For Air-Conditioner Fan Motor 3-Phase Brushless Fan Motor Driver BM6204FS General Description This motor driver IC adopts PrestoMOSTM as the output transistor, and put in a small full molding package with the 120 square wave commutation controller chip and the high voltage gate driver chip. The protection circuits for overcurrent, overheating, under voltage lock out and the high voltage bootstrap diode with current regulation are built-in. It provides optimum motor drive system and downsizing the built-in PCB of the motor. Key Specifications Output MOSFET Voltage: 600V Driver Output Current (DC): 1.5A (Max) Driver Output Current (Pulse): 2.5A (Max) Output MOSFET DC On Resistance: 2.7 (Typ) Duty Control Voltage Range: 2.1V to 5.4V Operating Case Temperature: -20C to +100C Junction Temperature: +150C Power Dissipation: 3.00W Features 600V PrestoMOSTM built-in Output current 1.5A Bootstrap operation by floating high side driver (including diode) 120 square wave commutation logic PWM control Rotational direction switch FG signal output with pulse number switch (4 or 12) VREG output (5V/30mA) Protection circuits provided: CL, OCP, TSD, UVLO, MLP and the external fault input Fault output (open drain) Package SSOP-A54_36 Applications Air conditioners; air purifiers; water pumps; dishwashers; washing machines W (Typ) x D (Typ) x H (Max) 22.0 mm x 14.1 mm x 2.4 mm SSOP-A54_36 Typical Application Circuit VDC GND VCC VSP R1 D1 C5 C6 C1 C13 C7 C2~C4 C8 M HW HV HU VREG R2 R4 C11 R3 FG R6 Q1 DTR R5 C10 R11 R9 R13 R12 R10 C14 R8 C12 C9 R7 Figure 1. Application Circuit Example Product structure : Semiconductor IC This product is not designed protection against radioactive rays .http://www.rohm.com TSZ02201-0828AB400120-1-2 (c) 2014 ROHM Co., Ltd. All rights reserved. 1/27 TSZ22111 * 14 * 001 09.Sep.2015 Rev.002 Datasheet BM6204FS Block Diagram and Pin Configuration VCC VCC VSP VREG 1 36 VDC BU 35 5 VCC GND VSP 6 TEST VREG VREG 7 LEVEL SHIFT & GATE DRIVER 34 U GND GND VCC VSP UH UL HWN HWP HW HVN HV HVP HUN HUP HU PCT PC 9 33 10 LEVEL SHIFT & GATE DRIVER 13 14 LOGIC V/I 15 VH VL FGS FG FOB 31 30 LEVEL SHIFT & GATE DRIVER 17 18 19 VREG FAULT 29 28 FIB 20 V M VDC BW WH WL VREG VREG 32 16 TEST CCW BV 11 12 W PGND GND 26 SNS 24 VSP 21 OSC 23 BU VREG NC HWN HWP HVN HVP HUN HUP PCT PC CCW FGS FG FOB U BV V VDC SNS NC RT GND PWM FAULT VDC GND RT BW W GND GND VCC Figure 2. Block Diagram PGND Figure 3. Pin Configuration Pin Descriptions (NC: No Connection) Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 Name VCC GND GND GND VCC VSP VREG NC HWN HWP HVN HVP HUN HUP PCT PC CCW FGS FG FOB SNS NC RT GND GND GND VCC Function Low voltage power supply Ground Ground Ground Low voltage power supply Duty control voltage input pin Regulator output Hall input pin phase WHall input pin phase W+ Hall input pin phase VHall input pin phase V+ Hall input pin phase UHall input pin phase U+ VSP offset voltage output pin PWM switching arm setting pin Direction switch (H:CCW) FG pulse # switch (H:12, L:4) FG signal output Fault signal output (open drain) Over current sense pin Carrier frequency setting pin Ground Ground Ground Low voltage power supply Pin 36 - Name VDC VDC 35 34 BU U U 33 32 BV V V 31 VDC VDC 30 29 BW W W 28 PGND PGND Function High voltage power supply Phase U floating power supply Phase U output Phase V floating power supply Phase V output High voltage power supply Phase W floating power supply Phase W output Ground (current sense pin) Note) All pin cut surfaces visible from the side of package are no connected, except the pin number is expressed as a "-". http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Description of Blocks 1. Commutation Logic When the hall frequency is about 1.4-Hz or less (e.g. when the motor starts up), or PC pin is "L", the commutation mode is 120 square wave drive with upper and lower switching (synchronous switching). The controller monitors the hall frequency, and switches to upper switching when the hall frequency reaches or exceeds about 1.4-Hz over four consecutive cycles and PC pin is "H". Refer to the timing charts in figures 12 and 13. Table 1. 