MIL-M-38510/8F
9 August 2005 _
SUPERSEDING
MIL-M-38510/8E
4 January 2005
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, BIPOLAR, TTL, BUFFERS/DRIVERS OPEN COLLECTOR OUTPUT,
HIGH VOLTAGE, MONOLITHIC SILICON
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic, silicon, TTL, buffers/drivers
microcircuits with open collector high voltage outputs. Two product assurance classes and a choice of case outlines
and lead finishes are provided for each type and are reflected in the complete part number. For this product, the
requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type Circuit
01 Hex inverter buffer/driver, 30-volt output
02 Hex inverter buffer/driver, 15-volt output
03 Hex buffer/driver, 30-volt output
04 Hex buffer/driver, 15-volt output
05 Quad 2 input inverter buffer/driver, 15-volt output
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
A GDFP5-F14 or CDFP6-F14 14 Flat pack
B GDFP4-14 14 Flat pack
C GDIP1-T14 or CDIP2-T14 14 Dual-in-line
D GDFP1-F14 or CDFP2-F14 14 Flat pack
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense
Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to
bipolar@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at http://assist.daps.dla.mil.
AMSC N/A FSC 5962
Inactive for new design after 7 September 1995.
MIL-M-38510/8F
2
1.2.4 Absolute maximum ratings.
Supply voltage range ...................................................... -0.5 V dc to +7.0 V dc
Input voltage range ......................................................... -1.5 V dc at -12 mA to +5.5 V dc
Storage temperature range ............................................ -65°C to +150°C
Maximum power dissipation per gate, PD 1/ ................ 54 mW dc per buffer
Lead temperature (soldering 10 seconds) ...................... 300°C
Thermal resistance, junction-to-case (θJC) ..................... (See MIL-STD-1835)
Junction temperature (TJ ) 2/ 175°C
1.2.5 Recommended operating conditions.
Supply voltage (VCC) ....................................................... 4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ........................... 2.0 V dc
Maximum low level input voltage (VIL) ............................ 0.8 V dc
Normalized fanout (each output) 3/ :
Device types 01, 02, 03, and 04 ............................ 18 maximum
Device type 05 ....................................................... 10 maximum
Case operating temperature range (TC ) ......................... -55°C to 125°C
2.0 APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or
http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
_______
1/ Must withstand the added PD due to short circuit condition (e.g. IOS) at one output for 5 seconds duration.
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ The device will fanout in both high and low levels to the specified number of inputs of the same device
type as that being tested.
MIL-M-38510/8F
3
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Logic diagram and terminal connections. The logic diagram and terminal connections shall be as specified
on figure 1.
3.3.2 Truth tables and logic equations. The truth tables and logic equations shall be as specified on figure 2.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to
the qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. Case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table 1
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 2 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
MIL-M-38510/8F
4
TABLE I. Electrical performance characteristics.
Limits
Test
Symbol
Conditions
-55°C ≤ TC ≤ +125°C
unless otherwise specified
Device
type Min Max Unit
High-level output voltage VOH 1/ 01, 03 30 V
02, 04, 05 15
Input clamp voltage VI C V
CC = 4.5 V, IIN = -12 mA, All -1.5 V
TA = 25° C
Maximum collector ICEX V
CC = 4.5 V, All 250 µA
cut-off current VOH = MAX 4/
Low-level output voltage VOL1 V
CC = 4.5 V, IOL = 30 mA, 01, 02 0.7 V
4/ 03, 04
Low-level output voltage VOL2 V
CC = 4.5 V, IOL = 16 mA, All 0.4 V
4/
High-level input current IIH1 V
CC = 5.5 V, VIN = 2.4 V 2/ All 40 µA
High-level input current IIH2 V
CC = 5.5 V, VIN = 5.5 V 2/ All 100
µA
Low-level input current IIL1 V
CC = 5.5 V, VIN = 0.4 V 3/ 01, 02 -0.4 -1.6 mA
03, 04
05 -0.7 -1.6
High-level supply current ICCH V
CC = 5.5 V, VIN = 0 V 01, 02 51 mA
VCC = 5.5 V, VIN = 5.5 V 03, 04 46 mA
V
CC = 5.5 V, VIN = 0 V 05 8 mA
Low-level supply current ICCL V
CC = 5.5 V, VIN = 5.5 V 01, 02 48 mA
V
CC = 5.5 V, VIN = 0 V 03, 04 32 mA
V
CC = 5.5 V, VIN = 5.5 V 05 22 mA
Propagation delay time tPHL CL = 50 pF ±10% minimum, 01, 02 3 30 ns
high-to-low level RL = 150 Ω ±5% 03, 04 3 35 ns
CL = 50 pF ±10% minimum, 05 3 35 ns
RL = 1 kΩ ±5%
Propagation delay time tPLH CL = 50 pF ±10% minimum, 01, 02 3 25 ns
low-to-high level RL = 150 Ω ±5% 03, 04 3 20 ns
CL = 50 pF ±10% minimum, 05 3 40 ns
RL = 1 kΩ ±5%
1/ See ICEX.
