SFH 3219-Z - OSRAM OPTO SEMICONDUCTORS

2016-01-31 1

2016-0 1-31

Silicon NPN Phototransistor

Version 1.4 / OS-IN-2015-033

SFH 3219

Ordering Information

Features:

•Spectral range of sensitivity: (typ) 450 ... 1150 nm

•Package: TOPLED with Lens

•Special: Suitable for all soldering methods

•High linearity

•Same package as SFH 4249, SFH 4259

Applications

•Miniature photointerrupters

•Industrial electronics

•For control and drive circuits

•Sensor Technology

Type: Photocurrent Ordering Code

IPCE [µA]

λ = 950 nm, Ee = 0.1 mW/cm2,

VCE = 5 V

SFH 3219 ≥ 63 Q65110A2651

2016-01-31 2

Version 1.4 / OS-IN-2015-033 SFH 3219

Maximum Ratings (TA = 25 °C)

Characteristics (TA = 25 °C)

Parameter Symbol Values Unit

Operating and storage temperature range Top; Tstg -40 ... 100 °C

Collector-emitter voltage VCE 35 V

Collector current IC15 mA

Collector surge current

(τ < 10 µs)

ICS 75 mA

Total Power dissipation Ptot 165 mW

ESD withstand voltage

(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)

VESD 2000 V

Thermal resistance for mounting on pcb RthJA 450 K/W

Parameter Symbol Values Unit

Wavelength of max. sensitivity (typ) λS max 990 nm

Spectral range of sensitivity (typ) λ10% (typ) 450

... 1150

Radiant sensitive area (typ) A 0.038 mm2

Dimensions of chip area (typ) L x W (typ) 0.45 x

0.45

mm x

Half angle (typ) ϕ ± 25 °

Capacitance

(VCE = 0 V, f = 1 MHz, E = 0)

(typ) CCE 5 pF

Photocurrent

(λ = 950 nm, Ee = 0.1 mW/cm2, VCE = 5 V)

IPCE ≥ 63 µA

Dark current

(VCE = 20 V, E = 0)

(typ (max)) ICE0 1 (≤ 50) nA

Rise and fall time

(IC = 1 mA, VCC = 5 V, RL = 1 kΩ)

(typ) tr, tf7 µs

Collector-emitter saturation voltage

(IC = 20 μA, Ee = 0.1 mW/cm2)

(typ) VCEsat 150 mV

Version 1.4 / OS-IN-2015-033 SFH 3219

2016-01-31 3

Relative Spectral Sensitivity 1) page 13

Srel = f(λ)

Photocurrent 1) page 13

IPCE = f(VCE), Ee = Parameter

Photocurrent 1) page 13

IPCE / IPCE(25°C) = f(TA), VCE = 5 V

Dark Current 1) page 13

ICEO = f(VCE), E = 0

OHF00207

400

rel

500 600 700 800 900 1100

100

OHF00007

PCE

10 -2

10 -1

5 10 15 20 25 30 35

0.1 2

0.2 2

0.4 2

OHF01524

-25

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 25 50 75 100

PCE

OHF01527

CEO

-3

10 -2

10 -1

10 0

10 1

0 5 10 15 20 25 30 35V

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Version 1.4 / OS-IN-2015-033 SFH 3219

Dark Current 1) page 13

ICE0 = f(TA),

= 0, VCE = 20 V

Collector-Emitter Capacitance 1) page 13

CCE = f(VCE), f = 1 MHz, E = 0

Power Consumption

Ptot = f(TA)

OHF01530

CEO

-1

10 0

10 1

10 2

10 3

-25

0 25 50 75 100

˚C

OHF01528

-2

10 -1 10 010 110 2

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

5.0

OHF00871

tot

120

160

200

20 40 60 80 ˚C 100

Version 1.4 / OS-IN-2015-033 SFH 3219

2016-01-31 5

Directional Characteristics 1) page 13

Srel = f(ϕ)

0.2

0.4

1.0

0.8

0.6

1.0 0.8 0.6 0.4

0˚10˚20˚40˚ 30˚ OHF00006

50˚

60˚

70˚

80˚

90˚

100˚ 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

2016-01-31 6

Version 1.4 / OS-IN-2015-033 SFH 3219

Package Outline

Dimensions in mm (inch).

3.5 (0.138) max.

