APTLGF350A608G
APTLGF350A608G – Rev 3 October, 2012
www.microsemi.com 1-8
OUT0/VBUSVBUS
GND
VDD
GND
INL
VDD
INH
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
See application note APT0502 on www.microsemi.com
VCES = 600V
IC = 350A @ Tc = 80°C
Phase leg
Intelligent Power Module
Application
Motor control
Uninterruptible Power Supplies
Switched Mode Power Supplies
Amplifier
Features
Non Punch Through (NPT) FAST IGBT
- Low voltage drop
- Low tail current
- Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- RBSOA & SCSOA rated
Integrated Fail Safe IGBT Protection (Driver)
- Top Bottom input signals Interlock
- Isolated DC/DC Converter
Low stray inductance
M5 power connectors
High level of integration
Benefits
Outstanding performance at high frequency operation
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Very high noise immunity
(common mode rejection > 25kV/µs)
Galvanic Isolation: 3750V for the optocoupler
2500V for the transformer
5V logic level with Schmitt-trigger Input
Single VDD=5V supply required
Secondary auxiliary power supplies internally generated
(15V, -6V)
Optocoupler qualified to AEC-Q100 test guidelines
RoHS compliant
APTLGF350A608G
APTLGF350A608G – Rev 3 October, 2012
www.microsemi.com 2-8
All ratings @ Tj = 25°C unless otherwise specified
1. Inverter Power Module
Absolute maximum ratings
Symbol Parameter Max ratings Unit
VCES Collector - Emitter Breakdown Voltage 600 V
TC = 25°C 430
IC Continuous Collector Current TC = 80°C 350
ICM Pulsed Collector Current TC = 25°C 700
A
PD Maximum Power Dissipation TC = 25°C 1562 W
RBSOA Reverse Bias Safe Operating Area Tj = 125°C 800A@550V
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Tj = 25°C 0.5
ICES Zero Gate Voltage Collector Current VGE = 0V
VCE = 600V Tj = 125°C 1.5
mA
Tj = 25°C 2 2.5
VCE(sat) Collector Emitter Saturation Voltage VDD = VIN = 5V
IC = 400A Tj = 125°C 2.2 V
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Cies Input Capacitance 17.2
Coes Output Capacitance 1.88
Cres Reverse Transfer Capacitance
VGE = 0V
VCE = 25V
f = 1MHz 1.6
nF
Tr Rise Time 25
Tf Fall Time
Inductive Switching (25°C)
VDD = VIN = 5V
VBus = 400V ; IC = 400A 30
ns
Tr Rise Time 25
Tf Fall Time 45 ns
Eon Turn-on Switching Energy 17.2
Eoff Turn-off Switching Energy
Inductive Switching (125°C)
VDD = VIN = 5V
VBus = 400V
IC = 400A
14 mJ
Isc Short Circuit data VDD = VIN = 5V; VBus =360V
tp 10µs ; Tj = 125°C 1800 A
RthJC Junction to Case thermal resistance 0.08 °C/W
APTLGF350A608G
APTLGF350A608G – Rev 3 October, 2012
www.microsemi.com 3-8
Reverse diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
VRRM Maximum Peak Repetitive Reverse Voltage 600 V
Tj = 25°C 350
IRM Maximum Reverse Leakage Current VR = 600V Tj = 150°C 500 µA
IF DC Forward Current Tc = 80°C 400 A
Tj = 25°C 1.6 2
VF Diode Forward Voltage IF = 400A Tj = 150°C 1.5 V
Tj = 25°C 125
trr Reverse Recovery Time
Tj = 150°C 220
ns
Tj = 25°C 19
Qrr Reverse Recovery Charge Tj = 150°C 40 µC
Tj = 25°C 4.4
Err Reverse Recovery Energy
IF = 400A
VR = 300V
di/dt =4800A/µs
Tj = 150°C 9.6 mJ
RthJC Junction to Case thermal resistance 0.20 °C/W
2. Driver
Absolute maximum ratings
Symbol Parameter Max ratings Unit
VDD Supply Voltage 5.5
VINi Input signal voltage i=L, H 5.5 V
VINi = 0V, i =L & H 0.35
IVDDmax Maximum Supply current VDD=5V, VINH = /VINL ; Fout = 60kHz 2
A
fmax Maximum Switching Frequency 60 kHz
Driver Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
VDD Operating Supply Voltage 4.5 5 5.5 V
VINi(max) Maximum Input Voltage -0.5 5 5.5
VINi (th+) Positive Going Threshold Voltage 3.2
VINi(th-) Negative Going Threshold Voltage 1
V
RINi Input Resistance *
i = L, H
1 k
Td(on) Turn On delay time Driver + IGBT 1100
DT Built in dead time 600
Td(off) Turn Off delay time Driver + IGBT 750
ns
PWD Pulse Width Distortion 300
PDD Propagation Delay Difference
between any two driver Td(on) - Td(off) -350 350
ns
VISOL Primary to Secondary Isolation 2500 VRMS
* Low impedance guarantees good noise immunity.