120 commutation (synchronous switching) truth table HU H H H L L L HV L L H H H L HW H L L L H H UH L VH PWM L L L L PWM L PWM L L PWM WH L PWM UL VL H -------------------- PWM L L -------------------- H WL PWM PWM L H -------------------- L -------------------- H L L -------------------- PWM L H L -------------------- H L PWM PWM PWM 2. Duty Control The switching duty can be controlled by forcing DC voltage with value from VSPMIN to VSPMAX to the VSP pin. When the VSP voltage is higher than VSPTST, the controller forces PC pin voltage to ground (Testing mode, maximum duty and synchronous switching). The VSP pin is pulled down internally by a 200 k resistor. Therefore, note the impedance when setting the VSP voltage with a resistance voltage divider. 3. Carrier Frequency Setting The carrier frequency setting can be freely adjusted by connecting an external resistor between the RT pin and ground. The RT pin is biased to a constant voltage, which determines the charge current to the internal capacitor. Carrier frequencies can be set within a range from about 16 kHz to 50 kHz. Refer to the formula to the right. 4. FG Signal Output The number of FG output pulses can be switched in accordance with the number of poles and the rotational speed of the motor. The FG signal is output from the FG pin. The 12-pulse signal is generated from the three hall signals (exclusive NOR), and the 4-pulse signal is the same as hall U signal. It is recommended to pull up FGS pin to VREG voltage when malfunctioning because of the noise. 5. Direction of Motor Rotation Setting The direction of rotation can be switched by the CCW pin. When CCW pin is "H" or open, the motor rotates at CCW direction. It is recommended to pull up CCW pin to VREG voltage when malfunctioning because of the noise. fOSC [ kHz ] 400 RT [ kohm ] FGS No. of pulse H 12 L 4 CCW Direction H CCW L CW 6. Hall Signal Comparator The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements should be set to the input voltage amplitude from the element, at a value higher than the minimum input voltage, VHALLMIN. We recommend connecting a ceramic capacitor with value from 100 pF to 0.01 F, between the differential input pins of the hall comparator. Note that the bias to hall elements must be set within the common mode input voltage range VHALLCM. http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS 7. Output Duty Pulse Width Limiter Pulse width duty is controlled during PWM switching in order to ensure the operation of internal power transistor. The controller doesn't output pulse of less than TMIN (0.8s minimum), nor output a duty pulse of DMAX or more. Dead time is forcibly provided to prevent internal power transistors to turn-on simultaneously in upper and lower side in gate driver output (for example, UH and UL) of each arm. This will not overlap the minimum time TDT (1.6s minimum). Because of this, the maximum duty of the synchronous switching mode is 84% (typical). 8. PWM Switching Arm Setting The PWM switching arm can choose one from the synchronous switching or the upper switching. When PC is "L", the switching mode is the synchronous. And also when PC is "H", the switching mode is the upper switching. However, when the hall cycle is about 1.4-Hz or less, the switching mode keeps the synchronous even if PC is "H". When the PWM control is entering to the testing mode, the controller forces PC pin voltage to ground and synchronous switching mode. Therefore, when PC pin pull-up to VREG pin, at least a resistor with a value 10k or more. The VSP offset voltage (Figure 32) is buffered to PCT pin, to connect an external resistor between PCT pin and ground. The internal bias current is determined by PCT voltage and the resistor value - VPCT / RPCT -, and mixed to PC