2/ All unspecified inputs grounded.
3/ All unspecified input at 5.5 volts.
4/ VIL = 0.7 V at 125°C only as follows:
I
CEX: device types 01, 02, 05.
V
OL1, VOL2: device types 03 and 04.
*
MIL-M-38510/8F
5
TABLE II. Electrical test requirements.
Subgroups (see table III)
MIL-PRF-38535
Test requirement
Class S
Devices
Class B
Devices
Interim electrical parameters
1 1
Final electrical test parameters
1*, 2, 3,
9, 10, 11 1*, 2, 3, 9
Group A test requirements
1, 2, 3,
9, 10, 11
1, 2, 3
9, 10, 11
Group B electrical test parameters
when using the method 5005 QCI option 1, 2, 3,
9, 10, 11 N/A
Groups C end point electrical parameters 1, 2, 3
9, 10, 11 1, 2, 3
Group D end point electrical parameters 1, 2, 3 1, 2, 3
*PDA applies to subgroup 1.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, 6, 7, and 8 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a. End point electrical parameters shall be as specified in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit
shall be maintained under document control by the device manufacturer's Technology Review Board (TRB)
in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-point
electrical parameters shall be as specified in table II herein.
4.5 Methods inspection. Methods of inspection shall be as specified in the appropriate tables and as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given
are conventional current and positive when flowing into the referenced terminal.
MIL-M-38510/8F
6
Figure 1. Logic diagram and terminal connections (top views).
MIL-M-38510/8F
7
Device types 01 and 02 Device type 03 and 04
Truth table each gate Truth table each gate
Input Output Input Output
A Y A Y
L H L L
H L H H
Positive logic Y = A Positive logic Y = A
Device type 05
Truth table each gate
Input Output
A B Y
L L H
H L H
L H H
H H L
Positive logic Y = AB
Figure 2. Truth tables and logic equations.
MIL-M-38510/8F
8
NOTES:
1. CL = 50 pF ± 10% minimum including scope probe, wiring, and stray capacitance, without package in test
fixture.
2. Voltage measurements are to be made with respect to network ground terminal.
3. RL = 150 Ω ± 5%.
FIGURE 3. Switching time test circuit for device types 01 and 02.
MIL-M-38510/8F
9
NOTES:
1. CL = 50 pF ± 10% minimum including scope probe, wiring, and stray capacitance, without package in test
fixture.
2. Voltage measurements are to be made with respect to network ground terminal.
3. RL = 150 Ω ± 5%.
FIGURE 4. Switching time test circuit for device types 03 and 04.
MIL-M-38510/8F
10
NOTES:
1. CL = 50 pF ± 10% minimum including scope probe, wiring, and stray capacitance, without package in test
fixture.
2. Voltage measurements are to be made with respect to network ground terminal.
3. RL = 1 kΩ ± 5%.
FIGURE 5. Switching time test circuits for device type 05.
TABLE III. Group A inspection for device type 01 and 02.
Terminal conditions (High > 2.0 V or Low < 0.8 V or open).
