Product structure : Semiconductor IC This product is not designed protection against radioactive rays
.
1/27
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
TSZ22111 · 14 · 001
http://www.rohm.com
For Air-Conditioner Fan Motor
3-Phase Brushless Fan Motor
Driver
BM6204FS
General Description
This motor driver IC adopts PrestoMOS™ as the output
transistor, and put in a small full molding package with
the 120° square wave commutation controller chip and
the high voltage gate driver chip. The protection circuits
for overcurrent, overheating, under voltage lock out and
the high voltage bootstrap diode with current regulation
are built-in. It provides optimum motor drive system and
downsizing the built-in PCB of the motor.
Features
600V PrestoMOS™ built-in
Output current 1.5A
Bootstrap operation by floating high side driver
(including diode)
120° square wave commutation logic
PWM control
Rotational direction switch
FG signal output with pulse number switch (4 or 12)
VREG output (5V/30mA)
Protection circuits provided: CL, OCP, TSD, UVLO,
MLP and the external fault input
Fault output (open drain)
Applications
Air conditioners; air purifiers; water pumps;
dishwashers; washing machines
Key Specifications
Output MOSFET Voltage: 600V
Driver Output Current (DC): ±1.5A (Max)
Driver Output Current (Pulse): ±2.5A (Max)
Output MOSFET DC On Resistance: 2.7Ω (Typ)
Duty Control Voltage Range: 2.1V to 5.4V
Operating Case Temperature: -20°C to +100°C
Junction Temperature: +150°C
Power Dissipation: 3.00W
Package W (Typ) x D (Typ) x H (Max)
SSOP-A54_36 22.0 mm x 14.1 mm x 2.4 mm
Typical Application Circuit
SSOP-A54_36
Figure 1. Application Circuit Example
R13
VREG
C14
HU
HV
HW
VSP
FG
VCC
GND
M
VDC
R1
R2
R4
R8
C1
C2~C4
C7
C8
C9
C12
D1
C11 R9
R10
R11
R12R5 C10R6
R3
C5 C13
DTR
Q1
C6
R7
2/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Block Diagram and Pin Configuration
Figure 2. Block Diagram Figure 3. Pin Configuration
Pin Descriptions (NC: No Connection)
Pin Name Function Pin Name Function
1 VCC Low voltage power supply 36 VDC High voltage power supply
2 GND Ground - VDC
3 GND Ground
4 GND Ground
5 VCC Low voltage power supply 35 BU Phase U floating power supply
6 VSP Duty control voltage input pin - U
7 VREG Regulator output 34 U Phase U output
8 NC
9 HWN Hall input pin phase W-
10 HWP Hall input pin phase W+ 33 BV Phase V floating power supply
11 HVN Hall input pin phase V- - V
12 HVP Hall input pin phase V+ 32 V Phase V output
13 HUN Hall input pin phase U-
14 HUP Hall input pin phase U+
15 PCT VSP offset voltage output pin
16 PC PWM switching arm setting pin - VDC
17 CCW Direction switch (H:CCW) 31 VDC High voltage power supply
18 FGS FG pulse # switch (H:12, L:4)
19 FG FG signal output
20 FOB Fault signal output (open drain)
21 SNS Over current sense pin 30 BW Phase W floating power supply
22 NC - W
23 RT Carrier frequency setting pin 29 W Phase W output
24 GND Ground
25 GND Ground
26 GND Ground - PGND
27 VCC Low voltage power supply 28 PGND Ground (current sense pin)
Note) All pin cut surfaces visible from the side of package are no connected, except the pin number is expressed as a “-”.
GND
RT
VREG
VR EG
FIB
SNS
PC
PCT
BW
BU
BV
PGND
U
M
35
34
V
33
32
W
30
29
20
FOB
VDC
28
TEST
31 VDC
FAULT
36
LEVEL
SHIFT
&
GATE
DRIVER
LEVEL
SHIFT
&
GATE
DRIVER
LEVEL
SHIFT
&
GATE
DRIVER
9
HWN
10
HWP
11
HVN
12
HVP
13
HUN
14
HUP
HW
HV
HU
1
VCC
5
VCC
6
VSP
7
15
V/I
16
FGS
18
CCW
FG
19
21
OSC 23
24
17
LOGIC
PWM
FAULT
UH
UL
VH
VL
WH
WL
VR EG
VR EG
VS P
VREG
TEST
VR EG
VSP
GND
26
PGND
W
BW
VDC
V
BV
U
BU
VDC VCC
GND
GND
GND
VCC
VSP
VREG
NC
HWN
HWP
HVN
HVP
HUN
HUP
PCT
PC
CCW
FGS
FG
FOB
SNS
NC
RT
GND
GND
GND
VCC
3/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Description of Blocks
1. Commutation Logic
When the hall frequency is about 1.4-Hz or less (e.g. when the motor starts up), or PC pin is “L”, the commutation mode
is 120° square wave drive with upper and lower switching (synchronous switching). The controller monitors the hall
frequency, and switches to upper switching when the hall frequency reaches or exceeds about 1.4-Hz over four
consecutive cycles and PC pin is “H”. Refer to the timing charts in figures 12 and 13.
