HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2001. 05.28
Page No. : 1/2
HBU406 HSMC Product S pecifi cation
HBU406
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBU406 is designed for use in TV Horizontal output and
Switching applications.
Features
• High Breakdown Voltage
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature............................................................................................ -50 ~ +150 °C
Junction Temperatur e..................................................................................... 150 °C Maximum
• Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 60 W
• Maximum Voltages and Currents (Ta=25°C)
VCEO Collector to Emitter Voltage................................................................................... 200 V
VEBO Emitter to Base Voltage ............................................................................................. 6 V
IC Collector Current ............................................................................................................. 7 A
IB Base Current.................................................................................................................... 4 A
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
*BVCEO 200 - - V IC=100mA, IB=0
ICES - - 5 mA VCE=400V
IEBO - - 1 mA VEB=6V, IC=0
*VCE(sat) - - 1 V IC=5A, IB=0.5A
*VBE(sat) - - 1.2 V IC=5A, IB=0.5A
*hFE1 25 - - IC=500mA, VCE=5V
*hFE2 30 - 125 IC=2A, VCE=5V
*hFE3 10 - - IC=5A, VCE=5V
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE2
Rank A B C
Range 30-45 35-85 75-125
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2001. 05.28
Page No. : 2/2
HBU406 HSMC Product S pecifi cation
TO-220AB Dimension
*:Typical
Inches Millimeters Inches Millimeters
DIM Min. Max. Min. Max. DIM Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I - *0.1508 - *3.83
B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N - *0.1000 - *2.54
E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-
*0.6398 - *16.25
Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controll i ng dimensi on : mill imeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing m ethod, please contact your l ocal HSMC s ales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its produc ts without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any cons equence of customer product design, infringement of patents, or applic at ion assistance.
Head Office And Factory :
• Head Office (Hi-Sincerit y Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
• Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
A B
E
G
IK
M
O
P
3
2
1
C
N
H
D
4
Style : Pin 1.Base 2.Col lector 3.Emitter
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
Marking :
HSMC Logo
Part Number
Date Code
Product Series
Rank
