HSMA-C191 - AVAGO TECHNOLOGIES

Features

x High brightness AlInGaP material

x Small size

x Industry standard footprint

x Diused optics

x Top emitting or right angle emitting

x Available in 3 colors (red, orange, amber)

x Compatible with IR soldering

x Available in 8 mm tape on 7" diameter reel

x Reel sealed in zip locked moisture barrier bags

Applications

x LCD backlighting

x Push button backlighting

x Front panel indicator

x Symbol indicator

x Microdisplays

x Small message panel signage

Description

These chip-type LEDs utilize Aluminum Indium Gallium

Phosphide (AlInGaP) material technology. The AlInGaP

material has a very high luminous eciency, capable of

producing high light output over a wide range of drive

currents. The available colors in this surface mount series

are 592 nm Amber, 605 nm Orange, 626/631 nm Red for

AS AlInGaP.

All packages are binned by both color and intensity, ex-

cept for red color.

These ChipLEDs come either in two top emitting pack-

ages (HSMx-C170/C190/C191/C150) or in a side emitting

package (HSMx-C110). The right angle ChipLEDs are suit-

able for applications such as LCD backlighting. The top

emitting ChipLEDs with wide viewing angle are suitable

for light piping and direct backlighting of keypads and

panels. In order to facilitate pick and place operation,

these ChipLEDs are shipped in tape and reel, with 4000

units per reel for HSMx-C170/C190/C191 and 3000 units

per reel for HSMx-C110/C150.

These packages are compatible with IR soldering proc-

ess.

HSMA-C110/C170/C190/C191/C150

HSML-C110/C170/C190/C191/C150

HSMC-C110/C170/C190/C191/C150

HSMZ-C110/C170/C190

HSMx-C110/C170/C190/C191/C150

High Performance ChipLED

Data Sheet

CAUTION: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMZ-Cxxx LEDs are Class 1A ESD sensitive

per JESD22-A114C.01. Please observe appropriate precautions during handling and processing.

Refer to Application Note AN-1142 for additional details.

Package Dimensions

3.2 (0.126 )

0.5 (0.020)

0.9 (0.035)

POLARITY

CATHODE

MARK

1.5 (0.059)

LED DIE

CLEAR

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.0 (0.039)

2.6 (0.102 )

1.6 (0.063 )

CATHODE LINE

HSMx-C110

3.2 (0.126 )

2.0 (0.079 )

0.3 (0.012)

0.4 ± 0.15

(0.016 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.8 (0.031)

0.4 ± 0.15

(0.016 ± 0.006)

1.4

(0.055)

DIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.25 (0.049)

HSMx-C170

CATHODE LINE

HSMx-C190

1.6

(0.063 )

0.3 (0.012)

0.3 ± 0.15

(0.012 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.8 (0.031)

0.3 ± 0.15

(0.012 ± 0.006)

1.0

(0.039)

DIFFUSED EPOXY

PC BOARD

SOLDERING

TERMINAL

0.8 (0.031)

CATHODE LINE

0.7 (0.028) MIN.

HSMx-C191

1.6

(0.063 )

0.3 (0.012)

0.3 ± 0.15

(0.012 ± 0.006)

0.3 (0.012)

POLARITY

CATHODE

MARK

0.6 (0.023)

0.3 ± 0.15

(0.012 ± 0.006)

1.0

(0.039)

DIFFUSED EPOXY

PC BOARD

SOLDERING

TERMINAL

0.8 (0.031)

CATHODE LINE

0.7 (0.028) MIN.

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED

Package Dimensions, continued

Notes:

1. Dimensions in mm.

2. Tolerance ± 0.1 mm unless otherwise noted.

Device Selection Guide

Footprint AS AlInGaP AS AlInGaP AS AlInGaP AS AlInGaP Package

(mm)[1,2] Amber Orange Red Red Description

1.6 x 0.8 x 0.8 HSMA-C190 HSML-C190 HSMC-C190 HSMZ-C190 Untinted, Diused

2.0 x 1.25 x 0.8 HSMA-C170 HSML-C170 HSMC-C170 HSMZ-C170 Untinted, Diused

3.2 x 1.5 x 1.0 HSMA-C110 HSML-C110 HSMC-C110 HSMZ-C110 Untinted, Non-diused

1.6 x 0.8 x 0.6 HSMA-C191 HSML-C191 HSMC-C191 Untinted, Diused

3.2 x 1.6 x 1.1 HSMA-C150 HSML-C150 HSMC-C150 Untinted, Diused

Absolute Maximum Ratings

TA = 25°C

Parameter HSMx-C1xx Units

DC Forward Current[1,2] 25 mA

Power Dissipation 60 mW

Reverse Voltage (IR = 100 μA) 5 V

LED Junction Temperature 95 °C

Operating Temperature Range –40 to +85 °C

Storage Temperature Range –40 to +85 °C

Soldering Temperature See reow soldering prole (Figure 7 & 8)

Notes:

1. Derate linearly as shown in Figure 4.

2. Drive currents above 5 mA are recommended for best long term performance.

HSMx-C150

3.2 (0.126 )

