9352 049 40518 - Philips Semiconductors / NXP Semiconductors

November 96

Product specification

File under Integrated Circuits, ICO1

Philips

Semiconductors

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

FEATURES

.Full-wave commutation (using push/pull drivers at the output stages) without position sensors

.Built-in start-up circuit

.Optimum commutation independent on motor type or motor loading

.Built-in flyback diodes

.Three push-pull outputs:

-0.85 A output current

-built-in current limiter

.Thermal protection

.Soft slope outputs for low radiation.

.Low current consumption by adaptative base-drive

.Tacho output without extra sensor.

.Comparator for external position generator (PG) signal

.Built-in multiplexer combining internal FG and external PG signal on one pin for easy use with a controlling

microprocessor

.Linear control of the output stages

.PG signal output.

APPLICATIONS

.General purpose spindle driver ( e.g. VCR scanner motor).

GENERAL DESCRIPTION

The TDA5240T is a bipolar integrated circuit used to drive brushless DC motors in full-wave mode. The device senses

the rotor position using an EMF-sensing technique and is ideally suited as a drive circuit for VCR scanner motors.

QUICK REFERENCE DATA

Measured over full voltage and temperature ranges

SYMBOL PARAMETER MIN. TYPo MAX. UNIT

IUM

supply voltage range (note 1 ) 4

0.6

1.05 ~

current limiting 0.85

0.93

output voltage at 10 = 100 mA(Upper + Lower transistor)

Note

1. An unstabilized supply can be used; Transients of 2 V allowed with max slope 0.1 V/J.ls.

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November 96

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

ORDERING INFORMATION

PACKAGE

TYPE NUMBER NAME DESCRIPTION VERSION

SOT163AH17

TDA5240T SO20L 20-pin small-outline; plastic

Fig.1 Power derating curve

3119November 96

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

BLOCK DIAGRAM

r CAP-CPC

CTLIf'I

.CAPST -

MOT1

MOT2

CAPCDSI

CAPCDM

CAPTII

PGOUTI

,,1

-MOT3

PGFG '\'

IMOTO

L PGlfr .GND2- -tND1- J

Fig.2 Block diagram.

.November 96 4/19

Philips Semiconductors Product specification

TDA5240TBrushless DC motor drive circuit

November 96 5/19

PINNING

SYMBOL PIN DESCRIPTION

GND1 1ground (0 V) motor supply return for output stages

n.c. 2not connected

MOT2 3driver output 2

n.c. 4not connected

VP5positive supply voltage

PGIN 6position generator: input from the position detector sensor to the position detector

stage (optional)

FGPG 7 FG/PG (open collector)

GND2 8 ground supply return for control circuits

PGOUT 9position generator output of the position detector stage

CAP–CDM 10 external capacitor connection for commutation delay timing

CAP–CDS 11 external capacitor connection for commutation delay timing copy

CAP–ST 12 external capacitor connection for start–up oscillator

CAP–TI 13 external capacitor connection for timing

CTL IN 14 non–inverting input of the control amplifier

MOT0 15 input from the start point of the motor coils

CAP–CPC 16 external capacitor for stability of control loop

n.c. 17 not connected

MOT3 18 driver output 3

n.c. 19 not connected

MOT1 20 driver output 1

10 11

GND1

n.c.

MOT2

PGIN

FGPG

GND2

PGOUT

CAP–CDM

MOT1

n.c.

MOT3

n.c.

CAP–CPC

MOT0

CTL IN

CAP–ST

CAP–TI

CAP–CDS

TDA5240T

Fig. 3 Pin configuration

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

FUNCTIONAL DESCRIPTION

The TDA5240T offers a sensorless three phase motor drive function. It is unique in its combination of sensorless motor

drive and full-wave drive.

The TDA5240T offers protected outputs capable of handling high currents and can be used with star or delta connected

motors. It can easily be adapted for different motors and applications.

