DS90C383
DS90C383/DS90CF384 +3.3V Programmable LVDS Transmitter 24-Bit Flat Panel
Display (FPD) Link-65 MHz, +3.3V LVDS Receiver 24-Bit Flat Panel Display
(FPD) Link-65 MHz
Literature Number: SNLS124A
DS90C383/DS90CF384
+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel
Display (FPD) Link65 MHz, +3.3V LVDS Receiver
24-Bit Flat Panel Display (FPD) Link65 MHz
General Description
The DS90C383 transmitter converts 28 bits of LVCMOS/
LVTTL data into four LVDS (Low Voltage Differential Signal-
ing) data streams. A phase-locked transmit clock is transmit-
ted in parallel with the data streams over a fifth LVDS link.
Every cycle of the transmit clock 28 bits of input data are
sampled and transmitted. The DS90CF384 receiver con-
verts the LVDS data streams back into 28 bits of LVCMOS/
LVTTL data.At a transmit clock frequency of 65 MHz, 24 bits
of RGB data and 3 bits of LCD timing and control data
(FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455
Mbps per LVDS data channel. Using a 65 MHz clock, the
data throughputs is 227 Mbytes/sec. The transmitter is of-
fered with programmable edge data strobes for convenient
interface with a variety of graphics controllers. The transmit-
ter can be programmed for Rising edge strobe or Falling
edge strobe through a dedicated pin. A Rising edge trans-
mitter will inter-operate with a Falling edge receiver
(DS90CF384) without any translation logic. Both devices are
also offered in a 64 ball, 0.8mm fine pitch ball grid array
(FBGA) package which provides a 44 % reduction in PCB
footprint compared to the TSSOP package.
This chipset is an ideal means to solve EMI and cable size
problems associated with wide, high speed TTL interfaces.
Features
n20 to 65 MHz shift clock support
nProgrammable transmitter (DS90C383) strobe select
(Rising or Falling edge strobe)
nSingle 3.3V supply
nChipset (Tx + Rx) power consumption <250 mW (typ)
nPower-down mode (<0.5 mW total)
nSingle pixel per clock XGA (1024x768) ready
nSupports VGA, SVGA, XGA and higher addressability.
nUp to 227 Megabytes/sec bandwidth
nUp to 1.8 Gbps throughput
nNarrow bus reduces cable size and cost
n290 mV swing LVDS devices for low EMI
nPLL requires no external components
nLow profile 56-lead TSSOP package.
nAlso available in a 64 ball, 0.8mm fine pitch ball grid
array (FBGA) package
nFalling edge data strobe Receiver
nCompatible with TIA/EIA-644 LVDS standard
nESD rating >7kV
nOperating Temperature: −40˚C to +85˚C
Block Diagrams
TRI-STATE®is a registered trademark of National Semiconductor Corporation.
Typical Application
DS012887-2
November 2000
DS90C383/DS90CF384 +3.3V Programmable LVDS 24-Bit-Color Flat Panel Display (FPD)
Link65 MHz
© 2000 National Semiconductor Corporation DS012887 www.national.com
Block Diagrams (Continued)
DS90C383
DS012887-1
Order Number DS90C383MTD or DS90C383SLC
See NS Package Number MTD56 or SLC64A
DS90CF384
DS012887-24
Order Number DS90CF384MTD or DS90CF384SLC
See NS Package Number MTD56 or SLC64A
DS90C383/DS90CF384
www.national.com 2
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
) −0.3V to +4V
CMOS/TTL Input Voltage −0.3V to (V
CC
+ 0.3V)
CMOS/TTL Output Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Receiver Input Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Driver Output Voltage −0.3V to (V
CC
+ 0.3V)
LVDS Output Short Circuit
