LBCA2HNZYZ-711-BLK - Murata Electronics

Preliminary Specification Number: SP-HNZY-L

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

Bluetooth Low Energy Module Data Sheet

Dialog Semiconductor Chipset

for Bluetooth 4.2

Tentative P/N : LBCA2HNZYZ-TEMP

Preliminary Specification Number: SP-HNZY-L

1/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

Revision History

Revision

Code Date Description

Oct.24.2013

First issue

A Feb.13.2014

4. Dimensions and Terminal Configurations

Added Dimensions of m6 and m7

5. Revised Absolute Maximum Ratings

6. Revised Operating Condition

10. Revised RF Characteristics

12. Recommended Land Pattern

Corrected to Top view

B Mar.20.2014

11. packing Information

Added the figure of Tape and Reel

C Apr.23.2014

1. Revised Scope

Added the weight

5.Revised Absolute Maximum Ratings

8.Revised Sleep Clock for 32kHz Crystal

10.Revised RF Characteristics

13.Revised Application Circuit

D Apr.29.2014

11.Revised Packing Information

E Jun.04.2014

5.Revised Absolute Maximum Ratings

6. Operating Conditions

10.Revised RF Characteristics

F Jul.02.2014

4.Revised Dimensions and Terminal Configurations

10.Revised RF Characteristics

13.Revised Application Circuit

G Nov.6.2014

1.Scope

2.Part Number

3.RoHS Compliance

5.Dimensions and Terminal Configurations

6. Absolute Maximum Ratings

7.Operating Conditions

9.Sleep Clock: Recommended Operating Conditions

14.Application Circuit

15,Other Attentions

16.Wireless / BT Certification Numbers

H Feb.12.2014

14. Application Circuit

I Feb.23.2015

16. Wireless / BT Certification Numbers

J Feb.27.2015

14. Application Circuit

K Aug.10.2018

16. Wireless / BT Certification Numbers

L Oct.24.2018

Front Page BT Spec Version

16. Wireless / BT Certification Numbers

Preliminary Specification Number: SP-HNZY-L

2/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

TABLE OF CONTENTS

TABLE OF CONTENTS ............................................................................................................................. 2

1. Scope ................................................................................................................................................. 3

2. Part Number ....................................................................................................................................... 3

3. RoHS Compliance ............................................................................................................................. 3

4. Block Diagram ................................................................................................................................... 3

5. Dimensions and Terminal Configurations ..................................................................................... 4

6. Absolute Maximum Ratings ............................................................................................................. 7

7. Recommend Operating Condition .................................................................................................. 7

8. DC Characteristics ............................................................................................................................ 8

9. Sleep Clock: Recommended Operating Conditions ..................................................................... 8

10. Power Sequence ............................................................................................................................... 9

11. RF Characteristics .......................................................................................................................... 10

12. Packing Information ....................................................................................................................... 11

13. Recommended Land Pattern ......................................................................................................... 14

14. Application Circuit .......................................................................................................................... 15

15. Other Attentions .............................................................................................................................. 18

16. Wireless / BT Certification Numbers ............................................................................................ 18

17. NOTICE ............................................................................................................................................. 19

18. PRECONDITION TO USE OUR PRODUCTS ................................................................................. 22

Please be aware that an important notice concerning availability, standard warranty, and use in critical

applications of Murata products and disclaimers thereto appears at the end of this specification sheet.

Preliminary Specification Number: SP-HNZY-L

3/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

1. Scope

This specification is applied to the Bluetooth low energy module.

- Interface : GPIO(supporting UART / SPI / I2C)

- IC : DA14580-01 (Dialog Semiconductor)

- Reference Clock : Internal Crystal.

- Weight : 0.107g

- MSL : 3

2. Part Number

3. RoHS Compliance

This component can meet with RoHS compliance.