Including built in dead time.
APTLGF350A608G
APTLGF350A608G – Rev 3 October, 2012
www.microsemi.com 4-8
3. Package characteristics
Symbol Characteristic Min Typ Max Unit
VISOL RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 4000 V
TJ Operating junction temperature range -40 150
TOP Operating Ambient Temperature -40 85
TSTG Storage Temperature Range -40 100
TC Operating Case Temperature -40 100
°C
To heatsink M5 2 4.7
Torque Mounting torque For terminals M5 2 4 N.m
Wt Package Weight 550 g
4. LP8 Package outline (dimensions in mm)
APTLGF350A608G
APTLGF350A608G – Rev 3 October, 2012
www.microsemi.com 5-8
Typical IGBT Performance Curve
Output characteristics
T
J
=25°C
T
J
=125°C
0
200
400
600
800
01234
Ic, Collector Current (A)
V
CE
, Collector to Emitter Voltage (V)
250µs Pulse Test
< 0.5% Duty cycle
V
DD
= 5V
V
IN
= 5V
0.80
0.90
1.00
1.10
1.20
25 50 75 100 125
T
J
, Junction Temperature (°C)
Collector to Emitter Breakdown
Voltage (Normalized)
Breakdown Voltage vs Junction Temp.
0
100
200
300
400
500
25 50 75 100 125 150
T
C
, Case Temperature (°C)
Ic, DC Collector Current (A)
DC Collector Current vs Case Temperature
T
J
=125°C
0
20
40
60
80
100 200 300 400 500 600
I
CE
, Collector to Emitter Current (A)
tr, Rise Time (ns)
Current Rise Time vs Collector Current
V
CE
= 400V
V
DD
= 5V
V
IN
= 5V
T
J
= 25°C
T
J
= 125°C
0
20
40
60
80
100 200 300 400 500 600
I
CE
, Collector to Emitter Current (A)
tf, Fall Time (ns)
Current Fall Time vs Collector Current
V
CE
= 400V
V
DD
= 5V
V
IN
= 5V
T
J
=25°C
T
J
=125°C
0
8
16
24
32
100 200 300 400 500 600
I
CE
, Collector to Emitter Current (A)
E
on
, Turn-On Energy Loss (mJ)
Turn-On Energy Loss vs Collector Current
V
CE
= 400V
V
DD
= 5V
V
IN
= 5V
T
J
= 25°C
T
J
= 125°C
0
4
8
12
16
20
24
100 200 300 400 500 600
I
CE
, Collector to Emitter Current (A)
E
off
, Turn-off Energy Loss (mJ)
Turn-Off Energy Loss vs Collector Current
V
CE
= 400V
V
DD
= 5V
V
IN
= 5V
0
200
400
600
800
1000
0 100 200 300 400 500 600
I
C
, Collector Current (A)
Reverse Bias Safe Operating Area
V
CE
, Collector to Emitter Voltage (V)
APTLGF350A608G
APTLGF350A608G – Rev 3 October, 2012
www.microsemi.com 6-8
Cies
Cres
Coes
100
1000
10000
100000
0 1020304050
C, Capacitance (pF)
Capacitance vs Collector to Emitter Voltage
V
CE
, Collector to Emitter Voltage (V)
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.02
0.04
0.06
0.08
0.1
0.00001 0.0001 0.001 0.01 0.1 1 10
Rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Operating Frequency vs Collector Current
Hard
switching
0
10
20
30
40
50
60
70
0 100 200 300 400 500
I
C
, Collector Current (A)
F
max
,
O
p
eratin
g
Fre
q
uenc
y
(
kHz
)
V
CE
= 400V
D = 50%
V
DD
= 5V
V
IN
= 5V
T
J
= 125°C
T
C
=75°C
Limited by
internal gate
drive power
dissipation
APTLGF350A608G
APTLGF350A608G – Rev 3 October, 2012
www.microsemi.com 7-8
Typical diode Performance Curve
Energy losses vs Collector Current
0
4
8
12
16
0 200 400 600 800
IF (A)
Err (mJ)
V
R
= 300V
T
J
= 150°C
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
D = 0.9
0.7
0.5
0.3
0.1
0.05 Single Pulse
0
0.04
0.08
0.12
0.16
0.2
0.24
0.00001 0.0001 0.001 0.01 0.1 1 10
Rectangular Pulse Duration in Seconds
Thermal Impedance (°C/W)
Forward Characteristic of diode
T
J
=25°C
T
J
=150°C
0
100
200
300
400
500
600
700
800
0 0.4 0.8 1.2 1.6 2 2.4
VF (V)
IF (A)
APTLGF350A608G
APTLGF350A608G – Rev 3 October, 2012
www.microsemi.com 8-8
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement
will also apply. This document and the information contained herein may not be modified, by any person other than
authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication,
inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by
Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi
product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all
faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims
any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product
is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.