Cases A,B,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
Case C 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup
Symbol
MIL-
STD-883
method Test No. 1A 1Y 2A 2Y 3A 3Y GND 4Y 4A 5Y 5A 6Y 6A VCC
Meas.
terminal
Min
Max
Unit
1 VOL1 3007 1 2.0 V 30 mA 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 4.5 V 1Y 0.7 V
TC = +25°C “ “ 2 5.5 V 2.0 V 30 mA 5.5 V " " " " " 2Y “ “
“ “ “ 3 " 5.5 V 2.0 V 30 mA " " " " " 3Y “ “
“ “ “ 4 " " 5.5 V " 30 mA 2.0 V " " " 4Y “ “
“ “ “ 5 " " " " 5.5 V 30 mA 2.0 V " " 5Y “ “
” “ “ 6 " " " " " 5.5 V 30 mA 2.0 V " 6Y “ “
“ VOL2 “ 7 2.0 V 16 mA " " " " " 5.5 V " 1Y 0.4 “
’‘ “ “ 8 5.5 V 2.0 V 16 mA " " " " " " 2Y “ “
“ " " 9 " 5.5 V 2.0 V 16 mA " " " " " 3Y "
“
“ “ “ 10 " " 5.5 V " 16 mA 2.0 V " " " 4Y " “
“ “ “ 11 " " " " 5.5 V 16 mA 2.0 V " " 5Y " “
“ “ “ 12 " " " " " 5.5 V 16 mA 2.0 V " 6Y " “
“ ICEX 13 0.8 V A " " " " " 5.5 V " 1Y 250
µA
“ “ 14 5.5 V 0.8 V A " " " " " " 2Y “ “
“ “ 15 " 5.5 V 0.8 V A " " " " " 3Y “ “
“ “ 16 " " 5.5 V " A 0.8 V " " " 4Y “ “
“ " 17 " " " " 5.5 V A 0.8 V " " 5Y " "
“ “ 18 " " " " 5.5 V 5.5 V A 0.8 V " 6Y “ “
“ VIC 19 -12 mA " " 1A -1.5 V
“ “ 20 -12 mA " " 2A “ “
“ “ 21 -12 mA " " 3A “ “
“ “ 22 " -12 mA " 4A “ “
“ “ 23 " -12 mA " 5A “ “
“ “ 24 " -12 mA " 6A “ “
“ IIH1 3010 25 2.4 V GND GND " GND GND GND 5.5 V 1A 40 µA
“ “ 26 GND 2.4 V GND " " " " " 2A " "
“ “ " 27 " GND 2.4 V " " " " " 3A “ “
“ “ " 28 " " GND " 2.4 V " " " 4A “ “
“ “ " 29 " " " " GND 2.4 V " " 5A “ “
“ “ " 30 " " " " " GND 2.4 V " 6A “ “
“ IIH2 3010 31 5.5 V " " " " " GND " 1A 100 "
“ “ 32 GND 5.5 V " " " " " " 2A " "
“ “ " 33 " GND 5.5 V " " " " " 3A “ “
“ “ " 34 " " GND " 5.5 V " " " 4A “ “
“ “ " 35 " " " " GND 5.5 V " " 5A “ “
“ “ " 36 " " " " GND GND 5.5 V " 6A “ “
Note: A = 30 volts for device type 01 and 15 volts for device type 02.
11
MIL-M-38510/8F
TABLE III. Group A inspection for device type 01 and 02. - Continued
Terminal conditions (High > 2.0 V or Low < 0.8 V or open).
Cases A,B,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
Case C 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup
Symbol
MIL-
STD-883
method Test No. 1A 1Y 2A 2Y 3A 3Y GND 4Y 4A 5Y 5A 6Y 6A VCC
Meas.