pin. Because you can freely determine the slope by the resistance ratio of PC pin and PCT pin, which allows you to adjust the voltage command value to switch the synchronous switching or the upper switching. Please select the RPCT value from 50 k to 200 k in the range on the basis of 100 k, because the PCT pin current capability is a 100 A or less. VSP V PCT = VSP-V SPMIN V SPMIN Upper SW or Upper/Lower S W Upper/Lower SW PCT V PC Upper SW V PCT R PCT PC PC: H PC: L 1/2 V REG R PCL R PCT VSP Figure 4. PWM Switching Arm Setting 9. Current Limiter (CL) Circuit and Overcurrent Protection (OCP) Circuit The current limiter circuit can be activated by connecting a low value resistor for current detection between the output stage ground (PGND) and the controller ground (GND). When the SNS pin voltage reaches or surpasses the threshold value (VSNS, 0.5V typical), the controller forces all the upper switching arm inputs low (UH, VH, WH = L, L, L), thus initiating the current limiter operation. When the SNS pin voltage swings below the ground, it is recommended to insert a resistor - 1.5 k or more - between SNS pin and PGND pin to prevent malfunction. Since this limiter circuit is not a latch type, it returns to normal operation - synchronizing with the carrier frequency - once the SNS pin voltage falls below the threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, and does not activate when a short pulse of less than TMASK is present at the input. When the SNS pin voltage reaches or surpasses the threshold value (VOVER, 0.9V typical) because of the power fault or the short circuit except the ground fault, the gate driver outputs low to the gate of all output MOSFETs, thus initiating the overcurrent protection operation. Since this protection circuit is also not a latch type, it returns to normal operation synchronizing with the carrier frequency. http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS 10. Under Voltage Lock Out (UVLO) Circuit To secure the lowest power supply voltage necessary to operate the controller and the driver, and to prevent under voltage malfunctions, the UVLO circuits are independently built into the upper side floating driver, the lower side driver and the controller. When the supply voltage falls to VUVL or below, the controller forces driver outputs low. When the voltage rises to VUVH or above, the UVLO circuit ends the lockout operation and returns the chip only after 32 carrier periods (1.6ms for the default 20kHz frequency) to normal operation. Even if the controller returns to normal operation, the output begins from the following control input signal. The voltage monitor circuit (4.0V nominal) is built-in for the VREG voltage. Therefore, the UVLO circuit does not release operation when the VREG voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes VUVH or more. 11. Thermal Shutdown (TSD) Circuit The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (125C nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (100C nominal). The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated, and do not use the IC in an environment where activation of the circuit is assumed. Moreover, it is not possible to follow the output MOSFET junction temperature rising rapidly because it is a gate driver chip that monitors the temperature and it is likely not to function effectively. 12. Motor Lock Protection (MLP) Circuit When the controller detects the motor locking during fixed time of 4 seconds nominal when each edge of the hall signal doesn't input either, the controller forces all driver outputs low under a fixed time 20 seconds nominal, and self-returns to normal operation. This circuit is enabled if the voltage force to VSP is over the duty minimum voltage VSPMIN, and note that the motor cannot start up when the controller doesn't detect the motor rotation by the minimum duty control. Even if the edge of the hall signal is inputted within range of the OFF state by this protection circuit, it is ignored. But if the VSP is forced to ground level once, the protection can be canceled immediately. 