Duration Continuous
Junction Temperature +150˚C
Storage Temperature −65˚C to +150˚C
Lead Temperature
(Soldering, 4 sec for TSSOP) +260˚C
Solder Reflow Temperature
(20 sec for FBGA) +220˚C
Maximum Package Power Dissipation Capacity 25˚C
MTD56 (TSSOP) Package:
DS90C383MTD 1.63 W
DS90CF384MTD 1.61 W
Package Derating:
DS90C383MTD 12.5 mW/˚C above +25˚C
DS90CF384MTD 12.4 mW/˚C above +25˚C
Maximum Package Power Dissipation Capacity 25˚C
SLC64A Package:
DS90C383SLC 2.0 W
DS90CF384SLC 2.0 W
Package Derating:
DS90C383SLC 10.2 mW/˚C above +25˚C
DS90CF384SLC 10.2 mW/˚C above +25˚C
ESD Rating
(HBM, 1.5 k, 100 pF) >7kV
Recommended Operating
Conditions
Min Nom Max Units
Supply Voltage (V
CC
) 3.0 3.3 3.6 V
Operating Free Air
Temperature (T
A
) −40 +25 +85 ˚C
Receiver Input Range 0 2.4 V
Supply Noise Voltage (V
CC
) 100 mV
PP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
LVCMOS/LVTTL DC SPECIFICATIONS
V
IH
High Level Input Voltage 2.0 V
CC
V
V
IL
Low Level Input Voltage GND 0.8 V
V
OH
High Level Output Voltage I
OH
= −0.4 mA 2.7 3.3 V
V
OL
Low Level Output Voltage I
OL
= 2 mA 0.06 0.3 V
V
CL
Input Clamp Voltage I
CL
= −18 mA −0.79 −1.5 V
I
IN
Input Current V
IN
=V
CC
, GND, 2.5V or 0.4V ±5.1 ±10 µA
I
OS
Output Short Circuit Current V
OUT
= 0V −60 −120 mA
LVDS DC SPECIFICATIONS
V
OD
Differential Output Voltage R
L
= 100250 345 450 mV
V
OD
Change in V
OD
between 35 mV
complimentary output states
V
OS
Offset Voltage (Note 4) 1.125 1.25 1.375 V
V
OS
Change in V
OS
between 35 mV
complimentary output states
I
OS
Output Short Circuit Current V
OUT
= 0V, R
L
= 100−3.5 −5 mA
I
OZ
Output TRI-STATE®Current Power Down = 0V, ±1±10 µA
V
OUT
=0VorV
CC
V
TH
Differential Input High Threshold V
CM
= +1.2V +100 mV
V
TL
Differential Input Low Threshold −100 mV
I
IN
Input Current V
IN
= +2.4V, V
CC
= 3.6V ±10 µA
V
IN
= 0V, V
CC
= 3.6V ±10 µA
TRANSMITTER SUPPLY CURRENT
ICCTW Transmitter Supply Current R
L
= 100,
C
L
= 5 pF, f = 32.5 MHz 31 45 mA
Worst Case Worst Case Pattern f = 37.5 MHz 32 50 mA
DS90C383/DS90CF384
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Electrical Characteristics (Continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Units
TRANSMITTER SUPPLY CURRENT
(Figures 1, 3 )
,T
A
=
−40˚C to +85˚C f = 65 MHz 42 55 mA
ICCTG Transmitter Supply Current R
L
= 100,
C
L
= 5 pF, f = 32.5 MHz 23 35 mA
16 Grayscale 16 Grayscale Pattern f = 37.5 MHz 28 40 mA
(Figures 2, 3 )
,T
A
=
−40˚C to +85˚C f = 65 MHz 31 45 mA
ICCTZ Transmitter Supply Current Power Down = Low 10 55 µA
Power Down Driver Outputs in TRI-STATE®under
Power Down Mode
RECEIVER SUPPLY CURRENT
ICCRW Receiver Supply Current C
L
= 8 pF, f = 32.5 MHz 49 65 mA
Worst Case Worst Case Pattern f = 37.5 MHz 53 70 mA
(Figures 1, 4 )
,T
A
=
−40˚C to +85˚C f = 65 MHz 78 105 mA
ICCRG Receiver Supply Current, C
L
= 8 pF, f = 32.5 MHz 28 45 mA
16 Grayscale 16 Grayscale Pattern f = 37.5 MHz 30 47 mA
(Figures 2, 4 )
,T
A
=
−40˚C to +85˚C f = 65 MHz 43 60 mA
ICCRZ Receiver Supply Current Power Down = Low 10 55 µA
Power Down Receiver Outputs Stay Low during
Power Down Mode
Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device
should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
Note 2: Typical values are given for VCC = 3.3V and TA= +25C.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise
specified (except VOD and VOD).
