SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 1
DDR - LoRa
DDR - LoRa
DDR - LoRa
8x
LoRa
(G)FSK
(G)FSK/LoRa
Packet handler
MCU
SX1308
SPI
Packet
handler
Control
Tx/Rx
(Tx/Rx)
(GPS)
I/Q
I/Q
I/Q
I/Q
timestamp
General Description
The SX1308 digital baseband chip is a massive
digital signal processing engine specifically
designed to offer breakthrough gateway
capabilities in the ISM bands worldwide. It
integrates the LoRa concentrator IP.
The LoRa concentrator is a multi-channel high
performance transmitter/receiver designed to
simultaneously receive several LoRa packets
using random spreading factors on random
channels. Its goal is to enable robust
connection between a central wireless data
concentrator and a massive amount of
wireless end-points spread over a very wide
range of distances.
The SX1308 is targeted at smart metering
fixed networks and Internet of Things
applications.
Ordering Information
Part Number
Conditioning
SX1308IMLTRT
Tape & Reel
3,000 parts per reel
Pb-free, Halogen free, RoHS/WEEE compliant
product
Key Product Features
• Up to -139 dBm sensitivity with SX1257
or SX1255 Tx/Rx front-end
• 70 dB CW interferer rejection at
1 MHz offset
• Able to operate with negative SNR
• CCR up to 9 dB
• Emulates 49x LoRa demodulators and 1x
(G)FSK demodulator
• Dual digital Tx & Rx radio front-end
interfaces
• 10 programmable parallel demodulation
paths
• Dynamic data-rate adaptation (ADR)
• True antenna diversity or simultaneous
dual-band operation
Applications
• Smart Metering
• Security Sensors Network
• Agricultural Monitoring
• Internet of Things (IoT)
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 2
Contents
1 PIN CONFIGURATION .................................................................................................................. 4
1.1 Pins Placement and Circuit Marking ........................................................................................... 4
1.2 Pins Description .......................................................................................................................... 5
2 ELECTRICAL CHARACTERISTICS ................................................................................................... 7
2.1 Absolute Maximum Ratings ........................................................................................................ 7
2.2 Constraints on External ............................................................................................................... 7
2.3 Operating Conditions .................................................................................................................. 7
2.4 Electrical Specifications ............................................................................................................... 8
2.5 Timing Specifications .................................................................................................................. 8
3 CIRCUIT OPERATION ................................................................................................................... 9
3.1 General Presentation .................................................................................................................. 9
3.2 Power-On .................................................................................................................................... 9
3.2.1 Power-Up Sequence ................................................................................................................ 9
3.2.2 Setting the Circuit is Low-Power Mode .................................................................................. 9
3.3 Clocking ..................................................................................................................................... 10
3.4 SPI Interface .............................................................................................................................. 11
3.5 Rx I/Q Interface ......................................................................................................................... 12
3.5.1 I/Q Generated on Clock Rising Edge ..................................................................................... 12
3.5.2 I/Q Generated on Clock Falling Edge .................................................................................... 12
3.6 RX Mode Block Diagram, Reception Paths Characteristics ....................................................... 13
3.6.1 Block Diagram ....................................................................................................................... 13
3.6.2 Reception Paths Characteristics ............................................................................................ 14
3.7 Packet Engine and Data Buffers ................................................................................................ 15
3.7.1 Receiver Packet Engine ......................................................................................................... 15
3.7.2 Transmitter Packet Engine .................................................................................................... 17
3.8 Receiver IF Frequencies Configuration ..................................................................................... 19
3.8.1 Configuration Using 2 x SX1257 Radios ................................................................................ 19
3.8.2 Two SX1255: 433 MHz Band ................................................................................................. 21
3.8.3 One SX1257 and one SX1255 ................................................................................................ 21
3.9 Connection to RF Front End ...................................................................................................... 22
3.9.1 Connection to Semtech SX1255 or SX1257 Components ..................................................... 22
3.9.2 SX1308 RX Operation Using a Third Party RF Front End ....................................................... 22
3.9.3 Radio Calibration ................................................................................................................... 24
3.9.4 SX1308 Connection to RF Front End for TX Operation ......................................................... 24
3.10 Reference Application ............................................................................................................... 26
3.11 Hardware Abstraction Layer (HAL) ........................................................................................... 27
3.11.1 Introduction .......................................................................................................................... 27
3.11.2 Abstraction Presented to the Gateway Host ........................................................................ 27
4 EXTERNAL COMPONENTS ......................................................................................................... 29
5 PCB LAYOUT CONSIDERATIONS ................................................................................................ 30
6 PACKAGING INFORMATION ...................................................................................................... 32
6.1 Package Outline Drawing .......................................................................................................... 32
6.2 Thermal Impedance of Package ................................................................................................ 32
6.3 Land Pattern Drawing ............................................................................................................... 33
7 REVISION INFORMATION .......................................................................................................... 34
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 3
Figures
Figure 1: Top View of SX1308 Package with 64 Pins & Exposed Ground Paddle (Package Bottom) ...... 4
Figure 2: Power-up Sequence ................................................................................................................. 9
Figure 3: SPI Timing Diagram (single access) ........................................................................................ 11
Figure 4: I/Q on Clock Rising Edge ........................................................................................................ 12
Figure 5: I/Q on Clock Falling Edge ....................................................................................................... 12
Figure 6: SX1308 Digital Baseband Chip Block Diagram ....................................................................... 13
Figure 7: Access FIFO and Data Buffer .................................................................................................. 16
Figure 8: SX1255/57 Digital I/Q Power Spectral Density ...................................................................... 19
Figure 9: Radio Spectrum ...................................................................................................................... 20
Figure 10: Radio Spectrum .................................................................................................................... 20
Figure 11: Radio Spectrum .................................................................................................................... 21
Figure 12: Dual Band Operation ............................................................................................................ 22
Figure 13: SX1308 with Third Party Front End ...................................................................................... 23
Figure 14: Digital Interface for Third Party Radio ................................................................................. 23
Figure 15: Transmission Schematics ..................................................................................................... 25
Figure 16: Reference Application .......................................................................................................... 26
Figure 17: PCB Layout Example ............................................................................................................. 31
Figure 18: Package Dimensions ............................................................................................................ 32
Figure 19: Land Pattern Drawing .......................................................................................................... 33
Tables
Table 1: Pins Name and Description ....................................................................................................... 6
Table 2: Absolute Maximum Ratings ...................................................................................................... 7
Table 3: Externals .................................................................................................................................... 7
Table 4: Operating Conditions for Electrical Specifications .................................................................... 7
Table 5: Electrical Specifications ............................................................................................................. 8
Table 6: Timing Specifications ................................................................................................................. 8
Table 7: Packet Data Fields ................................................................................................................... 17
Table 8: Packet Structure for Transmission .......................................................................................... 18
Table 9: IF Frequencies Set ................................................................................................................... 20
Table 10: IF Frequency Used ................................................................................................................. 21
Table 11: Recommended External Components .................................................................................. 29
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 4
1 Pin Configuration
1.1 Pins Placement and Circuit Marking
1
16
17
32
64
49
48
33
SX1308
yyww
xxxxxxxx
Legend: yyww is the date code and xxxxxxxx is the Semtech lot number.