13. Hall Signal Wrong Input Detection Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the abnormal hall signals continuously for four times or more motor rotation, the controller forces all driver outputs low and latches the state. It is released if the duty control voltage VSP is forced to ground level once. 14. Internal Voltage Regulator The internal voltage regulator VREG is output for the bias of the hall element and the phase control setting. However, when using the VREG function, be aware of the IOMAX value. If a capacitor is connected to the ground in order to stabilize output, a value of 1 F or more should be used. In this case, be sure to confirm that there is no oscillation in the output. VCC VREG R1 HUP HU HUN HV HVN HW HWN HVP HWP Controller IC Figure 5. VREG Output Pin Application Example http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS 15. Bootstrap Operation VB DX HO L VB VDC DX CB OFF H VS HO VDC CB ON VS VCC VCC LO H L ON Figure 6. Charging Period LO OFF Figure 7. Discharging Period The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap capacitor (CB) as shown in the figure above. In a word, this operation is repeated while the output of an external transistor is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the VCC power supply to CB through prevention of backflow diode DX, it is approximately (VCC-1V). The resistance series connection with DX has the impedance of approximately 200 . Because the total gate charge is needed only by the carrier frequency in the upper switching section of 120 commutation driving, please set it after confirming actual application operation. 16. Fault Signal Output When the controller detects either state that should be protected the overcurrent (OCP) and the over temperature (TSD), the FOB pin outputs low (open drain) and it returns to normal operation synchronizing with the carrier frequency. Even when this function is not used, the FOB pin is pull-up to the voltage of 3V or more and at least a resistor with a value 10k or more. A filter is built into the fault signal input circuit to prevent malfunctions by the switching noise, and does not activate when a short pulse of less than TMASK is present at the input. The time to the fault operation is the sum total of the propagation delay time of the detection circuit and the filter time, 1.6s (typical). VSP TRIOSC XH YL XHO YLO 1.6s (Typ) SNS 1.6s (Typ) 1.6s (Typ) 1.6s (Typ) 0.9V(Typ) OCP threshold 0.5V(Typ) CL threshold FOB Figure 8. Fault Operation ~ OCP ~ Timing Chart http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 6/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS 10 The release time from the protection operation can be changed by inserting an external capacitor. Refer to the formula below. Release time of 5ms or more is recommended. 8 Release time : t [ms] 2 .3 ) R C [s] VREG t ln( 1 9 VREG R FOB 7 6 5 4 3 2 C 1 0 0.01 Figure 9. Release Time Setting Application Circuit 0.10 1.00 Capacitance : C[F] Figure 10. Release Time (Reference Data @R=100k) 17. Switching Time XH, XL VDS trr ton td(on) tr 90% 90% ID 10% 10% td(off) tf toff Figure 11. Switching Time Definition Parameter High Side Switching Time Low Side Switching Time http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Symbol tdH(on) trH trrH tdH(off) tfH tdL(on) trL trrL tdL(off) tfL Reference 790 110 200 490 15 830 110 160 570 80 7/27 Unit ns ns ns ns ns ns ns ns ns ns Conditions VDC=300V, VCC=15V, ID=0.75A Inductive load The propagation delay time: Internal gate driver input stage to the driver IC output. TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Timing Chart (CW) Hall Signals HALL U HALL V HALL W Spin Up (Hall Period < 1.4Hz) UH VHPWM WH PWM PWM UL PWM PWM PWM PWM VLPWM WL PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PC=L, Hall Period >1.4Hz