2. Duty Control
The switching duty can be controlled by forcing DC voltage with value from VSPMIN to VSPMAX to the VSP pin. When the
VSP voltage is higher than VSPTST, the controller forces PC pin voltage to ground (Testing mode, maximum duty and
synchronous switching). The VSP pin is pulled down internally by a 200 kΩ resistor. Therefore, note the impedance when
setting the VSP voltage with a resistance voltage divider.
3. Carrier Frequency Setting
The carrier frequency setting can be freely adjusted by connecting an external
resistor between the RT pin and ground. The RT pin is biased to a constant
voltage, which determines the charge current to the internal capacitor. Carrier
frequencies can be set within a range from about 16 kHz to 50 kHz. Refer to the
formula to the right.
4. FG Signal Output
The number of FG output pulses can be switched in accordance with the number
of poles and the rotational speed of the motor. The FG signal is output from the FG
pin. The 12-pulse signal is generated from the three hall signals (exclusive NOR),
and the 4-pulse signal is the same as hall U signal. It is recommended to pull up
FGS pin to VREG voltage when malfunctioning because of the noise.
5. Direction of Motor Rotation Setting
The direction of rotation can be switched by the CCW pin. When CCW pin is “H” or
open, the motor rotates at CCW direction. It is recommended to pull up CCW pin to
VREG voltage when malfunctioning because of the noise.
6. Hall Signal Comparator
The hall comparator provides voltage hysteresis to prevent noise malfunctions. The bias current to the hall elements
should be set to the input voltage amplitude from the element, at a value higher than the minimum input voltage, VHALLMIN.
We recommend connecting a ceramic capacitor with value from 100 pF to 0.01 µF, between the differential input pins of
the hall comparator. Note that the bias to hall elements must be set within the common mode input voltage range
VHALLCM.
Table 1. 120° commutation (synchronous switching) truth table
HU HV HW UH VH WH UL VL WL
H L H L PWM L H
PWM
-------------------- L
H L L L L PWM H L
PWM
--------------------
H H L L L PWM L H PWM
--------------------
L H L PWM L L
PWM
--------------------
H L
L H H PWM L L
PWM
--------------------
L H
L L H L PWM L L PWM
--------------------
H
FGS No. of pulse
H 12
L 4
CCW Direction
H CCW
L CW
]kohm[R
400
]kHz[f
T
OSC
4/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
7. Output Duty Pulse Width Limiter
Pulse width duty is controlled during PWM switching in order to ensure the operation of internal power transistor. The
controller doesn’t output pulse of less than TMIN (0.8µs minimum), nor output a duty pulse of DMAX or more. Dead time is
forcibly provided to prevent internal power transistors to turn-on simultaneously in upper and lower side in gate driver
output (for example, UH and UL) of each arm. This will not overlap the minimum time TDT (1.6µs minimum). Because of
this, the maximum duty of the synchronous switching mode is 84% (typical).
8. PWM Switching Arm Setting
The PWM switching arm can choose one from the synchronous switching or the upper switching. When PC is “L”, the
switching mode is the synchronous. And also when PC is “H”, the switching mode is the upper switching. However, when
the hall cycle is about 1.4-Hz or less, the switching mode keeps the synchronous even if PC is “H”. When the PWM
control is entering to the testing mode, the controller forces PC pin voltage to ground and synchronous switching mode.
Therefore, when PC pin pull-up to VREG pin, at least a resistor with a value 10k Ω or more. The VSP offset voltage
(Figure 32) is buffered to PCT pin, to connect an external resistor between PCT pin and ground. The internal bias current
is determined by PCT voltage and the resistor value - VPCT / RPCT -, and mixed to PC pin. Because you can freely
determine the slope by the resistance ratio of PC pin and PCT pin, which allows you to adjust the voltage command
value to switch the synchronous switching or the upper switching. Please select the RPCT value from 50 kΩ to 200 kΩ in
the range on the basis of 100 kΩ, because the PCT pin current capability is a 100 µA or less.
Figure 4. PWM Switching Arm Setting
9. Current Limiter (CL) Circuit and Overcurrent Protection (OCP) Circuit
The current limiter circuit can be activated by connecting a low value resistor for current detection between the output
stage ground (PGND) and the controller ground (GND). When the SNS pin voltage reaches or surpasses the threshold
value (VSNS, 0.5V typical), the controller forces all the upper switching arm inputs low (UH, VH, WH = L, L, L), thus
initiating the current limiter operation. When the SNS pin voltage swings below the ground, it is recommended to insert a
resistor - 1.5 kΩ or more - between SNS pin and PGND pin to prevent malfunction. Since this limiter circuit is not a latch
type, it returns to normal operation - synchronizing with the carrier frequency - once the SNS pin voltage falls below the
threshold voltage. A filter is built into the overcurrent detection circuit to prevent malfunctions, and does not activate when
a short pulse of less than TMASK is present at the input.