Figure 1: Top View of SX1308 Package with 64 Pins & Exposed Ground Paddle (Package Bottom)
The ground paddle must be connected to ground potential through a large conductive plane that
also serves for temperature dissipation.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 5
1.2 Pins Description
The table below gives the description of the pins of the circuit.
Pin
Pin Name
Type
0
VSS
Power (GND)
1
RESET
Input
2
HOST_SCK
Input
3
HOST_MISO
Output
4
HOST_MOSI
Input
5
HOST_CSN
Input
6
SCANMODE
Input
7
VSS
Power (GND)
8
VCC18
Power (VDD)
9
GPS_IN
Input
10
VSS
Power (GND)
11
VSS
Power (GND)
12
VCC18
Power (VDD)
13
RADIO_A_EN
Output
14
LNA_A_CTRL
Output
15
PA_A_CTRL
Output
16
NC
17
PA_GAIN[1]
Output
18
PA_GAIN[0]
Output
19
RADIO_B_CS
Output
20
RADIO_B_MOSI
Output
21
RADIO_B_MISO
Input
22
RADIO_B_SCK
Output
23
VCC18
Power (VCC)
24
VSS
Power (GND)
25
RADIO_RST
Output
26
PA_B_CTRL
Output
27
LNA_B_CTRL
Output
28
RADIO_B_EN
Output
29
VCC33
Power (VCC)
30
VSS
Power (GND)
31
VSS
Power (GND)
32
NC
33
NC
34
SP_VALID
Input
35
B_IQ_RX
Input
36
B_QI_RX
Input
37
B_IQ_TX
Output
38
B_QI_TX
Output
39
SP_CLK_OUT
Output
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 6
Pin
Pin Name
Type
40
GND
Power (GND)
41
GND
Power (GND)
42
VCC18
Power (VCC)
43
CLK32M
Input
44
A_IQ_RX
Input
45
A_QI_RX
Input
46
A_IQ_TX
Output
47
A_QI_TX
Output
48
NC
49
NC
50
VSS
Power (GND)
51
VSS
Power (GND)
52
VCC33
Power (VCC)
53
CLKHS
Input
54
GPIO[4]
In/Out
55
GPIO[3]
In/Out
56
GPIO[2]
In/Out
57
GPIO[1]
In/Out
58
GPIO[0]
In/Out
59
VSS
Power (GND)
60
VCC18
Power (VCC)
61
RADIO_A_SCK
Output
62
RADIO_A_MISO
Input
63
RADIO_A_MOSI
Output
64
RADIO_A_CS
Output
Table 1: Pins Name and Description
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 7
2 Electrical Characteristics
2.1 Absolute Maximum Ratings
Stresses above the values listed below may cause permanent device failure. Exposure to absolute
maximum ratings for extended periods may affect device reliability. Operation outside the
parameters specified in the Operating Conditions section is not implied.
Parameter
Symbol
Conditions
Value
IO power supply to VSS
VDDIO,ABSMAX
-0.5 V to 4.0 V
Core power supply to VSS
VDDCORE,ABSMAX
-0.5 V to 2.0 V
Storage temperature
TJ,STORE
-50 °C to 150 °C
Junction temperature
TJ,ABSMAX
-40 °C to 125 °C
Pin voltage on IO and Clock pins
VDPIN,ABSMAX
-0.3 V to VDDIO + 0.3 V
Peak reflow temperature
TPKG
260 °C
Latchup
ILUP
JESD78D, class I
+/-100 mA
Humidity
HR
0 – 95 %
ESD
HBM
Human Body Model
JESD22-A114 CLASS 2
2 kV
CDM
Charged Device Model
JESD22-C101 CLASS III
300 V
Table 2: Absolute Maximum Ratings
2.2 Constraints on External
Circuit is expected to be used with the following external conditions.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Radio ADC samples clock input
frequency
XTAL32F
Clock for data communication
with Tx
†
32
MHz
ADC sample clock frequency
tolerance
XTAL32T
-10
+10
ppm
High speed processing clock
HSC_F
Clock for data processing
130
133
150
MHz
Load on IO pins
CLOP
0
25
pF
Notes:
†
The data communication IOs are A_I_RX, A_Q_RX, B_X_RX, B_Q_RX and clock signal is CLK32M
Table 3: Externals
2.3 Operating Conditions
The circuit will operate full specs within the following operating conditions.
