1
Precision Edge™
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
DESCRIPTION
Guaranteed AC performance over temperature and
voltage:
>10.7Gbps data throughput
<60ps tr/tf times
<285ps tpd (IN-to-Q)
<20ps skew
Low jitter:
<10pspp total jitter (clock)
<1psrms random jitter (data)
<10pspp deterministic jitter (data)
Crosstalk induced jitter: <0.7psrms
Accepts an input signal as low as 100mV
Unique input termination and VT pin accepts DC-
coupled and AC-coupled differential inputs:
LVPECL, LVDS, and CML
50 source terminated CML outputs
Fully differential inputs/outputs
Power supply 2.5V ±5% and 3.3V ±10%
Industrial –40°C to +85°C temperature range
Available in 16-pin (3mm ××
××
× 3mm) MLF™ package
FEATURES
ULTRA-LOW JITTER 2 ××
××
×2 CROSSPOINT
SWITCH w/CML OUTPUTS AND
INTERNAL I/O TERMINATION Precision Edge™
SY58023U
Rev.: C Amendment: /0
Issue Date: August 2004
The SY58023U is a 2.5V/3.3V precision, high-speed, fully
differential CML 2 ×2 crosspoint switch. The SY58023U is
optimized to provide two identical output copies with less
than 20ps of skew and ultra-low jitter. It can route clock
signals as fast as 6GHz or data up to 10.7Gbps.
The differential input includes Micrel’s unique, 3-pin input
termination architecture that allows the SY58023U to directly
interface to LVPECL, LVDS, and CML differential signals
(AC- or DC-coupled) as small as 100mV (200mVpp) without
any level-shifting or termination resistor networks in the signal
path. The CML outputs features 400mV typical swing into
50 loads, and provide an extremely fast rise/fall time
guaranteed to be less than 60ps.
The SY58023U operates from a +2.5V ±5% supply or
+3.3V ±10% supply and is guaranteed over the full industrial
temperature range (–40°C to +85°C). For applications that
require high speed dual CML switches, consider the
SY58024U. The SY58023U is part of Micrel’s high-speed,
Precision Edge™ product line.
Data sheets and support documentation can be found on
Micrel’s website at www.micrel.com.
Precision Edge is a trademark of Micrel , Inc.
Micro
LeadFrame and MLF are trademarks of Amkor Technology, Inc.
Precision Edge™
IN0
/IN0
Q1
/Q1
Q0
/Q0
V
T0
50
50
IN1
/IN1
V
T1
50
50
SEL0
(TTL/CMOS)
SEL1
(TTL/CMOS)
0
1
0
1
FUNCTIONAL BLOCK DIAGRAM
APPLICATIONS
Gigabit Ethernet data/clock routing
SONET data/clocking routing
Switch fabric clock routing
Redundant switchover
Backplane redundancy
2
Precision Edge™
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
PACKAGE/ORDERING INFORMATION
Pin Number Pin Name Pin Function
1, 2, IN0, /IN0, Differential Signal Input: Each pin of this pair internally terminates with 50 to the VT pin.
3, 4 /IN1, IN1 Note that this input will default to an indeterminate state if left open.
See Input Interface Applications section.
16, 5 VT0, VT1 Input Termination Center-Tap: Each input terminates to this pin. The VT pin provides a
center-tap for each input (IN, /IN) to a termination network for maximum interface
flexibility. See Input Interface Applications section.
15, 6 SEL0, SEL1 Select Input: TTL/CMOS select input control that selects inputs IN0, or IN1. Note that this
input is internally connected to a 25k pull-up resistor and will default to a logic High
state if left open.
7, 14 GND, Ground. Exposed pad must be connected to a ground plane that is the same potential as
(Exposed Pad) the device ground pin.
8, 13 VCC Positive Power Supply: Bypass with 0.1µF0.01µF low ESR capacitors as close to the
pins as possible.
12, 11, 10, 9 Q0, /Q0, /Q1, Q1 CML Differential Output Pairs: Differential buffered output copy of the selected input
signal. The CML output swing is typically 400mV across 100. Unused output pairs may
be left floating with no impact on jitter. See CML Output Termination section.