Note 4: VOS previously referred as VCM.
Transmitter Switching Characteristics
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
LLHT LVDS Low-to-High Transition Time
(Figure 3 )
0.75 1.5 ns
LHLT LVDS High-to-Low Transition Time
(Figure 3 )
0.75 1.5 ns
TCIT TxCLK IN Transition Time
(Figure 5 )
5ns
TCCS TxOUT Channel-to-Channel Skew
(Figure 6 )
250 ps
TPPos0 Transmitter Output Pulse Position for Bit 0
(Figure 17 )
f = 65 MHz −0.4 0 0.3 ns
TPPos1 Transmitter Output Pulse Position for Bit 1 1.8 2.2 2.5 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 4.0 4.4 4.7 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 6.2 6.6 6.9 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 8.4 8.8 9.1 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 10.6 11 11.3 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 12.8 13.2 13.5 ns
TCIP TxCLK IN Period
(Figure 7)
15 T 50 ns
TCIH TxCLK IN High Time
(Figure 7)
0.35T 0.5T 0.65T ns
TCIL TxCLK IN Low Time
(Figure 7)
0.35T 0.5T 0.65T ns
TSTC TxIN Setup to TxCLK IN
(Figure 7 )
f = 65 MHz 2.5 ns
THTC TxIN Hold to TxCLK IN
(Figure 7 )
0ns
TCCD TxCLK IN to TxCLK OUT Delay 25˚C, V
CC
= 3.3V
(Figure 9 )
3.0 3.7 5.5 ns
DS90C383/DS90CF384
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Transmitter Switching Characteristics (Continued)
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
TPLLS Transmitter Phase Lock Loop Set
(Figure 11 )
10 ms
TPDD Transmitter Power Down Delay
(Figure 15 )
100 ns
Receiver Switching Characteristics
Over recommended operating supply and −40˚C to +85˚C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
CLHT CMOS/TTL Low-to-High Transition Time
(Figure 4 )
2.2 5.0 ns
CHLT CMOS/TTL High-to-Low Transition Time
(Figure 4 )
2.2 5.0 ns
RSPos0 Receiver Input Strobe Position for Bit 0
(Figure 18 )
f = 65 MHz 0.7 1.1 1.4 ns
RSPos1 Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns
RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns
RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns
RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns
RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns
RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 ns
RSKM RxIN Skew Margin (Note 5)
(Figure 19 )
f = 65 MHz 400 ps
RCOP RxCLK OUT Period
(Figure 8)
15 T 50 ns
RCOH RxCLK OUT High Time
(Figure 8 )
f = 65 MHz 7.3 8.6 ns
RCOL RxCLK OUT Low Time
(Figure 8)
3.45 4.9 ns
RSRC RxOUT Setup to RxCLK OUT
(Figure 8 )
2.5 6.9 ns
RHRC RxOUT Hold to RxCLK OUT
(Figure 8 )
2.5 5.7 ns
RCCD RxCLK IN to RxCLK OUT Delay 25˚C, V
CC
= 3.3V
(Figure 10 )
5.0 7.1 9.0 ns
RPLLS Receiver Phase Lock Loop Set
(Figure 12 )
10 ms
RPDD Receiver Power Down Delay
(Figure 16 )
s
Note 5: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account the transmitter pulse positions (min
and max) and the receiver input setup and hold time (internal data sampling window-RSPOS). This margin allows for LVDS interconnect skew, inter-symbol
interference (both dependent on type/length of cable), and clock jitter (less than 250 ps).
AC Timing Diagrams
DS012887-3
FIGURE 1. “Worst Case” Test Pattern
DS90C383/DS90CF384
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AC Timing Diagrams (Continued)
Note 6: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Note 7: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed
to produce groups of 16 vertical stripes across the display.
Note 8:
Figures 1, 2
show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Note 9: Recommended pin to signal mapping. Customer may choose to define differently.
