MC74VHCU04MELG - ON Semiconductor

November, 2014 − Rev. 7 1Publication Order Number:

MC74VHCU04/D

MC74VHCU04

Hex Inverter

(Unbuffered)

The MC74VHCU04 is an advanced high speed CMOS unbuffered

inverter fabricated with silicon gate CMOS technology. It achieves

high speed operation similar to equivalent Bipolar Schottky TTL

while maintaining CMOS low power dissipation.

The inputs tolerate voltages up to 7.0 V, allowing the interface of

5.0 V systems to 3.0 V systems.

Features

•High Speed: tPD = 3.5 ns (Typ) at VCC = 5.0 V

•Low Power Dissipation: ICC = 2 mA (Max) at TA = 25°C

•High Noise Immunity: VNIH = VNIL = 10% VCC (Min.)

•Power Down Protection Provided on Inputs

•Balanced Propagation Delays

•Designed for 2.0 V to 5.5 V Operating Range

•Low Noise: VOLP = 0.8 V (Max)

•Pin and Function Compatible with Other Standard Logic Families

•Latchup Performance Exceeds 300 mA

•ESD Performance:

Human Body Model > 2000 V;

Machine Model > 200 V

•Chip Complexity: 12 FETs or 3 Equivalent Gates

•NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

•These Devices are Pb−Free and are RoHS Compliant

Figure 1. Logic Diagram

Y1A1

Y = A

MARKING

DIAGRAMS

TSSOP−14

DT SUFFIX

CASE 948G

SOIC−14

D SUFFIX

CASE 751A

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

http://onsemi.com

A = Assembly Location

WL, L = Wafer Lot

Y, YY = Year

WW, W = Work Week

G or G= Pb−Free Package

VHCU04G

AWLYWW

VHCU

ALYWG

(Note: Microdot may be in either location)

FUNCTION TABLE

Inputs Outputs

MC74VHCU04

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Figure 2. Pinout: 14−Lead Packages

1314 12 11 10 9 8

21 34567

VCC A6 Y6 A5 Y5 A4 Y4

A1 Y1 A2 Y2 A3 Y3 GND

(Top View)

MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage –0.5 to + 7.0 V

Vin DC Input Voltage –0.5 to + 7.0 V

Vout DC Output V oltage –0.5 to VCC + 0.5 V

IIK Input Diode Current −20 mA

IOK Output Diode Current ±20 mA

Iout DC Output Current, per Pin ±25 mA

ICC DC Supply Current, VCC and GND Pins ±50 mA

PDPower Dissipation in Still Air, SOIC Package†

TSSOP Package† 500

450 mW

Tstg Storage Temperature – 65 to + 150 _C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of

these limits are exceeded, device functionality should not be assumed, damage may occur and

reliability may be affected.

†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Max Unit

VCC DC Supply Voltage 2.0 5.5 V

Vin DC Input Voltage 0 5.5 V

Vout DC Output V oltage 0 VCC V

TAOperating Temperature −40 + 85 _C

Functional operation above the stresses listed in the Recommended Operating Ranges is not

implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may

affect device reliability.

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

cuit. For proper operation, Vin and

Vout should be constrained to the

range GND v (Vin or Vout) v VCC.

Unused inputs must always be

tied to an appropriate logic voltage

level (e.g., either GND or VCC).

Unused outputs must be left open.

