1. General description
The TJA1051 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed CAN applications in the automotive industry,
providing differential transmit and receive capability to (a microcontroller with) a CAN
protocol cont ro ller.
The TJA1051 belongs to the third generation of high-speed CAN transceivers from NXP
Semiconductors, offering significant improvements over first- and second-generation
devices such as the TJA1050. It offers improved ElectroMagnetic Compatibility (EMC)
and ElectroStatic Discharge (ESD) performance, and also features:
•Ideal passive behavior to the CAN bus when the supply voltage is off
•TJA1051T/3 and TJA1051TK/3 can be inter fa ced directly to microcontrollers with
supply voltages from 3Vto5V
The TJA1051 implem en ts the CAN physic al laye r as def ine d in th e cur re n t ISO11898
standard (ISO11898-2:2003). Pending the release of the updated version of ISO11898-2
including CAN FD, additional timing parameters defining loop delay symmetry are
specified. This implementation enables r eliable communication in the CAN FD fast phase
at data rates up to 2 Mbit/s.
These features make the TJA1051 an excellent choice for all types of HS-CAN networks,
in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features and benefits
2.1 General
Fully ISO 11898-2:2003 compliant
Loop delay symmetry timing enables reliable communication at data rates up to
2 Mbit/s in the CAN FD fast phase
Suitable for 12 V and 24 V systems
Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V
microcontrollers (available in SO8 and very small HVSON8 packages respectively)
EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very
low-current Off mode
Available in SO8 package or leadless HVSON8 package (3.0 mm 3.0 mm) with
improved Automated Optical Inspection (AOI) capability
TJA1051
High-speed CAN transceiver
Rev. 7 — 15 January 2015 Product data sheet
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 2 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
Dark green product (halogen free and Restriction of Hazardous Subst ances (RoHS)
compliant)
AEC-Q100 qualified
2.2 Low-power management
Functional behavior predictable under all supply conditions
Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
High ElectroStatic Discharge (ESD) handling capability on the bus pins
Bus pins protected against transients in automotive environments
Transmit Data (TXD) dominant time-out function
Undervoltage detection on pins VCC and VIO
Thermally protected
3. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.5 - 5.5 V
VIO supply voltage on pin VIO 2.8 - 5.5 V
Vuvd(VCC) undervoltage detection
voltage on pin VCC
3.5 - 4.5 V
Vuvd(VIO) undervoltage detection
voltage on pin VIO
1.3 2.0 2.7 V
ICC supply current Silent mode 0.1 1 2.5 mA
Normal mode; bus
recessive 2.5 5 10 mA
Normal mode; bus
dominant 20 50 70 mA
IIO supply current on pin VIO Normal and Silent
modes
recessive; VTXD =V
IO - 80 250 A
dominant; VTXD = 0 V - 350 500 A
VESD electrostatic discharge
voltage IEC 61000-4-2 at pins
CANH and CANL 8- +8kV
VCANH voltage on pin CANH 58 - +58 V
VCANL voltage on pin CANL 58 - +58 V
Tvj virtual junction temp erature 40 - +150 C
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 3 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
4. Ordering information
[1] TJA1051T/3 and TJA1051TK/3 with VIO pin; TJA1051T/E with EN pin.
5. Block diagram
Table 2. Ordering information
Type number Package
Name Description Version
TJA1051T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TJA1051T/3[1] SO8 plastic small outline package; 8 lead s; body width 3.9 mm SOT96-1
TJA1051T/E[1] SO8 plastic small outl ine package; 8 leads; body width 3.9 mm SOT96-1
TJA1051TK/3[1] HVSON8 plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 3 0.85 mm SOT782-1
(1) In a transceiver without a VIO pin, the VIO input is internally connected to VCC.
(2) Only present in the TJA1051T/E.
Fig 1. Block diagram
TEMPERATURE
PROTECTION
TIME-OUT
MODE
CONTROL
DRIVER
TXD 1
VI/O(1)
S8
EN(2) 5
RXD 4
SLOPE
CONTROL
AND
DRIVER
VCC
CANH
CANL
7
6
53
2
GND
TJA1051
015aaa036
VCC
VIO(1)
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 4 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
6. Pinning information
6.1 Pinning
6.2 Pin description
[1] For enhanced thermal and electrical performance, the exposed center pad of the HVSON8 package should
be soldered to board ground.