The TDA5240T offers the following features:

.Sensorless commutation by using the motor EMF

.Built-in start-up circuit

.Optimum commutation, independent of motor type or motor loading

.Built-in flyback diodes

.Three phase full-wave drive

.High output current (0.85 A)

.Outputs protected by current limiting and thermal protection of each output transistor

.Low current consumption by adaptive base-drive

.Soft slope outputs for low radiation

.Accurate frequency generator (FG) by using the motor EMF

.Comparator for external position generator (PG) signal

.Built-in multiplexer combining internal FG and external PG signals on one pin for easy use with a controlling

microprocessor

.Linear control of the output stages.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. UNIT

I Ptot

supply voltage v

input voltage; all pins except Vp (VI < 8 V) -0.3

GND

-1

MAX.

Vp + 0.5

Vp + VD

2.5

see power

derating

curve

+150

+70

.output voltage; PGOUT and PG/FG

output voltage; MOTO, MOT1, MOT2 and MOT3

input voltage; CAP-ST, CAP- TI, CAP-CD and CAP-DC

I total power dissipation

-55

-10 °c

°c

I Tamb

I~ge temperature range

operating ambient temperature range

6/19

November 96

Philips Semiconductors Product specification

TDA5240TBrushless DC motor drive circuit

November 96 7/19

CHARACTERISTICS

VP = 14.5 V "10%; Tamb = –10 °C to 70 °C, unless otherwise specified

Symbol Parameter Conditions Min Typ Max Unit

Supply

VPSupply voltage range note 1 4 – 18 V

IPInput current range note 2 – 5.3 7 mA

Thermal protection

TSD Local temperature at temperature

sensor causing shut–down 130 140 150 °C

DTReduction in temperature

before switch–on after shut–down – TSD–30 – °C

MOT0 – CENTER TAP

VIInput voltage range –0.5 – VPV

IIInput bias current 0.5 V<VI <VP–1.5 V –10 – – mA

VCSW Comparator Switching Level note 3 20 30 40 mV

DVCS Variations in comparator switching

levels –3 0 +3 mV

VHComparator input hysteresis – 75 – mV

MOT1, MOT2 AND MOT3

VDO Voltage drop at 25 °C IO = 100 mA – 0.93 1.05 V

(Vout upper stage + Vout lower stage) IO = 500 mA – 1.65 1.9 V

DVOL Variation in voltage between lower

transistors in control mode;

IO = 100 mA – – 150 mV

DVOH Variation in voltage between upper

transistors in control mode;

IO = –100 mA – – 150 mV

ILIM Current limiting 12 V/6.8W0.6 0.85 1 A

TrRise time switching output between

1.9 and 12.2 V IO = 250 mA 7 12 17 ms

TfFall time switching output between

12.2 and 1.9 V IO = 250 mA 16 23 30 ms

VDHF Diode forward voltage (DH) notes 4 and 5; see Fig. 2;

IO = –500 mA – – 1.5 V

VDLF Diode forward voltage (DL) notes 4 and 5; see Fig. 2;

IO = 500 mA –1.5 – – V

IDM Peak diode current note 5 – – 1 A

CTL IN

VCTLIN Input voltage range 0 – VPV

VCTLIN0 Offset voltage See Fig. 6

VCAPCPC v 1.1 V 0.7 – – V

GTRAN T ransfer gain CAP–CPC = 100 nF

VCTLIN = 1.5V and

VCTLIN = 3 V

4.5 5 5.5 V/V

Philips Semiconductors Product specification

TDA5240TBrushless DC motor drive circuit

November 96 8/19

Symbol UnitMaxTypMinConditionsParameter

PG IN

VIInput voltage range –0.3 – +5 V

IBInput bias current – – 650 nA

RIInput resistance 5 – 30 kW

VCSW Comparator switching level 86 93 107 mV

+/–VIAMP Comparator input hysteresis – 8 – mV

PG OUT (open collector)

VOL Output voltage LOW IO = 1.6 mA – – 0.4 V

VOHmax Output voltage HIGH – – VPV

tTHL T ransition time HIGH-to-LOW;

CL = 50 pF;

RL = 10 kW

– 0.5 – ms

tPL Pulse width LOW 4 – 10 ms

FG/PG (open collector)