4. Block Diagram

Sample LBCA2HNZYZ-TEMP

Design Kit LBCA2HNZYZ-TEMP-DK

Daughter Board LBCA2HNZYZ-TEMP-D-MU

Power

Source

Antenna

X’tal (16MHz)

External X’tal / TCXO

(32.768kHz)

LC Network

for DCDC

UART /SPI/I2C

GPIO/ADC

Quadrature

Decoder

BLE IC

Preliminary Specification Number: SP-HNZY-L

4/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

5. Dimensions and Terminal Configurations

(unit: mm)

Dimension

Mark

Dimensions Mark

Dimensions

L 7.4±0.25 W 7.0±0.25 T 1.0 Max

a1 0.3±0.1 a2 0.3±0.1

b1 0.3±0.2 b2 0.425±0.2 b3 0.425±0.2

c1 0.6±0.1 c2 0.6±0.1

e1 0.35±0.1 e2 0.35±0.1 e3 0.35±0.1 e4 0.5±0.1

e5 0.5±0.1 e6 0.4±0.1 e7 0.5±0.1 e8 0.5±0.1

m1 0.3±0.1 m2 0.6±0.1 m3 0.3±0.1 m4 0.3±0.1

m5 0.6±0.1 m6 3.3±0.2 m7 0.3±0.2

Pin 1 Marking

Preliminary Specification Number: SP-HNZY-L

5/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

Terminal Configurations

1

2

3

4

5

6

7

26

25

24

23

22

21

20

31

30 29

32 33

28

34

27

1918

35

17161514

36

13

12

11

10

9

8

37

No. Terminal

Name

Connection to

IC Terminal Description

1 P0_5 P0_5 INPUT/OUTPUT with selectable pull up/down resistor.

Pull-down enabled during and after reset. General

purpose I/O port bit or alternate function nodes. Contain

state retention mechanism during power down.

2 P0_7 P0_7

3 P0_6 P0_6

4 SWCLK SWCLK INPUT JTAG clock signal

5 SWDIO SWDIO INPUT/OUTPUT. JTAG Data input/output. Bidirectional

data and control communication

6 GND GND Ground

7 VBAT VBAT INPUT Battery connection.

8 GND GND Ground

9 XTAL32KP XTAL32KP INPUT. Crystal input for the 32.768 kHz XTAL

10 XTAL32KM XTAL32KM OUTPUT. Crystal output for the 32.768 kHz XTAL

11 P0_3 P0_3 INPUT/OUTPUT with selectable pull up/down resistor.

Pull-down enabled during and after reset. General

purpose I/O port bit or alternate function nodes. Contain

state retention mechanism during power down.

12 P0_2 P0_2

13 ANTout - RF input/output. Refer to reference schematic

14 ANTin -

15 GND GND

Ground

16 GND GND

17 GND GND

18 GND GND

Preliminary Specification Number: SP-HNZY-L

6/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

No. Terminal

Name

Connection to

IC Terminal Description

19 NC - No connection

20 GND GND Ground

21 GND GND

22 P0_1 P0_1 INPUT/OUTPUT with selectable pull up/down resistor.

Pull-down enabled during and after reset. General

purpose I/O port bit or alternate function nodes. Contain

state retention mechanism during power down.

23 P0_0 P0_0

24 P0_4 P0_4

25 RST RST INPUT. Reset signal (Active High, Internally Pulled

Down). It can be open or connected to GND if not used.

26 GND GND

Ground

27 GND GND

28 GND GND

29 GND GND

30 P1_1 P1_1

INPUT/OUTPUT with selectable pull up/down resistor.

Pull-down enabled during and after reset. General

purpose I/O port bit or alternate function nodes. Contain

state retention mechanism during power down.

31 VPP VPP INPUT. This pin is used while OTP programming.

Should be left open when not programming.

32 GND GND

Ground 33 GND GND

34 GND GND

35 P1_0 P1_0

INPUT/OUTPUT with selectable pull up/down resistor.

Pull-down enabled during and after reset. General

purpose I/O port bit or alternate function nodes. Contain

state retention mechanism during power down.

36 NC No Connection

37 NC No Connection

Marking Information

Preliminary Specification Number: SP-HNZY-L

7/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

6. Absolute Maximum Ratings

Stresses in excess of the absolute ratings may cause permanent damage. Functional operation is

not implied under these conditions. Exposure to absolute ratings for extended periods of time may

adversely affect reliability. No damage assuming only one parameter is set at limit at a time with all

other parameters are set within operating condition.

7. Recommend Operating Condition

Item Min Typ Max Unit Remarks

Operating Temperature

*1

-40 85 degC

VBAT supply voltage 2.35 3.3 V

VBAT supply voltage

for cold boot 2.5 3.3 V

VPP supply voltage 6.6 6.7 6.8 V Supply only during

OTP programming.