a. TJA1051T: SO8 b. TJA1051T/E: SO8
c. TJA1051T/3: SO8 d. TJA1051TK/3: HVSON8
Fig 2. Pin configuration di ag ra ms
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Table 3. Pin descripti on
Symbol Pin Description
TXD 1 transmit data input
GND[1] 2 ground
VCC 3 supply voltage
RXD 4 receive data output; reads out data from the bus lines
n.c. 5 not connected; in TJA1051T version
EN 5 enable control input; TJA1051T/E only
VIO 5 supply voltage for I/O level adapter; T J A1051T/3 and TJA1051TK/3 only
CANL 6 LOW-level CAN bus line
CANH 7 HIGH-level CAN bus line
S 8 Silent mode control input
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 5 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
7. Functional description
The TJA1051 is a high-speed CAN stand- alone transce iver with Silent mode. It combi nes
the functiona lity of the TJ A10 5 0 tra n sce ive r with impr ov ed EMC an d ESD han dlin g
capability. Improved slope control and high DC handling capability on the bus pins
provides additional application flexibility.
The TJA1051 is available in three versions, distinguished only by the function of pin 5:
•The TJA1051T is backwards compatible with the TJA1050
•The TJA1051T/3 and TJA1051TK/3 allow for dire ct interfacing to microcontrollers with
supply voltages down to 3 V
•The TJA1051T/E allows the transceiver to be switched to a very low-current Off
mode.
7.1 Operati ng modes
The TJA1051 supports two operating modes, Normal and Silent, which are selected via
pin S. An additional Off mode is supported in the TJA1051T /E via pin EN. See Table 4 for
a description of th e op er a ting mode s un de r nor mal sup ply con dition s .
[1] Only available on the TJA1051T/E.
[2] LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive.
[3] ‘X’ = don’t care.
7.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to
transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block
diagram). The differential receiver converts the analog data on the bus lines into digital
data which is output to pin RXD. The slopes of the output signals on the bus lines are
controlled internally and are optimized in a way that guarantees the lowest possible
ElectroMagnetic Emission (EME).
7.1.2 Silent mode
A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled,
releasing the bus pin s to re ce ssiv e state. All other IC functions, including the receiver,
continue to operate as in Norm al mode. Si lent mode can be used to p reve nt a fa ulty CAN
controller from disrupting all network communications.
Table 4. Operating mo des
Mode Inputs Outputs
Pin EN[1] Pin S Pin TXD CAN driver Pin RXD
Normal HIGH LOW LOW dominant active[2]
HIGH LOW HIGH recessive active[2]
Silent HIGH HIGH X[3] recessive active[2]
Off[1] LOW X[3] X[3] floating floating
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 6 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
7.1.3 Off mode
A LOW level on pin EN of TJA1051T/E selects Off mode. In Off mode the entire
transceiver is disabled, allowing the microcontroller to save power when CAN
communication is not required. The bus pins are floating in Off mode, making the
transceiver inv isib le to th e rest of th e ne two r k.
7.2 Fail-safe features
7.2.1 TXD dominant time-out function
A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on
pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 40 kbit/s.
7.2.2 Internal biasing of TXD, S and EN input pins
Pin TXD has an internal pull-up to VIO and pins S and EN (TJA1051T/E) have internal
pull-downs to GND. This ensures a safe, defined state in case one or more of these pins
is left floating.
7.2.3 Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC)
and Vuvd (VIO); see Table 7), the transceiver will switch off and disengage from the bus
(zero load) until VCC and VIO have recovered.
7.2.4 Overtemperature protection
The output dri vers are protected a gainst overte mperature cond itions. If the virtu al junction
temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be
disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes
recessive again. Including the TXD condition ensures that output driver oscillations due to
temperature drift are avoided.
7.3 VIO supply pin
There are three ve rsions of the TJA1051 availabl e, only dif fering in the function of a single
pin. Pin 5 is either an enable control input (EN), a VIO supply pin or is not connected.
Pin VIO on the TJA1051T/3 and T JA1051TK/3 shou ld be conn ected to the micro controller
supply voltage ( see Figure 6). This will adjust the signal levels of pins TXD, RXD and S to
the I/O levels of the microcontroller. For versions of the TJA1051 without a VIO pin, the VIO
input is internally connected to VCC. This set s the sign al levels of pins TXD, RXD and S to
levels compatible with 5 V microcontrollers.
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 7 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
8. Limiting values
[1] V erified by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a,
3a and 3b.
[2] According to IEC TS 62228 (2007), Section 4.3; DIN EN 61000-4-2.
[3] According to AEC-Q100-002.
[4] According to AEC-Q100-003.
