage Temperature Range −65°C to +150°C

TO-220 (10 seconds) 260°C

DDPAK/TO-263 (10 seconds) 230°C

SOT-223 (Vapor Phase, 60 seconds) 215°C

SOT-223 (Infared, 15 seconds) 220°C

ESD Susceptibility(4) 2 kV

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device outside of its rated Operating Conditions.

(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 −TA)/θJA, where 125 is the maximum junction

temperature for operation, TAis the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is

exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above

150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the

TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is

the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the

DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area

thermally connected to the package (see Application Hints for more information on heatsinking).

(4) ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.

Operating Conditions(1)

LM2937ET, LM2937ES −40°C ≤TJ≤125°C

Temperature Range(2) LM2937IMP −40°C ≤TJ≤85°C

Maximum Input Voltage 26V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when

operating the device outside of its rated Operating Conditions.

(2) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 −TA)/θJA, where 125 is the maximum junction

temperature for operation, TAis the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is

exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above

150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the

TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is

the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the

DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area

thermally connected to the package (see Application Hints for more information on heatsinking).

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LM2937

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SNVS100E –MARCH 2000–REVISED APRIL 2013

Electrical Characteristics

VIN = VNOM + 5V(1) IOUTmax = 500 mA for the TO-220 and DDPAK/TO-263 packages, IOUTmax=400mA for the SOT-223 package,

COUT = 10 μF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the

indicated device., all other specifications are for TA= TJ= 25°C.

Output Voltage (VOUT) 5V 8V 10V Units

Parameter Conditions Typ Limit Typ Limit Typ Limit

Output Voltage 4.85 7.76 9.70 V(Min)

5.00 4.75 8.00 7.60 10.00 9.50 V(Min)

5 mA ≤IOUT ≤IOUTmax 5.15 8.24 10.30 V(Max)

5.25 8.40 10.50 V(Max)

Line Regulation (VOUT + 2V) ≤VIN ≤26V, 15 50 24 80 30 100 mV(Max)

IOUT = 5 mA

Load Regulation 5 mA ≤IOUT ≤IOUTmax 550 880 10 100 mV(Max)

Quiescent Current (VOUT + 2V) ≤VIN ≤26V, 210 210 210 mA(Max)

IOUT = 5 mA

VIN = (VOUT + 5V), 10 20 10 20 10 20 mA(Max)

IOUT = IOUTmax

Output Noise Voltage 10 Hz–100 kHz, IOUT = 5 mA 150 240 300 μVrms

Long Term Stability 1000 Hrs. 20 32 40 mV

Dropout Voltage IOUT = IOUTmax 0.5 1.0 0.5 1.0 0.5 1.0 V(Max)

IOUT = 50 mA 110 250 110 250 110 250 mV(Max)

Short-Circuit Current 1.0 0.6 1.0 0.6 1.0 0.6 A(Min)

Peak Line Transient Voltage tf< 100 ms, RL= 100Ω75 60 75 60 75 60 V(Min)

Maximum Operational Input 26 26 26 V(Min)

Voltage

Reverse DC Input Voltage VOUT ≥ −0.6V, RL= 100Ω −30 −15 −30 −15 −30 −15 V(Min)

Reverse Transient Input tr< 1 ms, RL= 100Ω −75 −50 −75 −50 −75 −50 V(Min)

Voltage

(1) Typicals are at TJ= 25°C and represent the most likely parametric norm.

Product Folder Links: LM2937

LM2937

SNVS100E –MARCH 2000–REVISED APRIL 2013

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Electrical Characteristics

VIN = VNOM + 5V(1) IOUTmax = 500 mA for the TO-220 and DDPAK/TO-263 packages, IOUTmax=400mA for the SOT-223 package,

COUT = 10 μF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the

indicted device., all other specifications are for TA= TJ= 25°C.