Input voltage for

all other pins 0 Min(3.3,VBAT+0.2)

V

RF Load Impedance 50 Ω

Output current for

Each I/O pin 4.8 mA

*1: Please keep derating / margin as much as possible at extreme temperature.

Item Min Max Unit Remarks

Storage Temperature -40 85 degC

VBAT supply voltage -0.1 3.6 V

VPP supply voltage -0.1 6.8 V Supply only during

OTP programming

Input voltage for

XTAL32KM -0.2 Min(1.2,VBAT+0.2) V

Input voltage for

XTAL32KP -0.2 Min(1.5,VBAT+0.2) V

Input voltage for

all other pins -0.1 Min(3.6,VBAT+0.2) V

Preliminary Specification Number: SP-HNZY-L

8/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

8. DC Characteristics

Parameters Description Conditions Min Typ Max Unit

V

IH

HIGH level input voltage Active mode 0.84 V

VIL LOW level input voltage Active mode 0.36 V

VOH HIGH level output voltage Active mode 1.88 V

VOL LOW level output voltage Active mode 0.47 V

IIH(PD) HIGH level input current with

internal pull down enabled

Vin = VBAT

= 2.5V 50 150 uA

IIL(PU) LOW level input current with

internal pull up enabled

Vin = GND

= 0V -150 -50 uA

9. Sleep Clock: Recommended Operating Conditions

For 32kHz Crystal

Parameters Description Conditions Min Typ Max Unit

fXTAL Crystal frequency 32.768 kHz

ESR Equivalent Series Resistance 100 kohm

C

L

Load Capacitance 6 7 9 pF

C0 Shunt Capacitance 1 2 pF

dfXTAL Crystal frequency tolerance -250 250 ppm

DLmax Maximum drive level 0.1 uW

For 32kHz Crystal Oscillator

Parameters Description Conditions Min Typ Max Unit

fXO Oscillator frequency 32.768 kHz

AXO Amplitude 100 1500 mVpp

dfXO Frequency tolerance -250 250 ppm

Preliminary Specification Number: SP-HNZY-L

9/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

10. Power Sequence

Power Up / Down Sequence

VBAT

GPIO

Ta Tb

H

L

H

L

Power Up Power Down

V1

Td

Reset and Power Cycle Sequence

Symbol Description Typ Unit

Ta Time between VCC valid

and GPIO enabled Ta > 500 us

Tb Time between GPIO invalid

and VCC invalid Tb > 0 us

Tc Length of RST pulse Tc > 10 us

Td Required VBAT ramp-up time Td < 50 ms

V1 Threshold voltage of VBAT rise up V1 > 2.35 V

Preliminary Specification Number: SP-HNZY-L

10/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

11. RF Characteristics

Normal Condition: VBAT=3.0V, +25deg.C, (otherwise notified)

Item / Conditions Spec. Unit

MIN TYP MAX

Center frequency 2402 - 2480 MHz

Channel Spacing - 2 - MHz

Number of RF Channels - 40 - -

Output power (Measured at ANT pin) - -1 - dBm

Modulation characteristics

1) Δf1avg 225 - 275 kHz

2) Δf2max (at 99.9%) 185 - - kHz

3) Δf2

avg

/ Δf1

avg

0.8 - - -

Carrier frequency offset and drift

1) Frequency offset: | fn – fTX | - - 150 kHz

2) Frequency drift: | f0 – fn | - - 50 kHz

3) Drift rate #0: | f1 – f0 | - - 20 kHz

4) Drift rate #n: | f

n

– f

n

-

5

| - - 20 kHz

Receiver sensitivity (Ideal transmitter PER <= 30.8%) - -93 -70 dBm

Maximum input signal level (PER <= 30.8%) -10 - - dBm

PER Report Integrity (-30dBm input) 50 - 65.4 %

TX Current consumption - 4.8 - mA

RX Current consumption - 5.1 - mA

Preliminary Specification Number: SP-HNZY-L

11/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

12. Packing Information

1. Dimensions of Tape (Plastic tape)

Φ1.5±0.1

Φ1.5

4.0±0.1

2.0±0.1

12.0±0.1

7.8±0.1

7.5±0.1 1.75

±0.1

16.0±0.2

7.5±0.1

1.4 max.