DS012887-4
FIGURE 2. “16 Grayscale” Test Pattern (Notes 6, 7, 8, 9)
DS012887-5
FIGURE 3. DS90C383 (Transmitter) LVDS Output Load and Transition Times
DS012887-6
FIGURE 4. DS90CF384 (Receiver) CMOS/TTL Output Load and Transition Times
DS90C383/DS90CF384
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AC Timing Diagrams (Continued)
DS012887-7
FIGURE 5. DS90C383 (Transmitter) Input Clock Transition Time
DS012887-8
Measurements at Vdiff =0V
TCCS measured between earliest and latest LVDS edges.
TxCLK Differential Low VHigh Edge
FIGURE 6. DS90C383 (Transmitter) Channel-to-Channel Skew
DS012887-9
FIGURE 7. DS90C383 (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)
DS012887-10
FIGURE 8. DS90CF384 (Receiver) Setup/Hold and High/Low Times
DS90C383/DS90CF384
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AC Timing Diagrams (Continued)
DS012887-11
FIGURE 9. DS90C383 (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe)
DS012887-12
FIGURE 10. DS90CF384 (Receiver) Clock In to Clock Out Delay
DS012887-13
FIGURE 11. DS90C383 (Transmitter) Phase Lock Loop Set Time
DS012887-14
FIGURE 12. DS90CF384 (Receiver) Phase Lock Loop Set Time
DS90C383/DS90CF384
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AC Timing Diagrams (Continued)
DS012887-15
FIGURE 13. Seven Bits of LVDS in Once Clock Cycle
DS012887-16
FIGURE 14. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs
DS012887-17
FIGURE 15. Transmitter Power Down Delay
DS90C383/DS90CF384
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AC Timing Diagrams (Continued)
DS012887-18
FIGURE 16. Receiver Power Down Delay
DS012887-26
FIGURE 17. Transmitter LVDS Output Pulse Position Measurement
DS90C383/DS90CF384
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AC Timing Diagrams (Continued)
DS012887-25
FIGURE 18. Receiver LVDS Input Strobe Position
DS90C383/DS90CF384
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AC Timing Diagrams (Continued)
Applications Information
The DS90C383 and DS90CF384 are backward compatible
with the existing 5V FPD Link transmitter/receiver pair
(DS90CR583, DS90CR584, DS90CF583 and DS90CF584).
To upgrade from a 5V to a 3.3V system the following must be
addressed:
1. Change 5V power supply to 3.3V. Provide this supply to
the V
CC
, LVDS V
CC
and PLL V
CC
of both the transmitter
and receiver devices. This change may enable the re-
moval of a 5V supply from the system, and power may
be supplied from an existing 3V power source.
2. The DS90C383 (transmitter) incorporates a rise/fall
strobe select pin. This select function is on pin 17,
formerly a V
CC
connection on the 5V products. When the
rise/fall strobe select pin is connected to V
CC
, the part is
configured with a rising edge strobe. In a system cur-
rently using a 5V rising edge strobe transmitter
(DS90CR583), no layout changes are required to ac-
commodate the new rise/fall select pin on the 3.3V
transmitter. The V
CC
signal may remain at pin 17, and
the device will be configured with a rising edge strobe.
When converting from a 5V falling edge transmitter
(DS90CF583) to the 3V transmitter a minimal board
layout change is necessary. The 3.3V transmitter will
not be configured with a falling edge strobe if V
CC
re-
mains connected to the select pin. To guarantee the
3.3V transmitter functions with a falling edge strobe pin
17 should be connected to ground OR left unconnected.
When not connected (left open) and internal pull-down
resistor ties pin 17 to ground, thus configuring the trans-
mitter with a falling edge strobe.
3. The DS90C383 transmitter input and control inputs ac-
cept 3.3V TTL/CMOS levels. They are not 5V tolerant.
DS012887-21
CSetup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and max
TpposTransmitter output pulse position (min and max)
RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) (Note 10) + ISI (Inter-symbol interference) (Note 11)
Cable Skewtypically 10 ps–40 ps per foot, media dependent
Note 10: Cycle-to-cycle jitter is less than 250 ps at 65 MHZ
Note 11: ISI is dependent on interconnect length; may be zero
FIGURE 19. Receiver LVDS Input Skew Margin
DS90C383/DS90CF384
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DS90C383 TSSOP Package Pin Description FPD Link Transmitter
Pin Name I/O No. Description
TxIN I 28 TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control linesFPLINE,
FPFRAME and DRDY (also referred to as HSYNC, VSYNC, Data Enable).