0.5 (0.020)

0.50 ± 0.2

(0.020 ± 0.008)

0.6 (0.024)

POLARITY

CATHODE

MARK

1.1 (0.043)

0.50 ± 0.2

(0.020 ± 0.008)

2.0 (0.079)

DIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.6 (0.063)

CATHODE LINE

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED

Optical Characteristics

TA = 25°C

Luminous Color, Viewing Luminous

Intensity Peak Dominant Angle Ecacy

Iv (mcd) Wavelength Wavelength 2 T1/2 Kv

Part @ 20 mA[1] Opeak (nm) Od[2] (nm) Degrees[3] (lm/w)

Number Color Min. Typ. Typ. Typ. Typ. Typ.

HSMA-C110 AS Amber 28.5 95 595 592 130 480

HSMA-C170/190/191/150 AS Amber 28.5 90 595 592 170 480

HSML-C110 AS Orange 28.5 95 609 605 130 370

HSML-C170/190/191/150 AS Orange 28.5 90 609 605 170 370

HSMC-C110 AS Red 28.5 95 637 626 130 155

HSMC-C170/190/191/150 AS Red 28.5 90 637 626 170 155

HSMZ-C110 AS Red 45 170 643 631 130 122

HSMZ-C170/190 AS Red 45 165 643 631 170 122

Notes:

1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the

lamp package.

2. The dominant wavelength, Od, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.

3. T1/2 is the o-axis angle where the luminous intensity is 1/2 the peak intensity.

Electrical Characteristics

TA = 25°C

Forward Voltage Reverse Breakdown Capacitance C Thermal

VF (Volts) VR (Volts) (pF), VF = 0, Resistance

@ IF = 20 mA @ IR = 100 μA f = 1 MHz RTJ-PIN = (°C/W)

Parameter Number Typ. Max. Min. Typ. Typ.

HSMA-C110 1.9 2.4 5 45 600

HSML-C110 1.9 2.4 5 45 600

HSMC-C110 1.9 2.4 5 45 600

HSMZ-C110 2.2 2.8 5 35 600

HSMA-C170/190/191/150 1.9 2.4 5 45 300

HSML-C170/190/191/150 1.9 2.4 5 45 300

HSMC-C170/190/191/150 1.9 2.4 5 45 300

HSMZ-C170/190 2.2 2.6 5 35 300

Note:

1. Bin categories are established for classication of products. Products may not be available in all categories. Please contact your Avago

representative for information on currently available bins.

Notes:

1. Bin categories are established for classication of products. Products may not be available

in all categories. Please contact your Avago representative for information on currently

available bins.

2. The Iv binning specication set-up is for lowest allowable Iv binning only. There are no upper

Iv bin limits.

Orange Color Bins[1]

Dom. Wavelength (nm)

Bin ID Min. Max.

A 597.0 600.0

B 600.0 603.0

C 603.0 606.0

D 606.0 609.0

E 609.0 612.0

F 612.0 615.0

Tolerance: ± 1 nm.

Amber Color Bins[1]

Dom. Wavelength (nm)

Bin ID Min. Max.

A 582.0 584.5

B 584.5 587.0

C 587.0 589.5

D 589.5 592.0

E 592.0 594.5

F 594.5 597.0

Tolerance: ± 1 nm.

Light Intensity (Iv) Bin Limits[1]

Intensity (mcd) Intensity (mcd)

Bin ID Min. Max. Bin ID Min. Max.

A 0.11 0.18 N 28.50 45.00

B 0.18 0.29 P 45.00 71.50

C 0.29 0.45 Q 71.50 112.50

D 0.45 0.72 R 112.50 180.00

E 0.72 1.10 S 180.00 285.00

F 1.10 1.80 T 285.00 450.00

G 1.80 2.80 U 450.00 715.00

H 2.80 4.50 V 715.00 1125.00

J 4.50 7.20 W 1125.00 1800.00

K 7.20 11.20 X 1800.00 2850.00

L 11.20 18.00 Y 2850.00 4500.00

M 18.00 28.50

Tolerance: ± 15%.

Color Bin Limits[1]

Red Color Bins [1]

Dom. Wavelength (nm)

Bin ID Min. Max.

- 620.0 635.0

Tolerance: ±1 nm

Figure 3. Luminous intensity vs. forward current.

Figure 2. Forward current vs. forward voltage. Figure 4. Maximum forward current vs.

ambient temperature.

Figure 1. Relative intensity vs. wavelength.

100

0.11.5 1.7 1.9 2.1 2.5

– FORWARD VOLTAGE – V

IF – FORWARD CURRENT – mA

2.3

AS AlInGaP

(HSMZ-Cxxx only)

0 5 15 30

– FORWARD CURRENT – mA

0.4

1.0

1.4

LUMINOUS INTENSITY

(NORMALIZED AT 20 mA)

0.6

0.2

0.8

10 25

1.2

WAVELENGTH – nm

AS AlInGaP

AMBER

RELATIVE INTENSITY

1.0

0.5

0500 550 600 650 700 750

AS AlInGaP

ORANGE

AS AlInGaP

RED

AS AlInGaP Red

(HSMZ-Cxxx only)

020 60 80 100

IF MAX. – MAXIMUM FORWARD CURRENT – mA

TA – AMBIENT TEMPERATURE – °C

HSMx-C110

HSMx-C150/170/

1990/191

Figure 5. Relative intensity vs. angle for HSMx-C110.