+0.1

0

0.30±0.05

2. Dimensions of Reel

22.4 max



100)

(in mm)



13.0±0.2

2.0±0.5

17.4

±

1.0

330)



Preliminary Specification Number: SP-HNZY-L

12/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

3. Taping Diagrams

[1] Feeding Hole : As specified in (1)

[2] Hole for chip : As specified in (1)

[3] Cover tape : 62μm in thickness

[4] Base tape : As specified in (1)

4. Leader and Tail tape

Tail tape

(No components)

40 to 200mm

Components No components

150mm min.

Leader tape

(Cover tape alone)

250mm min.

Feeding direction

Feeding Hole

Chip

Feeding Direction

Pin 1 Marking

[2]

[3]

[4]

[3]

[1]

Preliminary Specification Number: SP-HNZY-L

13/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

5. The tape for chips are wound clockwise, the feeding holes to the right side as the tape is pulled

toward the user.

6. The cover tape and base tape are not adhered at no components area for 250 mm min.

7. Tear off strength against pulling of cover tape : 5 N min.

8. Packaging unit : 1000 pcs./ reel

9. material : Base tape : Plastic

Reel : Plastic

Cover tape , cavity tape and reel are made the anti-static processing.

10. Peeling of force : 1.1 N max. in the direction of peeling as shown below.

11. PACKAGE (Humidity proof Packing)

Tape and reel must be sealed with the anti-humidity plastic bag. The bag contains the desiccant and

the humidity indicator.

165 to 180 °

1.3 N max.

Base tape

Cover tape

　湿度

インジケ－タ

乾燥剤

表示ラべル

防湿梱包袋

表示ラベル

Label

Desiccant

Humidity

Indicator

Anti-humidity

Plastic Bag

1.1

Preliminary Specification Number: SP-HNZY-L

14/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

13. Recommended Land Pattern

(Unit : mm)

Preliminary Specification Number: SP-HNZY-L

15/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

14. Application Circuit

(1) Configuration using internal OTP

P0_2

P0_3

P1_0

P1_1

VBAT

XTAL32KM

XTAL32KP

No load

RST

P0_4

P0_0

P0_1

P0_6

P0_7

P0_5

0 ohm

Test Pads for OTP writing

via UART

Test Pads for OTP Writing

and Software Debugging via J-Link

GND 8

VBAT

7

GND

6

SWDIO

5

SWCLK

4

P0_6

3

P0_7

2

P0_5

1

P0_3 11

P0_2 12

ANTout 13

ANTin 14

GND 15

GND 16

GND 17

NC 19

GND 18

GND 20

GND 21

P0_1 22

P0_0 23

P0_4 24

RST 25

GND

26

GND

27

GND

28

GND

29

P1_1

30

VPP

31

GND

32

GND

33

GND

34

P1_0

35

NC

36

NC

37

XTAL32KM 10

XTAL32KP 9

typeZY

P0_4

GND

P0_5

P0_7

RST

VPP

UART_TX

UART_RX

VPP_CONTROL

RST

VPP

2.2uF

C1

VPP

XTAL

X1

XTAL32KM

XTAL32KP

Use External XTAL

32kHz_CLK Option

XTAL32KM

XTAL32KP 32K_CLK

NC

Use External OSC

RST

VBAT

GND

RST

SWCLK

SWDIO

VPP

*1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible.

*2) Connection is necessary for writing program to the OTP via UART.

Other GPIO pin can be used for VPP_CONTROL instead of P0_7.

Please see the document "Hardware setup Guide for OTP Programming".

Other pairs of GPIO can be used for UART instead of P0_4 and P0_5.

Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins".

*3) Connection is necessary for software debugging in your product via J-Link.

OTP writing can also be done using J-Link.

Please see the document "Hardware Setup for Software Debugging".

RST input logic should be inverted externally if J-Link reset is enabled.

*4) 10 GPIOs (P0_0 to P0_7, P1_0 and P1_1) are available for multipurpose use.

P0_0 to P0_3 can be used for analog input.

Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580

datasheet for more details.

Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC

under some limitations noted below:

- Environment temperature change is flat, connection interval < 2sec.

- Confirmation in actual condition should be done enough by the customer’s responsibility.