TxOUT+ O 4 Positive LVDS differentiaI data output.
TxOUT− O 4 Negative LVDS differential data output.
FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.
R_FB I 1 Programmable strobe select.
RTxCLK OUT+ O 1 Positive LVDS differential clock output.
TxCLK OUT− O 1 Negative LVDS differential clock output.
PWR DOWN I 1 TTL level input. When asserted (low input) TRI-STATES the outputs, ensuring low current at
power down.
V
CC
I 3 Power supply pins for TTL inputs.
GND I 4 Ground pins for TTL inputs.
PLL V
CC
I 1 Power supply pin for PLL.
PLL GND I 2 Ground pins for PLL.
LVDS V
CC
I 1 Power supply pin for LVDS outputs.
LVDS GND I 3 Ground pins for LVDS outputs.
DS90C383SLC SLC64A (FBGA) Package Pin Summary FPD Link
Transmitter
Pin Name I/O No. Description
TxIN I 28 TTL level input.
TxOUT+ O 4 Positive LVDS differential data output.
TxOUT− O 4 Negative LVDS differential data output.
TxCLKIN I 1 TTL IeveI clock input. The rising edge acts as data strobe. Pin name TxCLK IN.
TxCLK OUT+ O 1 Positive LVDS differential clock output.
TxCLK OUT− O 1 Negative LVDS differential clock output.
PWR DWN I 1 TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at
power down.
R_FB I 1 Programmable strobe select. HIGH = rising edge, LOW = falling edge.
V
CC
I 3 Power supply pins for TTL inputs.
GND I 5 Ground pins for TTL inputs.
PLL V
CC
I 1 Power supply pin for PLL.
PLL GND I 2 Ground pins for PLL.
LVDS V
CC
I 2 Power supply pin for LVDS outputs.
LVDS GND I 4 Ground pins for LVDS outputs.
NC 6 Pins not connected.
DS90C383SLC SLC64A (FBGA) Package Pin Description FPD Link
Transmitter
By Pin By Pin Type
Pin Pin Name Type Pin Pin Name Type
A1 TxIN27 I D3 GND G
A2 TxOUT0- O E4 GND G
A3 TxOUT0+ O E8 GND G
A4 LVDS VCC P G1 GND G
A5 LVDS VCC P G6 GND G
A6 TxCLKOUT- O B3 LVDS GND G
DS90C383/DS90CF384
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DS90C383SLC SLC64A (FBGA) Package Pin Description FPD Link
Transmitter (Continued)
By Pin By Pin Type
A7 TxCLKOUT+ O B4 LVDS GND G
A8 TxOUT3+ O B7 LVDS GND G
B1 TxIN1 I D5 LVDS GND G
B2 TxIN0 I C6 PLL GND G
B3 LVDS GND G D6 PLL GND G
B4 LVDS GND G D7 PWR DWN I
B5 TxOUT2- O G5 R_FB I
B6 TxOUT3- O C8 TxCLKIN I
B7 LVDS GND G B2 TxIN0 I
B8 NC B1 TxIN1 I
C1 TxIN3 I D2 TxIN2 I
C2 NC C1 TxIN3 I
C3 NC D1 TxIN4 I
C4 TxOUT1- O F1 TxIN5 I
C5 TxOUT2+ O E2 TxIN6 I
C6 PLL GND G E3 TxIN7 I
C7 PLL VCC P G2 TxIN8 I
C8 TxCLKIN I H1 TxIN9 I
D1 TxIN4 I G3 TxIN10 I
D2 TxIN2 I H3 TxIN11 I
D3 GND G F4 TxIN12 I
D4 TxOUT1+ O G4 TxIN13 I
D5 LVDS GND G H4 TxIN14 I
D6 PLL GND G H5 TxIN15 I
D7 PWD DWN I E5 TxIN16 I
D8 TxIN26 I F5 TxIN17 I