When the SNS pin voltage reaches or surpasses the threshold value (VOVER, 0.9V typical) because of the power fault or
the short circuit except the ground fault, the gate driver outputs low to the gate of all output MOSFETs, thus initiating the
overcurrent protection operation. Since this protection circuit is also not a latch type, it returns to normal operation
synchronizing with the carrier frequency.
PC
RPCL
PCT
RPC T
VSP
RPC T
VPCT
VSPMIN
VPCT = VSP-VSPMIN
1/2 VREG
Upper S W
or
Upper/Lower SW
VPC
VSP
Upper/Lower
SW
Upper
SW
PC: H
PC: L
5/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
10. Under Voltage Lock Out (UVLO) Circuit
To secure the lowest power supply voltage necessary to operate the controller and the driver, and to prevent under
voltage malfunctions, the UVLO circuits are independently built into the upper side floating driver, the lower side driver
and the controller. When the supply voltage falls to VUVL or below, the controller forces driver outputs low. When the
voltage rises to VUVH or above, the UVLO circuit ends the lockout operation and returns the chip only after 32 carrier
periods (1.6ms for the default 20kHz frequency) to normal operation. Even if the controller returns to normal operation,
the output begins from the following control input signal.
The voltage monitor circuit (4.0V nominal) is built-in for the VREG voltage. Therefore, the UVLO circuit does not release
operation when the VREG voltage rising is delayed behind the VCC voltage rising even if VCC voltage becomes VUVH or
more.
11. Thermal Shutdown (TSD) Circuit
The TSD circuit operates when the junction temperature of the controller exceeds the preset temperature (125°C
nominal). At this time, the controller forces all driver outputs low. Since thermal hysteresis is provided in the TSD circuit,
the chip returns to normal operation when the junction temperature falls below the preset temperature (100°C nominal).
The TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or
guarantee its operation in the presence of extreme heat. Do not continue to use the IC after the TSD circuit is activated,
and do not use the IC in an environment where activation of the circuit is assumed.
Moreover, it is not possible to follow the output MOSFET junction temperature rising rapidly because it is a gate driver
chip that monitors the temperature and it is likely not to function effectively.
12. Motor Lock Protection (MLP) Circuit
When the controller detects the motor locking during fixed time of 4 seconds nominal when each edge of the hall signal
doesn't input either, the controller forces all driver outputs low under a fixed time 20 seconds nominal, and self-returns to
normal operation. This circuit is enabled if the voltage force to VSP is over the duty minimum voltage VSPMIN, and note
that the motor cannot start up when the controller doesn’t detect the motor rotation by the minimum duty control. Even if
the edge of the hall signal is inputted within range of the OFF state by this protection circuit, it is ignored. But if the VSP
is forced to ground level once, the protection can be canceled immediately.
13. Hall Signal Wrong Input Detection
Hall element abnormalities may cause incorrect inputs that vary from the normal logic. When all hall input signals go high
or low, the hall signal wrong input detection circuit forces all driver outputs low. And when the controller detects the
abnormal hall signals continuously for four times or more motor rotation, the controller forces all driver outputs low and
latches the state. It is released if the duty control voltage VSP is forced to ground level once.
14. Internal Voltage Regulator
The internal voltage regulator VREG is output for the bias of the hall
element and the phase control setting. However, when using the VREG
function, be aware of the IOMAX value. If a capacitor is connected to the
ground in order to stabilize output, a value of 1 µF or more should be used.
In this case, be sure to confirm that there is no oscillation in the output.
Figure 5. VREG Output Pin Application Example
HUP
HUN
HVP
HVN
HWP
HWN
HU
HV
HW
VCC
Controller IC
R1
VREG
6/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
15. Bootstrap Operation
Figure 6. Charging Period Figure 7. Discharging Period
The bootstrap is operated by the charge period and the discharge period being alternately repeated for bootstrap
capacitor (CB) as shown in the figure above. In a word, this operation is repeated while the output of an external
transistor is switching with synchronous rectification. Because the supply voltage of the floating driver is charged from the
VCC power supply to CB through prevention of backflow diode DX, it is approximately (VCC-1V). The resistance series
connection with DX has the impedance of approximately 200 Ω. Because the total gate charge is needed only by the
carrier frequency in the upper switching section of 120° commutation driving, please set it after confirming actual
application operation.
16. Fault Signal Output
When the controller detects either state that should be protected the overcurrent (OCP) and the over temperature (TSD),
the FOB pin outputs low (open drain) and it returns to normal operation synchronizing with the carrier frequency. Even
when this function is not used, the FOB pin is pull-up to the voltage of 3V or more and at least a resistor with a value 10k
Ω or more. A filter is built into the fault signal input circuit to prevent malfunctions by the switching noise, and does not
activate when a short pulse of less than TMASK is present at the input. The time to the fault operation is the sum total of
the propagation delay time of the detection circuit and the filter time, 1.6µs (typical).