*1)

*2)

*3)

*4)

Preliminary Specification Number: SP-HNZY-L

16/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

(2) Configuration using external Flash ROM

P1_0

P1_1

VBAT

No load

RST

P0_4

P0_1

0 ohm

VBAT

SWDIO

SWCLK

RST

GND

RST

Test Pads for Software Debugging

via J-Link

GND 8

VBAT

7

GND

6

SWDIO

5

SWCLK

4

P0_6

3

P0_7

2

P0_5

1

P0_3 11

P0_2 12

ANTout 13

ANTin 14

GND 15

GND 16

GND 17

NC 19

GND 18

GND 20

GND 21

P0_1 22

P0_0 23

P0_4 24

RST 25

GND

26

GND

27

GND

28

GND

29

P1_1

30

VPP

31

GND

32

GND

33

GND

34

P1_0

35

NC

36

NC

37

XTAL32KM 10

XTAL32KP 9

typeZY

2.2uF

C1

SPI Flash ROM for

Software Storing

VBAT

DI

CLK

#HOLD

VCC#CS

DO

#WP

GND

SPI FLASH

P0_2

XTAL32KM

XTAL32KP

P0_7

XTAL

X1

XTAL32KM

XTAL32KP

Use External XTAL

32kHz_CLK Option

XTAL32KM

XTAL32KP 32K_CLK

NC

Use External OSC

*1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible.

*2) 6 GPIOs (P0_1, P0_2, P0_4, P0_7, P1_0 and P1_1) are available for multipurpose use.

P0_1 and P0_2 can be used for analog input.

Please do NOT toggle those pins by external devices during starting up.

Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins".

*3) Connection is necessary for software debugging in your product via J-Link.

Please see the document "Hardware Setup for Software Debugging".

RST input logic should be inverted externally if J-Link reset is enabled.

Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580

datasheet for more details.

Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC

under some limitations noted below:

- Environment temperature change is flat, connection interval < 2sec.

- Confirmation in actual condition should be done enough by the customer’s responsibility.

*1)

*2)

*3)

Preliminary Specification Number: SP-HNZY-L

17/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

(3) Configuration using external I2C EEPROM

*1) ANTout and ANTin are to be connected with pi-matching network. Connected line is recommended to be as short as possible.

*2) 8 GPIOs (P0_0, P0_1, P0_4 to P0_7, P1_0 and P1_1) are available for multipurpose use.

P0_0 and P0_1 can be used for analog input.

Please do NOT toggle those pins by external devices during starting up.

Please see the document "Overview of DA1458X Initial Boot Sequence and Available Interface Pins".

*3) Connection is necessary for software debugging in your product via J-Link.

Please see the document "Hardware Setup for Software Debugging".

RST input logic should be inverted externally if J-Link reset is enabled.

Note: XTAL32K_DISABLE_AMPREG register should be ‘1’ for using external OSC. See DA14580

datasheet for more details.

Note: Internal RCX oscillator might be functional for sleep clock instead of external 32kHz XTAL / OSC

under some limitations noted below:

- Environment temperature change is flat, connection interval < 2sec.

- Confirmation in actual condition should be done enough by the customer’s responsibility.

*1)

*2)

*3)

Preliminary Specification Number: SP-HNZY-L

18/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

15. Other Attentions

This product is not confirmed connectivity to all Bluetooth(R) Smart Ready devices, so the connectivity

to all devices in actual use is not guaranteed. Also the Bluetooth(R) Low Energy wireless technology

sometimes fails connections depending on surrounding environment (radio interference, noise,

disturbance etc.), so it is highly recommended to implement connection-retry scheme in the customer’s

application software.

When starting design the device, please refer to following application notes provided by Murata.

- Hardware Setup Guide for OTP Programming

- Hardware Setup Guide for Software Debugging

- Overview of OTP Header Structure

- Overview of DA1458X Initial Boot Sequence and Available Interface Pins.

- TypeZY/ZS What should you do for Wireless Certification?

- TypeZY/ZS Antenna Performance Layout Guide

16. Wireless / BT Certification Numbers

This product is certified by following regulation bodies.

- Japanese Radio Law （日本電波法）

Type certification （工事設計認証）

R001-P00500

- FCC (United States) FCC Part 15 subpart C

Limited Modular Approval

FCC ID: VPYLBZY

- IC (Canada) RSS-210

Limited Modular Approval

IC: 772C-LBZY

- CE (Europe) EN 300328 V.2.1.1

Conducted Test Report available

Note: CE marking and declaration should be done by customer as a final product.