E1 VCC P H6 TxIN18 I
E2 TxIN6 I H7 TxIN19 I
E3 TxIN7 I H8 TxIN20 I
E4 GND G G7 TxIN21 I
E5 TxIN16 I F7 TxIN22 I
E6 VCC P G8 TxIN23 I
E7 TxIN24 I E7 TxIN24 I
E8 GND G F8 TxIN25 I
F1 TxIN5 I D8 TxIN26 I
F2 NC A1 TxIN27 I
F3 NC A6 TxCLKOUT- O
F4 TxIN12 I A7 TxCLKOUT+ O
F5 TxIN17 I A2 TxOUT0- O
F6 NC A3 TxOUT0+ O
F7 TxIN22 I C4 TxOUT1- O
F8 TxIN25 I D4 TxOUT1+ O
G1 GND G B5 TxOUT2- O
G2 TxIN8 I C5 TxOUT2+ O
G3 TxIN10 I B6 TxOUT3- O
G4 TxIN13 I A8 TxOUT3+ O
G5 R_FB I A4 LVDS VCC P
G6 GND G A5 LVDS VCC P
DS90C383/DS90CF384
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DS90C383SLC SLC64A (FBGA) Package Pin Description FPD Link
Transmitter (Continued)
By Pin By Pin Type
G7 TxIN21 I C7 PLL VCC P
G8 TxIN23 I E1 VCC P
H1 TxIN9 I E6 VCC P
H2 VCC P H2 VCC P
H3 TxIN11 I B8 NC
H4 TxIN14 I C2 NC
H5 TxIN15 I C3 NC
H6 TxIN18 I F2 NC
H7 TxIN19 I F3 NC
H8 TxIN20 I F6 NC
G : Ground
I : Input
O : Output
P : Power
NC : No Connect
DS90CF384 MTD56 TSSOP Package Pin Description FPD Link Receiver
Pin Name I/O No. Description
RxIN+ I 4 Positive LVDS differentiaI data inputs.
RxIN− I 4 Negative LVDS differential data inputs.
RxOUT O 28 TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control linesFPLINE,
FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable).
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT.
PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V
CC
I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V
CC
I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V
CC
I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
DS90CF384 64 ball FBGA Package Pin Description FPD Link Receiver
Pin Name I/O No. Description
RxIN+ I 4 Positive LVDS differentiaI data inputs.
RxIN− I 4 Negative LVDS differential data inputs.
RxOUT O 28 TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control linesFPLINE,
FPFRAME, DRDY (also referred to as HSYNC, VSYNC, Data Enable).
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN− I 1 Negative LVDS differential clock input.
FPSHIFT OUT O 1 TTL Ievel clock output. The falling edge acts as data strobe. Pin name RxCLK OUT.
PWR DOWN I 1 TTL level input. When asserted (low input) the receiver outputs are low.
V
CC
I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V
CC
I 1 Power supply for PLL.
PLL GND I 2 Ground pin for PLL.
LVDS V
CC
I 2 Power supply pin for LVDS inputs.
DS90C383/DS90CF384
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DS90CF384 64 ball FBGA Package Pin Description FPD Link Receiver
(Continued)
Pin Name I/O No. Description
LVDS GND I 4 Ground pins for LVDS inputs.
NC 6 Pins not connected.