[5] AEC-Q100-011 R ev-C1. The classification level is C4B.
[6] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj =T
amb +PRth(vj-a), where Rth(vj-a) is a
fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
9. Thermal characteristics
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter Conditions Min Max Unit
Vxvoltage on pin x on pins CANH, CANL and SPLIT 58 +58 V
on any other pin 0.3 +7 V
Vtrt transient voltage on pins CANH and CANL [1] 150 +100 V
VESD electrostatic discharge voltage IEC 61000-4-2 (150 pF, 330 )[2]
at pins CANH and CANL 8+8 kV
Human Body Model (HBM); 100 pF, 1.5 k [3]
at pins CANH and CANL 8+8 kV
at any other pin 4+4 kV
Machine Model (MM); 200 pF, 0.75 H, 10 [4]
at any pin 300 +300 V
Charged Device Model (CDM); field Induced
charge; 4 pF [5]
at corner pins 750 +750 V
at any pin 500 +500 V
Tvj virtual junction temperature [6] 40 +150 C
Tstg storage temperature 55 +150 C
Table 6. Thermal characteristics
According to IEC 60747-1.
Symbol Parameter Conditions Value Unit
Rth(vj-a) thermal resistance from virtual junction to ambient SO8 package; in free air 155 K/W
HVSON8 package; in free air 55 K/W
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 8 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
10. Static characteristics
Table 7. Static characteristics
Tvj =
40
C to +150
C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60
unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol Parameter Conditions Min Typ Max Unit
Supply; pin VCC
VCC supply voltage 4.5 - 5.5 V
ICC supply current Off mode (TJA1051T/E) 1 5 8 A
Silent mode 0.1 1 2.5 mA
Normal mode
recessive; VTXD =VIO -510mA
dominant; VTXD =0V - 50 70 mA
Vuvd(VCC) undervoltage detection
voltage on pin VCC
3.5 - 4.5 V
I/O level adapter supply; pin VIO[1]
VIO supply voltage on pin VIO 2.8 - 5.5 V
IIO supply current on pin VIO Normal and Silent modes
recessive; VTXD =V
IO -80250A
dominant; VTXD = 0 V - 350 500 A
Vuvd(VIO) undervoltage detection
voltage on pin VIO
1.3 2.0 2.7 V
Mode control inp uts; pins S and EN[3]
VIH HIGH-level input voltage [4] 0.7VIO -V
IO +0.3 V
VIL LOW-level input voltage 0.3 - 0.3VIO V
IIH HIGH-level input current VS=V
IO; VEN =V
IO 1410A
IIL LOW-level input current VS=0V; V
EN =0 V 10+1A
CAN transmit data input; pin TXD
VIH HIGH-level input voltage [4] 0.7VIO -V
IO +0.3 V
VIL LOW-level input voltage 0.3 - +0.3VIO V
IIH HIGH-level input current VTXD =V
IO 50+5A
IIL LOW-level input current Normal mode; VTXD =0V 260 150 30 A
Ciinput capacitance [5] -510pF
CAN receive data output; pin RXD
IOH HIGH-level output current VRXD =V
IO 0.4 V; VIO =V
CC 831mA
IOL LOW-level output current VRXD = 0.4 V; bus domin an t 2 5 12 mA
Bus lines; pins CANH and CANL
VO(dom) dominant output voltage VTXD =0V; t<t
to(dom)TXD
pin CANH 2.75 3.5 4.5 V
pin CANL 0.5 1.5 2.25 V
Vdom(TX)sym transmitter dominant voltage
symmetry Vdom(TX)sym = VCC VCANH VCANL 400 0 +400 mV
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Product data sheet Rev. 7 — 15 January 2015 9 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage range.
[3] Only TJA1051T/E has an EN pin.
[4] Maximum value assumes VCC <V
IO; if VCC >V
IO, the maximum value will be VCC + 0.3 V.
[5] Not tested in production; guaranteed by design.
[6] Vcm(CAN) is the common mode voltage of CANH and CANL.