- Bluetooth(R) SIG Qualifications

For Bluetooth Specification 4.1

QDID: 56016 (Controller Subsystem by Murata)

QDID: 52696 (Host Subsystem by Dialog)

QDID: 56907 (Profile Subsystem by Dialog)

For Bluetooth Specification 4.2

QDID: 83573 (Controller Subsystem by Dialog)

QDID: 83565 (Host Subsystem by Dialog)

QDID: Ask Dialog or S/W 3rd Party (Profile Subsystem by Dialog)

Note: Profile subsystem QDID is needed only if SIG standard profile is used.

Preliminary Specification Number: SP-HNZY-L

19/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

17. NOTICE

1.Storage Conditions:

Please use this product within 6month after receipt.

- The product shall be stored without opening the packing under the ambient temperature from 5 to

35deg.C and humidity from 20 to 70%RH.

(Packing materials, in particular, may be deformed at the temperature over 40deg.C.)

- The product left more than 6months after reception, it needs to be confirmed the solderbility before

used.

- The product shall be stored in non corrosive gas (Cl2, NH3, SO2, Nox, etc.).

- Any excess mechanical shock including, but not limited to, sticking the packing materials by sharp

object and dropping the product, shall not be applied in order not to damage the packing materials.

This product is applicable to MSL3 (Based on JEDEC Standard J-STD-020)

- After the packing opened, the product shall be stored at <30deg.C / <60%RH and the product shall be

used within 168hours.

- When the color of the indicator in the packing changed, the product shall be baked before soldering.

Baking condition: 125+5/-0deg.C, 24hours, 1time

The products shall be baked on the heat-resistant tray because the material (Base Tape, Reel Tape and

Cover Tape) are not heat-resistant.

2.Handling Conditions:

Be careful in handling or transporting products because excessive stress or mechanical shock may

break products.

Handle with care if products may have cracks or damages on their terminals, the characteristics of

products may change. Do not touch products with bear hands that may result in poor solder ability and

destroy by static electrical charge.

3.Standard PCB Design (Land Pattern and Dimensions):

All the ground terminals should be connected to the ground patterns. Furthermore, the ground pattern

should be provided between IN and OUT terminals. Please refer to the specifications for the standard

land dimensions.

The recommended land pattern and dimensions is as Murata's standard. The characteristics of

products may vary depending on the pattern drawing method, grounding method, land dimensions,

land forming method of the NC terminals and the PCB material and thickness. Therefore, be sure to

verify the characteristics in the actual set. When using non-standard lands, contact Murata beforehand.

4.Notice for Chip Placer:

When placing products on the PCB, products may be stressed and broken by uneven forces from a

worn-out chucking locating claw or a suction nozzle. To prevent products from damages, be sure to

follow the specifications for the maintenance of the chip placer being used. For the positioning of

products on the PCB, be aware that mechanical chucking may damage products.

Preliminary Specification Number: SP-HNZY-L

20/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

5.Soldering Conditions:

The recommendation conditions of soldering are as in the following figure.

When products are immersed in solvent after mounting, pay special attention to maintain the

temperature difference within 100 °C. Soldering must be carried out by the above mentioned

conditions to prevent products from damage. Set up the highest temperature of reflow within 260 °C.

Contact Murata before use if concerning other soldering conditions.

Reflow soldering standard conditions

Reflow soldering standard conditions(Example)

Please use the reflow within 2 times.

Use rosin type flux or weakly active flux with a chlorine content of 0.2 wt % or less.

6.Cleaning:

Since this Product is Moisture Sensitive, any cleaning is not permitted.

7.Operational Environment Conditions:

Products are designed to work for electronic products under normal environmental conditions (ambient

temperature, humidity and pressure). Therefore, products have no problems to be used under the

similar conditions to the above-mentioned. However, if products are used under the following

circumstances, it may damage products and leakage of electricity and abnormal temperature may

occur.

- In an atmosphere containing corrosive gas ( Cl2, NH3, SOx, NOx etc.).

- In an atmosphere containing combustible and volatile gases.

- Dusty place.

- Direct sunlight place.

- Water splashing place.

- Humid place where water condenses.

- Freezing place.

If there are possibilities for products to be used under the preceding clause, consult with Murata before

actual use.

As it might be a cause of degradation or destruction to apply static electricity to products, do not apply

static electricity or excessive voltage while assembling and measuring.