terminal
Min
Max
Unit
1 IIL 3009 37 CKT A, C 0.4 V 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 1A -.7 -1.6 mA
TC = +25°C “ “ 37 CKT B 0.4 V 5.5 V " " " " " " 1A -.4 -1.3 “
“ “ “ 38 CKT A, C 5.5 V 0.4 V " " " " " " 2A -.7 -1.6 “
“ “ “ 38 CKT B " 0.4 V " " " " " " 2A -.4 -1.3 “
“ “ “ 39 CKT A, C " 5.5 V 0.4 V " " " " " 3A -.7 -1.6 “
“ “ “ 39 CKT B " " 0.4 V " " " " " 3A -.4 -1.3 “
“ “ 40 CKT A, C " " 5.5 V " 0.4 V " " " 4A -.7 -1.6 “
“ “ “ 40 CKT B " " " " 0.4 V " " " 4A -.4 -1.3
“
“ “ “ 41 CKT A, C " " " " 5.5 V 0.4 V " " 5A -.7 -1.6 “
“ “ “ 41 CKT B " " " " " 0.4 V " " 5A -.4 -1.3 “
“ “ “ 42 CKT A, C " " " " " 5.5 V 0.4 V " 6A -.7 -1.6 "
“ “ “ 42 CKT B " " " " " " 0.4 V " 6A -.4 -1.3 “
“ ICCL 3005 43 CKT A " " " " " " 5.5 V " VCC 41 “
“ “ “ 43 CKT B " " " " " " " " " 48 “
“ “ “ 43 CKT C " " " " " " " " " 44 “
“ ICCH " 44 CKT A GND GND GND " GND GND GND " " 42 "
“ " " 44 CKT B " " " " " " " " " 51 "
“ " " 44 CKT C " " " " " " " " " 48 "
2 Same tests, terminal conditions and limits as for subgroup 1, except TC = 125° C and VIC tests are omitted. VIL = 0.7 V for ICEX.
3 Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C and VIC tests are omitted.
9 tPHL 3003 45 IN OUT GND 5.0 V 1A to 1Y 3 25 ns
TC = +25°C “ (Fig 3) 46 IN OUT " " 2A to 2Y " “ “
“ “ " 47 IN OUT " " 3A to 3Y " “
“
“ “ " 48 " OUT IN " 4A to 4Y " “
“
“ “ " 49 " OUT IN " 5A to 5Y " “
“
“ “ " 50 " OUT IN " 6A to 6Y " “
“
" tPLH " 51 IN OUT " " 1A to 1Y " 20 "
" “ " 52 IN OUT " " 2A to 2Y " “ “
“ “ " 53 IN OUT " " 3A to 3Y " “
“
“ “ " 54 " OUT IN " 4A to 4Y " “
“
“ “ " 55 " OUT IN " 5A to 5Y " “
“
“ “ " 56 " OUT IN " 6A to 6Y " “
“
12
MIL-M-38510/8F
TABLE III. Group A inspection for device type 01 and 02. - Continued
Terminal conditions (High > 2.0 V or Low < 0.8 V or open).
Cases A,B,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
Case C 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup
Symbol
MIL-
STD-883
method Test No. 1A 1Y 2A 2Y 3A 3Y GND 4Y 4A 5Y 5A 6Y 6A VCC
Meas.
terminal
Min
Max
Unit
10 tPHL 3003 57 IN OUT GND 5.0 V 1A to 1Y 3 30 ns
TC = +125°C “ (Fig 3) 58 IN OUT " " 2A to 2Y " “ “
“ “ " 59 IN OUT " " 3A to 3Y " “
“
“ “ " 60 " OUT IN " 4A to 4Y " “
“
“ “ " 61 " OUT IN " 5A to 5Y " “
“
“ “ " 62 " OUT IN " 6A to 6Y " “
“
" tPLH " 63 IN OUT " " 1A to 1Y " 25 "
" “ " 64 IN OUT " " 2A to 2Y " “ “
“ “ " 65 IN OUT " " 3A to 3Y " “ “
“ “ " 66 " OUT IN " 4A to 4Y " “ “
“ “ " 67 " OUT IN " 5A to 5Y " “ “
“ “ " 68 " OUT IN " 6A to 6Y " “ “
11 Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
13
MIL-M-38510/8F
TABLE III. Group A inspection for device type 03 and 04.
Terminal conditions (High > 2.0 V or Low < 0.8 V or open).
Cases A,B,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
Case C 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup
Symbol
MIL-
STD-883
method Test No. 1A 1Y 2A 2Y 3A 3Y GND 4Y 4A 5Y 5A 6Y 6A VCC
Meas.