ø2.55 (0.100)

0.13 (0.005)

0.18 (0.007)

0.1 (0.004) (typ.)

marking

Package

1.1 (0.043)

0.5 (0.020)

2.6 (0.102)

3.4 (0.134)

3.0 (0.118)

2.1 (0.083)

2.3 (0.091)

3.0 (0.118)

3.7 (0.146)

3.3 (0.130)

GEOY6956

0.4 (0.016)

0.6 (0.024)

0.9 (0.035)

0.7 (0.028)

1.7 (0.067)

2.1 (0.083)

ø2.60 (0.102)

Version 1.4 / OS-IN-2015-033 SFH 3219

2016-01-31 7

Pinning

Pin Description

1 emitter

2 collector

Package

TOPLED with Lens

Approximate Weight:

37 mg

Recommended Solder Pad

Dimensions in mm.

2016-01-31 8

Version 1.4 / OS-IN-2015-033 SFH 3219

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01

OHA04525

100

150

200

250

300

50 100 150 200 250 300

˚C

240 ˚C

217 ˚C

245 ˚C

25 ˚C

Profil-Charakteristik

Profile Feature

Ramp-up Rate to Preheat*)

25 °C to 150 °C

2 3 K/s

Time tS

TSmin to TSmax

100 12060

10 20 30

80 100

217

2 3

245 250

3 4

Time

25 °C to TP

Time within 5 °C of the specified peak

temperature TP - 5 K

Ramp-down Rate*

TP to 100 °C

All temperatures refer to the center of the package, measured on the top of the component

* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

Ramp-up Rate to Peak*)

TSmax to TP

Liquidus Temperature

Peak Temperature

Time above Liquidus temperature

Symbol

Einheit

Unit

Pb-Free (SnAgCu) Assembly

Minimum MaximumRecommendation

K/s

°C

480

Version 1.4 / OS-IN-2015-033 SFH 3219

2016-01-31 9

Taping

Dimensions in mm.

Tape and Reel

12 mm tape with 2000 pcs. on ∅ 330 mm reel

F E

Direction of unreeling

OHAY0324

Label

Leader:

Trailer:

13.0

Direction of unreeling

±0.25

min. 160 mm *

min. 400 mm *

*) Dimensions acc. to IEC 60286-3; EIA 481-D

2016-01-31 10

Version 1.4 / OS-IN-2015-033 SFH 3219

Tape dimensions [mm]

Tape dim ensions in m m

Reel dimensions [mm]

Reel dim ensions in m m

Barcode-Product-Label (BPL)

Dry Packing Process and Materials

Note:

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.

Regarding dry pack you will find further information in the internet. Here you will also find the normative

references like JEDEC.

WP0P1P2D0E F

12 + 0.3 / - 0.1 4 ± 0.1 4 ± 0.1

8 ± 0.1

2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 5.5 ± 0.05

A W Nmin W1W2max

330 12 60 12.4 + 2 18.4

OHA04563

(G) GROUP:

1234567890(1T) LOT NO: (9D) D/C: 1234

(X) PROD NO: 123456789

(6P) BATCH NO: 1234567890

LX XXXX

RoHS Compliant

BIN1: XX-XX-X-XXX-X

XTemp ST

XXX °C X

Pack: RXX

DEMY XXX

X_X123_1234.1234 X

9999(Q)QTY:

Semiconductors

OSRAM Opto

XX-XX-X-X

EXAMPLE

X_X123_1234.1234 XX_X123_1234.1234 X

EXAMPLE

XXXXXX

X_X123_1234.1234 XX_X123_1234.1234 X

XX-XX-X-XXX-XX-X-X

EXAMPLE

XXXXXX

X_X123_1234.1234 XX_X123_1234.1234 X

XX-XX-X-XXX-XX-X-X

EXAMPLE

Pack: RXX

XXX

X_X123_1234.1234 XX_X123_1234.1234 X

XX-XX-X-X

EXAMPLE

Pack: RXXPack: RXX

DEMY DEMY

EXAMPLE

1234

EXAMPLE

(9D) D/C:(9D) D/C:

12341234

EXAMPLE

12341234

EXAMPLE

Pack: RXXPack: RXX

DEMY

EXAMPLE

(9D) D/C:(9D) D/C:

EXAMPLE

(9D) D/C:

1234

EXAMPLE

(9D) D/C:

EXAMPLE

12345678901234567890

EXAMPLE

(6P) BATCH NO:(6P) BATCH NO:

12345678901234567890

SemiconductorsSemiconductors

EXAMPLE

(6P) BATCH NO:(6P) BATCH NO:

12345678901234567890

EXAMPLE

SemiconductorsSemiconductors

OSRAM OptoOSRAM Opto

EXAMPLE

1234567890

X_X123_1234.1234 X

Pack: RXX

DEMY

X_X123_1234.1234 X

(9D) D/C:

1234

(9D) D/C:

1234567890

(6P) BATCH NO:

1234567890

OSRAM Opto

XXX

X_X123_1234.1234 X

XX-XX-X-X

Pack: RXX

DEMY

Semiconductors

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately after

bag opening.