Parameter†
Symbol
Conditions
Min
Typ
Max
Unit
Digital IO supply
V
DDIO
Operating Conditions for
Electrical Specification
3.0
3.6
V
Digital core supply
V
DDCORE
Operating Conditions for
Electrical Specification
1.75
1.85
V
Ambient operating temperature
T
A
With chip paddle soldered to
PCB ground plan with
minimum 100 cm2 air
exposed area and heat sink
0
70
°C
Table 4: Operating Conditions for Electrical Specifications
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 8
2.4 Electrical Specifications
The table below gives the specifications of the circuit within the Operating Conditions as indicated in
2.3 unless otherwise specified.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Current Consumption
Current in idle mode
I
VDDCORE,IDLE
1.8V supply current in Idle
mode
1
120
5000
uA
I
VDDIO,IDLE
3.3V supply current in idle
mode
1
2
uA
Current in medium active
I
VDDCORE,MED
1.8V supply current with 4
active paths
330
600
mA
I
VDDIO,MED
3.3V supply current with 4
active paths – no load
5
10
mA
Current in full active
I
VDDCORE,FULL
1.8V supply current with 8
active paths
550
800
mA
I
VDDIO,FULL
3.3V supply current with 8
active paths – no load
5
10
mA
IO Pins levels
Logic low input threshold
VIL
“0” logic input
0.4
V
Logic high input threshold
VIH
“1” logic input
V
DDIO
– 0.4
V
Logic low output level
VOL
“0” logic output, 2 mA sink
VSS
VSS +
0.4
V
Logic high output level
VOH
“1” logic output, 2 mA
source
V
DDIO
–
0.4
V
DDIO
V
Table 5: Electrical Specifications
2.5 Timing Specifications
The table below gives the specifications of the circuit within the Operating Conditions as indicated in
2.3 unless otherwise specified. See chapters 3.4 and 3.5 for timing diagrams and symbol definitions.
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
SPI
SCK frequency
FSCK
-
-
10
MHz
SCK high time
tch
50
-
-
ns
SCK low time
tcl
50
-
-
ns
SCK rise time
trise
-
5
-
ns
SCK fall time
tfall
-
5
-
ns
MOSI setup time
t
setup
From MOSI change to SCK
rising edge.
10
-
-
ns
MOSI hold time
t
hold
From SCK rising edge to
MOSI change.
20
-
-
ns
CSN setup time
t
nsetup
From CSN falling edge to
SCK rising edge
10
-
-
ns
CSN hold time
t
nhold
From SCK falling edge to
CSN rising edge, normal
mode
40
-
-
ns
CSN high time between SPI
accesses
t
nhigh
40
-
-
ns
Clock to Rx I-Q data
Rx IQ hold and setup time
tIQ
2
-
-
ns
Table 6: Timing Specifications
1 Idle current is reached following procedure indicated in application part of datasheet (chapter 3.2.2)
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 9
3 Circuit Operation
This chapter is for information only.
3.1 General Presentation
The SX1308 is a smart baseband processor for long range ISM communication. In the receiver part, it
receives I and Q digitized bitstream from one or two receivers (SX1257 as an example), demodulates
these signals using several demodulators, adapting the demodulators settings to the received signal
and stores the received demodulated packets in a FIFO to be retrieved from a MCU. In the
transmitter part, the packets are modulated using a programmable (G)FSK/LoRa modulator and sent
to one transmitter (SX1257 as an example). Received packets can be time-stamped using a GPS
input.
The SX1308 has an internal control block that receives microcode from the MCU. The microcode is
provided by Semtech as a binary file to load in the SX1308 at power-on (see Semtech application
support for more information).
The control of the SX1308 by the MCU is made using a Hardware Abstraction Layer (HAL). The
Hardware Abstraction Layer source code is provided by Semtech and can be adapted by the MCU
developers. It is recommended to fully re-use the latest HAL as provided by Semtech on
https://github.com/Lora-net/picoGW_hal.
3.2 Power-On
3.2.1 Power-Up Sequence
Power-up sequence must follow the timing indicated in the figure below.
>= 0 ns
>= 0 ns >= 100 ns
VCC33
VCC18
RESET
Figure 2: Power-up Sequence
3.2.2 Setting the Circuit is Low-Power Mode
At power up, the circuit is in a general low-power state but some registers linked to the memory are
in undefined state. To set the circuit in low-power mode, the following instructions and clocks must
be provided to the circuit.
// Setting circuit in low-power mode after power-up
// spi_write(x, y) is a write of data “y” on address “x” on HOST SPI bus
spi_write(0,128); Reset On
spi_write(0,0); Reset Off
// provide at least 16 cycles on CLKHS and 16 cycles CLK32M
spi_write(18,1); BIST 1
// provide at least 4 cycles on CLKHS and 32 cycles CLK32M and 4 cycles on HOST_SCK
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 10
spi_write(18,2); BIST 2
// provide at least 4 cycles CLK32M and 4 cycles on HOST_SCK
spi_write(0,128); Reset On
spi_write(0,0); Reset Off
Idle mode sequence after power-up
3.3 Clocking
The SX1308 gateway requires two clocks.
• A 32MHz clock synchronous with the ADC samples. This clock is used to internally sample
the ADC samples and clock all the decimation filters. When the SX1308 is used with a
Semtech S1257 or SX1255 RF front-end, this clock is provided by the radio. This clock uses
CMOS levels (0 – 3.3 V). If a third party radio front-end is used, this must be the clock that
also clocks the ADCs and serves as a reference for the radio PLLs.
• A high speed clock whose frequency can be anywhere in the range 130 - 150 MHz. This clock
uses CMOS level and must be provided from an external Oscillator. There is no constraint on
this clock jitter. This clock is used for most of the demodulation blocks and data processing.