terminal
Min
Max
Unit
1 VOL1 3007 1 0.8 V 30 mA 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 4.5 V 1Y 0.7 V
TC = +25°C “ “ 2 5.5 V 0.8 V 30 mA 5.5 V " " " " " 2Y “ “
“ “ “ 3 " 5.5 V 0.8 V 30 mA " " " " " 3Y “ “
“ “ “ 4 " " 5.5 V " 30 mA 0.8 V " " " 4Y “ “
“ “ “ 5 " " " " 5.5 V 30 mA 0.8 V " " 5Y “ “
” “ “ 6 " " " " " 5.5 V 30 mA 0.8 V " 6Y “ “
“ VOL2 “ 7 0.8 V 16 mA " " " " " 5.5 V " 1Y 0.4 “
’‘ “ “ 8 5.5 V 0.8 V 16 mA " " " " " " 2Y “ “
“ " " 9 " 5.5 V 0.8 V 16 mA " " " " " 3Y "
“
“ “ “ 10 " " 5.5 V " 16 mA 0.8 V " " " 4Y " “
“ “ “ 11 " " " " 5.5 V 16 mA 0.8 V " " 5Y " “
“ “ “ 12 " " " " " 5.5 V 16 mA 0.8 V " 6Y " “
“ ICEX 13 2.0 V A " " " " " 5.5 V " 1Y 250
µA
“ “ 14 5.5 V 2.0 V A " " " " " " 2Y “ “
“ “ 15 " 5.5 V 2.0 V A " " " " " 3Y “ “
“ “ 16 " " 5.5 V " A 2.0 V " " " 4Y “ “
“ " 17 " " " " 5.5 V A 2.0 V " " 5Y " "
“ “ 18 " " " " 5.5 V 5.5 V A 2.0 V " 6Y “ “
“ VIC 19 -12 mA " " 1A -1.5 V
“ “ 20 -12 mA " " 2A “ “
“ “ 21 -12 mA " " 3A “ “
“ “ 22 " -12 mA " 4A “ “
“ “ 23 " -12 mA " 5A “ “
“ “ 24 " -12 mA " 6A “ “
“ IIH1 3010 25 2.4 V GND GND " GND GND GND 5.5 V 1A 40 µA
“ “ 26 GND 2.4 V GND " " " " " 2A " "
“ “ " 27 " GND 2.4 V " " " " " 3A “ “
“ “ " 28 " " GND " 2.4 V " " " 4A “ “
“ “ " 29 " " " " GND 2.4 V " " 5A “ “
“ “ " 30 " " " " " GND 2.4 V " 6A “ “
“ IIH2 3010 31 5.5 V " " " " " GND " 1A 100 "
“ “ 32 GND 5.5 V " " " " " " 2A " "
“ “ " 33 " GND 5.5 V " " " " " 3A “ “
“ “ " 34 " " GND " 5.5 V " " " 4A “ “
“ “ " 35 " " " " GND 5.5 V " " 5A “ “
“ “ " 36 " " " " GND GND 5.5 V " 6A “ “
Note: A = 30 volts for device type 03 and 15 for device type 04.
14
MIL-M-38510/8F
TABLE III. Group A inspection for device type 03 and 04. - Continued
Terminal conditions (High > 2.0 V or Low < 0.8 V or open).
Cases A,B,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
Case C 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup
Symbol
MIL-
STD-883
method Test No. 1A 1Y 2A 2Y 3A 3Y GND 4Y 4A 5Y 5A 6Y 6A VCC
Meas.
terminal
Min
Max
Unit
1 IIL 3009 37 CKT A, C 0.4 V 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 1A -.7 -1.6 mA
TC = +25°C “ “ 37 CKT B 0.4 V 5.5 V " " " " " " 1A -.4 -1.3 “
“ “ “ 38 CKT A, C 5.5 V 0.4 V " " " " " " 2A -.7 -1.6 “
“ “ “ 38 CKT B " 0.4 V " " " " " " 2A -.4 -1.3 “
“ “ “ 39 CKT A, C " 5.5 V 0.4 V " " " " " 3A -.7 -1.6 “
“ “ “ 39 CKT B " " 0.4 V " " " " " 3A -.4 -1.3 “
“ " “ 40 CKT A, C " " 5.5 V " 0.4 V " " " 4A -.7 -1.6 “
“ “ “ 40 CKT B " " " " 0.4 V " " " 4A -.4 -1.3 “
“ “ “ 41 CKT A, C " " " " 5.5 V 0.4 V " " 5A -.7 -1.6 “
“ “ “ 41 CKT B " " " " " 0.4 V " " 5A -.4 -1.3 “
“ “ “ 42 CKT A, C " " " " " 5.5 V 0.4 V " 6A -.7 -1.6
“ “ “ 42 CKT B " " " " " " 0.4 V " 6A -.4 -1.3 “
“ ICCL 3005 43 CKT A, B " " " " " " 5.5 V " VCC 42 “
“ ICCL “ 43 CKT C " " " " " " 5.5 V " " 46
“
“ ICCH " 44 CKT A, B GND GND GND " GND GND GND " " 30 "
“ ICCH " 44 CKT C GND GND GND " GND GND GND " " 32 "
2 Same tests, terminal conditions and limits as for subgroup 1, except TC = 125° C and VIC tests are omitted. VIL = 0.7 V for VOL1 and VOL2.
