HSMx-C110/C170/C190/C191/C150 High Performance ChipLED Data Sheet HSMA-C110/C170/C190/C191/C150 HSML-C110/C170/C190/C191/C150 HSMC-C110/C170/C190/C191/C150 HSMZ-C110/C170/C190 Description Features These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 605 nm Orange, 626/631 nm Red for AS AlInGaP. x High brightness AlInGaP material All packages are binned by both color and intensity, except for red color. x Compatible with IR soldering These ChipLEDs come either in two top emitting packages (HSMx-C170/C190/C191/C150) or in a side emitting package (HSMx-C110). The right angle ChipLEDs are suitable for applications such as LCD backlighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMx-C170/C190/C191 and 3000 units per reel for HSMx-C110/C150. These packages are compatible with IR soldering process. x Small size x Industry standard footprint x Diffused optics x Top emitting or right angle emitting x Available in 3 colors (red, orange, amber) x Available in 8 mm tape on 7" diameter reel x Reel sealed in zip locked moisture barrier bags Applications x LCD backlighting x Push button backlighting x Front panel indicator x Symbol indicator x Microdisplays x Small message panel signage CAUTION: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMZ-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions CATHODE MARK CATHODE MARK LED DIE 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 2.0 (0.079 ) 3.2 (0.126 ) POLARITY CLEAR EPOXY 1.4 (0.055) DIFFUSED EPOXY 1.5 (0.059) POLARITY 0.3 (0.012) PC BOARD PC BOARD 0.8 (0.031) 0.5 (0.020) 1.6 (0.063 ) 3.2 (0.126 ) 0.3 (0.012) CATHODE LINE 0.4 0.15 (0.016 0.006) 0.4 0.15 (0.016 0.006) 3.2 (0.126 ) 0.9 (0.035) 1.0 (0.039) CATHODE LINE SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C170 HSMx-C110 CATHODE MARK CATHODE MARK 0.8 (0.031) 0.8 (0.031) 1.6 (0.063 ) 1.6 (0.063 ) 1.0 (0.039) 1.0 (0.039) POLARITY 0.3 (0.012) 0.3 (0.012) DIFFUSED EPOXY DIFFUSED EPOXY PC BOARD POLARITY PC BOARD CATHODE LINE 0.8 (0.031) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) CATHODE LINE 0.6 (0.023) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 HSMx-C191 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED 2 0.7 (0.028) MIN. Package Dimensions, continued CATHODE MARK 1.6 (0.063) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD CATHODE LINE 0.50 0.2 (0.020 0.008) 0.5 (0.020) SOLDERING TERMINAL HSMx-C150 0.50 0.2 (0.020 0.008) NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED Device Selection Guide Footprint (mm)[1,2] AS AlInGaP Amber AS AlInGaP Orange AS AlInGaP Red AS AlInGaP Red Package Description 1.6 x 0.8 x 0.8 HSMA-C190 HSML-C190 HSMC-C190 HSMZ-C190 Untinted, Diffused 2.0 x 1.25 x 0.8 HSMA-C170 HSML-C170 HSMC-C170 HSMZ-C170 Untinted, Diffused 3.2 x 1.5 x 1.0 HSMA-C110 HSML-C110 HSMC-C110 HSMZ-C110 Untinted, Non-diffused 1.6 x 0.8 x 0.6 HSMA-C191 HSML-C191 HSMC-C191 Untinted, Diffused 3.2 x 1.6 x 1.1 HSMA-C150 HSML-C150 HSMC-C150 Untinted, Diffused Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted. Absolute Maximum Ratings TA = 25C Parameter HSMx-C1xx Units DC Forward Current[1,2] 25 mA Power Dissipation 60 mW Reverse Voltage (IR = 100 A) 5 V LED Junction Temperature 95 C Operating Temperature Range -40 to +85 C Storage Temperature Range -40 to +85 C Soldering Temperature See reflow soldering profile (Figure 7 & 8) Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents above 5 mA are recommended for best long term performance. 3 Electrical Characteristics TA = 25C Parameter Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 A Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RTJ-PIN = (C/W) Typ. HSMA-C110 1.9 2.4 5 45 600 HSML-C110 1.9 2.4 5 45 600 HSMC-C110 1.9 2.4 5 45 600 HSMZ-C110 2.2 2.8 5 35 600 HSMA-C170/190/191/150 1.9 2.4 5 45 300 HSML-C170/190/191/150 1.9 2.4 5 45 300 HSMC-C170/190/191/150 1.9 2.4 5 45 300 HSMZ-C170/190 2.2 2.6 5 35 300 Optical Characteristics TA = 25C Part Number Color Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. Peak Wavelength Opeak (nm) Typ. Color, Dominant Wavelength Od[2] (nm) Typ. Viewing Angle 2 T1/2 Degrees[3] Typ. Luminous Efficacy Kv (lm/w) Typ. HSMA-C110 AS Amber 28.5 95 595 592 130 480 HSMA-C170/190/191/150 AS Amber 28.5 90 595 592 170 480 HSML-C110 AS Orange 28.5 95 609 605 130 370 HSML-C170/190/191/150 AS Orange 28.5 90 609 605 170 370 HSMC-C110 AS Red 28.5 95 637 626 130 155 HSMC-C170/190/191/150 AS Red 28.5 90 637 626 170 155 HSMZ-C110 AS Red 45 170 643 631 130 122 HSMZ-C170/190 AS Red 45 165 643 631 170 122 