DS90CF384 64 ball, FBGA Package Pin Definition FPD Link Receiver
By Pin By Pin Type
Pin Pin Name Type Pin Pin Name Type
A1 RxOUT17 O A4 GND G
A2 VCC P B1 GND G
A3 RxOUT15 O B6 GND G
A4 GND G D8 GND G
A5 RxOUT12 O E3 GND G
A6 RxOUT8 O E5 LVDS GND G
A7 RxOUT7 O G3 LVDS GND G
A8 RxOUT6 O G7 LVDS GND G
B1 GND G H5 LVDS GND G
B2 NC F6 PLL GND G
B3 RxOUT16 O G8 PLL GND G
B4 RxOUT11 O E6 PWR DWN I
B5 VCC P H6 RxCLKIN- I
B6 GND G H7 RxCLKIN+ I
B7 RxOUT5 O H2 RxIN0- I
B8 RxOUT3 O H3 RxIN0+ I
C1 RxOUT21 O F4 RxIN1- I
C2 NC G4 RxIN1+ I
C3 RxOUT18 O G5 RxIN2- I
C4 RxOUT14 O F5 RxIN2+ I
C5 RxOUT9 O G6 RxIN3- I
C6 RxOUT4 O H8 RxIN3+ I
C7 NC E7 RxCLKOUT O
C8 RxOUT1 O E8 RxOUT0 O
D1 VCC P C8 RxOUT1 O
D2 RxOUT20 O D7 RxOUT2 O
D3 RxOUT19 O B8 RxOUT3 O
D4 RxOUT13 O C6 RxOUT4 O
D5 RxOUT10 O B7 RxOUT5 O
D6 VCC P A8 RxOUT6 O
D7 RxOUT2 O A7 RxOUT7 O
D8 GND G A6 RxOUT8 O
E1 RxOUT22 O C5 RxOUT9 O
E2 RxOUT24 O D5 RxOUT10 O
E3 GND G B4 RxOUT11 O
E4 LVDS VCC P A5 RxOUT12 O
E5 LVDS GND G D4 RxOUT13 O
E6 PWR DWN I C4 RxOUT14 O
E7 RxCLKOUT O A3 RxOUT15 O
E8 RxOUT0 O B3 RxOUT16 O
F1 RxOUT23 O A1 RxOUT17 O
DS90C383/DS90CF384
www.national.com 16
DS90CF384 64 ball, FBGA Package Pin Definition FPD Link Receiver
(Continued)
By Pin By Pin Type
F2 RxOUT26 O C3 RxOUT18 O
F3 NC D3 RxOUT19 O
F4 RxIN1- I D2 RxOUT20 O
F5 RxIN2+ I C1 RxOUT21 O
F6 PLL GND G E1 RxOUT22 O
F7 PLL VCC P F1 RxOUT23 O
F8 NC E2 RxOUT24 O
G1 RxOUT25 O G1 RxOUT25 O
G2 NC F2 RxOUT26 O
G3 LVDS GND G H1 RxOUT27 O
G4 RxIN1+ I E4 LVDS VCC P
G5 RxIN2- I H4 LVDS VCC P
G6 RxIN3- I F7 PLL VCC P
G7 LVDS GND G A2 VCC P
G8 PLL GND G B5 VCC P
H1 RxOUT27 O D1 VCC P
H2 RxIN0- I D6 VCC P
H3 RxIN0+ I B2 NC
H4 LVDS VCC P C2 NC
H5 LVDS GND G C7 NC
H6 RxCLKIN- I F3 NC
H7 RxCLKIN+ I F8 NC
H8 RxIN3+ I G2 NC
G : Ground
I : Input
O : Output
P : Power
NC : Not Connect
DS90C383/DS90CF384
www.national.com17
Pin Diagrams for TSSOP Packages
TABLE 1. Programmable Transmitter
Pin Condition Strobe Status
R_FB R_FB = V
CC
Rising edge strobe
R_FB R_FB = GND Falling edge strobe
DS90C383MTD
DS012887-22
DS90CF384MTD
DS012887-23
DS90C383/DS90CF384
www.national.com 18
Physical Dimensions inches (millimeters) unless otherwise noted
56-Lead Molded Thin Shrink Small Outline Package, JEDEC
Dimensions show in millimeters
Order Number DS90C383MTD, DS90CF384MTD
NS Package Number MTD56
DS90C383/DS90CF384
www.national.com19
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant
into the body, or (b) support or sustain life, and
whose failure to perform when properly used in
accordance with instructions for use provided in the
labeling, can be reasonably expected to result in a
significant injury to the user.
2. A critical component is any component of a life
support device or system whose failure to perform
can be reasonably expected to cause the failure of
the life support device or system, or to affect its
safety or effectiveness.
National Semiconductor
Corporation
Americas
Tel: 1-800-272-9959
Fax: 1-800-737-7018
Email: support@nsc.com
National Semiconductor
Europe Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
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Response Group
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Fax: 65-2504466
Email: ap.support@nsc.com
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Japan Ltd.
Tel: 81-3-5639-7560
Fax: 81-3-5639-7507
www.national.com
64 ball, 0.8mm fine pitch ball grid array (FBGA) Package
Dimensions show in millimeters only
Order Number DS90CF384SLC or DS90C383SLC
NS Package Number SLC64A
DS90C383/DS90CF384 +3.3V Programmable LVDS 24-Bit-Color Flat Panel Display (FPD)
Link65 MHz
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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