3 Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C and VIC tests are omitted.
9 tPHL 3003 45 IN OUT GND 5.0 V 1A to 1Y 3 26 ns
TC = +25°C “ (Fig 4) 46 IN OUT " " 2A to 2Y " “ “
“ “ " 47 IN OUT " " 3A to 3Y " “
“
“ “ " 48 " OUT IN " 4A to 4Y " “
“
“ “ " 49 " OUT IN " 5A to 5Y " “
“
“ “ " 50 " OUT IN " 6A to 6Y " “
“
" tPLH " 51 IN OUT " " 1A to 1Y " 15 "
" “ " 52 IN OUT " " 2A to 2Y " “ “
“ “ " 53 IN OUT " " 3A to 3Y " “
“
“ “ " 54 " OUT IN " 4A to 4Y " “
“
“ “ " 55 " OUT IN " 5A to 5Y " “
“
“ “ " 56 " OUT IN " 6A to 6Y " “
“
15
MIL-M-38510/8F
*
TABLE III. Group A inspection for device type 03 and 04. - Continued
Terminal conditions (High > 2.0 V or Low < 0.8 V or open).
Cases A,B,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
Case C 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup
Symbol
MIL-
STD-883
method Test No. 1A 1Y 2A 2Y 3A 3Y GND 4Y 4A 5Y 5A 6Y 6A VCC
Meas.
terminal
Min
Max
Unit
10 tPHL 3003 57 IN OUT GND 5.0 V 1A to 1Y 3 35
ns
TC = +125°C “ (Fig 4) 58 IN OUT " " 2A to 2Y " “ “
“ “ " 59 IN OUT " " 3A to 3Y " “
“
“ “ " 60 " OUT IN " 4A to 4Y " “
“
“ “ " 61 " OUT IN " 5A to 5Y " “
“
“ “ " 62 " OUT IN " 6A to 6Y " “
“
" tPLH " 63 IN OUT " " 1A to 1Y " 20 "
" “ " 64 IN OUT " " 2A to 2Y " “ “
“ “ " 65 IN OUT " " 3A to 3Y " “ “
“ “ " 66 " OUT IN " 4A to 4Y " “ “
“ “ " 67 " OUT IN " 5A to 5Y " “ “
“ “ " 68 " OUT IN " 6A to 6Y " “ “
11 Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
MIL-M-38510/8F
16
*
TABLE III. Group A inspection for device type 05.
Terminal conditions (High > 2.0 V or Low < 0.8 V or open).
Cases A,B,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
Case C 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup
Symbol
MIL-
STD-883
method Test No. 1A 1B 1Y 2A 2B 2Y GND 3Y 3A 3B 4Y 4A 4B VCC
Meas.