PIN DESCRIPTION
1
2
3
4
12
11
10
9
16 15 14 13
5678
IN0
/IN0
/IN1
IN1
Q0
/Q0
/Q1
Q1
VCC
GND
SEL0
VT0
VCC
GND
SEL1
VT1
16-Pin MLF™ (MLF-16)
SEL0 SEL1 Q0 Q1
L L IN0 IN0
L H IN0 IN1
H L IN1 IN0
H H IN1 IN1
TRUTH TABLE
Ordering Information(1)
Package Operating Package Lead
Part Number Type Range Marking Finish
SY58023UMI MLF-32 Industrial 023U Sn-Pb
SY58023UMITR(2) MLF-32 Industrial 023U Sn-Pb
SY58023UMY MLF-32 Industrial 023U & Pb Free
Y designator
SY58023UMYTR(2) MLF-32 Industrial 023U & Pb Free
Y designator
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC
electricals only.
2. Tape and Reel.
3
Precision Edge™
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Supply Voltage (VCC) .................................. 0.5V to +4.0V
Input Voltage (VIN) ......................................... 0.5V to VCC
CML Output Voltage (VOUT)......... VCC 1.0V to VCC +0.5V
Current (VT)
Source or Sink Current on VT pin...................±100mA
Input Current (VT)
Source or Sink Current on IN, /IN.....................±50mA
Lead Temperature (soldering, 20 sec.) ..................... 260°C
Storage Temperature (TS) ...........................65°C +150°C
Operating Ratings(2)
Supply Voltage (VCC) ............................ +2.375V to +3.60V
Ambient Temperature (TA)......................... 40°C to +85°C
Package Thermal Resistance(3)
MLF JA)
Still-Air .............................................................60°C/W
500lfpm............................................................54°C/W
MLF JB)
Junction-to-board ............................................38°C/W
TA = 40°C to +85°C.
Symbol Parameter Condition Min Typ Max Units
VCC Power Supply Voltage 2.5V nominal 2.375 2.5 2.625 V
3.3V nominal 3.0 3.3 3.60 V
ICC Power Supply Current VCC = max., current through internal 100 130 mA
50 source termination resistor included.
VIH Input HIGH Voltage IN, /IN; Note 5 VCC 1.6 VCC V
VIL Input LOW Voltage IN, /IN 0 VIH 0.1 V
VIN Input Voltage Swing IN, /IN; see Figure 1a. 0.1 1.7 V
VDIFF_IN Differential Input Swing IN, /IN; see Figure 1b. 0.2 V
RIN IN-to-VT Resistance 40 50 60
IN to VT1.28 V
DC ELECTRICAL CHARACTERISTICS(4)
VCC = +3.3V ±10% or +2.5V ±5%; RL = 100 across each output pair; TA = 40°C to +85°C, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VOH Output HIGH Voltage Q0, /Q0; Q1, /Q1 VCC0.020 VCC V
VOUT Output Voltage Swing Q0, /Q0; Q1, /Q1; see Figure 1a. 325 400 500 mV
VDIFF_OUT Differential Voltage Swing Q0, /Q0; Q1, /Q1; see Figure 1b. 650 800 1000 mV
ROUT Output Source Impedance Q0, /Q0; Q1, /Q1 40 50 60
Notes:
1. Permanent device damage may occur if ratings in the Absolute Maximum Ratings section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Thermal performance assumes exposed pad is soldered (or equivalent) to the device's most negative potential (GND) on the PCB. θJA uses 4-layer
in still-air, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. VIH (min.) not lower than 1.2V.
