2007-04-20
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BBY66...
Silicon Tuning Diodes
• High capacitance ratio
• High Q hyperabrupt tuning diode
• Low series resistance
• Designed for low tuning voltage operation
for VCO's in mobile communications equipment
• Very low capacitance spread
• Pb-free (RoHS compliant) package1)
• Qualified according AEC Q101
BBY66-02V BBY66-05
BBY66-05W
!
,
,
Type Package Configuration LS(nH) Marking
BBY66-02V
BBY66-05
BBY66-05W
SC79
SOT23
SOT323
single
common cathode
common cathode
0.6
1.8
1.4
h
O1s / O2s*
*
OBs
**For differences see next page Capacitance groups
Maximum Ratings at TA = 25°C, unless otherwise specified
Parameter Symbol Value Unit
Diode reverse voltage VR12 V
Forward current IF50 mA
Operating temperature range Top -55 ... 150 °C
Storage temperature Tstg -55 ... 150
1Pb-containing package may be available upon special request
2007-04-20
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BBY66...
Electrical Characteristics at TA = 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Reverse current
VR = 10 V
VR = 10 V, TA = 65 °C
IR
-
-
-
-
20
200
nA
AC Characteristics
Diode capacitance1)
VR = 1 V, f = 1 MHz
VR = 2 V, f = 1 MHz
VR = 3 V, f = 1 MHz
VR = 4.5 V, f = 1 MHz
CT
66
33
19.7
12
68.7
35.4
20.95
12.7
71.5
38
22.2
13.5
pF
Capacitance ratio
VR = 1 V, VR = 4.5 V CT1/CT4.5 5 5.41 -
Series resistance
VR = 1 V, f = 470 MHz rS- 0.25 0.4 Ω
1Capacitance groups at 1V, coded 01; 02 (only BBY66-05)
CT/groups 01 02
C1V min 66pF 68.5pF
C1V max 69pF 71.5pF
Deliveries contain either CT group 01 or group 02 (marked on reel).
No direct order of CT groups possible
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Diode capacitance CT = ƒ (VR)
f = 1MHz
0123V5
VR
0
10
20
30
40
50
60
pF
80
CT
Temperature coefficient of the diode
capacitance TCc = ƒ (VR)
1 2 3 V5
VR
0
300
600
ppm/°C
1200
TCC
Reverse current IR = ƒ(VR)
TA = Parameter
2 3 4 5 6 7 8 9 10 V12
VR
0
10
1
10
2
10
3
10
4
10
pA
IR
TA=+25°C
TA=+65°C
TA=+85°C
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BBY66...
Package SC79
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch)
Reel ø330 mm = 10.000 Pieces/Reel
±0.1
1.6
0.3
1
2
marking
Cathode
0.8 ±0.1
10
˚
MAX.
±0.1
1.2
A
±0.05
10
˚
MAX.
0.13
A0.2
M
+0.05
-0.03
±0.04
0.55
±0.05
0.2
0.35
0.35
1.35
BAR63-02V
Type code
Cathode marking
Laser marking
2
0.66
0.93
0.4
1.33
1.96
8
0.2
Cathode
marking
4
Cathode
marking
Standard Reel with 2 mm Pitch
2005, June
Date code
2007-04-20
5
BBY66...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04dsDSdsDSdsDS
05et ETet ETet ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08hxHXhxHXhxHX
09jyJYjyJYjyJY
10kzKZkzKZkzKZ
11l 2L4l 2L4l 2L4
12n3N5n3N5n3N5
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Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EH
s
BCW66
Type code
Pin 1
0.8
0.9 0.91.3
0.8 1.2
0.25 MBC
1.9
-0.05
+0.1
0.4
±0.1
2.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚ MAX.
0.08...0.15
1.3
±0.1
10˚ MAX.
M
2.4
±0.15
±0.1
1
A
0.15 MIN.
1)
1) Lead width can be 0.6 max. in dambar area
12
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Manufacturer
2005, June
Date code (YM)
2007-04-20
7
BBY66...
Package SOT323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.25
±0.1
0.1 MAX.
2.1
±0.1
0.15
+0.1
-0.05
0.3
+0.1
±0.1
0.9
12
3A
±0.2
2
-0.05
0.650.65
M
3x 0.1
0.1 MIN.
0.1
M
0.2 A
0.2
4
2.15 1.1
8
2.3
Pin 1
Pin 1
2005, June
Date code (YM)
BCR108W
Type code
0.6
0.8
1.6
0.65 0.65
Manufacturer
2007-04-20
8
BBY66...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