UH VHPWM WH PWM PWM UL PWM PWM PWM PWM VLPWM WL PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PC=H, Hall Period >1.4Hz UH VHPWM WH PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM UL VL WL FG Output (FGS=H) FG Figure 12. Timing Chart (Clockwise) http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 8/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Timing Chart (CCW) Hall Signals HALL U HALL V HALL W Spin Up (Hall Period < 1.4Hz) UH PWM PWM VHPWM PWM WH UL PWM PWM WL PWM PWM PWM PWM PWM PWM PWM PWM PWM VLPWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PC=L, Hall Period >1.4Hz UH PWM PWM VHPWM PWM WH UL PWM PWM WL PWM PWM PWM PWM PWM PWM PWM PWM PWM VLPWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM PC=H, Hall Period >1.4Hz UH PWM PWM VHPWM WH PWM PWM PWM PWM PWM PWM PWM PWM PWM PWM UL VL WL FG Output (FGS=H) FG Figure 13. Timing Chart (Counter Clockwise) http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 9/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Controller Outputs and Operation Mode Summary Detected direction Conditions Hall sensor frequency PC pin L Forward (CW:U~V~W, CCW:U~W~V) Reverse (CW:U~W~V, CCW:U~V~W) < 1.4Hz < 1.4Hz 1.4Hz < H L VSP < VSPMIN (Duty off) Normal operation H L H L H Upper and lower arm off VSPMIN < VSP < VSPMAX (Control range) Upper switching Upper and lower switching Upper and lower switching VSPTST < VSP (Testing mode) Upper and lower switching Current limiter (Note 1) Upper arm off Overcurrent 1.4Hz < Upper switching Upper and lower arm off (Note 2) TSD (Note 2) Protect operation External input (Note 2) UVLO Upper and lower arm off (Note 3) Motor lock Hall sensor abnormally (Note) (Note 1) (Note 2) (Note 3) Upper and lower arm off and latch The controller monitors both edges of three hall sensors for detecting period. It returns to normal operation by the carrier frequency synchronization. It works together with the fault operation, and returns after the release time synchronizing with the carrier frequency. It returns to normal operation after 32 cycles of the carrier oscillation period. Absolute Maximum Ratings (Ta=25C) Parameter Output MOSFET Symbol VDSS Supply Voltage VDC Output Voltage VU, VV, VW High Side Supply Pin Voltage High Side Floating Supply Voltage Ratings 600 (Note 1) VBU, VBV, VBW V (Note 1) V -0.3 to +600 (Note 1) V (Note 1) V -0.3 to +600 -0.3 to +600 VBU-VU, VBV-VV, VBW -VW Unit -0.3 to +20 V Low Side Supply Voltage VCC -0.3 to +20 V Duty Control Voltage VSP -0.3 to +20 V All Others VI/O -0.3 to +5.5 V Driver Outputs (DC) IOMAX(DC) 1.5 (Note 1) A Driver Outputs (Pulse) IOMAX(PLS) 2.5 (Note 1, 2) A Fault Signal Output IOMAX(FOB) 15 (Note 1) mA 3.00 (Note 3) W Rthj-c 15 C/W TC -20 to +100 C Storage Temperature TSTG -55 to +150 C Junction Temperature Tjmax 150 C Power Dissipation Thermal Resistance Operating Case Temperature Pd (Note) (Note 1) (Note 2) (Note 3) All voltages are with respect to ground. Do not, however, exceed Pd or ASO. Pw 10s, Duty cycle 1% Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 24mW/C above 25C. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 10/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Recommended Operating Conditions (Tc=25C) Parameter Symbol Min Typ Max Unit VDC - 310 400 V VBU-VU, VBV-VV, VBW -VW 13.5 15 16.5 V Low Side Supply Voltage VCC 13.5 15 16.5 V Bootstrap Capacitor CB 1.0 - - F VREG Bypass Capacitor CVREG 1.0 - - F Shunt Resistor (PGND) RS 0.6 - - Junction Temperature Tj - - 125 C Supply Voltage High Side Floating Supply Voltage (Note) All voltages are with respect to ground. Electrical Characteristics (Driver part, unless otherwise specified, Ta=25C and VCC=15V) Parameter Symbol Min Typ Max Unit Conditions HS Quiescence Current IBBQ 30 70 150 A VSP=0V, each phase LS Quiescence Current ICCQ 0.2 0.7 1.3 mA VSP=0V V(BR)DSS 600 - - V ID=1mA, VSP=0V IDSS - - 100 A VDS=600V, VSP=0V RDS(ON) - 2.7 3.5 ID=0.75A VSD - 1.1 1.5 V ID=0.75A Leak