Preliminary Specification Number: SP-HNZY-L Bluetooth Low Energy Module Data Sheet Dialog Semiconductor Chipset for Bluetooth 4.2 Tentative P/N : LBCA2HNZYZ-TEMP Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 1/22 Revision History Revision Code Date Oct.24.2013 A Feb.13.2014 B Mar.20.2014 Description First issue 4. Dimensions and Terminal Configurations Added Dimensions of m6 and m7 5. Revised Absolute Maximum Ratings 6. Revised Operating Condition 10. Revised RF Characteristics 12. Recommended Land Pattern Corrected to Top view 11. packing Information Added the figure of Tape and Reel 1. Revised Scope Added the weight C Apr.23.2014 D Apr.29.2014 E Jun.04.2014 F Jul.02.2014 G Nov.6.2014 5.Revised Absolute Maximum Ratings 8.Revised Sleep Clock for 32kHz Crystal 10.Revised RF Characteristics 13.Revised Application Circuit 11.Revised Packing Information 5.Revised Absolute Maximum Ratings 6. Operating Conditions 10.Revised RF Characteristics 4.Revised Dimensions and Terminal Configurations 10.Revised RF Characteristics 13.Revised Application Circuit 1.Scope 2.Part Number 3.RoHS Compliance 5.Dimensions and Terminal Configurations 6. Absolute Maximum Ratings 7.Operating Conditions 9.Sleep Clock: Recommended Operating Conditions 14.Application Circuit 15,Other Attentions H I J K Feb.12.2014 Feb.23.2015 Feb.27.2015 Aug.10.2018 L Oct.24.2018 16.Wireless / BT Certification Numbers 14. Application Circuit 16. Wireless / BT Certification Numbers 14. Application Circuit 16. Wireless / BT Certification Numbers Front Page BT Spec Version 16. Wireless / BT Certification Numbers Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 2/22 TABLE OF CONTENTS TABLE OF CONTENTS ............................................................................................................................. 2 1. Scope ................................................................................................................................................. 3 2. Part Number....................................................................................................................................... 3 3. RoHS Compliance ............................................................................................................................. 3 4. Block Diagram ................................................................................................................................... 3 5. Dimensions and Terminal Configurations ..................................................................................... 4 6. Absolute Maximum Ratings............................................................................................................. 7 7. Recommend Operating Condition .................................................................................................. 7 8. DC Characteristics ............................................................................................................................ 8 9. Sleep Clock: Recommended Operating Conditions ..................................................................... 8 10. Power Sequence ............................................................................................................................... 9 11. RF Characteristics .......................................................................................................................... 10 12. Packing Information ....................................................................................................................... 11 13. Recommended Land Pattern ......................................................................................................... 14 14. Application Circuit .......................................................................................................................... 15 15. Other Attentions .............................................................................................................................. 18 16. Wireless / BT Certification Numbers ............................................................................................ 18 17. NOTICE............................................................................................................................................. 19 18. PRECONDITION TO USE OUR PRODUCTS ................................................................................. 22 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Murata products and disclaimers thereto appears at the end of this specification sheet. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 3/22 1. Scope This specification is applied to the Bluetooth low energy module. - Interface - IC - Reference Clock - Weight - MSL : GPIO(supporting UART / SPI / I2C) : DA14580-01 (Dialog Semiconductor) : Internal Crystal. : 0.107g :3 2. Part Number Sample Design Kit Daughter Board LBCA2HNZYZ-TEMP LBCA2HNZYZ-TEMP-DK LBCA2HNZYZ-TEMP-D-MU 3. RoHS Compliance This component can meet with RoHS compliance. 