VOL Output voltage LOW IO =1.6 mA – – 0.4 V

VOHmax Maximum output voltage HIGH – – VPV

tTHL T ransition time HIGH–to–LOW

CL = 50 pF

RL = 10 kW

– 0.5 – ms

Ratio of FG frequency and

commutation frequency – 1:2 – –

dDuty factor – 50 – %

tPL Pulse width LOW after a PG IN pulse 5 7 15 ms

CAP–ST

IIOutput sink current 1.5 2.0 2.5 mA

IOOutput source current –2.5 –2.0 –1.5 mA

VSWL Lower switching level – 0.20 – V

VSWM Middle switching level – 0.30 – V

VSWH Upper switching level – 2.20 – V

CAP–TI

IIOutput sink current 22 30 38 mA

IOH Output source current HIGH –70 –63 –56 mA

IOL Lower source current LOW –6.0 –5.3 –4.6 mA

VSWL Lower switching level – 50 – mV

VSWM Middle switching level – 0.30 – V

VSWH Upper switching level – 2.20 – V

CAP–CDM

IIOutput sink current 10.6 16.2 22 mA

IOOutput source current –5.3 –8.1 –11 mA

II/IORatio of sink to source current 1.85 2.05 2.25

VIL Input voltage level LOW 780 860 940 mV

VIH Input voltage level HIGH 2.3 2.4 2.55 V

Philips Semiconductors Product specification

TDA5240TBrushless DC motor drive circuit

November 96 9/19

Symbol UnitMaxTypMinConditionsParameter

CAP–CDS

IIOutput sink current 10.1 15.5 20.9 A

IOOutput source current –20.9 –15.5 –10.1 A

II/IORatio of sink to source current 0.9 1.025 1.15

VIL Input voltage level LOW 780 860 940 mV

VIH Input voltage level HIGH 2.3 2.4 2.55 V

CAP–CPC

IIOutput sink current 1 – 3 mA

IOOutput source current –100 – –30 A

NOTES:

1. An unstabilized supply can be used; transients of 2 V allowed with max slope 0.1 V/s.

2. All other inputs at 0 V; all outputs at VP and IO = 0 A.

3. Switching levels with respect to MOT1, MOT2 and MOT3.

4. Drivers are in high impedance OFF–state.

5. The outputs are short–circuit protected by limiting the current and the IC temperature.

Fig. 4 Switching levels

Philips Semiconductors Product specification

TDA5240TBrushless DC motor drive circuit

November 96 10/19

APPLICATION INFORMATION

Introduction

Figure 5 shows full–wave driving of a three phase motor requires three push–pull output stages. In each of the six possible states two outputs

are active, one sourcing and one sinking current. The third output presents a high impedance to the motor which enables measurement of the

motor EMF in the corresponding motor coil by the EMF comparator at each output. The commutation logic is responsible for control of the

output transistors and selection of the correct EMF comparator.

The zero–crossing in the motor EMF (detected by the comparator selected by the commutation logic) is used to calculate the correct moment

for the next commutation, that is, the change to the next output state. The delay is calculated (depending on the motor loading) by the adaptive

commutation delay block.

Because of high inductive loading the output stages contain flyback diodes. The output stages are also protected by a current limiting circuit and

by thermal protection of the six output transistors.

The zero–crossings can be used to provide speed information such as the tacho signal FG. A VCR scanner also requires a PG phase sensor.

This circuit has an interface for a simple pick–up coil. A multiplexer circuit is also provided to combine the FG and PG signals in time. The

TDA5240 is providing 1 multiplexed FG PG signal: pin7 (SO20) FG–PG 3 times the number of pole pairs. A PG output signal is generated;

pulse width is typically 7 µs.

Table 1 OUTPUT STATES

STATE MOT1 MOT2 MOT3

1 Z L H

2 H L Z

3 H Z L

4 Z H L

5 L H Z

6 L Z H

In Table 1, the sequence of the six possible states of the outputs has been depicted

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

Fig.5 Typical application of the TDA5240T.

11/19

November 96

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

Analog control of the motor output voltages is achieved by an internal operational amplifier which tranfer gain is internally

fixed. Compensation of the motor pole is done by an external capacitor (CAP CPC).

Both grounds GND1 and GND2 must be connected together.