Current ILBD - - 10 A VBX=600V Forward Voltage VFBD 1.5 1.8 2.1 V IBD=-5mA, including series-R Series Resistance RBD - 200 - HS Release Voltage VBUVH 9.5 10.0 10.5 V VBX - VX HS Lockout Voltage VBUVL 8.5 9.0 9.5 V VBX - VX Power Supply Output MOSFET D-S Breakdown Voltage Leak Current DC On Resistance Diode Forward Voltage Bootstrap Diode Under Voltage Lock Out http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 11/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Electrical Characteristics (Controller part, unless otherwise specified, Ta=25C and VCC=15V) Parameter Symbol Min Typ Max Unit Conditions Supply Current ICC 0.8 1.7 3.0 mA VSP=0V VREG Voltage VREG 4.5 5.0 5.5 V IO=-30mA VIN=0V Power Supply Hall Comparators Input Bias Current IHALL -2.0 -0.1 2.0 A VHALLCM 0 - VREG-1.5 V Minimum Input Level VHALLMIN 50 - - mVp-p Hysteresis Voltage P VHALLHY+ 5 13 23 mV Hysteresis Voltage N VHALLHY- -23 -13 -5 mV ISP 15 25 35 A Duty Minimum Voltage VSPMIN 1.8 2.1 2.4 V Duty Maximum Voltage VSPMAX 5.1 5.4 5.7 V Testing Operation Range Common Mode Input Duty Control Input Bias Current VIN=5V VSPTST 8.2 - 18 V Minimum Output Duty DMIN - 2 - % FOSC=20kHz Maximum Output Duty DMAX - 95 - % FOSC=20kHz, upper switching VIN=0V Mode Switch - FGS and CCW Input Bias Current IIN -70 -50 -30 A Input High Voltage VINH 3 - VREG V Input Low Voltage VINL 0 - 1 V VFOBIH 3 - VREG V Fault Input/Output - FOB Input High Voltage Input Low Voltage VFOBIL 0 - 1 V Output Low Voltage VFOBOL 0 0.07 0.60 V IO=5mA Output High Voltage VMONH VREG-0.40 VREG-0.08 VREG V IO=-2mA Output Low Voltage VMONL 0 0.02 0.40 V IO=2mA VIN=0V Monitor Output - FG Current Detection Input Bias Current ISNS -30 -20 -10 A Current Limiter Voltage VSNS 0.48 0.50 0.52 V Overcurrent Voltage VOVER 0.84 0.90 0.96 V Noise Masking Time TMASK 0.8 1.0 1.2 s VPC -0.05 0 0.05 V FOSC 18 20 22 kHz PWM Switching Arm Setting Threshold Voltage 1/2*VREG, reference voltage Carrier Frequency Oscillator Carrier Frequency RT=20k Under Voltage Lock Out LS Release Voltage VCCUVH 11.5 12.0 12.5 V LS Lockout Voltage VCCUVL 10.5 11.0 11.5 V http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 12/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Typical Performance Curves (Reference data) 5.0 10 3.5 3.0 2.5 Supply Current : I QVBX [A] _ 7 6 5 1.5 4 12 14 16 18 20 110C 25C -40C 8 2.0 12 14 16 18 Supply Voltage : VCC [V] Figure 14. Quiscence Current (Low Side Drivers) Figure 15. Low Side Drivers Operating Current (FPWM: 20kHz) 120 400 100 350 80 60 40 125C 25C -40C 20 300 250 200 125C 25C -40C 150 12 20 Supply Voltage : VCC [V] Supply Current : I QVBX [A] _ Supply Current : Icc [mA] 4.0 9 Supply Current : Icc [mA] 110C 25C -40C 4.5 14 16 18 20 12 Supply Voltage : VBX-VX [V] 16 18 20 Supply Voltage : VBX-VX [V] Figure 16. Quiescence Current (High Side Driver, Each Phase) http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 14 Figure 17. High Side Driver Operating Current (FPWM: 20kHz, Each Phase) 13/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Typical Performance Curves (Reference data) - Continued 2.0 125C 25C -40C 6 Forward Voltage : V SD [V] Output On Resistance : R DSON [ohm] 8 4 2 1.5 1.0 0.5 -40C 25C 125C 0 0.0 0.0 0.5 1.0 1.5 2.0 0.0 0.5 1.0 1.5 2.0 Drain Current : IDS [A] Source Current : ISD [A] Figure 18. Output MOSFET ON Resistance Figure 19. Output MOSFET Body Diode 4 1.2 125C 25C -40C 3 Voltage : V BOOTR [V] Forward Voltage : V FBD [V] 1.0 0.8 0.6 0.4 1 -40C 25C 125C 0.2 2 0.0 0 0 2 4 6 8 0 10 4 6 8 10 Bootstrap Series Resistor Current : IBR [mA] Bootstrap Diode Current : IBD [mA] Figure 20. Bootstrap Diode Forward Voltage http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2 Figure 21. Bootstrap Series Resistor 14/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Typical Performance Curves (Reference data) - Continued 200 15 125C 25C -40C 125C 25C -40C EON 150 E [J] E [J] 10 100 5 50 EOFF 0 0 0.0 0.5 1.0 1.5 0.0 Drain Current : IO [A] 0.5 1.0 1.5 Drain Current : IO [A] Figure 22. High Side Switching Loss (VDC=300V) Figure 23. High Side Recovery Loss (VDC=300V) 200 15 125C 25C -40C 125C 25C -40C EON 150 E [J] E [J] 10 100 5 50 EOFF 0 0 0.0 0.5 1.0 1.5 0.0 Drain Current : IO [A] 1.0 1.5 Drain Current : IO [A] Figure 24. Low Side Switching Loss (VDC=300V) http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0.5 Figure 25. Low Side Recovery Loss (VDC=300V) 15/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Typical Performance Curves (Reference data) - Continued 5.4 5.4 -40C 25C 110C 5.2 VREG voltage : V REG [V] VREG voltage : V REG [V] -40C 25C 110C 5.0 4.8 4.6 5.0 4.8 4.6 12 14 16 18 20 0 10 20 30 40 Supply Voltage : VCC [V] Output Current : IOUT [mA] Figure 26. VREG - VCC Figure 27. VREG Drive Capability 6 110C 25C -40C 4 3 2 1 110C 25C -40C 0 Input Bias Current : I SP [A] 200 5 Internal Output Voltage : [V] 5.2 -1 150 100 50 110C 25C -40C 0 -30 -15 0 15 30 0 5 10 15 Differential Voltage : VHUP-VHUN [mV] VSP Voltage : VSP [V] Figure 28. Hall Comparator Hysteresis Voltage Figure 29. VSP Input Bias Current http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 16/27 20 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Typical Performance Curves (Reference data) - Continued 1.5 100 Internal Logic : H/L [-] Output Duty : D SP [%] 80 60 40 110C 25C -40C 20 0 1.0 0.5 0.0 110C 25C -40C -0.5 0 2 4 6 0 8 5 Figure 30. Output Duty - VSP Voltage (PC=H) 5 20 4 3 PC Voltage : VPC [V] PCT Voltage : V PCT [V] 15 Figure 31. Testing Mode Threshold Voltage 110C 25C -40C 4 10 VSP Voltage : VSP [V] VSP Voltage : VSP [V] 3 2 2 1 1 -40C 25C 110C 0 0 0 1 2 3 4 5 6 0 7 2 3 4 PCT Voltage : VPCT [V] VSP Voltage : VSP [V] Figure 32. VSP - PCT Offset Voltage http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 1 Figure 33. PCT - PC Linearity (RPCT=RPC=100k) 17/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Typical Performance Curves (Reference data) - Continued 1.5 30 1.0 Frequency : F OSC [kHz] Internal Logic : H/L [-] 25C 110C -40C 0.5 0.0 110C 25C -40C -0.5 25 20 15 10 0.0 0.2 0.4 0.6 0.8 1.0 14 VPC/VREG (Normalized) : [V/V] Figure 34. PWM Switching Arm Threshold Voltage 22 26 30 Figure 35. Carrier Frequency - RT 0.0 0.8 110C 25C -40C Output Voltage : VOL [V] _ Output Drop Voltage : VOH [V] 18 External Resistor : RT [kohm] -0.2 -0.4 -0.6 -40C 25C 110C -0.8 0.6 0.4 0.2 0.0 0 2 4 6 0 Output Current : IOUT [mA] 4 6 Output Current : IOUT [mA] Figure 36. High Side Output Voltage (FG) http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2 Figure 37. Low Side Output Voltage (FG) 18/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Typical Performance Curves (Reference data) - Continued 1.5 60 Internal Logic : H/L [-] 50 Input Bias Current : I IN [A] 110C 25C -40C 110C 25C -40C 40 30 20 110C 25C -40C 1.0 0.5 0.0 10 0 -0.5 0 1 2 3 4 5 1.5 1.9 2.1 2.3 2.5 Input Voltage : VIN [V] Figure 38. Input Bias Current (CCW, FGS) Figure 39. Input Threshold Voltage (CCW, FGS, FOB) 2.7 1.5 30 110C 25C -40C Internal Logic : H/L [-] SNS Input Bias Current : I SNS [A] 1.7 Input Voltage : VIN [V] 20 10 1.0 0.5 0.0 110C 25C -40C 0 0 1 2 3 4 -0.5 0.48 5 0.49 0.50 0.51 0.52 SNS Input Voltage : VSNS [V] Input Voltage : VSNS [V] Figure 40. SNS Input Bias Current Figure 41. Current Limiter Input Threshold Voltage (SNS) http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Typical Performance Curves (Reference data) - Continued 1.5 1.5 1.0 Internal Logic : H/L [-] Internal Logic : H/L [-] -40C 25C 110C 0.5 0.0 -0.5 1.0 0.5 0.0 -0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 75 Input Voltage : VSNS [V] 105 120 135 150 Junction Temperature : Tj [C] Figure 42. OCP Input Threshold Voltage (SNS) Figure 43. Thermal Shutdown 1.5 1.5 125C 25C -40C 110C 25C -40C 110C 25C -40C 125C 25C -40C 1.0 Internal Logic : H/L [-] Internal Logic : H/L [-] 90 0.5 0.0 -0.5 1.0 0.5 0.0 -0.5 8 9 10 11 12 13 8 Supply Voltage : VBX - VX [V] 10 11 12 13 Supply