This clock is never used by any of the analog/radio blocks.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 11
3.4 SPI Interface
The SPI interface gives access to the configuration register via a synchronous full-duplex protocol.
Only the slave side is implemented.
Three access modes to the registers are provided:
• SINGLE access: an address byte followed by a data byte is sent for a write access whereas an
address byte is sent and a read byte is received for the read access. The CSN pin goes low at
the beginning of the frame and goes high after the data byte.
• BURST access: the address byte is followed by several data bytes. The address is
automatically incremented internally between each data byte. This mode is available for
both read and writes accesses. The CSN pin goes low at the beginning of the frame and stay
low between each byte. It goes high only after the last byte transfer.
• FIFO access: if the address byte corresponds to the address of the FIFO, then succeeding
data byte will address the FIFO. The address is not automatically incremented but is
memorized and does not need to be sent between each data byte. The CSN pin goes low at
the beginning of the frame and stay low between each byte. It goes high only after the last
byte transfer.
The figure below shows a typical SPI single access to a register.
Figure 3: SPI Timing Diagram (single access)
MOSI is generated by the master on the falling edge of SCK and is sampled by the slave (i.e. this SPI
interface) on the rising edge of SCK. MISO is generated by the slave on the falling edge of SCK.
MISO is always low impedance so it cannot be shared with another device.
A transfer is always started by the CSN pin going low.
The first byte is the address byte. It is comprises:
• one wnr bit, which is “1” for write access and “0” for read access.
• then seven bits of address, MSB first.
The second byte is a data byte, either sent on MOSI by the master in case of a write access or
received by the master on MISO in case of read access. The data byte is transmitted MSB first.
Proceeding bytes may be sent on MOSI (for write access) or received on MISO (for read access)
without a rising CSN edge and re-sending the address. In FIFO mode, if the address was the FIFO
address then the bytes will be written / read at the FIFO address. In Burst mode, if the address was
not the FIFO address, then it is automatically incremented for each new byte received.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 12
The frame ends when CSN goes high. The next frame must start with an address byte. The SINGLE
access mode is therefore a special case of FIFO / BURST mode with only 1 data byte transferred.
During the write access, the byte transferred from the slave to the master on the MISO line is the
value of the written register before the write operation.
3.5 Rx I/Q Interface
The Rx I/Q bit stream has to be generated relative to the radio clock (32 MHz).
The SX1308 can manage I/Q generated on both clock rising and falling edges.
3.5.1 I/Q Generated on Clock Rising Edge
To relax the constraint on setup and hold time, it is recommended to use the falling edge of the
clock.
To avoid internal setup and hold violation, it is mandatory to avoid I/Q change in a range of +/- 2 ns
around clock falling edge
Figure 4: I/Q on Clock Rising Edge
3.5.2 I/Q Generated on Clock Falling Edge
To relax the constraint on setup and hold time, it is recommended to use the rising edge of the clock
To avoid internal setup and hold violation, it is mandatory to avoid I/Q change in a range of +/- 2 ns
around clock rising edge
Figure 5: I/Q on Clock Falling Edge
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 13
3.6 RX Mode Block Diagram, Reception Paths Characteristics
3.6.1 Block Diagram
Figure 6: SX1308 Digital Baseband Chip Block Diagram
All chip functionalities can be accessed through a single high speed SPI interface.
The chip integrates two dedicated micro-controllers.
1. A radio AGC MCU. Handling the real time automatic gain control of the entire chain. For this
purpose this MCU can control the two radio front-ends through a dedicated SPI master
interface. This MCU also handles radio calibration and RX<->TX radio switch
2. A packet arbiter MCU. Assigning the available LoRa modems to the various reception paths.
This arbiter can be configured to follow different priority rules based on parameters like data
rate of the incoming packet, channel, radio path or signal strength of the incoming packet.
The firmware of those 2 MCUs can be fully programmed at any time through the HOST SPI
interface. This firmware is embedded in the Hardware Abstraction Layer provided by Semtech
and does not need to be developed by the user.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 14
3.6.2 Reception Paths Characteristics
The SX1308 digital baseband chip contains 10 programmable reception paths. Those paths have
differentiated levels of programmability and allow different use cases. It is important to understand
the differences between those demodulation paths to make the best possible use from the system.
IF8 LoRa Channel
This channel can be connected to Radio A or B using any arbitrary intermediate frequency within the
allowed range. This channel is LoRa only. The demodulation bandwidth can be configured to be 125,
250 or 500 kHz. The data rate can be configured to any of the LoRa available data rates (SF7 to SF12)
but, as opposed to IF0 to 7, ONLY the configured data rate will be demodulated. This channel is
intended to serve as a high speed backhaul link to other gateways or infrastructure equipment. This
demodulation path is compatible with the signal transmitted by the SX1272 & SX1276 chip family.
IF9 (G)FSK Channel
Same as previous except that this channel is connected to a GFSK demodulator. The channel
bandwidth and bitrate can be adjusted. This demodulator offers a very high level of configurability,
going well beyond the scope of this document. The demodulator characteristics are essentially the
same than the GFSK demodulator implemented on the SX1232 and SX1272 Semtech chips.
This demodulation path can demodulate any legacy FSK or GFSK formatted signal.
IF0 to IF7 LoRa Channels
Those channels can be connected individually to Radio A or B. The channel bandwidth is 125 kHz
and cannot be modified or configured. Each channel IF frequency can be individually configured. On
each of those channels any data rate can be received without prior configuration. Several packet
using different data rates may be demodulated simultaneously even on the same channel. Those
channels are intended to be used for a massive asynchronous star network of 10000’s of sensor
nodes. Each sensor may use a random channel (amongst IF0 to 7) and a different data rate for any
transmission.