VO(dif)bus bus differential output voltage VTXD =0V; t<t
to(dom)TXD
VCC = 4.75 V to 5.25 V
RL=45to 65
1.5 - 3 V
VTXD =V
IO; recessive; no load 50 - +50 mV
VO(rec) recessive output voltage Normal and Silent modes;
VTXD =V
IO; no load 20.5V
CC 3V
Vth(RX)dif differential receiver threshold
voltage Normal and Silent modes
Vcm(CAN)[6] =30 V to +30 V 0.5 0.7 0.9 V
Vhys(RX)dif differenti al receiver hysteresis
voltage Normal and Silent modes
Vcm(CAN) =30 V to +30 V 50 120 200 mV
IO(sc)dom dominant short-circuit output
current VTXD =0V; t<t
to(dom)TXD; VCC =5 V
pin CANH; VCANH =0V 100 70 40 mA
pin CANL; VCANL = 5 V / 40 V 40 70 100 mA
IO(sc)rec recessive short-circuit output
current Normal and Silent modes;
VTXD =V
IO;
VCANH =V
CANL =27 V to +32 V
5-+5mA
ILleakage current VCC =V
IO =0V;
VCANH =V
CANL =5V 50+5A
Riinput resistance 9 15 28 k
Riinput resistance deviation between VCANH and VCANL 10+1%
Ri(dif) differential input resistance 19 30 52 k
Ci(cm) common-mode input
capacitance [5] --20pF
Ci(dif) differential input capacitance [5] --10pF
Temperature protection
Tj(sd) shutdown junction
temperature [5] - 190 - C
Table 7. Static characteristics …continued
Tvj =
40
C to +150
C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60
unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol Parameter Conditions Min Typ Max Unit
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 10 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
11. Dynamic characteristics
[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage range.
[3] See Figure 4.
Table 8. Dynamic characteristics
Tvj =
40
C to +150
C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60
unless specified otherwise. All voltages are
defined with respect to ground. Positive currents flow into the IC.[2]
Symbol Parameter Conditions Min Typ Max Unit
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 7 and Figure 3
td(TXD-busdom) delay time from TXD to bus dominant Normal mode - 65 - ns
td(TXD-busrec) delay time from TXD to bus recessive Normal mode - 90 - ns
td(busdom-RXD) delay time from bus dominan t to RX D Normal and Silent modes - 60 - ns
td(busrec-RXD) delay time from bus recessive to RXD Normal and Silent modes - 65 - ns
tPD(TXD-RXD) propagation delay from TXD to RXD Normal mode; versions
with VIO pin 40 - 250 ns
Normal mode; all other
versions 40 - 220 ns
tbit(RXD) bit time on pin RXD tbit(TXD) = 500 ns [3] 400 - 550 ns
tto(dom)TXD TXD dominant time-out time VTXD = 0 V; Normal mode 0.3 1 5 ms
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 11 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
Fig 3. CAN transceiver timing diagram
Fig 4. Loop delay symmetry ti ming diagram
CANH
CANL
td(TXD-busdom)
TXD
VO(dif)(bus)
RXD
HIGH
HIGH
LOW
LOW
dominant
recessive
0.9 V
0.5 V
0.3VIO
0.7VIO
td(busdom-RXD)
td(TXD-busrec)
td(busrec-RXD)
tPD(TXD-RXD)
tPD(TXD-RXD) 015aaa025
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 12 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
12. Application information
12.1 Application diagrams
12.2 Application hints
Further information on the application of the TJA1051 can be found in NXP application
hints AH1014 Application Hints - Sta ndalone high speed CAN transceiver
TJA1042/TJA1043/TJA1048/TJA1051.
Fig 5. Typical application of the TJA1051T/E
Fig 6. Typical application of the TJA1051T/3 or TJA1051TK/3.
TJA1051T/E
EN
S
TXD
RXD
MICRO-
CONTROLLER
Pxx
Pyy
TX0
RX0
VDD
GND
GND
VCC
CANH CANH
CANL CANL
5 V
BAT
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TJA1051T/3 S
TXD
RXD
TJA1051TK/3 MICRO-
CONTROLLER
Pxx
Pyy
TX0
RX0
V
DD
GND
GND
V
CC
CANH CANH
CANL CANL
5 V
BAT 3 V
V
IO
EN
015aaa227
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 13 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
13. Test information
13.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive app licat ion s.
(1) For versions with a VIO pin (TJA1051T/3 and TJA1051TK/3) or an EN pin (TJA1051T/E), these
inputs are connected to pin VCC.
Fig 7. Timing test circuit for CAN transceiver
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 14 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
14. Package outline
Fig 8. Package outline SOT96-1 (SO8)
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 15 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 16 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate pre ca u tio ns ar e taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
W ave soldering is a joinin g technology in which the joint s are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
•Through-hole components
•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•Board specifications, including the board finish, solder masks and vias
•Package footprints, including solder thieves and orientation
•The moisture sensitivity level of the packages
•Package placement
•Inspection and repair
•Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 17 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
•Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
•Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to
higher minimum peak temperatures (see Figure 10) than a SnPb process, thus
reducing the process window
•Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
•Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enoug h for the solder to make reliable solder joint s (a solder paste
characteristic). In addition, the peak temperature must be low en ough that the
packages and/or boards are not damaged. Th e peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 10.