MC74VHCU04

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DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Test Conditions VCC

TA = 25°C TA = −40 to 85°C

Unit

Min Typ Max Min Max

VIH Minimum High−Level

Input Voltage 2.0

3.0 to 5.5 1.70

VCC x 0.8 1.70

VCC x 0.8 V

VIL Maximum Low−Level

Input Voltage 2.0

3.0 to 5.5 0.30

VCC x 0.2 0.30

VCC x 0.2 V

VOH Minimum High−Level

Output Voltage Vin =VIL

IOH = −50mA2.0

3.0

4.5

1.8

2.7

4.0

2.0

3.0

4.5

1.8

2.7

4.0

Vin = GND

IOH = −4mA

IOH = −8mA 3.0

4.5 2.58

3.94 2.48

3.80

VOL Maximum Low−Level

Output Voltage Vin = VIH

IOL = 50mA2.0

3.0

4.5

0.0

0.2

0.3

0.5

0.2

0.3

0.5

Vin = VCC

IOL = 4mA

IOL = 8mA 3.0

4.5 0.36

0.36 0.44

0.44

Iin Maximum Input

Leakage Current Vin = 5.5 or GND 0 to 5.5 ±0.1 ±1.0 mA

ICC Maximum Quiescent

Supply Current Vin = VCC or GND 5.5 2.0 20.0 mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)

Symbol Parameter Test Conditions

TA = 25°C TA = −40 to 85°C

Unit

Min Typ Max Min Max

tPLH,

tPHL Maximum Propagation Delay

A or B to Y VCC = 3.3 ± 0.3V CL = 15pF

CL = 50pF 5.0

7.5 8.9

11.4 1.0

1.0 10.5

13.0 ns

VCC = 5.0 ± 0.5V CL = 15pF

CL = 50pF 3.5

5.0 5.5

7.0 1.0

1.0 6.5

8.0

Cin Maximum Input Capacitance 5 10 10 pF

CPD Power Dissipation Capacitance (Per Inverter) (Note 1)

Typical @ 25°C, VCC = 5.0V

1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC/6 (per buffer). CPD is used to determine the

no−load dynamic power consumption; PD = CPD  VCC2  fin + ICC  VCC.

NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50pF, VCC = 5.0V)

Symbol Characteristic

TA = 25°C

Unit

Typ Max

VOLP Quiet Output Maximum Dynamic VOL 0.5 0.8 V

VOLV Quiet Output Minimum Dynamic VOL −0.5 −0.8 V

VIHD Minimum High Level Dynamic Input Voltage 4.0 V

VILD Maximum Low Level Dynamic Input Voltage 1.0 V

MC74VHCU04

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Figure 3. Switching Waveforms

VCC

GND

50%

50% VCC

tPHL

tPLH

*Includes all probe and jig capacitance

Figure 4. Test Circuit

CL*

TEST POINT

DEVICE

UNDER

TEST

OUTPUT

Figure 5. Input Equivalent Circuit

INPUT OUTPUT

Parasitic Diode

ORDERING INFORMATION

Device Package Shipping†

MC74VHCU04DR2G SOIC−14

(Pb−Free) 2500 / Tape & Reel

MC74VHCU04DTR2G TSSOP−14

(Pb−Free) 2500 / Tape & Reel

NLV74VHCU04DTR2G* TSSOP−14

(Pb−Free) 2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

MC74VHCU04

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PACKAGE DIMENSIONS

TSSOP−14

DT SUFFIX

CASE 948G

ISSUE B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.50 0.60 0.020 0.024

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

U0.15 (0.006) T

2X L/2

0.10 (0.004) V S

L−U−

SEATING

PLANE

0.10 (0.004)

−T−

ÇÇÇ

SECTION N−N

DETAIL E

JJ1

ÉÉÉ

DETAIL E

−W−

0.25 (0.010)

PIN 1

IDENT.

U0.15 (0.006) T

−V−

14X REFK

7.06

14X

0.36 14X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74VHCU04

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PACKAGE DIMENSIONS

SOIC−14

CASE 751A−03

ISSUE J NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.127

(0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

−A−

−B−

P7 PL

14 8

0.25 (0.010) B M

0.25 (0.010) A S

−T−

RX 45

SEATING

PLANE D14 PL K

_DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A8.55 8.75 0.337 0.344

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.228 0.244

R0.25 0.50 0.010 0.019

__ __

7.04

14X

0.58

14X

1.52

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MC74VHCU04/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative

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