Typically sensor located near the gateway will use the highest possible data rate in the fixed 125 kHz
channel bandwidth (e.g. 6 kbit/s) while sensors located far away will use a lower data rate down to
300 bit/s (minimum LoRa data rate in a 125 kHz channel).
The SX1308 digital baseband chip scans the 8 channels (IF0 to IF7) for preambles of all data rates at
all times. The chip is able to demodulate simultaneously up to 8 packets. Any combination of up to 8
packets is possible (e.g. one SF7 packet on IF0, one SF12 packet on IF7 and one SF9 packet on IF1
simultaneously).
The SX1308 can detect simultaneously preambles corresponding to all data rates on all IF0 to IF7
channels. However it cannot demodulate more than 8 packets simultaneously. This is because the
SX1308 architecture separates the preamble detection and acquisition task from the demodulation
process. The number of simultaneous demodulation (in this case 8) is an arbitrary system parameter
and may be set to any value for a customer specific circuit.
The unique multi data-rate multi-channel demodulation capacity of channels 0 to 7 allow innovative
network architecture to be implemented:
• End-point nodes can change frequency with each transmission in a random pattern. This
provides vast improvement of the system in term of interferer robustness and radio channel
diversity
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 15
• End-point nodes can dynamically perform link rate adaptation based on their link margin
without adding to the protocol complexity. There is no need to maintain a table of which
end point uses which data rate, because all data rates are demodulated in parallel.
• True antenna diversity can be achieved on the gateway side. Allows better performance for
mobile nodes in difficult multi-path environments.
3.7 Packet Engine and Data Buffers
3.7.1 Receiver Packet Engine
Each time any of the demodulators decodes a packet, it is tagged with some additional information
and stored in a shared data buffer (the data buffer size is 1024 bytes). For this purpose a specific
data buffer management block reserves a segment with the necessary length in the data buffer and
at the same time, stores the start address and the length of the packet field in a small FIFO type
structure (named the access FIFO). The FIFO can contain up to 16 (start_addr, length) pairs.
A status register contains at any moment the number of packets currently stored in the data buffer
(and in the access FIFO).
To retrieve a packet, the host micro-controller first advances 1 step in the access FIFO by writing 1 to
the ‘next’ bit. Then reads the (start_addr, length) information. The host micro-controller can now
retrieve in one SPI burst operation the entire packet and associated meta-data by reading
‘length’+16 bytes starting at address ‘start_addr’ in the data buffer .. To do so, first position the
HOST address pointer to ‘start-addr’, then read ‘length’ + 16 bytes from the ‘packet_data’ register.
At the end of each byte the HOST address pointer is automatically incremented.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 16
Figure 7: Access FIFO and Data Buffer
The packet data is organized as follows:
Packet buffer data organization
Offset from start
pointer
Data stored
Comment
0
PAYLOAD PAYLOAD DATA
…
…
…
…
payload_size-1
payload_size
CHANNEL
1 to 10 as described by block diagram
1+payload_size
SF[3:0],CR[2:0],CRC_EN
2+payload_size
SNR AVERAGE
averaged SNR in dB on the packet length
3+payload_size SNR MIN minimum SNR (dB) recorded during packet
length
4+payload_size
SNR MAX
maximum SNR recorded during packet length
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 17
5+payload_size RSSI channel signal strength in dB averaged during
packet
6+payload_size
TIMESTAMP[7:0]
32 bits time stamp , 1 us step
7+payload_size
TIMESTAMP[15:8]
8+payload_size
TIMESTAMP[23:16]
9+payload_size
TIMESTAMP[31:24]
10+payload_size
CRC_VALUE[7:0]
value of the computed CRC16
11+payload_size
CRC_VALUE[15:8]
12+payload_size
MODEM ID
13+payload_size
RX_MAX_BIN_POS[7:0]
Correlation peak position
14+payload_size
RX_MAX_BIN_POS[15:8]
15+payload_size RX_CORR_SNR Detection correlation SNR
16+payload_size Reserved
17+payload_size
Reserved
Table 7: Packet Data Fields
This means that the host micro-processor has to read 16 additional bytes on top of each packet to
have access to all the meta-data. If the host is only interested in the payload itself + the channel and
the data rate used, then payload + 2bytes is enough.
3.7.2 Transmitter Packet Engine
The SX1308 gateway transmitter can be used to send packets. The following parameters can be
dynamically programmed with each packet:
• Radio channel
• FSK or LoRa modulation
• Bandwidth, data rate, coding rate (in LoRa mode), bit rate and Fdev (in FSK mode)
• RF output power
• Radio path (A or B)
• Time of departure (immediate or differed based on the gateway hardware clock with 1us
accuracy)
All those dynamic parameter fields are sent alongside the payload in the same data buffer.
The data buffer can only hold a single packet at a time (next packet to be sent). The scheduling and
ordering task is let to the host micro-processor.