Table 9. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350
< 2.5 235 220
2.5 220 220
Table 10. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 18 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of HVSON packages
Section 16 contains a brief intr oduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
•AN10365 ‘Surface mount reflow soldering description”
•AN10366 “HVQFN application information”
MSL: Moisture Sensitivity Level
Fig 10. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 19 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
18. Revision history
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TJA1051 v.7 20150115 Product data sheet - TJA1051 v.6
Modifications: •Section 1: text revised (1st paragraph); paragraph added
•Section 2.1: minor amendments to text; features added
•Table 1: added parameters VIO, Vuvd(VIO) and IIO; measurements conditions changed: VCANH, VCANL
•Figure 2 : pin diagrams updated
•Table 3: Table note 1 added
•Section 7, Section 7.1.1: minor changes to text
•Table 5: measurements conditions changed: Vx, VESD; table note section revised
•Table 7: parameter values changed: Vuvd(VIO); parameters renamed: IO(sc)dom and IO(sc)rec
•Table 8: parameter tbit(RXD) added; Table note 3 and Figure 4 added
•Section 12.2 “Application hints”: added
•Figure 7 moved to Section 13
•Section 13.1: text updated
•Section 19.3: ‘Translations’ disclaimer added
TJA1051 v.6 20110325 Product data sheet - TJA1051 v.5
TJA1051 v.5 20101229 Product data sheet - TJA1051 v.4
TJA1051 v.4 20091020 Product data sheet - TJA1051 v.3
TJA1051 v.3 20090825 Product data sheet - TJA1051 v.2
TJA1051 v.2 20090701 Product data sheet - TJA1051 v.1
TJA1051 v.1 20090309 Product data sheet - -
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 20 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
19. Legal information
19.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre vail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond tho se described in the
Product data sheet.
19.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability t owards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless ot herwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, lif e-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications an d ther efo re su ch inclusi on a nd/or use is at the cu stome r's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for th e customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by cust omer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2015. All rights reserved.
Product data sheet Rev. 7 — 15 January 2015 21 of 22
NXP Semiconductors TJA1051
High-speed CAN transceiver
No offer to sell or license — Nothing in this document may be interpret ed or
construed as an of fer to sell product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference dat a is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a docume nt is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
19.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors TJA1051
High-speed CAN transceiver
© NXP N.V. 2015. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 15 January 2015
Document identifier: TJA1051
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
21. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
2.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2 Low-power management . . . . . . . . . . . . . . . . . 2
2.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 5
7.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5
7.1.1 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.1.2 Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.1.3 Off mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.2 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6
7.2.1 TXD dominant time-out function. . . . . . . . . . . . 6
7.2.2 Internal biasing of TXD, S and EN input pins . . 6
7.2.3 Undervoltage detection on pins VCC and VIO . . 6
7.2.4 Overtemperature protection . . . . . . . . . . . . . . . 6
7.3 VIO supply pin. . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Thermal characteristics . . . . . . . . . . . . . . . . . . 7
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
12 Application information. . . . . . . . . . . . . . . . . . 12
12.1 Application diagrams . . . . . . . . . . . . . . . . . . . 12
12.2 Application hints . . . . . . . . . . . . . . . . . . . . . . . 12
13 Test information. . . . . . . . . . . . . . . . . . . . . . . . 13
13.1 Quality information . . . . . . . . . . . . . . . . . . . . . 13
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
15 Handling information. . . . . . . . . . . . . . . . . . . . 16
16 Soldering of SMD packages . . . . . . . . . . . . . . 16
16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 16
16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 16
16.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16
16.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 17
17 Soldering of HVSON packages. . . . . . . . . . . . 18
18 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19
19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
19.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
19.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
19.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
19.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 21
20 Contact information . . . . . . . . . . . . . . . . . . . . 21
21 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
NXP:
TJA1051T,112 TJA1051T,118 TJA1051T/3,112 TJA1051T/3,118 TJA1051T/E,118 TJA1051TK/3,118
TJA1051T/CM,118 TJA1051T/3/CM,118 TJA1051TK/3/1J TJA1051T/3/1J TJA1051T/1J TJA1051T/E/1J