DATA SHEE
T
LOW-OHMIC CHIP RESISTORS
LRC21/22
5%; 1%
size 0603
Product Specification – Jan 15, 2004 V.4
Phycomp Product specification
Low-ohmic chip resistors
size 0603
LRC21/22
5% 1%
2004 Jan 15 Rev.4 2 www.yageo.com
FEATURES
Reduced size of final equipment
Low assembly costs
Higher component and equipment
reliability
APPLICATIONS
Power supply in small equipment
Digital multimeter
Telecommunication
Computers
Automotive industry
Medical and military equipment.
DESCRIPTION
The resistors are constructed on a
high grade ceramic body (aluminium
oxide). Internal metal electrodes are
added at each end and connected
by a resistive paste which is applied
to the top surface of the substrate.
The composition of the paste is
adjusted to give the approximate
resistance required and the value is
trimmed to within tolerance by laser
cutting of this resistive layer.
The resistive layer is covered with a
protective coating and printed with
the resistance value. Finally, the two
external end terminations are added.
For ease of soldering the outer layer
of these end terminations is a lead-
tin alloy.
The outlines and dimensions of the
resistor are given in Fig.2.
QUICK REFERENCE DATA
DESCRIPTION VALUE
Resistance range 0.01 to 0.99 ; E24 series
Resistance tolerance ±5%; ±1%
Temperature coefficient:
0.01 R < 0.04 ±1500 × 106/K
0.04 R < 0.10 ±1000 × 106/K
0.10 R < 0.30 ±800 × 106/K
0.30 R < 0.51 ±600 × 106/K
0.51 R < 1 ±300 × 106/K
Absolute maximum at Tamb = 70 °C 0.1 W
Maximum permissible voltage 50 V (DC or RMS)
Climatic category (IEC 60068) 55/125/56
Basic specification IEC 60115-8
ORDERING INFORMATION
Table 1 Ordering code indicating type and packing
ORDERING CODE 2350 512 …..
CARDBOARD TAPE ON REEL
TYPE RESISTANCE
RANGE
TOL.
(%)
5000 UNITS
LRC21 0.01 to 0.99 ±5 10…
LRC22 0.01 to 0.99 ±1 12…
Ordering code (12NC)
The resistors have a 12-digit
ordering code starting with
2350 512.
The subsequent 2 digits indicate
the resistor type and packing;
see Table 1.
The remaining 3 digits indicate the
resistance value:
The first 2 digits indicate the
resistance value.
The last digit indicates the
resistance decade in
accordance with Table 2.
Table 2 Last digit of 12NC
RESISTANCE LAST DIGIT
0.01 to 0.099 0
0.10 to 0.99 7
ORDERING EXAMPLE
The ordering code of an LRC22 low-
ohmic resistor, value 0.22 with a
1% tolerance, supplied on cardboard
tape of 5000 units per reel is:
2350 512 12227.
Phycomp Product specification
Low-ohmic chip resistors
size 0603
LRC21/22
5% 1%
2004 Jan 15 Rev.4 3 www.yageo.com
FUNCTIONAL DESCRIPTION
Product characterization
The resistors are available in the
E24 series for resistors with a
tolerance of ±5% or ±1%. The values
of the E24 series are in accordance
with
“IEC publication 60063”.
Limiting values
TYPE LIMITING
VOLTAGE(1)
(V)
LIMITING
POWER
(W)
LRC21 50 0.1
LRC22 50 0.1
Note
1. This is the maximum voltage that
may be continuously applied to
the resistor element, see
“IEC publication 60115-8”.
DERATING
The power that the resistor can dissipate depends on the operating
temperature; see Fig.1.
CCB413
70 10055 50
T
amb
(°C)
0
0
50
100
125
P
max
(%P
rated
)
Fig.1 Maximum dissipation (Pmax) in percentage of rated power as a
function of the ambient temperature (Tamb).
Phycomp Product specification
Low-ohmic chip resistors
size 0603
LRC21/22
5% 1%
2004 Jan 15 Rev.4 4 www.yageo.com
MECHANICAL DATA
Mass per 100 units
TYPE MASS
(g)
LRC21 0.21
LRC22 0.21
Marking
The resistors are not marked for the
E96 series and are marked with a
3-digit code for the E24 series on the
protective coating to designate the
nominal resistance value.
3-DIGIT MARKING
The R is used as a decimal point.
Example
MARKING RESISTANCE
R10 0.10
R22 0.22
R82 0.82
PACKAGE MARKING
The packing is also marked and
includes resistance value, tolerance,
catalogue number, quantity,
production period, batch number and
source code.
t
b
t
t
T
inner electrode
end termination
protective coat
CCC317
R10
marking
W
L
protective coat
resistor layer
ceramic substrate
Outlines
Table 3 Chip resistor type and relevant physical dimensions; see Fig.2
TYPE L
(mm)
W
(mm)
T
(mm)
tt
(mm)
tb
(mm)
LRC21
LRC22 1.6 ±0.10 0.80
±0.10 0.45
±0.10 0.25
±0.15 0.25
±0.15
Fig.2 Outlines.
For dimensions see Table 3.
Phycomp Product specification
Low-ohmic chip resistors
size 0603
LRC21/22
5% 1%
2004 Jan 15 Rev.4 5 www.yageo.com
TEST AND REQUIREMENTS
Essentially all tests are carried out in
accordance with the schedule of
“IEC publication 60115-8”, category
55/125/56 (rated temperature range
55 to +125 °C; damp heat, long
term, 56 days). The testing also
covers the requirements specified by
EIA and EIAJ.
The tests are carried out in
accordance with IEC publication
60068, “Recommended basic
climatic and mechanical robustness
testing procedure for electronic
components” and under standard
atmospheric conditions according to
“IEC 60068-1”, subclause 5.3.
Unless otherwise specified the
following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45% to 75%
Air pressure: 86 kPa to 106 kPa
Table 4 Test procedures and requirements
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
Tests in accordance with the schedule of IEC publication 60115-8
4.4.1 visual
examination
no holes; clean surface;
no damage
applied voltage (+0/10%):
R < 10 : 0.1 V
10 R < 100 : 0.3 V
100 R < 1 k: 1 V
1 k R < 10 k: 3 V
10 k R < 100 k: 10 V
100 k R < 1 M: 25 V
4.5 resistance
R 1 M: 50 V
R Rnom: max. ±5%
4.18 20 (Tb) resistance to
soldering heat
unmounted chips: 10 ±1 s; 260 ±5 °C no visible damage
R/R max.: ±1%
4.29 45 (Xa) component
solvent resistance
isopropyl alcohol; H2O followed by
brushing in accordance with
“MIL 202 F”
no visible damage
4.17 20 (Ta) solderability unmounted chips completely
immersed for 2 ±0.5 s in a solder
bath at 235 ±2 °C
good tinning
(95% covered);
no damage
4.7 voltage proof
on insulation
maximum voltage (RMS) during
1 minute metal block method
no breakdown or flashover
4.13 short time
overload
room temperature;
dissipation 6.25 × Pn;
5 s (voltage not more than 2 × Vmax)
no visible damage
R/R max.: ±1%
In Table 4 the tests and
requirements are listed with
reference to the relevant clauses of
“IEC publications 60115-8 and
60068”; a short description of the
test procedure is also given. In some
instances deviations from the IEC
recommendations were necessary
for our method of specifying.
All soldering tests are performed
with mildly activated flux.
Phycomp Product specification
Low-ohmic chip resistors
size 0603
LRC21/22
5% 1%
2004 Jan 15 Rev.4 6 www.yageo.com
IEC
60115-8
CLAUSE
IEC
60068-2
TEST
METHOD
TEST PROCEDURE REQUIREMENTS
4.19 14 (Na) rapid change of
temperature
30 minutes at LCT and
30 minutes at UCT; 5 cycles
no visible damage
R/R max.: ±1%
4.24.2 3 (Ca) damp heat
(steady state)
56 days; 40 ±2 °C; 93 +2/3% RH;
loaded with 0.01 Pn
R/R max.: ±3%
4.25.1 endurance 1000
+48/0 hours; 70 ±2 °C; loaded
with Pn or Vmax;
1.5 hours on and 0.5 hours off
R/R max.: ±3%
4.23.2 27 (Ba) endurance at
upper category
temperature
1000 +48/0 hours; no load no visible damage
R/R max.: ±3%
at 20/LCT/20 °C and 20/UCT/20 °C:
0.01 R < 0.04 ±1500 × 106/K
0.04 R < 0.10 ±1000 × 106/K
0.10 R < 0.30 ±800 × 106/K
0.30 R < 0.51 ±600 × 106/K
4.8.4.2 temperature
coefficient
0.51 R < 1 ±300 × 106/K
Other tests in accordance with IEC 60115 clauses and IEC 6068 test method
4.17 20 (Ta) solderability
(after ageing)
8 hours steam or 16 hours at 155 °C;
unmounted chips completely
immersed for 2 ±0.5 s in a solder
bath at 235 ±2 °C
good tinning
(95% covered);
no damage
4.6.1.1 insulation
resistance
50 V (DC) after 1 minute,
metal block method
Rins min.: 104 M
4.12 noise IEC publication 60195 (measured
with Quantech-equipment)
max. 0.316 µV/V (10 dB)
Other applicable tests
(JIS) C
5202 7.9
endurance (under
damp and load)
1000 +48/0 hours; 40 ±2 °C;
93 +2/3% RH;
loaded with Pn or Vmax;
1.5 hours on and 0.5 hours off
R/R max.: ±3%
EIA
575 3.13
leaching unmounted chips 60
±1 s; 260 ±5 °C good tinning; no leaching
EIA/IS
703 4.5
load humidity 1000
+48/0 hours;
85 ±2 °C; 85 ±5% RH;
loaded with 0.01 Pn or Vmax
R/R max.: ±3%
Phycomp Product specification
Low-ohmic chip resistors
size 0603
LRC21/22
5% 1%
2004 Jan 15 Rev.4 7 www.yageo.com
REVISION HISTORY
Revision Date Change
Notification
Description
Rev.2 2001 Apr 27 - - Converted to Phycomp brand
Rev.3 2003 May 14 - - Updated company logo
Rev.4 2004 Jan 15 - - Resistance range and T.C. expanded