Output Voltage (VOUT) 12V 15V Units

Parameter Conditions Typ Limit Typ Limit

Output Voltage 11.64 14.55 V (Min)

12.00 11.40 15.00 14.25 V(Min)

5 mA ≤IOUT ≤IOUTmax 12.36 15.45 V(Max)

12.60 15.75 V(Max)

Line Regulation (VOUT + 2V) ≤VIN ≤26V, 36 120 45 150 mV(Max)

IOUT = 5 mA

Load Regulation 5 mA ≤IOUT ≤IOUTmax 12 120 15 150 mV(Max)

Quiescent Current (VOUT + 2V) ≤VIN ≤26V, 210 210 mA(Max)

IOUT = 5 mA

VIN = (VOUT + 5V), 10 20 10 20 mA(Max)

IOUT = IOUTmax

Output Noise Voltage 10 Hz–100 kHz, IOUT = 5 mA 360 450 μVrms

Long Term Stability 1000 Hrs 44 56 mV

Dropout Voltage IOUT = IOUTmax 0.5 1.0 0.5 1.0 V(Max)

IOUT = 50 mA 110 250 110 250 mV(Max)

Short-Circuit Current 1.0 0.6 1.0 0.6 A(Min)

Peak Line Transient Voltage tf< 100 ms, RL= 100Ω75 60 75 60 V(Min)

Maximum Operational Input 26 26 V(Min)

Voltage

Reverse DC Input Voltage VOUT ≥ −0.6V, RL= 100Ω −30 −15 −30 −15 V(Min)

Reverse Transient Input tr< 1 ms, RL= 100Ω −75 −50 −75 −50 V(Min)

Voltage

(1) Typicals are at TJ= 25°C and represent the most likely parametric norm.

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LM2937

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SNVS100E –MARCH 2000–REVISED APRIL 2013

Typical Performance Characteristics

Dropout Voltage vs. Output Current Dropout Voltage vs. Temperature

Figure 5. Figure 6.

Output Voltage vs. Temperature Quiescent Current vs. Temperature

Figure 7. Figure 8.

Quiescent Current vs. Input Voltage Quiescent Current vs. Output Current

Figure 9. Figure 10.

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SNVS100E –MARCH 2000–REVISED APRIL 2013

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Typical Performance Characteristics (continued)

Line Transient Response Load Transient Response

Figure 11. Figure 12.

Ripple Rejection Output Impedance

Figure 13. Figure 14.

Maximum Power Dissipation (TO-220) Maximum Power Dissipation (DDPAK/TO-263)(1)

Figure 15. Figure 16.

(1) The maximum allowable power dissipation at any ambient temperature is PMAX = (125 −TA)/θJA, where 125 is the maximum junction

temperature for operation, TAis the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is

exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above

150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the

TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is

the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the

DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area

thermally connected to the package (see Application Hints for more information on heatsinking).

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LM2937

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SNVS100E –MARCH 2000–REVISED APRIL 2013

Typical Performance Characteristics (continued)

Low Voltage Behavior Low Voltage Behavior

Figure 17. Figure 18.

Low Voltage Behavior Output at Voltage Extremes

Figure 19. Figure 20.

Output at Voltage Extremes

Figure 21.

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SNVS100E –MARCH 2000–REVISED APRIL 2013

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Typical Performance Characteristics (continued)

Output Capacitor ESR Peak Output Current

Figure 22. Figure 23.

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LM2937

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SNVS100E –MARCH 2000–REVISED APRIL 2013

Typical Application

* Required if the regulator is located more than 3 inches from the power supply filter capacitors.

** Required for stability. Cout must be at least 10 μF (over the full expected operating temperature range) and located

as close as possible to the regulator. The equivalent series resistance, ESR, of this capacitor may be as high as 3Ω.

APPLICATION HINTS

EXTERNAL CAPACITORS

The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both

ESR (Equivalent Series Resistance) and minimum amount of capacitance.

MINIMUM CAPACITANCE:

The minimum output capacitance required to maintain stability is 10 μF (this value may be increased without

limit). Larger values of output capacitance will give improved transient response.

ESR LIMITS:

The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of

ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet

these requirements, or oscillations can result.

Output Capacitor ESR

Figure 24. ESR Limits

It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer

must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the

design.

For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25°C to

−40°C. This type of capacitor is not well-suited for low temperature operation.

Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum

electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid

Tantalum, with the total capacitance split about 75/25% with the Aluminum being the larger value.

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SNVS100E –MARCH 2000–REVISED APRIL 2013

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If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The “flatter” ESR of

the Tantalum will keep the effective ESR from rising as quickly at low temperatures.