Figure 8. Fault Operation ~ OCP ~ Timing Chart
CB
HO
VS
VDC
VB
L
H
DX
LO
OFF
ON
VCC
CB
HO
VS
VDC
VB
H
L
DX
LO
ON
OFF
VCC
XH
YL
SNS
XHO
YLO
FOB
0.9V(Typ)
1.6µs (Typ) 1.6µs (Typ)
0.5V(Typ)
OCP threshold
CL threshold
1.6µs (Typ) 1.6µs (Typ)
VSP
TRIOSC
7/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
FOB
VREG
R
C
The release time from the protection operation can be
changed by inserting an external capacitor. Refer to
the formula below. Release time of 5ms or more is
recommended.
CR)
V
3.2
1ln(t
REG
[s]
Figure 9. Release Time Setting Application Circuit
Figure 10. Release Time (Reference Data @R=100kΩ)
17. Switching Time
Figure 11. Switching Time Definition
Parameter Symbol Reference Unit Conditions
tdH(on) 790 ns
trH 110 ns
trrH 200 ns
tdH(off) 490 ns
High Side Switching
Time
tfH 15 ns
tdL(on) 830 ns
trL 110 ns
trrL 160 ns
tdL(off) 570 ns
Low Side Switching
Time
tfL 80 ns
VDC=300V, VCC=15V, ID=0.75A
Inductive load
The propagation delay time: Internal
gate driver input stage to the driver
IC output.
XH, XL
VDS
ID
ton
td(on) t
r
trr
td(off)
toff
tf
10%
90%
10%
90%
0
1
2
3
4
5
6
7
8
9
10
0.01 0.10 1.00
Capacitance : C[µF]
Release time : t [ms]
8/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Timing Chart (CW)
Figure 12. Timing Chart (Clockwise)
PWM
PWM PWM PWM PWM
PWM
PWM PWM PWM PWM
PWM PWM PWM
PWM PWMPWMPWM
PWMPWM PWMPWM PWM
PWM PWMPWMPWM
PWM
PWM PWM PWM PWM
PWM
PWM PWM PWM PWM
PWM PWM PWM
PWM PWMPWMPWM
PWMPWM PWMPWM PWM
PWM PWMPWMPWM
PWM
PWM PWM PWM PWM
PWM
HALL U
PWM
HALL V
HALL W
PWM PWM PWM
UH
PWM PWM PWM
VH
WH
UL
VL
WL
UH
VH
WH
UL
VL
WL
UH
VH
WH
UL
VL
WL
FG
Hall Signals
Spin Up (Hall Period < 1.4Hz)
PC=L, Hall Period >1.4Hz
PC=H, Hall Period >1.4Hz
FG Output (FGS=H)
9/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Timing Chart (CCW)
Figure 13. Timing Chart (Counter Clockwise)
PWM
PWM PWM PWM PWM
PWM
PWM PWM PWM PWM
PWM PWM PWM
PWM PWMPWMPWM
PWMPWM PWMPWM PWM
PWM PWMPWMPWM
PWM
PWM PWM PWM PWM
PWM
PWM PWM PWM PWM
PWM PWM PWM
PWM PWMPWMPWM
PWMPWM PWMPWM PWM
PWM PWMPWMPWM
PWM
PWM PWM PWM PWM
PWM
HALL U
PWM
HALL V
HALL W
PWM PWM PWM
UH
PWM PWM PWM
VH
WH
UL
VL
WL
UH
VH
WH
UL
VL
WL
UH
VH
WH
UL
VL
WL
FG
Hall Signals
Spin Up (Hall Period < 1.4Hz)
PC=L, Hall Period >1.4Hz
PC=H, Hall Period >1.4Hz
FG Output (FGS=H)
10/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Controller Outputs and Operation Mode Summary
Detected direction Forward (CW:U~V~W, CCW:U~W~V) Reverse (CW:U~W~V, CCW:U~V~W)
Hall sensor frequency < 1.4Hz 1.4Hz < < 1.4Hz 1.4Hz <
Conditions
PC pin L H L H L H L H
VSP < VSPMIN
(Duty off) Upper and lower arm off
VSPMIN < VSP < VSPMAX
(Control range) Upper
switching
Normal
operation
VSPTST < VSP
(Testing mode)
Upper and lower
switching
Upper and lower
switching
Upper and lower
switching Upper switching
Current limiter (Note 1) Upper arm off Upper and lower arm off
Overcurrent (Note 2)
TSD (Note 2)
External input (Note 2)
UVLO (Note 3)
Motor lock
Upper and lower arm off
Protect
operation
Hall sensor abnormally Upper and lower arm off and latch
(Note) The controller monitors both edges of three hall sensors for detecting period.
(Note 1) It returns to normal operation by the carrier frequency synchronization.
(Note 2) It works together with the fault operation, and returns after the release time synchronizing with the carrier frequency.