4. Block Diagram External X'tal / TCXO (32.768kHz) X'tal (16MHz) Antenna BLE IC LC Network for DCDC UART /SPI/I2C GPIO/ADC Quadrature Decoder Power Source Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 4/22 5. Dimensions and Terminal Configurations <Top View> <Side View> <Bottom View> Pin 1 Marking (unit: mm) Dimension Mark Dimensions Mark Dimensions Mark Dimensions Mark Dimensions L 7.40.25 W 7.00.25 T 1.0 Max a1 0.30.1 a2 0.30.1 b1 0.30.2 b2 0.4250.2 b3 0.4250.2 c1 0.60.1 c2 0.60.1 e1 0.350.1 e2 0.350.1 e3 0.350.1 e4 0.50.1 e5 0.50.1 e6 0.40.1 e7 0.50.1 e8 0.50.1 m1 0.30.1 m2 0.60.1 m3 0.30.1 m4 0.30.1 m5 0.60.1 m6 3.30.2 m7 0.30.2 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 5/22 Terminal Configurations <Bottom View> 36 13 37 14 15 16 17 18 19 20 12 22 11 31 32 33 34 10 30 29 28 27 35 25 7 6 1 Terminal Name P0_5 Connection to IC Terminal P0_5 2 P0_7 P0_7 3 4 P0_6 SWCLK P0_6 SWCLK 5 SWDIO SWDIO 6 7 8 9 10 GND VBAT GND XTAL32KP XTAL32KM GND VBAT GND XTAL32KP XTAL32KM 11 P0_3 P0_3 12 P0_2 P0_2 13 14 15 16 17 18 ANTout ANTin GND GND GND GND GND GND GND GND No. 23 24 9 8 21 5 4 3 2 1 26 Description INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT JTAG clock signal INPUT/OUTPUT. JTAG Data input/output. Bidirectional data and control communication Ground INPUT Battery connection. Ground INPUT. Crystal input for the 32.768 kHz XTAL OUTPUT. Crystal output for the 32.768 kHz XTAL INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. RF input/output. Refer to reference schematic Ground Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 6/22 19 Terminal Name NC Connection to IC Terminal - 20 GND GND 21 GND GND 22 P0_1 P0_1 23 P0_0 P0_0 24 P0_4 P0_4 25 RST RST 26 GND GND 27 GND GND 28 GND GND 29 GND GND No. 30 P1_1 P1_1 31 VPP VPP 32 GND GND 33 GND GND 34 GND GND Description No connection Ground INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT. Reset signal (Active High, Internally Pulled Down). It can be open or connected to GND if not used. Ground INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. INPUT. This pin is used while OTP programming. Should be left open when not programming. Ground 35 P1_0 36 NC INPUT/OUTPUT with selectable pull up/down resistor. Pull-down enabled during and after reset. General purpose I/O port bit or alternate function nodes. Contain state retention mechanism during power down. No Connection 37 NC No Connection P1_0 Marking Information Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 7/22 6. Absolute Maximum Ratings Item Storage Temperature VBAT supply voltage Min -40 -0.1 Max 85 3.6 Unit degC V VPP supply voltage -0.1 6.8 V Remarks Supply only during OTP programming Input voltage for -0.2 Min(1.2,VBAT+0.2) V XTAL32KM Input voltage for -0.2 Min(1.5,VBAT+0.2) V XTAL32KP Input voltage for -0.1 Min(3.6,VBAT+0.2) V all other pins Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is not implied under these conditions. Exposure to absolute ratings for extended periods of time may adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all other parameters are set within operating condition. 7. Recommend Operating Condition Item Operating Temperature*1 VBAT supply voltage VBAT supply voltage for cold boot Min -40 2.35 VPP supply voltage 6.6 Typ 2.5 6.7 Max 85 3.3 Unit degC V 3.3 V 6.8 V Remarks Supply only during OTP programming. Input voltage for 0 Min(3.3,VBAT+0.2) V all other pins RF Load Impedance 50 Output current for 4.8 mA Each I/O pin *1: Please keep derating / margin as much as possible at extreme temperature. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 8/22 8. DC Characteristics Parameters VIH VIL VOH VOL IIH(PD) IIL(PU) Description HIGH level input voltage LOW level input voltage HIGH level output voltage LOW level output voltage HIGH level input current with internal pull down enabled LOW level input current with internal pull up enabled Conditions Active mode Active mode Active mode Active mode Vin = VBAT = 2.5V Vin = GND = 0V Min 0.84 Typ Max 0.47 Unit V V V V 50 150 uA -150 -50 uA Max Unit kHz kohm pF pF ppm uW 0.36 1.88 9. Sleep Clock: Recommended Operating Conditions For 32kHz Crystal Parameters fXTAL ESR CL C0 dfXTAL DLmax Description Crystal frequency Equivalent Series Resistance Load Capacitance Shunt Capacitance Crystal frequency tolerance Maximum drive level Conditions Min Typ 32.768 6 7 1 -250 0.1 100 9 2 250 For 32kHz Crystal Oscillator Parameters fXO AXO dfXO Description Oscillator frequency Amplitude Frequency tolerance Conditions Min Typ 32.768 100 -250 Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Max 1500 250 Unit kHz mVpp ppm Preliminary Specification Number: SP-HNZY-L 9/22 10. Power Sequence Power Up / Down Sequence Power Up Power Down Td H VBAT V1 L Ta Tb H GPIO L Reset and Power Cycle Sequence Symbol Description Typ Unit Ta > 500 us Ta Time between VCC valid and GPIO enabled Tb Time between GPIO invalid and VCC invalid Tb > 0 us Tc Length of RST pulse Tc > 10 us Td Required VBAT ramp-up time Td < 50 ms V1 Threshold voltage of VBAT rise up V1 > 2.35 V Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 10/22 11. RF Characteristics Normal Condition: VBAT=3.0V, +25deg.C, (otherwise notified) Item / Conditions Center frequency Channel Spacing Number of RF Channels Output power (Measured at ANT pin) Modulation characteristics 1) f1avg 