HEATSINKING

A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of

the application. Under all possible operating conditions, the junction temperature must be within the range

specified under Absolute Maximum Ratings.

To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated.

The figure below shows the voltages and currents which are present in the circuit, as well as the formula for

calculating the power dissipated in the regulator:

IIN = IL+ IG

PD= (VIN −VOUT) IL+ (VIN) IG

Figure 25. Power Dissipation Diagram

The next parameter which must be calculated is the maximum allowable temperature rise, TR(max). This is

calculated by using the formula:

TR(max) = TJ(max) −TA(max)

where

• TJ(max) is the maximum allowable junction temperature, which is 125°C for commercial grade parts

• TA(max) is the maximum ambient temperature which will be encountered in the application (1)

Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient

thermal resistance, θ(J−A), can now be found:

θ(J−A) = TR(max)/PD(2)

IMPORTANT: If the maximum allowable value for θ(J−A) is found to be ≥53°C/W for the TO-220 package, ≥

80°C/W for the DDPAK/TO-263 package, or ≥174°C/W for the SOT-223 package, no heatsink is needed since

the package alone will dissipate enough heat to satisfy these requirements.

If the calculated value for θ(J−A) falls below these limits, a heatsink is required.

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LM2937

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SNVS100E –MARCH 2000–REVISED APRIL 2013

HEATSINKING TO-220 PACKAGE PARTS

The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board. If a copper plane

is to be used, the values of θ(J−A) will be the same as shown in the next section for the DDPAK/TO-263.

If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, θ(H−A), must

first be calculated:

θ(H−A) =θ(J−A) − θ(C−H) − θ(J−C)

where

•θ(J−C) is defined as the thermal resistance from the junction to the surface of the case. A value of 3°C/W can be

assumed for θ(J−C) for this calculation

•θ(C−H) is defined as the thermal resistance between the case and the surface of the heatsink. The value of

θ(C−H) will vary from about 1.5°C/W to about 2.5°C/W (depending on method of attachment, insulator, etc.). If

the exact value is unknown, 2°C/W should be assumed for θ(C−H) (3)

When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is

less than or equal to this number.

θ(H−A) is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots

temperature rise vs power dissipation for the heatsink.

HEATSINKING DDPAK/TO-263 AND SOT-223 PACKAGE PARTS

Both the DDPAK/TO-263 (“S”) and SOT-223 (“MP”) packages use a copper plane on the PCB and the PCB itself

as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the

plane.

Figure 26 shows for the DDPAK/TO-263 the measured values of θ(J−A) for different copper area sizes using a

typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking.

Figure 26. θ(J−A) vs. Copper (1 ounce) Area for the DDPAK/TO-263 Package

As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It

should also be observed that the minimum value of θ(J−A) for the DDPAK/TO-263 package mounted to a PCB is

32°C/W.

As a design aid, Figure 27 shows the maximum allowable power dissipation compared to ambient temperature

for the DDPAK/TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C).

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Figure 27. Maximum Power Dissipation vs. TAMB for the DDPAK/TO-263 Package

Figure 28 and Figure 29 show the information for the SOT-223 package. Figure 29 assumes a θ(J−A) of 74°C/W

for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of +85°C.

Figure 28. θ(J−A) vs Copper (2 ounce) Area for the Figure 29. Maximum Power Dissipation vs TAMB for

SOT-223 Package the SOT-223 Package

SOT-223 SOLDERING RECOMMENDATIONS

It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed

circuit board. The excessive temperatures involved may cause package cracking.

Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223

package.

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SNVS100E –MARCH 2000–REVISED APRIL 2013

REVISION HISTORY

Changes from Revision D (April 2013) to Revision E Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 12

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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2937ES-10 NRND DDPAK/

TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES

-10

LM2937ES-10/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-10

LM2937ES-12 NRND DDPAK/

TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES

-12

LM2937ES-12/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-12

LM2937ES-15 NRND DDPAK/

TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES

-15

LM2937ES-15/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-15

LM2937ES-5.0 NRND DDPAK/

TO-263 KTT 3 45 TBD Call TI Call TI -40 to 125 LM2937ES

-5.0

LM2937ES-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-5.0

LM2937ES-8.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 45 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-8.0