terminal
Min
Max
Unit
1 VOL2 3007 1 2.0 V 2.0 V 16 mA 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 4.5 V 1Y 0.4 V
TC = +25°C “ “ 2 5.5 V 5.5 V 2.0 V 2.0 V 16 mA " 5.5 V 5.5 V " " " 2Y “ “
“ “ “ 3 " " 5.5 V 5.5 V " 16 mA 2.0 V 2.0 V " " " 3Y “ “
“ “ “ 4 " " " " " 5.5 V 5.5 V 16 mA 2.0 V 2.0 V " 4Y “ “
“ ICEX 5 0.8 V 2.0 V 15.0 V " " " " " 5.5 V 5.5 V " 1Y 250
µA
” “ 6 2.0 V 0.8 V 15.0 V " " " " " " " " 1Y “ “
“ " 7 5.5 V 5.5 V 0.8 V 2.0 V 15.0 V " " " " " " 2Y " “
’‘ “ 8 " " 2.0 V 0.8 V 15.0 V " " " " " " 2Y “ “
“ " 9 " " 5.5 V 5.5 V " 15.0 V 0.8 V 2.0 V " " " 3Y " “
“ “ 10 " " " " " 15.0 V 2.0 V 0.8 V " " " 3Y " “
“ “ 11 " " " " " 5.5 V 5.5 V 15.0 V 0.8 V 2.0 V " 4Y " “
“ “ 12 " " " " " 5.5 V 5.5 V 15.0 V 2.0 V 0.8 V " 4Y " “
“ VIC 13 -12 mA " " 1A -1.5 V
“ “ 14 -12 mA " " 1B “ “
“ “ 15 -12 mA " " 2A “ “
“ “ 16 -12 mA " " 2B “ “
“ " 17 " -12 mA " 3A " "
“ “ 18 " -12 mA " 3B “ “
“ " 19 " -12 mA " 4A " "
“ “ 20 " -12 mA " 4B “ “
“ IIH1 3010 21 2.4 V GND GND GND " GND GND GND GND 5.5 V 1A 40 µA
“ “ " 22 GND 2.4 V GND " " " " " " " 1B “ “
“ “ " 23 " GND 2.4 V " " " " " " " 2A “ “
“ “ " 24 " " GND 2.4 V " " " " " " 2B “ “
“ " " 25 " " " GND " 2.4 V " " " " 3A " "
“ " “ 26 " " " " " GND 2.4 V " " " 3B " "
“ “ " 27 " " " " " " GND 2.4 V " " 4A “ “
“ “ " 28 " " " " " " " GND 2.4 V " 4B “ “
“ IIH2 3010 29 5.5 V " " " " " " " GND " 1A 100 “
“ “ " 30 GND 5.5 V " " " " " " " " 1B “ “
“ " " 31 " GND 5.5 V " " " " " " " 2A " "
“ " “ 32 " " GND 5.5 V " " " " " " 2B " "
“ “ " 33 " " " GND " 5.5 V " " " " 3A “ “
“ “ " 34 " " " " " GND 5.5 V " " " 3B “ “
“ “ " 35 " " " " " " GND 5.5 V " " 4A “ “
“ “ " 36 " " " " " " GND GND 5.5 V " 4B “ “
17
MIL-M-38510/8F
TABLE III. Group A inspection for device type 05. - Continued
Terminal conditions (High > 2.0 V or Low < 0.8 V or open).
Cases A,B,D 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Test limits
Case C 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Subgroup
Symbol
MIL-
STD-883
method Test No. 1A 1B 1Y 2A 2B 2Y GND 3Y 3A 3B 4Y 4A 4B VCC
Meas.
terminal
Min
Max
Unit
1 IIL 3009 37 0.4 V 5.5 V 5.5 V 5.5 V GND 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 1A -.7 -1.6 mA
TC = +25°C “ “ 38 5.5 V 0.4 V 5.5 V " " " " " " " 1B " " “
“ “ “ 39 " 5.5 V 0.4 V " " " " " " " 2A " " “
“ “ “ 40 " " 5.5 V 0.4 V " " " " " " 2B " " “
“ “ “ 41 " " " 5.5 V " 0.4 V " " " " 3A " " “
“ “ “ 42 " " " " " 5.5 V 0.4 V " " " 3B " " “
“ " “ 43 " " " " " " 5.5 V 0.4 V " " 4A " " “
“ “ “ 44 " " " " " " " 5.5 V 0.4 V " 4B " " “
“ ICCL 3005 45 " " " " " " " 5.5 V 5.5 V " VCC 22 “
“ ICCH 3005 46 GND GND GND GND " GND GND GND GND " VCC 8
"
2 Same tests, terminal conditions and limits as for subgroup 1, except TC = 125° C and VIC tests are omitted. VIL = 0.7 V for ICEX.