CML OUTPUT DC ELECTRICAL CHARACTERISTICS(4)
4
Precision Edge™
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
VDIFF_IN,
VDIFF_OUT (Typ. 800mV)
Figure 1b. Differential Voltage Swing
V
IN
,
V
OUT
Typ. 400mV
Figure 1a. Single-Ended Voltage Swing
SINGLE-ENDED AND DIFFERENTIAL SWINGS
VCC = 2.5V ±5% or 3.3V ±10%; RL = 100 across each output pair; TA = 40°C to +85°C, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
fMAX Maximum Operating Frequency VIN 100mV; VOUT 200mV Clock 6 GHz
NRZ Data 10.7 Gbps
tpd Propagation Delay IN-to-Q 135 285 ps
SEL-to-Q 100 400 ps
tSKEW Channel-to-Channel Skew
(Within Bank) Note 7 20 ps
Part-to-Part Skew Note 8 75 ps
tJITTER Clock Cycle-to-Cycle Jitter Note 9 1ps
rms
Total Jitter Note 10 10 pspp
Data Random Jitter Note 11 1ps
rms
Deterministic Jitter Note 12 10 pspp
Crosstalk Induced Jitter
(Adjacent Channel) Note 13 0.7 psrms
tr, tfOutput Rise/Fall Time 20% to 80%, at full swing. 25 60 ps
Notes:
6. Measured with 100mV input swing. High frequency AC-parameters are guaranteed by design and characterization.
7. Skew is measured between outputs of the same bank under identical transitions.
8. Skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective inputs.
9. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, TnTn1 where T is the time between rising edges of the output
signal.
10.Total jitter definition: With an ideal clock input of frequency fMAX, no more than one output edge in 1012 output edges will deviate by more than the
specified peak-to-peak jitter value.
11.Random jitter is measured with a K28.7 comma detect character pattern, measured at 2.5Gbps3.2Gbps.
12.Deterministic jitter is measured at 2.5Gbps3.2Gbps with both K28.5 and 2231 PRBS pattern.
13.Crosstalk induced jitter is defined as the added jitter that results from signals applied to two adjacent channels. It is measured at the output while
applying similar, differential clock frequencies that are asynchronous with respect to each other at inputs.
AC ELECTRICAL CHARACTERISTICS(6)
5
Precision Edge™
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
TIMING DIAGRAM
/IN
IN
/Q
Q
t
pd
t
pd
V
OUT
= 400mV (typ.)
(50 load)
V
OUT
= 400mV (typ.)
(50 load)
Figure 2a. AC Timing Diagram IN-to-Q
SEL
/Q
Q
t
pd
t
pd
V
CC
/2 V
CC
/2
IN0, /IN1 = LOW, /IN0, IN1 = HIGH
V
OUT
= 400mV (typ.)
(50 load)
Figure 2b. AC Timing Diagram SEL-to-Q
6
Precision Edge™
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
TYPICAL OPERATING CHARACTERISTICS
VCC = 2.5V, VIN = 100mV, TA = 25°C, unless otherwise noted.
195
196
197
198
199
200
201
202
203
204
205
-60 -40 -20 0 20 40 60 80 100
PROPAGATION DELAY (ps)
TEMPERATURE (°C)
Propagation Delay vs.
Temperature
175
180
185
190
195
200
205
210
215
0 200 400 600 800 1000 1200
PROPAGATION DELAY (ps)
INPUT VOLTAGE SWING (mV)
Propagation Delay vs.
Input Voltage Swing
0
0.5
1
1.5
2
2.5
3
3.5
-60 -40 -20 0 20 40 60 80 100
AMPLITUDE (mV)
TEMPERATURE (°C)
Within Device Skew vs.
Temperature
0
50
100
150
200
250
300
350
400
450
500
0 2000 4000 6000 8000 10000
AMPLITUDE (mV)
FREQUENCY (MHz)
Frequency vs.
Amplitude
7
Precision Edge
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
FUNCTIONAL CHARACTERISTICS
VCC = 2.5V, VIN = 100mV, TA = 25°C, unless otherwise noted.
5Gbps Output
TIME (50ps/div.)
Amplitude
(100mV/div.)
2231 PRBS
2.5GHz Output
TIME (50ps/div.)
Amplitude
(100mV/div.)
1.25GHz Output
TIME (100ps/div.)
Amplitude
(100mV/div.)
200MHz Output
TIME (600ps/div.)
Amplitude
(100mV/div.)
8
Precision Edge
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
INPUT INTERFACE APPLICATIONS
LVPECL
IN
/IN
VT
SY58023U
VCC VCC
0.01µF
For VCC = 2.5V, Rpd = 19Ω.