2) f2max (at 99.9%) 3) f2avg / f1avg Carrier frequency offset and drift 1) Frequency offset: | fn - fTX | 2) Frequency drift: | f0 - fn | 3) Drift rate #0: | f1 - f0 | 4) Drift rate #n: | fn - fn-5 | Receiver sensitivity (Ideal transmitter PER <= 30.8%) Maximum input signal level (PER <= 30.8%) PER Report Integrity (-30dBm input) TX Current consumption RX Current consumption MIN 2402 - Spec. TYP 2 40 -1 MAX 2480 - MHz MHz dBm 225 185 0.8 - 275 - kHz kHz - -10 50 - -93 4.8 5.1 150 50 20 20 -70 65.4 - kHz kHz kHz kHz dBm dBm % mA mA Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Unit Preliminary Specification Number: SP-HNZY-L 11/22 12. Packing Information Dimensions of Tape (Plastic tape) 2.00.1 4.00.1 7.50.1 1.5 0.300.05 +0.1 0 1.50.1 7.80.1 16.00.2 1.750.1 1. 12.00.1 7.50.1 1.4 max. Dimensions of Reel 17.41.0 13.00.2 330) 2.00.5 100) 2. 22.4 max (in mm) Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 12/22 3. Taping Diagrams [1] Feeding Hole : As specified in (1) [2] Hole for chip : As specified in (1) [3] Cover tape : 62m in thickness [4] Base tape : As specified in (1) [3] [1] [2] [3] [4] Feeding Hole Feeding Direction Pin 1 Marking Chip 4. Leader and Tail tape Feeding direction Tail tape (No components) 40 to 200mm Components No components Leader tape (Cover tape alone) 150mm min. 250mm min. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. 5. Preliminary Specification Number: SP-HNZY-L 13/22 The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled toward the user. 6. The cover tape and base tape are not adhered at no components area for 250 mm min. 7. Tear off strength against pulling of cover tape : 5 N min. 8. Packaging unit : 1000 pcs./ reel 9. material : Base tape : Plastic Reel : Plastic Cover tape , cavity tape and reel are made the anti-static processing. 10. Peeling of force : 1.1 N max. in the direction of peeling as shown below. 1.3 1.1 N max. 165 to 180 Cover tape Base tape 11. PACKAGE (Humidity proof Packing) Label Desiccant Humidity Indicator Label Anti-humidity Plastic Bag Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and the humidity indicator. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 14/22 13. Recommended Land Pattern <Top View> (Unit : mm) Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 15/22 14. Application Circuit X1 XTAL P0_1 P0_0 26 19 20 18 Use External OSC GND NC GND GND VPP GND 21 VPP 22 RST 23 VPP_CONTROL P0_1 VPP XTAL32KP XTAL32KM P0_0 RST Use External XTAL 24 P0_7 32kHz_CLK Option UART_RX 25 *2) *4) UART_TX RST P0_5 P0_4 P0_4 RST Test Pads for OTP writing via UART P0_4 (1) Configuration using internal OTP XTAL32KP GND GND GND GND 17 32K_CLK XTAL32KM NC GND XTAL32KP P1_0 GND 15 *1) 0 ohm 14 No load 13 12 P0_2 11 No load XTAL32KM P0_3 10 XTAL32KM 9 XTAL32KP 8 VBAT NC GND NC 1 37 GND 16 VBAT 7 36 P0_3 6 35 P0_2 GND SWDIO 34 P1_0 typeZY VPP 5 33 ANTout SWCLK 32 P1_1 P0_6 31 ANTin 4 30 GND GND 3 P1_1 GND P0_7 29 P0_5 28 VPP 2 27 C1 2.2uF VPP Test Pads for OTP Writing and Software Debugging via J-Link P0_6 P0_7 P0_5 VBAT VPP SWDIO *3) SWCLK RST RST GND *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) Connection is necessary for writing program to the OTP via UART. Other GPIO pin can be used for VPP_CONTROL instead of P0_7. Please see the document "Hardware setup Guide for OTP Programming". Other pairs of GPIO can be used for UART instead of P0_4 and P0_5. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. OTP writing can also be done using J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. *4) 10 GPIOs (P0_0 to P0_7, P1_0 and P1_1) are available for multipurpose use. P0_0 to P0_3 can be used for analog input. Note: XTAL32K_DISABLE_AMPREG register should be `1' for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer's responsibility. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 16/22 *2) P0_1 RST P0_4 (2) Configuration using external Flash ROM 32kHz_CLK Option Use External XTAL XTAL32KP X1 XTAL 28 29 P1_1 30 31 32 19 20 18 GND NC GND GND ANTin P1_1 ANTout typeZY VPP P0_2 GND P0_3 GND XTAL32KM GND XTAL32KP P1_0 GND 32K_CLK XTAL32KM 17 NC 16 15 14 *1) 0 ohm No load 13 12 P0_2 11 P0_7 10 9 XTAL32KM XTAL32KP 8 GND VBAT VBAT 7 6 SWDIO 5 4 NC SWCLK NC 1 DI 21 GND P0_6 37 #HOLD GND GND GND P0_7 VCC CLK 22 23 GND 3 35 36 SPI FLASH #WP P0_1 24 GND 2 33 P1_0 DO GND VBAT 34 #CS XTAL32KP GND P0_5 SPI Flash ROM for Software Storing Use External OSC No load 27 P0_0 RST 26 P0_4 25 XTAL32KM C1 2.2uF Test Pads for Software Debugging via J-Link VBAT SWDIO SWCLK RST *3) RST GND *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) 6 GPIOs (P0_1, P0_2, P0_4, P0_7, P1_0 and P1_1) are available for multipurpose use. P0_1 and P0_2 can be used for analog input. Please do NOT toggle those pins by external devices during starting up. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. Note: XTAL32K_DISABLE_AMPREG register should be `1' for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer's responsibility. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 17/22 (3) Configuration using external I2C EEPROM *2) *1) *3) *1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible. *2) 8 GPIOs (P0_0, P0_1, P0_4 to P0_7, P1_0 and P1_1) are available for multipurpose use. P0_0 and P0_1 can be used for analog input. Please do NOT toggle those pins by external devices during starting up. Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins". *3) Connection is necessary for software debugging in your product via J-Link. Please see the document "Hardware Setup for Software Debugging". RST input logic should be inverted externally if J-Link reset is enabled. Note: XTAL32K_DISABLE_AMPREG register should be `1' for using external OSC. See DA14580 datasheet for more details. Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC under some limitations noted below: - Environment temperature change is flat, connection interval < 2sec. - Confirmation in actual condition should be done enough by the customer's responsibility. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 18/22 15. Other Attentions This product is not confirmed connectivity to all Bluetooth(R) Smart Ready devices, so the connectivity to all devices in actual use is not guaranteed. Also the Bluetooth(R) Low Energy wireless technology sometimes fails connections depending on surrounding environment (radio interference, noise, disturbance etc.), so it is highly recommended to implement connection-retry scheme in the customer's application software. When starting design the device, please refer to following application notes provided by Murata. - Hardware Setup Guide for OTP Programming - Hardware Setup Guide for Software Debugging - Overview of OTP Header Structure - Overview of DA1458X Initial Boot Sequence and Available Interface Pins. - TypeZY/ZS What should you do for Wireless Certification? - TypeZY/ZS Antenna Performance Layout Guide 16. Wireless / BT Certification Numbers This product is certified by following regulation bodies. - Japanese Radio Law Type certification R001-P00500 - FCC (United States) FCC Part 15 subpart C Limited Modular Approval FCC ID: VPYLBZY - IC (Canada) RSS-210 Limited Modular Approval IC: 772C-LBZY - CE (Europe) EN 300328 V.2.1.1 Conducted Test Report available Note: CE marking and declaration should be done by customer as a final product. - Bluetooth(R) SIG Qualifications For Bluetooth Specification 4.1 QDID: 56016 (Controller Subsystem by Murata) QDID: 52696 (Host Subsystem by Dialog) QDID: 56907 (Profile Subsystem by Dialog) For Bluetooth Specification 4.2 QDID: 83573 (Controller Subsystem by Dialog) QDID: 83565 (Host Subsystem by Dialog) QDID: Ask Dialog or S/W 3rd Party (Profile Subsystem by Dialog) Note: Profile subsystem QDID is needed only if SIG standard profile is used. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 19/22 17. NOTICE 1.Storage Conditions: Please use this product within 6month after receipt. - The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperature over 40deg.C.) - The product left more than 6months after reception, it needs to be confirmed the solderbility before used. - The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.). - Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp object and dropping the product, shall not be applied in order not to damage the packing materials. This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020) - After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be used within 168hours. - When the color of the indicator in the packing changed, the product shall be baked before soldering. Baking condition: 125+5/-0deg.C, 24hours, 1time The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and Cover Tape) are not heat-resistant. 2.Handling Conditions: Be careful in handling or transporting products because excessive stress or mechanical shock may break products. Handle with care if products may have cracks or damages on their terminals, the characteristics of products may change. Do not touch products with bear hands that may result in poor solder ability and destroy by static electrical charge. 3.Standard PCB Design (Land Pattern and Dimensions): All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern should be provided between IN and OUT terminals. Please refer to the specifications for the standard land dimensions. The recommended land pattern and dimensions is as Murata's standard. The characteristics of products may vary depending on the pattern drawing method, grounding method, land dimensions, land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand. 4.Notice for Chip Placer: When placing products on the PCB, products may be stressed and broken by uneven forces from a worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to follow the specifications for the maintenance of the chip placer being used. For the positioning of products on the PCB, be aware that mechanical chucking may damage products. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 20/22 5.Soldering Conditions: The recommendation conditions of soldering are as in the following figure. When products are immersed in solvent after mounting, pay special attention to maintain the temperature difference within 100 C. Soldering must be carried out by the above mentioned conditions to prevent products from damage. Set up the highest temperature of reflow within 260 C. Contact Murata before use if concerning other soldering conditions. Reflow soldering standard conditions Reflow soldering standard conditions(Example) Within 3s 240to 250 deg.C 220 deg.C Cooling down Slowly 180 deg.C 150 deg.C Pre-heating Within 120s Within 60s time(s) Please use the reflow within 2 times. Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less. 6.Cleaning: Since this Product is Moisture Sensitive, any cleaning is not permitted. 7.Operational Environment Conditions: Products are designed to work for electronic products under normal environmental conditions (ambient temperature, humidity and pressure). Therefore, products have no problems to be used under the similar conditions to the above-mentioned. However, if products are used under the following circumstances, it may damage products and leakage of electricity and abnormal temperature may occur. - In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.). - In an atmosphere containing combustible and volatile gases. - Dusty place. - Direct sunlight place. - Water splashing place. - Humid place where water condenses. - Freezing place. If there are possibilities for products to be used under the preceding clause, consult with Murata before actual use. As it might be a cause of degradation or destruction to apply static electricity to products, do not apply static electricity or excessive voltage while assembling and measuring. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 21/22 8.Input Power Capacity: Products shall be used in the input power capacity as specified in this specifications. Inform Murata beforehand, in case that the components are used beyond such input power capacity range. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd. Preliminary Specification Number: SP-HNZY-L 22/22 18. PRECONDITION TO USE OUR PRODUCTS PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS. Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the specifications of our product when our product is mounted to your product. All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that our product is used for the purpose, under the condition and in the environment specified in this specification. You are requested not to use our product deviating from the condition and the environment specified in this specification. Please note that the only warranty that we provide regarding the products is its conformance to the specifications provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this specification. WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS. The product shall not be used in any application listed below which requires especially high reliability for the prevention of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that, if you use our products in such applications, we will not be responsible for any failure to meet such requirements. Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS, DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS. - Aircraft equipment. - Aerospace equipment - Undersea equipment. - Power plant control equipment - Medical equipment. - Transportation equipment (vehicles, trains, ships, elevator, etc.). - Traffic signal equipment. - Disaster prevention / crime prevention equipment. -Burning / explosion control equipment - Application of similar complexity and/ or reliability requirements to the applications listed in the above. We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by the regulations and laws in the world. We do not warrant or represent that any license, either express or implied, is granted under any our patent right, copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in which our products or services are used. Information provided by us regarding third-party products or services does not constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from us under our patents or other intellectual property. Please do not use our products, our technical information and other data provided by us for the purpose of developing of mass-destruction weapons and the purpose of military use. Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations", etc. Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials and/or components from our suppliers. By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your company and that you understand and accept the validity of the contents herein. When you are not able to return the signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer acknowledges that engineering samples may deviate from specifications and may contain defects due to their development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability for damages caused by - the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the product to be sold by you, -deviation or lapse in function of engineering sample, -improper use of engineering samples. We disclaim any liability for consequential and incidental damages. If you can't agree the above contents, you should inquire our sales. Preliminary < Specification may be changed by Murata without notice > Murata Manufacturing Co., Ltd.