(Note 3) It returns to normal operation after 32 cycles of the carrier oscillation period.
Absolute Maximum Ratings (Ta=25°C)
Parameter Symbol Ratings Unit
Output MOSFET VDSS 600 (Note 1) V
Supply Voltage VDC -0.3 to +600 (Note 1) V
Output Voltage VU, VV, VW -0.3 to +600 (Note 1) V
High Side Supply Pin Voltage VBU, VBV, VBW -0.3 to +600 (Note 1) V
High Side Floating Supply Voltage VBU-VU, VBV-VV, VBW-VW -0.3 to +20 V
Low Side Supply Voltage VCC -0.3 to +20 V
Duty Control Voltage VSP -0.3 to +20 V
All Others VI/O -0.3 to +5.5 V
Driver Outputs (DC) IOMAX(DC) ±1.5 (Note 1) A
Driver Outputs (Pulse) IOMAX(PLS) ±2.5 (Note 1, 2) A
Fault Signal Output IOMAX(FOB) 15 (Note 1) mA
Power Dissipation Pd 3.00 (Note 3) W
Thermal Resistance Rthj-c 15 °C/W
Operating Case Temperature TC -20 to +100 °C
Storage Temperature TSTG -55 to +150 °C
Junction Temperature Tjmax 150 °C
(Note) All voltages are with respect to ground.
(Note 1) Do not, however, exceed Pd or ASO.
(Note 2) Pw ≤ 10µs, Duty cycle ≤ 1%
(Note 3) Mounted on a 70mm x 70mm x 1.6mm FR4 glass-epoxy board with less than 3% copper foil. Derated at 24mW/°C above 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
11/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Recommended Operating Conditions (Tc=25°C)
Parameter Symbol Min Typ Max Unit
Supply Voltage VDC - 310 400 V
High Side Floating Supply Voltage VBU-VU, VBV-VV, VBW-VW 13.5 15 16.5 V
Low Side Supply Voltage VCC 13.5 15 16.5 V
Bootstrap Capacitor CB 1.0 - - µF
VREG Bypass Capacitor CVREG 1.0 - - µF
Shunt Resistor (PGND) RS 0.6 - - Ω
Junction Temperature Tj - - 125 °C
(Note) All voltages are with respect to ground.
Electrical Characteristics (Driver part, unless otherwise specified, Ta=25°C and VCC=15V)
Parameter Symbol Min Typ Max Unit Conditions
Power Supply
HS Quiescence Current IBBQ 30 70 150 µA VSP=0V, each phase
LS Quiescence Current ICCQ 0.2 0.7 1.3 mA VSP=0V
Output MOSFET
D-S Breakdown Voltage V(BR)DSS 600 - - V ID=1mA, VSP=0V
Leak Current IDSS - - 100 µA VDS=600V, VSP=0V
DC On Resistance RDS(ON) - 2.7 3.5 Ω I
D=0.75A
Diode Forward Voltage VSD - 1.1 1.5 V ID=0.75A
Bootstrap Diode
Leak Current ILBD - - 10 µA VBX=600V
Forward Voltage VFBD 1.5 1.8 2.1 V IBD=-5mA, including series-R
Series Resistance RBD - 200 - Ω
Under Voltage Lock Out
HS Release Voltage VBUVH 9.5 10.0 10.5 V VBX - VX
HS Lockout Voltage VBUVL 8.5 9.0 9.5 V VBX - VX
12/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Electrical Characteristics (Controller part, unless otherwise specified, Ta=25°C and VCC=15V)
Parameter Symbol Min Typ Max Unit Conditions
Power Supply
Supply Current ICC 0.8 1.7 3.0 mA VSP=0V
VREG Voltage VREG 4.5 5.0 5.5 V IO=-30mA
Hall Comparators
Input Bias Current IHALL -2.0 -0.1 2.0 µA VIN=0V
Common Mode Input VHALLCM 0 - VREG-1.5 V
Minimum Input Level VHALLMIN 50 - - mVp-p
Hysteresis Voltage P VHALLHY+ 5 13 23 mV
Hysteresis Voltage N VHALLHY- -23 -13 -5 mV
Duty Control
Input Bias Current ISP 15 25 35 µA VIN=5V
Duty Minimum Voltage VSPMIN 1.8 2.1 2.4 V
Duty Maximum Voltage VSPMAX 5.1 5.4 5.7 V
Testing Operation Range VSPTST 8.2 - 18 V
Minimum Output Duty DMIN - 2 - % FOSC=20kHz
Maximum Output Duty DMAX - 95 - % FOSC=20kHz, upper switching
Mode Switch - FGS and CCW
Input Bias Current IIN -70 -50 -30 µA VIN=0V
Input High Voltage VINH 3 - VREG V
Input Low Voltage VINL 0 - 1 V
Fault Input/Output - FOB
Input High Voltage VFOBIH 3 - VREG V
Input Low Voltage VFOBIL 0 - 1 V
Output Low Voltage VFOBOL 0 0.07 0.60 V IO=5mA
Monitor Output - FG
Output High Voltage VMONH V
REG-0.40 VREG-0.08 VREG V IO=-2mA
Output Low Voltage VMONL 0 0.02 0.40 V IO=2mA
Current Detection
Input Bias Current ISNS -30 -20 -10 µA VIN=0V
Current Limiter Voltage VSNS 0.48 0.50 0.52 V
Overcurrent Voltage VOVER 0.84 0.90 0.96 V
Noise Masking Time TMASK 0.8 1.0 1.2 µs
PWM Switching Arm Setting
Threshold Voltage VPC -0.05 0 0.05 V 1/2·VREG, reference voltage
Carrier Frequency Oscillator
Carrier Frequency FOSC 18 20 22 kHz RT=20kΩ