RELATIVE INTENSITY – %

1.00

ANGLE

0.80

0.60

0.50

0.70

0.20

0.10

0.30

0.40

0.90

-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80

RELATIVE INTENSITY – %

1.00

ANGLE

0.80

0.60

0.50

0.70

0.20

0.10

0.30

0.40

0.90

-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80

Figure 8. Recommended Pb-free reow soldering prole.

Figure 9. Recommended soldering pattern for HSMx-C110. Figure 10. Recommended soldering pattern for HSMx-C170.

Figure 11. Recommended soldering pattern for HSMx-C190 and C191. Figure 12. Recommended soldering pattern for HSMx-C150.

5.0 (0.200)

1.0 (0.039)

1.5

(0.059)

1.5

(0.059)

2.0

(0.079)

0.9 (0.035)

0.2 (0.008)

0.9 (0.035)

CENTERING

BOARD

1.2 (0.047)

1.2

(0.047)

0.9

(0.035)

1.2

(0.047)

0.8 (0.031)

0.8

(0.031) 0.7

(0.028)

0.8

(0.031)

1.5 (0.059)

1.5

(0.059)

1.5

(0.059)

2.0

(0.079)

Note: All dimensions in millimeters (inches).

Figure 7. Recommended reow soldering prole.

Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.

RELATIVE INTENSITY – %

1.00

ANGLE

0.80

0.60

0.50

0.70

0.20

0.10

0.30

0.40

0.90

-70 -50 -30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80

230°C MAX.

10 SEC. MAX.

4°C/SEC.

MAX.

OVER 2 MIN.

TIME

TEMPERATURE

4°C/SEC. MAX.

140-160°C

–3°C/SEC.

217 °C

200 °C

60 - 120 SEC.

6 °C/SEC. MAX.

3 °C/SEC. MAX.

150 °C

255 - 260 °C

60 SEC. MAX.

10 SEC. MAX.

TIME

TEMPERATURE

Figure 13. Reeling orientation.

Figure 14. Reel dimensions.

10.50 ± 1.0 (0.413 ± 0.039)

59.60 ± 1.00

(2.346 ± 0.039)

Ø 20.20 MIN.

(Ø 0.795 MIN.)

178.40 ± 1.00

(7.024 ± 0.039)

3.0 ± 0.5

(0.118 ± 0.020)

4.0 ± 0.5

(0.157 ± 0.020)

5.0 ± 0.5

(0.197 ± 0.020)

Ø 13.1 ± 0.5

(Ø 0.516 ± 0.020)

8.0 ± 1.0 (0.315 ± 0.039)

CATHODE SIDE

PRINTED LABEL

USER FEED DIRECTION

Note: All dimensions in millimeters (inches).

For product information and a complete list of distributors, please go to our website: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-0112EN - September 29, 2010

Figure 15. Tape dimensions.

Figure 16. Tape leader and trailer dimensions.

Convective IR Reow Soldering

For more information on IR reow

soldering, refer to Application Note

1060, Surface Mounting SMT LED

Indicator Components.

Storage Condition: 5 to 30˚C

@ 60% RH max.

Baking is required under the

condition:

a) Humidity Indicator Card is

>10% when read at 23±5°C.

b) Device exposed to factory

conditions <30°C/60% RH

more than 672 hours.

Baking recommended condition: 60

+/– 5˚C for 20 hours.

END START

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MOUNTED WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MINIMUM OF

230 mm

(9.05 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

DIM. A

(SEE TABLE 1)

3.50 ± 0.05

(0.138 ± 0.002)

1.75 (0.069)

DIM. C

(SEE TABLE 1)

0.20 ± 0.05

(0.008 ± 0.002)

CARRIER TAPE

COVER TAPE

DIM. B

(SEE TABLE 1)

4.00 (0.157)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157)

1.50 (0.059)

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

CATHODE

DIM. A

± 0.10 (± 0.004)

DIM. B

± 0.10 (± 0.004)PART NUMBER

DIM. C

± 0.10 (± 0.004)

HSMx-C170 SERIES 2.30 (0.091) 1.45 (0.057) 0.95 (0.037)

HSMx-C190 SERIES 1.75 (0.069) 0.90 (0.035) 0.90 (0.035)

HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)

HSMx-C191 SERIES 1.85 (0.073) 0.88 (0.035) 0.85 (0.033)

HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050)

HSMx-C110

POSITION IN

CARRIER TAPE

DIM. B

(SEE TABLE 1)

DIM. A

(SEE TABLE 1)

R 1.0 ± 0.05

(0.039 ± 0.002)

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.