The host micro-processor can program the exact time of departure of each packet relative to the
gateway hardware clock. The same clock is used to tag each packet received with a 32bits
timestamp. The same 32bits time stamp principle is used in TX mode to indicate when to transmit
exactly. This removes the real time constraint from the host micro-processor and allows very precise
protocol timing.( For example, if the protocol running on the end point expects and acknowledge
exactly one sec after the end of each packet of its uplink). The host micro-processor pulls the uplink
packet from the RX packet engine, realizes that it must send an acknowledge, takes the uplink
packet time stamp, simply increments it by 1 sec and uses that value to program the time of
departure of the acknowledge packet. Exactly one second (+/- 1us) after the uplink packet was
received, the gateway will transmit the desired acknowledge packet. This allows very tight reception
interval windows on the battery powered end points hence improved battery life.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 18
The packet structure for transmission is as follow:
Byte
Subfield
Description
comment
0
23:16
Channel frequency Fchan/32MHz*2^19
1
15:8
2
7:0
3
31:24
Start time
Value of the timer at which the
modem has to start (in us)
4
23:16
5
15:8
6
7:0
7
7:6
Reserved
5:5
Radio select
Select radio A (0) or B (1)
4:4
Modulation type
0:LoRa, 1:FSK
3:0
Tx power
>7: 20dBm, otherwise 14dBm
8
Reserved
LoRa:
9
7:7
Payload CRC16 enable
Enables CRC16
6:4
Coding rate
Coding rate = 4/(4+CR)
3:0
SF
6 to 12
10
7:0
Payload length
number of bytes
11
7:3
Reserved
2:2
Implicit header enable
1:0
Modulation bandwidth
2:500, 1:250, 0:125 kHz
12
15:8
Preamble symbol number Number of symbols in the preamble
13
7:0
14
Reserved
15
Reserved
FSK:
9
7:0
FSK frequency deviation
Frequency deviation in KHz
10
7:0
Payload length
number of bytes
11
0 Packet Mode
0 -> fixed length
1 -> variable length
1 CRC enable
0 -> No CRC
1 -> CRC
3:2 Dcfree Enc
00 -> DC free encoding off
01 -> Manchester encoding
10 -> Whitening Encoding
11 -> reserved
4 Crc IBM
0 -> CCITT CRC
1 -> IBM CRC
12
15:8
FSK Preamble Size
The number of preamble bytes sent
over the air before the sync pattern.
13
7:0
FSK Preamble Size
14
15:8
FSK bit rate
Bit rate = 32e6/(FSK bit rate)
15
7:0
FSK bit rate
16
Payload first byte
Up to 128 bytes
Table 8: Packet Structure for Transmission
For words of more than 1 byte, MSBs are sent first.
Bytes 9 to 15 vary depending whether the FSK or the LoRa TX modem is being used.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 19
The user payload starts at byte 16. This is the first byte that will be received by the end point. Bytes 0
to 15 are not transmitted and are just used to dynamically configure the gateway prior to emission.
3.8 Receiver IF Frequencies Configuration
Each IF path intermediate frequency can be programmed independently from -2 to +2 MHz. The
following sections give a few programming examples for various use cases.
3.8.1 Configuration Using 2 x SX1257 Radios
The SX1257 RX PLLs can be configured to any frequency inside the 868/900 MHz ISM band with a
61 Hz step. The SX1257 streams I/Q samples through a 2 wire digital interface. The bits stream
corresponds directly to the I/Q sigma delta ADCs outputs sampled at 32 MSps. This delta sigma
stream must be low-passed and decimated to recover the available 80dB dynamic of the ADCs. After
decimation the usable spectrum bandwidth is ±400 kHz centered on the RX PLL carrier frequency.
The following plot gives the spectral power content of the I/Q bit stream.
Figure 8: SX1255/57 Digital I/Q Power Spectral Density
The quantization noise raises sharply outside the -400 to +400 kHz range. For more details on the
SX1257/55 radio specifications please consult the specific product datasheet.
The following plot represents a possible use case where
• Radio A PLL is set to 867.0 MHz
• Radio B PLL is set to 868.4 MHz
• The system uses 8 separate 125 kHz LoRa channels for star connection to sensors
• One high speed 250 kHz LoRa channel for connection to a relay
• One high speed 200 kHz GFSK channel for meshing
-8 -6 -4 -2 0 2 46810
x 10
5
-10
0
10
20
30
40
signal power spectral density
dB
Hz (10
5
)
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 20
Figure 9: Radio Spectrum
In the previous example the various IF frequencies would be set as follow:
IF8
A: -125kHz
Lora backhaul , fixed data-rate
IF9
B: 0kHz
GFSK backhaul
IF0
A: -312.5kHz
LoRa multi-data rate channel
IF1
A: 62.5kHz
“
IF2
A: 187.5kHz
“
IF3
A: 312.5kHz
“
IF4
B: -312.5kHz
“
IF5
B: -187.5kHz
“
IF6
B: 187.5kHz
“
IF7
B: 312.5kHz
“
Table 9: IF Frequencies Set
If for example, 8 contiguous 125 kHz LoRa channels are desired the following configuration may be
used:
• Radio A PLL is set to 867 MHz
• Radio B PLL is set to 876.5 MHz
The two radio baseband spectrum overlap a little bit.
Figure 10: Radio Spectrum
The following IF frequencies are used:
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 21
IF8
A: 0 kHz
Lora backhaul , fixed data-rate
IF9
Not used
GFSK backhaul
IF0
B: -187.5 kHz
LoRa multi-data rate channel
IF1
B: -62.5 kHz
“
IF2
B: 62.5 kHz
“
IF3
B: 187.5 kHz
“
IF4
A: -187.5 kHz
“
IF5
A: -62.5 kHz
“
IF6
A: 62.5 kHz
“
IF7
A: 187.5 kHz
“
Table 10: IF Frequency Used
Note : As shown in this example the 500 or 250 kHz IF1 LoRa channel may overlap with the multi-
data rate IF3 to 10 channels. Transmissions happening in the IF7 to 10 channels will be noise like for
the IF1 LoRa demodulator and reciprocally. It is however better from a performance point of view to
separate as much as possible different channels mainly when the associated signal powers are very
different (like between a backhaul link which usually enjoys line-of-sight attenuation and sensor link
with very low signal levels).
3.8.2 Two SX1255: 433 MHz Band
The circuit will behave exactly as described in the previous section except that everything can be
transposed in the 433 MHz ISM band using SX1255 front-end radios instead of SX1257.
3.8.3 One SX1257 and one SX1255
In that case dual band simultaneous reception is possible. The following configuration is a typical
example of the possible system configuration.