Within 120s

Pre-heating

time(s)

220 deg.C

Within 60s

Cooling down

Slowly

180 deg.C

150 deg.C

240to 250 deg.C

Within 3s

Preliminary Specification Number: SP-HNZY-L

21/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

8.Input Power Capacity:

Products shall be used in the input power capacity as specified in this specifications.

Inform Murata beforehand, in case that the components are used beyond such input power capacity

range.

Preliminary Specification Number: SP-HNZY-L

22/22

Preliminary

< Specification may be changed by Murata without notice >

Murata Manufacturing Co., Ltd.

18. PRECONDITION TO USE OUR PRODUCTS

PLEASE READ THIS NOTICE BEFORE USING OUR PRODUCTS.

Please make sure that your product has been evaluated and confirmed from the aspect of the fitness for the

specifications of our product when our product is mounted to your product.

All the items and parameters in this product specification/datasheet/catalog have been prescribed on the premise that

our product is used for the purpose, under the condition and in the environment specified in this specification. You are

requested not to use our product deviating from the condition and the environment specified in this specification.

Please note that the only warranty that we provide regarding the products is its conformance to the specifications

provided herein. Accordingly, we shall not be responsible for any defects in products or equipment incorporating such

products, which are caused under the conditions other than those specified in this specification.

WE HEREBY DISCLAIMS ALL OTHER WARRANTIES REGARDING THE PRODUCTS, EXPRESS OR IMPLIED,

INCLUDING WITHOUT LIMITATION ANY WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THAT THEY

ARE DEFECT-FREE, OR AGAINST INFRINGEMENT OF INTELLECTUAL PROPERTY RIGHTS.

The product shall not be used in any application listed below which requires especially high reliability for the prevention

of such defect as may directly cause damage to the third party's life, body or property. You acknowledge and agree that,

if you use our products in such applications, we will not be responsible for any failure to meet such requirements.

Furthermore, YOU AGREE TO INDEMNIFY AND DEFEND US AND OUR AFFILIATES AGAINST ALL CLAIMS,

DAMAGES, COSTS, AND EXPENSES THAT MAY BE INCURRED, INCLUDING WITHOUT LIMITATION, ATTORNEY

FEES AND COSTS, DUE TO THE USE OF OUR PRODUCTS IN SUCH APPLICATIONS.

- Aircraft equipment. - Aerospace equipment - Undersea equipment.

- Power plant control equipment - Medical equipment.

- Transportation equipment (vehicles, trains, ships, elevator, etc.).

- Traffic signal equipment. - Disaster prevention / crime prevention equipment.

-Burning / explosion control equipment

- Application of similar complexity and/ or reliability requirements to the applications listed in the above.

We expressly prohibit you from analyzing, breaking, reverse-engineering, remodeling altering, and reproducing our

product. Our product cannot be used for the product which is prohibited from being manufactured, used, and sold by

the regulations and laws in the world.

We do not warrant or represent that any license, either express or implied, is granted under any our patent right,

copyright, mask work right, or our other intellectual property right relating to any combination, machine, or process in

which our products or services are used. Information provided by us regarding third-party products or services does not

constitute a license from us to use such products or services or a warranty or endorsement thereof. Use of such

information may require a license from a third party under the patents or other intellectual property of the third party, or a

license from us under our patents or other intellectual property.

Please do not use our products, our technical information and other data provided by us for the purpose of developing of

mass-destruction weapons and the purpose of military use.

Moreover, you must comply with "foreign exchange and foreign trade law", the "U.S. export administration regulations",

etc.

Please note that we may discontinue the manufacture of our products, due to reasons such as end of supply of materials

and/or components from our suppliers.

By signing on specification sheet or approval sheet, you acknowledge that you are the legal representative for your

company and that you understand and accept the validity of the contents herein. When you are not able to return the

signed version of specification sheet or approval sheet within 30 days from receiving date of specification sheet or

approval sheet, it shall be deemed to be your consent on the content of specification sheet or approval sheet. Customer

acknowledges that engineering samples may deviate from specifications and may contain defects due to their

development status. We reject any liability or product warranty for engineering samples. In particular we disclaim liability

for damages caused by

- the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in the

product to be sold by you,

-deviation or lapse in function of engineering sample,

-improper use of engineering samples.

We disclaim any liability for consequential and incidental damages.

If you can’t agree the above contents, you should inquire our sales.