Voltage : VCC [V] Figure 44. Under Voltage Lock Out (High Side Driver, Each Phase) http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 9 Figure 45. Under Voltage Lock Out (Low Side Drivers) 20/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Application Example VDC GND VCC VSP IC1 R1 D1 C5 C6 C13 C1 C7 C2~C4 C8 M HW HV HU VREG R2 R3 FG R6 Q1 C9 R4 C11 R5 C10 R11 R9 R13 R12 R10 C14 R8 C12 DTR R7 Figure 46. Application Example (120 Commutation Driver) Parts List Parts Value Manufacturer Type Parts Value Ratings Type IC1 - ROHM BM6204FS C1 0.1F 50V Ceramic R1 1k ROHM MCR18EZPF1001 C2 2200pF 50V Ceramic R2 150 ROHM MCR18EZPJ151 C3 2200pF 50V Ceramic R3 150 ROHM MCR18EZPJ151 C4 2200pF 50V Ceramic R4 20k ROHM MCR18EZPF2002 C5 10F 50V Ceramic R5 100k ROHM MCR18EZPF1003 C6 10F 50V Ceramic R6 100k ROHM MCR18EZPF1003 C7 2.2F 50V Ceramic R7 0.6 ROHM MCR50JZHFL1R80 x 3 C8 2.2F 50V Ceramic R8 10k ROHM MCR18EZPF1002 C9 2.2F 50V Ceramic R9 0 ROHM MCR18EZPJ000 C10 0.1F 50V Ceramic R10 - - - C11 2.2F 50V Ceramic R11 0 ROHM MCR18EZPJ000 C12 100pF 50V Ceramic R12 - - - C13 0.1F 630V Ceramic R13 100k ROHM MCR18EZPF1003 C14 0.1F 50V Ceramic Q1 - ROHM DTC124EUA HX - - Hall elements D1 - ROHM KDZ20B http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 21/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS I/O Equivalence Circuits VCC VREG VREG VREG 100k RT 100k VSP 250k SNS 2k Figure 47. RT Figure 48. SNS Figure 49. VSP Figure 50. VREG, VCC VREG HUP HUN HVP HVN HWP HWN FG Figure 51. FG 2k Figure 52. HXP, HXN VREG VREG 100k 2k FGS CCW PC 2k Figure 53. FGS, CCW 2k PCT Figure 54. PC, PCT BX VREG VDC FOB X VCC Figure 55. FOB PGND Figure 56. VCC, PGND, VDC, BX(BU/BV/BW), X(U/V/W) http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 22/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 23/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the IC. When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is judged that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be implemented with this product or its application circuits, it is important to take physical safety measures, such as providing voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC. This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor(NPN) Pin A Pin B E Pin A C P N P + N Pin B B C N P + N Parasitic Elements N P + N P N B P+ N E P Substrate Parasitic Elements N P Substrate GND Parasitic Elements GND GND N Region close-by Parasitic Elements Figure A-1. Example of IC structure 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 24/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Physical Dimension, Tape and Reel Information Package Name SSOP-A54_36 22.0 0.2 (MAX 22.35 include BURR) 11.4 36 28 1 27 0.4 Min. 0.3 0.2 14.1 4 +6 -4 0.1 0.1 0.1 2.1 0.1 1.05 0.1 0.27 0.8 0.38 (UNIT : mm) PKG : SSOP-A54_36 0.1 0.1 <Tape and Reel Information> Tape Embossed carrier tape Quantity 1000pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand Reel http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Direction of feed 1pin *Order quantity needs to be multiple of the minimum quantity. 25/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Ordering Information B M 6 2 0 ROHM Part Number BM6204 : 600V/1.5A, 120 4 F S Package FS : SSOP-A54_36 - E 2 Packaging specification E2 : Embossed carrier tape Marking Diagram SSOP-A54_36 (TOP VIEW) Part Number Marking BM6204FS 1PIN MARK http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 LOT Number 26/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet BM6204FS Revision History Date Revision 24.Dec.2014 09.Sep.2015 001 002 Changes New release Correct some misdescriptions http://www.rohm.com (c) 2014 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 27/27 TSZ02201-0828AB400120-1-2 09.Sep.2015 Rev.002 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bm6204fs - Web Page Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bm6204fs SSOP-A54_36 1000 1000 Taping inquiry Yes