Under Voltage Lock Out
LS Release Voltage VCCUVH 11.5 12.0 12.5 V
LS Lockout Voltage VCCUVL 10.5 11.0 11.5 V
13/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Typical Performance Curves (Reference data)
20
40
60
80
100
120
12 14 16 18 20
Supply Voltage : VBX-VX [V]
Supply Current : IQVBX [µA] _
125°C
25°C
-40°C
4
5
6
7
8
9
10
12 14 16 18 20
Supply Voltage : VCC [V]
Supply Current : Icc [mA]
110°C
25°C
-40°C
Figure 16. Quiescence Current Figure 17. High Side Driver Operating Current
(High Side Driver, Each Phase) (FPWM: 20kHz, Each Phase)
Figure 14. Quiscence Current Figure 15. Low Side Drivers Operating Current
(Low Side Drivers) (FPWM: 20kHz)
150
200
250
300
350
400
12 14 16 18 20
Supply Voltage : VBX-VX [V]
Supply Current : IQVBX [µA] _
125°C
25°C
-40°C
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
12 14 16 18 20
Supply Voltage : VCC [V]
Supply Current : Icc [mA]
110°C
25°C
-40°C
14/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Typical Performance Curves (Reference data) - Continued
Figure 20. Bootstrap Diode Forward Voltage Figure 21. Bootstrap Series Resistor
Figure 18. Output MOSFET ON Resistance Figure 19. Output MOSFET Body Diode
0
2
4
6
8
0.0 0.5 1.0 1.5 2.0
Drain Current : IDS [A]
Output On Resistance : RDSON [ohm]
125°C
25°C
-40°C
0.0
0.5
1.0
1.5
2.0
0.0 0.5 1.0 1.5 2.0
Source Current : ISD [A]
Forward Voltage : VSD [V]
-40°C
25°C
125°C
0
1
2
3
4
0246810
Bootstrap Series Resistor Current : IBR [mA]
Voltage : VBOOTR [V]
125°C
25°C
-40°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0246810
Bootstrap Diode Current : IBD [mA]
Forward Voltage : VFBD [V]
-40°C
25°C
125°C
15/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Typical Performance Curves (Reference data) - Continued
Figure 24. Low Side Switching Loss Figure 25. Low Side Recovery Loss
(VDC=300V) (VDC=300V)
Figure 22. High Side Switching Loss Figure 23. High Side Recovery Loss
(VDC=300V) (VDC=300V)
0
50
100
150
200
0.0 0.5 1.0 1.5
Drain Current : IO [A]
E [µJ]
125°C
25°C
-40°C EON
EOFF
0
5
10
15
0.0 0.5 1.0 1.5
Drain Current : IO [A]
E [µJ]
125°C
25°C
-40°C
0
50
100
150
200
0.0 0.5 1.0 1.5
Drain Current : IO [A]
E [µJ]
125°C
25°C
-40°C EON
EOFF
0
5
10
15
0.0 0.5 1.0 1.5
Drain Current : IO [A]
E [µJ]
125°C
25°C
-40°C
16/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Typical Performance Curves (Reference data) - Continued
Figure 28. Hall Comparator Hysteresis Voltage Figure 29. VSP Input Bias Current
Figure 26. VREG - VCC Figure 27. VREG Drive Capability
4.6
4.8
5.0
5.2
5.4
12 14 16 18 20
Supply Voltage : VCC [V]
VREG voltage : V REG [V]
-40°C
25°C
110°C
4.6
4.8
5.0
5.2
5.4
0 10203040
Output Current : IOUT [mA]
VREG voltage : V REG [V]
-40°C
25°C
110°C
0
50
100
150
200
0 5 10 15 20
VSP Voltage : VSP [V]
Input Bias Current : ISP [µA]
110°C
25°C
-40°C
-1
0
1
2
3
4
5
6
-30 -15 0 15 30
Differential Voltage : VHUP-VHUN [mV]
Internal Output Voltage : [V]
110°C
25°C
-40°C
110°C
25°C
-40°C
17/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Typical Performance Curves (Reference data) - Continued
Figure 32. VSP - PCT Offset Voltage Figure 33. PCT - PC Linearity
(RPCT=RPC=100kΩ)
Figure 30. Output Duty - VSP Voltage Figure 31. Testing Mode Threshold Voltage
(PC=H)
0
20
40
60
80
100
02468
VSP Voltage : VSP [V]
Output Duty : D SP [%]
110°C
25°C
-40°C
-0.5
0.0
0.5
1.0
1.5
0 5 10 15 20
VSP Voltage : VSP [V]
Internal Logic : H/L [-]
110°C
25°C
-40°C
0
1
2
3
4
5
01234567
VSP Voltage : VSP [V]
PCT Voltage : V PCT [V]
110°C
25°C
-40°C
0
1
2
3
4
01234
PCT Voltage : VPCT [V]
PC Voltage : VPC [V]
-40°C
25°C
110°C
18/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Typical Performance Curves (Reference data) - Continued
Figure 36. High Side Output Voltage Figure 37. Low Side Output Voltage
(FG) (FG)
Figure 34. PWM Switching Arm Threshold Voltage Figure 35. Carrier Frequency - RT
10
15
20
25
30
14 18 22 26 30
External Resistor : RT [kohm]
Frequency : F OSC [kHz]
25°C
110°C
-40°C
-0.8
-0.6
-0.4
-0.2
0.0