LM2937ESX-12/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-12

LM2937ESX-15/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-15

LM2937ESX-5.0 NRND DDPAK/

TO-263 KTT 3 500 TBD Call TI Call TI -40 to 125 LM2937ES

-5.0

LM2937ESX-5.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-5.0

LM2937ESX-8.0/NOPB ACTIVE DDPAK/

TO-263 KTT 3 500 Pb-Free (RoHS

Exempt) CU SN Level-3-245C-168 HR -40 to 125 LM2937ES

-8.0

LM2937ET-10 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET

-10

LM2937ET-10/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET

-10

LM2937ET-12 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET

-12

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 2

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2937ET-12/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET

-12

LM2937ET-15 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET

-15

LM2937ET-15/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET

-15

LM2937ET-5.0 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET

-5.0

LM2937ET-5.0/NOPB ACTIVE TO-220 NDE 3 45 Pb-Free (RoHS

Exempt) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET

-5.0

LM2937ET-8.0 NRND TO-220 NDE 3 45 TBD Call TI Call TI -40 to 125 LM2937ET

-8.0

LM2937ET-8.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS

& no Sb/Br) CU SN Level-1-NA-UNLIM -40 to 125 LM2937ET

-8.0

LM2937IMP-10 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 L73B

LM2937IMP-10/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L73B

LM2937IMP-12 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 L74B

LM2937IMP-12/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L74B

LM2937IMP-5.0 NRND SOT-223 DCY 4 1000 TBD Call TI Call TI -40 to 125 L71B

LM2937IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L71B

LM2937IMP-8.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L72B

LM2937IMPX-10 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 L73B

LM2937IMPX-10/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L73B

LM2937IMPX-12 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 L74B

LM2937IMPX-12/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L74B

LM2937IMPX-15/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L75B

LM2937IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L71B

PACKAGE OPTION ADDENDUM

www.ti.com 1-Nov-2013

Addendum-Page 3

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2937IMPX-8.0 NRND SOT-223 DCY 4 2000 TBD Call TI Call TI -40 to 125 L72B

LM2937IMPX-8.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L72B

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

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in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

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TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2937ESX-12/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2937ESX-15/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2937ESX-5.0 DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2937ESX-5.0/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2937ESX-8.0/NOPB DDPAK/

TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2937IMP-10 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-10/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-12 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-12/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-5.0 SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMP-8.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-10 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-10/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Oct-2013

Pack Materials-Page 1

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2937IMPX-12 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-12/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-15/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-8.0 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LM2937IMPX-8.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM2937ESX-12/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2937ESX-15/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2937ESX-5.0 DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2937ESX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2937ESX-8.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0

LM2937IMP-10 SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMP-10/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMP-12 SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMP-12/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMP-5.0 SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Oct-2013

Pack Materials-Page 2

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM2937IMP-8.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0

LM2937IMPX-10 SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-10/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-12 SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-12/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-15/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-8.0 SOT-223 DCY 4 2000 367.0 367.0 35.0

LM2937IMPX-8.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 16-Oct-2013

Pack Materials-Page 3

MECHANICAL DATA

NDE0003B

www.ti.com

MECHANICAL DATA

MPDS094A – APRIL 2001 – REVISED JUNE 2002

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE

4202506/B 06/2002

6,30 (0.248)

6,70 (0.264)

2,90 (0.114)

3,10 (0.122)

6,70 (0.264)

7,30 (0.287) 3,70 (0.146)

3,30 (0.130)

0,02 (0.0008)

0,10 (0.0040)

1,50 (0.059)

1,70 (0.067)

0,23 (0.009)

0,35 (0.014)

1 2 3

0,66 (0.026)

0,84 (0.033)

1,80 (0.071) MAX

Seating Plane

0°–10°

Gauge Plane

0,75 (0.030) MIN

0,25 (0.010)

0,08 (0.003)

0,10 (0.004) M

2,30 (0.091)

4,60 (0.181) M

0,10 (0.004)

NOTES: A. All linear dimensions are in millimeters (inches).

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC TO-261 Variation AA.

MECHANICAL DATA

KTT0003B

www.ti.com

BOTTOM SIDE OF PACKAGE

TS3B (Rev F)

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