Figure 11: Radio Spectrum
• Radio A is an SX1255 configured on 433.6 MHz
• Radio B is a SX1257 configured on 866.4 MHz
• 4 multi data-rates 125 kHz LoRa channel in the low –band
• 4 multi data-rates 125 kHz LoRa channel in the high –band
• One 250 kHz LoRa fixed data-rate channel superposed with a 200 kHz GFSK channel in the
high band
As can be seen the system is extremely flexible and allows any arbitrary set of channel configuration.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 22
3.9 Connection to RF Front End
3.9.1 Connection to Semtech SX1255 or SX1257 Components
The SX1308 digital baseband chip is designed to be preferably interfaced with either:
1. 2x SX1257 radio front-ends for the 868 MHz band with antenna diversity support
2. 2x SX1255 radio front-ends for the 433 MHz band with antenna diversity support
3. 1x SX1257 & 1x SX1255 , enabling simultaneous dual-band operation
All modems Intermediate Frequencies may be adjusted independently within the allowed radio
baseband bandwidth, e.g. ±400 kHz. Optimized firmware is provided to optimally setup the
SX1257/55 radios and perform real time automatic gain control.
Figure 12: Dual Band Operation
3.9.2 SX1308 RX Operation Using a Third Party RF Front End
In that case a third party RF front-end may be used. The digitized I/Q stream must be adapted to the
specific format required by the SX1308 digital baseband using an FPGA/CPLD or any other suitable
programmable component.
In that mode the SX1308 expects a stream of 4 bits samples at a 32 MSps rate. The “Sample valid”
input should pulse every 8 clock cycles to delimit packets of 8 samples. From those 8 samples
representing 32 bits, the first 24 MSB are kept as I/Q 12bits sample information and fed to the
internal sample 4 MSps sample bus.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 23
All modems Intermediate Frequencies may be adjusted independently within the allowed radio
baseband bandwidth up to 2 MHz (third party radio and FPGA/CPLD digital filtering dependent)
The 32MHz clock input is not represented for the sake of clarity.
Figure 13: SX1308 with Third Party Front End
The digital interface to third party radio works as follow:
Figure 14: Digital Interface for Third Party Radio
The RF front-end must provide a 32 MHz clock. ”Sample valid” and data bits must change state on
the rising edge of the clock. They are sampled internally in the SX1308 digital IC on the falling edge of
the 32 MHz clock.
The “sample valid” signal signals the start of a new I/Q sample. The I/Q ‘bits chunks are time
interleaved.
When the SX1308 digital baseband chip is connected to a third party radio front-end, the firmware
running on the AGC MCU can be changed to perform dynamic gain adaptation of the external radio
chip through an SPI interface. The radio SPI interface must fulfill the following conditions:
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 24
1. 7 bits address width and 1 W/R bit
2. 8 bits data width
The “Chip select” signal polarity is programmable.
3.9.3 Radio Calibration
All calibrations required are performed by uploading the calibration firmware to the integrated radio
controller MCU. This specific firmware runs entirely on the SX1308 gateway without intervention of
the host micro-processor and performs the following calibrations on both radio channels:
• Carrier leakage cancellation in TX mode
• IQ gain (better than 0.1 dB) and phase imbalance (better than 1 deg) in RX mode
All corrections are applied digitally inside the SX1308 gateway at the appropriate place in the TX &
RX processing chains.
During the duration of the calibration (500 ms), no RX or TX operation is possible.
3.9.4 SX1308 Connection to RF Front End for TX Operation
In TX mode, the SX1308 digital baseband must be connected either to:
1. At least one SX1255 or SX1257
2. Any combination of both radios
Any LoRa or (G)FSK packet may be transmitted on any of the two radios. Only a single packet may be
transmitted at any given time. Transmit operation interrupts all current reception operations.
The digital radio interfaces are separated between RX & TX, therefore the SX1308 may
accommodate a third party radio front-end for RX operations and any combination of SX1255/57 for
TX operation without problem.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 25
Figure 15: Transmission Schematics
A third party radio can be supported for TX operations as well. If the third party radio SPI protocol
differs from SX1255/57 then the SPI protocol from SX1308 must be adapted to the specific format
required by the third party radio using an FPGA/CPLD or any other suitable programmable
component. In that mode the digitized I/Q stream from the SX1308 is a sigma delta 1 bit sample at a
32 MSps rate and must also be adapted to the specific format required by the third party radio using
an FPGA/CPLD or any other suitable programmable component.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 26
3.10 Reference Application
Figure 16: Reference Application
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 27
3.11 Hardware Abstraction Layer (HAL)
3.11.1 Introduction
The Semtech SX1308 is an all-digital half-duplex radio modem capable of receiving multiple
modulations, multiple radio channels, and multiple data rates simultaneously. This SX1308 is highly
configurable.
Because of the variable number (and types) of radio channels, modems and transceivers, and
because the different hardware implementations can be quite different (typically, not the same
register mapping, naming and various features), presenting a unified Hardware Abstraction Layer
(HAL) software to the user can greatly simplify writing an application and porting an application
between different hardware.
The SX1308 registers are managed by the HAL software. The HAL software can be found on GitHub
at the following address:
https://github.com/Lora-net/picoGW_hal
The hardware supported by the current HAL software is the following:
• SX1308 based board
• Two SX1257 radios
• FPGA (TX mask baseband filter, Background Spectral Scan state machine and SPI muxing)
and associated SX1272 radio to execute Background Spectral Scan feature
• A native SPI link between the gateway host and the SX1308 LoRa concentrator
One example of how to use the HAL software is the packet_forwarder program running on the host
of a LoRA gateway. The packet_forwarder program can be found on GitHub at the following address:
https://github.com/Lora-net/picoGW_packet_forwarder
3.11.2 Abstraction Presented to the Gateway Host
The system composed of a SX1308 and one or more radio transceivers is represented to the user as
the following entities:
• 1 or more radio chains,
• 1 or more RX modems with a settable Intermediate Frequency (IF),
• A unified RX packet buffer,
• A single TX chain.