For VCC = 3.3V, Rpd = 50Ω.
Rpd
Figure 4c. DC-Coupled LVPECL
Input Interface
CML IN
/IN
V
T
SY58023U
V
CC
V
CC
NC
Option: may connect VT to VCC.
Figure 4a. DC-Coupled CML
Input Interface
LVPECL
IN
/IN
SY58023U
V
CC
V
CC
0.01µF
R
pd
R
pd
V
T
For V
CC
= 2.5V, R
pd
= 50Ω, R1 = 1kΩ, R2 = 1.1k Ω.
For V
CC
= 3.3V, R
pd
= 100Ω, R1 = 649Ω, R2 = 1k Ω.
R1
R2
Figure 4d. AC-Coupled LVPECL
Input Interface
LVDS IN
/IN
SY58023U
V
CC
V
CC
NC V
T
Figure 4e. LVDS
Input Interface
CML IN
/IN
V
T
0.01µF
SY58023U
V
CC
V
CC
R1
R2
For 2.5V, R1 = 1kΩ, R2 = 1.1kΩ.
For 3.3V, R1 = 649Ω, R2 = 1kΩ.
Figure 4b. AC-Coupled CML
Input Interface
50
50
VCC
GND
/IN
VT
IN
Figure 3. Simplified Differential Input Buffer
INPUT STAGE
9
Precision Edge
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
Part Number Function Data Sheet Link
SY58023U Ultra-low Jitter 2×2 Crosspoint Switch http://www.micrel.com/product-info/products/sy58023u.shtml
w/CML Outputs and Internal I/O Termination
SY58024U Ultra-low Jitter Dual 2×2 Crosspoint Switch http://www.micrel.com/product-info/products/sy58024u.shtml
w/CML Outputs and Internal I/O Termination
16-MLF Manufactering Guidelines
www.amkor.com/products/notes_papers/MLF_AppNote.pdf
Exposed Pad Application Note
HBW Solutions http://www.micrel.com/product-info/as/solutions.shtml
RELATED PRODUCT AND SUPPORT DOCUMENTATION
CML OUTPUT TERMINATION
5050
/Q
Q
V
CC
16mA
GND
100
Figure 5. CML DC-Coupled Termination
5050
/Q
Q
VCC
16mA
GND
50
50
DC-bias
per application
Figure 6. CML AC-Coupled Termination
Figures 5 and Figure 6 illustrates how to terminate a
CML output using both the AC-coupled and DC-coupled configuration. All outputs of the SY58023U are 50 with a
16mA current source.
10
Precision Edge
SY58023U
Micrel
M9999-082604
hbwhelp@micrel.com or (408) 955-1690
16 LEAD
Micro
LeadFrame (MLF-16)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
V
EE
V
EE
Heat Dissipation
PCB Thermal Consideration for 16-Pin MLF Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 qualification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
3.00BSC
2.75BSC
0.50 DIA 3.00BSC
12° max
SEATING
PLANE
2.75BSC
16
11
2
3
4
N
2
3
4
0.85
+0.15
0.65
0.65
+0.15
0.65
0.01
+0.04
0.01
0.23
+0.07
0.05
0.01
+0.04
0.01
0.42
+0.18
0.18
0.42
+0.18
0.18
0.23
+0.07
0.05
1.60
+0.10
0.10
PIN 1 ID
0.5 BSC
1.5 REF
0.42
+0.18
0.18
1.60
+0.10
0.10
0.40
+0.05
0.05
0.20 REF.
0.5BSC SECTION "C-C"
SCALE: NONE
T OP VIEW BO TTOM VIEW
1. DIMENSIONS ARE IN mm.
2. DIE THICKNESS ALLOWABLE IS 0.305mm MAX.
3. PACKAGE WARPAGE MAX 0.05mm.
4. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.20mm AND 0.25mm FROM TIP.
5. APPLIES ONLY FOR TERMINALS
CC
C
L4
Rev. 02
MICREL, INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchasers
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchasers own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2004 Micrel, Incorporated.