0246
Output Current : IOUT [mA]
Output Drop Voltage : VOH [V]
-40°C
25°C
110°C
0.0
0.2
0.4
0.6
0.8
0246
Output Current : IOUT [mA]
Output Voltage : VOL [V] _
110°C
25°C
-40°C
-0.5
0.0
0.5
1.0
1.5
0.0 0.2 0.4 0.6 0.8 1.0
VPC/VREG (Normalized) : [V/V]
Internal Logic : H/L [-]
110°C
25°C
-40°C
19/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Typical Performance Curves (Reference data) - Continued
Figure 40. SNS Input Bias Current Figure 41. Current Limiter Input Threshold Voltage
(SNS)
Figure 38. Input Bias Current Figure 39. Input Threshold Voltage
(CCW, FGS) (CCW, FGS, FOB)
0
10
20
30
40
50
60
012345
Input Voltage : VIN [V]
Input Bias Current : IIN [µA]
110°C
25°C
-40°C
-0.5
0.0
0.5
1.0
1.5
1.5 1.7 1.9 2.1 2.3 2.5 2.7
Input Voltage : VIN [V]
Internal Logic : H/L [-]
110°C
25°C
-40°C
110°C
25°C
-40°C
0
10
20
30
012345
SNS Input Voltage : VSNS [V]
SNS Input Bias Current : ISNS [µA]
110°C
25°C
-40°C
-0.5
0.0
0.5
1.0
1.5
0.48 0.49 0.50 0.51 0.52
Input Voltage : VSNS [V]
Internal Logic : H/L [-]
110°C
25°C
-40°C
20/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Typical Performance Curves (Reference data) - Continued
Figure 44. Under Voltage Lock Out Figure 45. Under Voltage Lock Out
(High Side Driver, Each Phase) (Low Side Drivers)
Figure 42. OCP Input Threshold Voltage Figure 43. Thermal Shutdown
(SNS)
-0.5
0.0
0.5
1.0
1.5
8 9 10 11 12 13
Supply Voltage : VCC [V]
Internal Logic : H/L [-]
110°C
25°C
-40°C
110°C
25°C
-40°C
-0.5
0.0
0.5
1.0
1.5
8 9 10 11 12 13
Supply Voltage : VBX - VX [V]
Internal Logic : H/L [-]
125°C
25°C
-40°C
125°C
25°C
-40°C
-0.5
0.0
0.5
1.0
1.5
0.60.70.80.91.01.11.2
Input Voltage : VSNS [V]
Internal Logic : H/L [-]
-40°C
25°C
110°C
-0.5
0.0
0.5
1.0
1.5
75 90 105 120 135 150
Junction Temperature : Tj [°C]
Internal Logic : H/L [-]
21/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Application Example
Figure 46. Application Example (120° Commutation Driver)
Parts List
Parts Value Manufacturer Type Parts Value Ratings Type
IC1 - ROHM BM6204FS C1 0.1µF 50V Ceramic
R1 1kΩ ROHM MCR18EZPF1001 C2 2200pF 50V Ceramic
R2 150Ω ROHM MCR18EZPJ151 C3 2200pF 50V Ceramic
R3 150Ω ROHM MCR18EZPJ151 C4 2200pF 50V Ceramic
R4 20kΩ ROHM MCR18EZPF2002 C5
10µF 50V Ceramic
R5 100kΩ ROHM MCR18EZPF1003 C6
10µF 50V Ceramic
R6 100kΩ ROHM MCR18EZPF1003 C7 2.2µF 50V Ceramic
R7 0.6Ω ROHM MCR50JZHFL1R80 x 3 C8 2.2µF 50V Ceramic
R8 10kΩ ROHM MCR18EZPF1002 C9 2.2µF 50V Ceramic
R9 0Ω ROHM MCR18EZPJ000 C10 0.1µF 50V Ceramic
R10 - - - C11 2.2µF 50V Ceramic
R11 0Ω ROHM MCR18EZPJ000 C12 100pF 50V Ceramic
R12 - - - C13 0.1µF 630V Ceramic
R13 100kΩ ROHM MCR18EZPF1003 C14 0.1µF 50V Ceramic
Q1 - ROHM DTC124EUA HX - - Hall elements
D1 - ROHM KDZ20B
R13
VREG
C14
HU
HV
HW
VSP
FG
VCC
GND
M
VDC
IC1
R1
R2
R4
R8
C1
C2~C4
C7
C8
C9
C12
D1
C11 R9
R10
R11
R12R5 C10R6
R3
C5 C13
DTR
Q1
C6
R7
22/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
I/O Equivalence Circuits
Figure 47. RT Figure 48. SNS Figure 49. VSP Figure 50. VREG, VCC
Figure 51. FG Figure 52. HXP, HXN
Figure 53. FGS, CCW Figure 54. PC, PCT
Figure 55. FOB
Figure 56. VCC, PGND, VDC, BX(BU/BV/BW), X(U/V/W)
VREG
FOB
VCC
X
BX
PGND
VDC
VREG
FG
HUP
HUN
2k
HVP
HVN
HWP
HWN
RT
2k SNS
250k
VREG
VREG
100k
VSP
100k
VCC
VREG
VREG
100k
CCW
FGS
VREG
PC
PCT
2k
2k
2k
23/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital
and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block.
Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the
capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to
back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not
cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor
characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground
caused by large currents. Also ensure that the ground traces of external components do not cause variations on the
ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC
is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase
the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The
electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always
be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent
damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
24/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply
or ground line.
12. Regarding the Input Pin of the IC
Do not force voltage to the input pins when the power does not supply to the IC. Also, do not force voltage to the input pins
that exceed the supply voltage or in the guaranteed the absolute maximum rating value even if the power is supplied to the
IC.
When using this IC, the high voltage pins VDC, BU/U, BV/V and BW/W need a resin coating between these pins. It is
judged that the inter-pins distance is not enough. If any special mode in excess of absolute maximum ratings is to be
implemented with this product or its application circuits, it is important to take physical safety measures, such as providing
voltage-clamping diodes or fuses. And, set the output transistor so that it does not exceed absolute maximum ratings or
ASO. In the event a large capacitor is connected between the output and ground, and if VCC and VDC are short-circuited
with 0V or ground for any reason, the current charged in the capacitor flows into the output and may destroy the IC.
This IC contains the controller chip, P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature
and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation
(ASO).
Figure A-1. Example of IC structure
Resistor
Pin A
Parasitic
Elements
P+ P
+ N N N N
P
P Substrate
GND
Parasitic
Elements
Pin A
Transistor(NPN)
Parasitic
Elements
P Substrate
GND
Pin B CB
GND
P+
NN
N
PP+
NN
E
Pin B
E
C
B
N Region
close-by
Parasitic
Elements
25/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Physical Dimension, Tape and Reel Information
Package Name SSOP-A54_36
Direction of feed
1pin
Reel
<Tape and Reel Information>
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
E2
1000pcs
Embossed carrier tape
Direction
of feed
Quantity
Tape
*Order quantity needs to be multiple of the minimum quantity.
0.8 0.1
0.4 Min.
36 28
271
(MAX 22.35 include BURR)
22.0 0.2
0.38 0.1
4
+6
-4
0.27 0.1
14.1 0.3
2.1 0.1
1.05 0.1
0.1 0.1 11.4 0.2
(UNIT : mm)
PKG : SSOP-A54_36
26/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Ordering Information
Marking Diagram
B M 6 2 0 4 F S - E 2
ROHM Part Number
BM6204 : 600V/1.5A, 120°
Package
FS : SSOP-A54_36
Packaging specification
E2 : Embossed carrier tape
BM6204FS
1PIN MARK LOT Number
Part Number Marking
SSOP-A54_36
(TOP VIEW)
27/27
Datasheet
Datasheet
BM6204FS
TSZ02201-0828AB400120-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
09.Sep.2015 Rev.002
http://www.rohm.com
TSZ22111 · 15 · 001
Revision History
Date Revision Changes
24.Dec.2014 001 New release
09.Sep.2015 002 Correct some misdescriptions
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Pro ducts.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissip ation (Pd) depe nding on Ambient temper ature (Ta). When us ed in se aled area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range descr ibed in the product specification.
9. ROHM shall not be in any way responsible or liable for fail ure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. W hen a highly active halogen ous (chlori ne, bromin e, etc.) flux is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall no t be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommen ded by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage c ondition, solderabil ity of products out of recommended storage time perio d
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before u s ing Products of
which storage time is exceeding the recommended storage time perio d.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly us ing an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under an y intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccur acy or errors of or
concerning such information.