The link between the SX1308 and the gateway host is transparent for the user.
Radio Chain
A radio chain selects and amplifies a limited portion of the RF spectrum, and digitizes it to be used by
the modem chains.
A radio chain is characterized by its bandwidth, maximum and minimum allowed RF frequency in RX,
maximum and minimum allowed RF frequency in TX.
Modem Chain
A modem chain demodulates a small portion (a RF channel) of the RF spectrum digitized by a radio
chain. Each modem chain RF channel can be placed individually inside the bandwidth of a radio using
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 28
the IF (for Intermediate Frequency) setting, that’s why they are designated in the abstraction as
“IF+modem” chains.
The modem demodulates packets according to it intrinsic capabilities (e.g. the modulations it can
process) and user-selected settings (e.g. what is the channel bandwidth for modems that supports
multiple bandwidths) and send the receive packets to the RX buffer.
An IF+modem chain is characterized by its type (e.g. Lora “multi”, FSK “standard”). That type defines
what sort of signal can be demodulated and how the settings are interpreted.
RX Buffer
Packets that are received by all the modem chains are stored in the RX packet buffer until the
gateway host come and fetch them.
TX Chain
The TX chain is composed of a single multi-standard, multi-bandwidth, multi-data-rate modem and is
used to send the single packet waiting in the TX packet buffer through one of the radio chains.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 29
4 External Components
A decoupling capacitor (Cdec) is required to minimize the ripple on the power lines.
Component
Value
Manufacturer
Part number
Package
Cdec
100 nF, 10 V
TDK
C0603X5R1A104KT
0201 (0603 metric)
100 nF, 6.3 V
Taiyo Yuden
EMK063AC6104MP-F
0201 (0603 metric)
100 nF, 6.3 V
Murata
GRM033R60J104ME19D
0201 (0603 metric)
Table 11: Recommended External Components
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 30
5 PCB Layout Considerations
The bottom ground paddle must be soldered to a ground plane. The ground plane must be large
enough to support SX1308 power dissipation.
The PCB layout must minimize distances between the IC and the decoupling capacitors.
PCB dimensions: 73mm x 31mm x 1.6mm – 4-layers FR4 with 6x6 via holes.
Caution!
This PCB is size-constrained which has a significant impact on thermal dissipation capabilities. Design
integrators should take care of thermal engineering to ensure proper dissipation.
Top Layer - Signals
Mid Layer 1
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 31
Mid Layer 2
Bottom layer – thermal dissipation
Figure 17: PCB Layout Example
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 32
6 Packaging Information
6.1 Package Outline Drawing
MILLIMETERS
0.50 BSC
.002
-0.00
.000A1
.350
.350
.276
.276
.012
.007
E1
aaa
bbb
N
e
L
A2
D1
D
E
b
.020 BSC
.281
.016
.003
.004
64
.354
(.008)
.281
.354
.010
-
7.00.285
.020 0.30
.358
.358
.285
-
.012
8.90
8.90
7.00
-
0.18
.031
MIN
DIM
A
MAX
DIMENSIONS
INCHES
-
NOM
.039 0.80
MIN
-0.05
9.10
9.10
7.25
7.25
0.50
0.30
7.15
0.40
0.10
0.08
64
9.00
(0.20)
7.15
9.00
0.25 -
1.00
MAX
-
NOM
SEATING
PLANE
1
2
N
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
2.
1.
PIN 1
INDICATOR
(LASER MARK)
A1
E
D
A
A2
D/2
AB
C
aaa C
e
e/2
E1
D1
E/2
LxN
bxN
M
bbb CA B
Figure 18: Package Dimensions
6.2 Thermal Impedance of Package
Thermal impedance with natural convection is 16.4 °C/W. Thermal impedance with heat sink on
package bottom is 0.18 °C/W.
The measurement was made with chip paddle soldered to PCB ground plane with minimum 100 cm²
air exposed area and heat sink per JESD51-7. The package is mounted on a 4-layer (2S2P) standard
JEDEC board.
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 33
6.3 Land Pattern Drawing
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
X
Y
H
K
P
C
G
MILLIMETERSINCHES
(8.95)
.012
.033
.319
.020
.287
.287
(.352)
0.30
0.85
7.30
0.50
7.30
8.10
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
9.80.386Z
SQUARE PACKAGE - DIMENSIONS APPLY IN BOTH " X " AND " Y " DIRECTIONS.
FUNCTIONAL PERFORMANCE OF THE DEVICE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
4.
3.
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
P
Y
X
(C) G
H
KZ
Figure 19: Land Pattern Drawing
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 34
7 Revision Information
Revision
Information
V1.0
First Release
V1.1
Correction of typos
V1.2
First publication on the website
Addition of the environmental data
SX1308
WIRELESS & SENSING PRODUCTS Datasheet
V1.2 June 2017 www.semtech.com 35
© Semtech 2017
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent
of the copyright owner. The information presented in this document does not form part of any
quotation or contract, is believed to be accurate and reliable and may be changed without notice.
No liability will be accepted by the publisher for any consequence of its use. Publication thereof
does not convey nor imply any license under patent or other industrial or intellectual property
rights. Semtech assumes no responsibility or liability whatsoever for any failure or unexpected
operation resulting from misuse, neglect improper installation, repair or improper handling or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the
specified maximum ratings or operation outside the specified range.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL
APPLICATIONS. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE
UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech
products for any such unauthorized application, the customer shall indemnify and hold Semtech and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs
damages and attorney fees which could arise.
Contact Information
Semtech Corporation
Wireless & Sensing Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111 Fax: (805) 498-3804
www.semtech.com