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. T1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 Color Bin Limits[1] Orange Color Bins[1] Amber Color Bins[1] Dom. Wavelength (nm) Dom. Wavelength (nm) Bin ID Min. Max. Bin ID Min. Max. A 597.0 600.0 A 582.0 584.5 B 600.0 603.0 B 584.5 587.0 C 603.0 606.0 C 587.0 589.5 D 606.0 609.0 D 589.5 592.0 E 609.0 612.0 E 592.0 594.5 F 612.0 615.0 F 594.5 597.0 Tolerance: 1 nm. Tolerance: 1 nm. Red Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. - 620.0 635.0 Tolerance: 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. Bin ID Intensity (mcd) Min. Max. A 0.11 0.18 N 28.50 45.00 B 0.18 0.29 P 45.00 71.50 C 0.29 0.45 Q 71.50 112.50 D 0.45 0.72 R 112.50 180.00 E 0.72 1.10 S 180.00 285.00 F 1.10 1.80 T 285.00 450.00 G 1.80 2.80 U 450.00 715.00 H 2.80 4.50 V 715.00 1125.00 J 4.50 7.20 W 1125.00 1800.00 K 7.20 11.20 X 1800.00 2850.00 L 11.20 18.00 Y 2850.00 4500.00 M 18.00 28.50 Tolerance: 15%. Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits. 5 1.0 AS AlInGaP RED RELATIVE INTENSITY AS AlInGaP AMBER AS AlInGaP ORANGE 0.5 AS AlInGaP Red (HSMZ-Cxxx only) 0 500 550 600 650 700 750 Figure 1. Relative intensity vs. wavelength. 1.4 AS AlInGaP LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF - FORWARD CURRENT - mA 100 10 AS AlInGaP (HSMZ-Cxxx only) 1 0.1 1.2 1.0 0.8 0.6 0.4 0.2 0 1.5 1.7 1.9 2.1 2.3 2.5 0 5 10 15 20 25 IF - FORWARD CURRENT - mA VF - FORWARD VOLTAGE - V Figure 3. Luminous intensity vs. forward current. Figure 2. Forward current vs. forward voltage. 1.00 RELATIVE INTENSITY - % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 RELATIVE INTENSITY - % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 6 30 IF MAX. - MAXIMUM FORWARD CURRENT - mA WAVELENGTH - nm 30 25 20 HSMx-C110 15 HSMx-C150/170/ 1990/191 10 5 0 0 20 40 60 80 100 TA - AMBIENT TEMPERATURE - C Figure 4. Maximum forward current vs. ambient temperature. 1.00 RELATIVE INTENSITY - % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 10 SEC. MAX. TEMPERATURE 10 SEC. MAX. TEMPERATURE 230C MAX. 4C/SEC. MAX. 140-160C 255 - 260 C 3 C/SEC. MAX. 217 C 200 C 6 C/SEC. MAX. 150 C 3 C/SEC. MAX. -3C/SEC. 4C/SEC. MAX. 60 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 7. Recommended reflow soldering profile. Figure 8. Recommended Pb-free reflow soldering profile. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.2 (0.047) 1.0 (0.039) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 9. Recommended soldering pattern for HSMx-C110. 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 10. Recommended soldering pattern for HSMx-C170. 0.8 (0.031) 1.5 (0.059) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 11. Recommended soldering pattern for HSMx-C190 and C191. Note: All dimensions in millimeters (inches). 7 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 12. Recommended soldering pattern for HSMx-C150. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 13. Reeling orientation. 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 13.1 0.5 (O 0.516 0.020) O 20.20 MIN. (O 0.795 MIN.) 3.0 0.5 (0.118 0.020) 59.60 1.00 (2.346 0.039) 178.40 1.00 (7.024 0.039) 4.0 0.5 (0.157 0.020) Figure 14. Reel dimensions. Note: All dimensions in millimeters (inches). 8 6 PS 5.0 0.5 (0.197 0.020) 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 8.00 0.30 (0.315 0.012) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C110 POSITION IN CARRIER TAPE DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) PART NUMBER DIM. A (SEE TABLE 1) HSMx-C191 SERIES 1.85 (0.073) 0.88 (0.035) 0.85 (0.033) HSMx-C190 SERIES 1.75 (0.069) 0.90 (0.035) 0.90 (0.035) HSMx-C170 SERIES 2.30 (0.091) 1.45 (0.057) 0.95 (0.037) HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047) HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050) R 1.0 0.05 (0.039 0.002) DIM. B (SEE TABLE 1) Figure 15. Tape dimensions. END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 16. Tape leader and trailer dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. For product information and a complete list of distributors, please go to our website: Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) Humidity Indicator Card is >10% when read at 235C. b) Device exposed to factory conditions <30C/60% RH more than 672 hours. Baking recommended condition: 60 +/- 5C for 20 hours. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright (c) 2005-2010 Avago Technologies. All rights reserved. Obsoletes 5989-3604EN AV02-0112EN - September 29, 2010