QREE0032 QUALIFICATION REPORT PDIP28 ChipPAC Assembly Plant Transfer Using the M28256 THIS REPORT This Qualification Report summarizes the reliability trials and results performed to qualify the transfer of the assembly plant of our subcontractor ChipPAC from Korea to China for PDIP28 package (Plastic Dual In line Package). This document serves for the qualification of the assembly plant, using the products. Test conditions are presented in Table 2 and results in Table 3. Table 1. Product and Process used for Qualification Product M28256 Package PDIP28 Process CMOSF6DP Fab Line Agrate PRODUCT DESCRIPTION The M28256 is 256 Kbits EEPROM with parallel interface organized as 32Kx8 bits. These products are already qualified, and in production. PROCESS DESCRIPTION The CMOSF6 Double Poly (DP) process is already qualified, and in production for EEPROM memory products. February 2001 1/5 QREE0032 - QUALIFICATION REPORT Table 2. Plastic package qualification, Package-related tests M28256, PDIP28, CMOSF6DP Sub group Test Procedure Method Test Conditions Criteria1 1 Temperature Shock Mil Std 883 Method 1011B -55 C / +125 C, 500 shocks 1 0/25 2 Temperature Cycling Mil Std 883 Method 1010C -65 C / +150 C, 1000 cycles 1 0/60 3 Temperature and Humidity Biased CECC 90000 85 C, 85% RH, 5.5 V, 1000 hr 1 0/60 4 Pressure Pot Internal spec. 121 C, 2 atm, 100% RH, 240 hr 1 0/60 5 High Temperature Bake Mil Std 883 Method 1005 150 C, 1000 hr or 200 C, 500 hr 1 0/60 Note: 1. Criteria 0/60 means: accepted with 0 rejects out of 60units (rejected with 1 reject). 2/5 Num of Lots QREE0032 - QUALIFICATION REPORT Table 3. Package qualification, Results M28256, PDIP28, CMOSF6DP Sub group 1 2 3 4 5 Test Procedure Test Conditions M28256 -55 C / +125 C, 100 shocks 0/25 -55 C / +125 C, 500 shocks 0/25 -65 C / +150 C, 500 cycles 0/80 -65 C / +150 C, 1000 cycles 0/80 85 C, 85% RH, 5.5 V, 500 hr 0/80 85 C, 85% RH, 5.5 V, 1000 hr 0/80 121 C, 2 atm, 100% RH, 168 hr 0/80 121 C, 2 atm, 100% RH, 240 hr 0/80 150 C, 500 hr 0/80 150 C, 1000 hr 0/80 Temperature Shock Temperature Cycling Temperature and Humidity Biased Pressure Pot High Temperature Bake 3/5 QREE0032 - QUALIFICATION REPORT Table 4. Revision History Date 14-Dec-2000 4/5 Description Document written QREE0032 - QUALIFICATION REPORT If you have any questions or suggestions concerning the matters raised in this document, please send them to the following electronic mail addresses: ask.memory@st.com (for general enquiries) Please remember to include your name, company, location, telephone number and fax number. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics All other names are the property of their respective owners (c) 2001 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. www.st.com 5/5