3 Same tests, terminal conditions and limits as for subgroup 1, except TC = -55° C and VIC tests are omitted.
9 tPHL 3003 47 IN 2.4 V OUT GND 5.0 V 1A to 1Y 3 25 ns
TC = +25°C “ (Fig 5) 48 IN 2.4 V OUT " " 2A to 2Y " “ “
“ “ " 49 " OUT IN 2.4 V " 3A to 3Y " “
“
“ “ " 50 " OUT IN 2.4 V " 4A to 4Y " “
“
" tPLH " 51 IN 2.4 V OUT " " 1A to 1Y " 30 "
" “ " 52 IN 2.4 V OUT " " 2A to 2Y " “ “
“ “ " 53 " OUT IN 2.4 V " 3A to 3Y " “
“
“ “ " 54 " OUT IN 2.4 V " 4A to 4Y " “
“
10 tPHL " 55 IN 2.4 V OUT " " 1A to 1Y " 35 "
TC = +125°C “ " 56 IN 2.4 V OUT " " 2A to 2Y " “ “
“ “ " 57 " OUT IN 2.4 V " 3A to 3Y " “
“
“ “ " 58 " OUT IN 2.4 V " 4A to 4Y " “
“
" tPLH " 59 IN 2.4 V OUT " " 1A to 1Y " 40 "
" “ " 60 IN 2.4 V OUT " " 2A to 2Y " “ “
“ “ " 61 " OUT IN 2.4 V " 3A to 3Y " “
“
“ “ " 62 " OUT IN 2.4 V " 4A to 4Y " “
“
11 Same tests, terminal conditions and limits as for subgroup 10, except TC = -55°C.
18
MIL-M-38510/8F
MIL-M-38510/8F
19
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel,
these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense
Agency, or within the military service's system command. Packaging data retrieval is available from the managing
Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the
responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory)
6.1 Intended use. Microcircuits conforming to this specification are intended for logistic support of existing
equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of the specification.
b. PIN and compliance identifier, if applicable (see 1.2).
c. Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d. Requirement for certificate of compliance, if applicable.
e. Requirements for notification of change of product or process to acquiring activity in addition
to notification to the qualifying activity, if applicable.
f. Requirements for failure analysis (including required test condition of method 5003), corrective action
and reporting of results, if applicable.
g. Requirements for product assurance options.
h. Requirements for carriers, special lead lengths or lead forming, if applicable. These requirements shall
not affect the part number. Unless otherwise specified, these requirements will not apply to direct
purchase by or direct shipment to the Government.
i. Requirements for "JAN" marking.
j. Packaging requirements (see 5.1).
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
6.4 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the
available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-
38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements
now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have
been retained to avoid adversely impacting existing government logistics systems and contractor's parts lists.
*
*
MIL-M-38510/8F
20
6.5 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined
in MIL-PRF-38535 and MIL-HDBK-1331, and as follows:
GND .................................................. Ground zero voltage potential.
V
IN ..................................................... Voltage level at an input terminal.
V
IC ..................................................... Input clamp voltage.
I
IN ...................................................... Current-flowing into an input terminal.
6.6 Logistic support. Lead materials and finishes (see 3.3) are interchangeable. Unless otherwise specified,
microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material
and finish A (see 3.4). Longer lead lengths and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users.
Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry
microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation
to case size. The presence of this information should not be deemed as permitting substitution of generic-industry
types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Device type Commercial type
01 5406
02 5416
03 5407
04 5417
05 5426
6.8 Supersession information. MIL-M-38510/8F supersedes MIL-M-38510/8E. MIL-M-0038510/8C(19) was issued
as an "in lieu of" document for MIL-M-38510/8B and was superseded by MIL-M-38510/8D.
6.9 Changes from previous issue. The margins of this specification are marked with asterisks to indicate where
changes from the previous issue were made. This was done as a convenience only and the Government assumes no
liability whatsoever for any inaccuracies in these notations. Bidders and contractors are cautioned to evaluate the
requirements of this document based on the entire content irrespective of the marginal notations and relationship to the
last previous issue.
Custodians: Preparing activity:
Army - CR DLA - CC
Navy - EC
Air Force - 11 (Project 5962-2005-005)
DLA - CC
Review activities:
Army - MI, SM
Navy - AS, CG, MC, SH, TD
Air Force - 03, 19, 99
NOTE: The activities listed above were interested in this document as of the date of this document. Since
organizations and responsibilities can change, you should verify the currency of the information above using the
ASSIST Online database at http://assist.daps.dla.mil.