Discard if circles overrun.

Avoid metal contact.

WET

Do not eat.

Comparator

check dot

parts still adequately dry.

examine units, if necessary

15%

10% bake units

bake units

If wet,

change desiccant

If wet,

Humidity Indicator

MIL-I-8835

If wet,

Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours

a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or

reflow, vapor-phase reflow, or equivalent processing (peak package

2. After this bag is opened, devices that will be subjected to infrared

1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).

Moisture Level 5a

at factory conditions of

(if blank, seal date is identical with date code).

a) Mounted within

b) Stored at

body temp.

3. Devices require baking, before mounting, if:

Bag seal date

Moisture Level 1

Moisture Level 2

Moisture Level 2a

4. If baking is required,

b) 2a or 2b is not met.

Date and time opened:

reference IPC/JEDEC J-STD-033 for bake procedure.

Floor time see below

If blank, see bar code label

Floor time > 1 Year

Floor time 1 Year

Floor time 4 Weeks

10% RH.

Moisture Level 4

Moisture Level 5

˚C).

OPTO SEMICONDUCTORS

MOISTURE SENSITIVE

This bag contains

CAUTION

Floor time 72 Hours

Floor time 48 Hours

Floor time 24 Hours

30 ˚C/60% RH.

LEVEL

If blank, see

bar code label

Version 1.4 / OS-IN-2015-033 SFH 3219

2016-01-31 11

Transportation Packing and Materials

Dimensions of transportation box in mm

Width Length Height

349 ± 5

33 ± 5

OHA02044

PACKVAR:

R077

Additional TEXT

P-1+Q-1

Multi TOPLED

Muster

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

(9D) D/C:

(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY:2000

0144

(G) GROUP:

260 C RT

240 C R

220 C R

Bin3:

Bin2: Q-1-20

Bin1: P-1-20

LSY T676

Temp ST

R18DEMY

PACKVAR:

R077

Additional TEXT

P-1+Q-1

Multi TOPLED

Muster

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

(9D) D/C:

(1T) LOT NO:

210021998

123GH1234

4 5

(Q)QTY:2000

0144

(G) GROUP:

260 C RT

240 C R

220 C R

Bin3:

Bin2: Q-1-20

Bin1: P-1-20

LSY T676

Temp ST

R18DEMY

OSRAM

Packing

Sealing label

Barcode label

Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours

a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or

reflow, vapor-phase reflow, or equivalent processing (peak package

2. After this bag is opened, devices that will be subjected to infrared

1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).

Moisture Level 5a

at factory conditions of

(if blank, seal date is identical with date code).

a) Mounted within

b) Stored at

body temp.

3. Devices require baking, before mounting, if:

Bag seal date

Moisture Level 1

Moisture Level 2

Moisture Level 2a

4. If baking is required,

b) 2a or 2b is not met.

Date and time opened:

reference IPC/JEDEC J-STD-033 for bake procedure.

Floor time see below

If blank, see bar code label

Floor time > 1 Year

Floor time 1 Year

Floor time 4 Weeks

10% RH.

Moisture Level 4

Moisture Level 5

˚C).

OPTO SEMICONDUCTORS

MOISTURE SENSITIVE

This bag contains

CAUTION

Floor time 72 Hours

Floor time 48 Hours

Floor time 24 Hours

30 ˚C/60% RH.

LEVEL

If blank, see

bar code label

Barcode label

2016-01-31 12

Version 1.4 / OS-IN-2015-033 SFH 3219

Disclaimer

Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!

The information describes the type of component and shall not be considered as assured characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances.

For information on the types in question please contact our Sales Organization.

If printed or downloaded, please find the latest version in the Internet.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any

costs incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose!

Critical components* may only be used in life-support devices** or systems with the express written approval of

OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be

expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that

device or system.

**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or

maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be

endangered.

Version 1.4 / OS-IN-2015-033 SFH 3219

2016-01-31 13

Glossary

1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or

calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily

correspond to the actual parameters of each single product, which could differ from the typical data and calculated

correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data

will be changed without any further notice.

2016-01-31 14

Version 1.4 / OS-IN-2015-033 SFH 3219

Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg