Chip On Board Mixer Quads Alpha Features @ High Volume Automatic Assembly @ For Microwave MIC Assembly and Automated High Volume Manufacturing @ Mechanically Rugged Design m 100% DC Tested @ Three Barrier Heights for Customized Mixer Performance Description Alphas ceramic Chip on Board (COB) mixer quads are designed for high performance RF and microwave receiver applications. These devices utilize Alphas advanced silicon beamless Schottky technology, combined with precision ceramic COB assembly techniques, to achieve a high degree of device reliability in commercial applications. Performance to 10 GHz is available with the Absolute Maximum Ratings Characteristic Value Maximum Current (Imax) 50 mA Power Dissipation (Pp) CW 75 mW/Junction ring quads in the 106 package, which employs via hole Storage Temperature (Ts7) 65C to +175C technology resulting in metalized contacts on the bottom Operating Temperature (Top) 65C to +150C side and eliminating the need for wire bonds to topside ESD Human Body Model Class 1B contacts. Alpha Industries, Inc. [781] 935-5150 Fax [617] 824-4579 Email sales@alphaind.com www.alphaind.com 1 Specifications subject to change without notice. 6/99A Chip On Board Mixer Quads Electrical Specifications at 25C Ve@1mA | (A) V>@1 mA! Cy@ov (A) C7 @ OV? Rr @ 10 mA Part Number Barrier (mV) (mV) (pF) (pF) (Q) Outline Min. | Max. Max. Min. | Max. Max. Max. Drawing Ring Quad (to 6 GHz) DMF3926-101 Low 200 260 15 0.3 0.5 0.07 101 DME3927-101 Medium 300 400 15 0.3 0.5 0.07 101 DMJ3928-101 High 525 625 15 0.3 0.5 0.07 101 Ring Quad (to 10 GHz) DMF3948-106 Low 250 310 15 0.05 0.15 0.07 15 106 DME3949-106 Medium 350 450 15 0.05 0.15 0.07 15 106 DMJ3950-106 High 575 675 15 0.05 0.15 0.07 15 106 Crossover Ring Quad (to 6 GHz) DMF3926-100 Low 200 260 15 0.3 0.5 0.07 100 DME3927-100 Medium 300 400 15 0.3 0.5 0.07 100 DMJ3928-100 High 525 625 15 0.3 0.5 0.07 8 100 Back-to-Back Crossover Quad (to 6 GHz) DMF3945-103 Low 200 260 15 0.3 0.5 0.07 103 DME3946-103 Medium 300 400 15 0.3 0.5 0.07 103 DMJ3947-103 High 525 625 15 0.3 0.5 0.07 103 Vr@1mA (A) Ve @ Cy@0V_ | (AVC; @OV2| R>@10mMA| Vg@10yA Part Number Barrier (mV) 1 mA! (mV) (pF) (pF) (Q) (Vv) Outline Min. | Max. Max. Min. | Max. Max. Max. Min. Drawing Bridge Quad (to 6 GHz) DMF3929-102 Low 200 260 15 0.3 0.5 0.07 102 DME3930-102 Medium 300 400 15 0.3 0.5 0.07 102 DMJ3931 -102 High 525 625 15 0.3 0.5 0.07 102 1. Forward voltage difference between package electrodes. 2. Capacitance difference between package electrodes. SPICE Model Parameters (Per Junction) DMF3926 DME3927 DMJ3928 Parameter Unit DMF3929 DME3930 DMJ3931 DMF3948 DME3949 DMJ3950 DMF3945 DME3946 DMJ3947 IS A 2.5E-07 1.3E-09 9.0E-13 4.4E-08 9.3E-10 3.3E-13 Rs Q 4 4 4 9 9 9 N 1.04 1.04 1.04 1.04 1.04 1.04 TT s 1E-11 1E-11 1E-11 1E-11 1E-11 1E-11 Cro pF 0.42 0.39 0.39 0.14 0.10 0.10 M 0.32 0.37 0.42 0.32 0.37 0.42 Eg eV 0.69 0.69 0.69 0.69 0.69 0.69 XTI 2 2 2 2 2 2 Fo 0.5 0.5 0.5 0.5 0.5 0.5 By Vv 2 3 4 3 4 5 IByv A 1.0E-05 1.0E-05 1.0E-05 1.0E-05 1.0E-05 1.0E-05 Vy Vv 0.495 0.595 0.800 0.495 0.595 0.800 Alpha Industries, Inc. [781] 935-5150 Fax [617] 824-4579 Email sales@alphaind.com www.alphaind.com Specifications subject to change without notice. 6/99A Chip On Board Mixer Quads 100, 101, 102 INK DOT 0.010 (0.25 mm) DIA. MIN. 0.005 (0.13 mm) COLOR PER INTERNAL SPECIFICATION 0.001 (0.02 mm) TYP. |< f 0.026 0.100 (2.54 mm) )Yio.es mm) MIN. +0.002 (0.05 mm) e -0.004 (0.10 mm) ' 0.030 (0.76 mm) ! | AL gLass DAM +0.003 (0.08 mm) _,| 0.120 (3.05 mm) SQ. +0.002 (0.05 mm) EPOXY ENCAPSULATION 0.004 (0.10 mim) \ (BLACK) J 0.020 (0.51 mm) 0.040 X 0.010 (0.25 mm) (1.02 mm) ~ ORIENTATION MARK MAX. $4 0.020 (0.51 mm) GLASS NOT + 0.002 (0.05 mm) SHOWN FOR CLARITY 106 0.085 (2.159 mm) SQ. EPOXY ENCAPSULATION J 0.003 . (0.08 mm) TYP. 45 REF. EPOXY 1 ENCAPSULATION E 0.003 , 0.015 (0.08 mm) 0.017 (0.38 mm) Typ { (0.43 mm) L r f 0.026 0.020 (0.51 mm) MAX. (0-66 mm) GLASS GOLD METALIZATION Bi Pd/Pt /Ag METALIZATION 103 SCHEMATIC ORIENTATION 0-140 (3.56 mm) + 0.003 (0.08 mm) DoT, 2 DOT . _ 1 3 0.020 { | | (0.51 mm) +0.003 r (0.08 mm) 0.130 (3.30 mm) +0.003 (0.08 mm) 4 | Li 0.025 (0.64 mm) +0.003 (0.08 mm) 0.050 t +0.002 (0.05 MAX. Pr A F ( mm) CERAMIC SUBSTRATE Notes: 1. Bottom side is free of metalization. 2. The minimum specified area of the contact pads (0.017 x 0.022) shall be free of epoxy. Alpha Industries, Inc. [781] 935-5150 Fax [617] 824-4579 Email sales@alphaind.com www.alphaind.com Specifications subject to change without notice. 6/99A