ADJUSTMENTS

The system has been designed in such a way that the tolerances of the application components are not critical. However,

the approximate values of the following components must still be determined:

.The start capacitor; this determines the frequency of the start oscillator

.The two capacitors in the adaptive commutation delay circuit. These are important in determining the optimum moment

for commutation, depending on the type and loading of the motor

~ The timing capacitor; this provides the system with its timing signals

(This deals with the application note AN94070)

THE START CAPACITORS (CAP-ST)

This capacitor determines the frequency of the start oscillator. It is charged and discharged, with a current of 2 ~A, from

0.05 to 2.2 V and back to 0.05 V. The time taken to complete one cycle is given by:

tstart = (2.15 X C)s (with C in ~F)

The start oscillator is reset by a commutation pulse and so is only active when the system is in the start-up mode. A pulse

from the start oscillator will cause the outputs to change to the next state (torque in the motor) .If the movement of the motor

generates enough EMF the TDA5240T will run the motor. If the amount of EMF generated is insufficient, then the motor will

move one step only and will oscillate in its new position.

The amplitude of the oscillation must decrease sufficiently before the arrival of the next start pulse, to prevent the pulse

arriving during the wrong phase of the oscillation. The oscillation of the motor is given by:

= ¥ x ( Kt x I x J )2

'osc

12/19

November 96

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

where:

Kt = torque constant (N.m/A)

I = current (A)

p = number of magnetic pole-pairs

J = inertia J (kg/m2)

Example: J = 72 x 10---6 kg/m2, K = 25 x 10-3 N.m/A, p = 6 and I = 0.5 A; this gives f osc = 5 Hz. If the damping is high

then a start frequency of 2 Hz can be chosen or t = 500 ms, thus C = 0.5/2 = 0.25 ~F, (choose 220 nF).

THE ADAPTIVE COMMUTATION DELAY (CAP-CDM AND CAP-CDS)

In this circuit capacitor CAP-CDM is charged during one commutation period, with an interruption of the charging current

during the diode pulse. During the next commutation period this capacitor (CAP-CDM) is discharged at twice the charging

current. The charging current is 8.1 J.lA and the discharging current 16.2 J.lA ; the voltage range is from 0.9 to 2.2 V. The

voltage must stay within this range at the lowest commutation frequency of interest, fc1 :

8.1 -5

iXT:3

c= -~ (C in nF)

-fC1

If the frequency is lower, then a constant commutation delay after the zero-crossing is generated by the discharge from

2.2 to 0.9 Vat 16.2I1A.

maximum delay = (0.076 x C) ms (witch C in nF)

Example: nominal commutation frequency = 900 Hz and the lowest usable frequency = 400 Hz, so:

CAP-CDM = ~= 15.6 (choose 18 nF)

The other capacitor, CAP-CDS, is used to repeat the same delay by charging and discharging with 20 ~.

The same value can be chosen as for CAP-CDM. Figure 7 illustrates typical voltage waveforms

! COM I ICOM COM I COM

voltoge l\ I rT\ I rr\ i I I

on CAP-DC I ~ I ~ I ~

II I t~

I I 1

ZCR ZCR ZCR ZCR ZCR ZCR

Fig.7 CAP-CDM and CAP-CDS voltage waveforms in normal running mode.

(ZCR=ZERO-CROSSING ; COM=COMMUTATION)

ICOM I

ICOM

THE TIMING CAPACITOR (CAP- TI)

Capacitor CAP- TI is used for timing the successive steps within one commutation period; these steps include some

internal delays.

13/19

November 96

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

The most important function is the watchdog time in which the motor EMF has to recover from a negative diode-pulse

back to a positive EMF voltage (or vice versa). A watchdog timer is a guarding function that only becomes active when

the expected event does not occur within a predetermined time.

The EMF usually recovers within a short time if the motor is running normally ( « ms ). However, if the motor is

motionless or rotating in the reverse direction, then the time can be longer ( » ms ).

A watchdog time must be chosen so that it is long enough for a motor without EMF (still) and eddy currents that may

stretch the voltage in a motor winding; however, it must be short enough to detect reverse rotation. If the watchdog time

is made too long, then the motor may run in the wrong direction (with little torque).

The capacitor is charged, with a current of 57 I1A, from 0.2 to 0.3 V. Above this level it is charged, with a current of 5 JlA,

up to 2.2 V only if the selected motor EMF remains in the wrong polarity (watchdog function). At the end, or, if the motor

voltage becomes positive, the capacitor is discharged with a current of 28 11 A. The watchdog time is the time taken to

charge the capacitor, with a current of 5 JlA, from 0.3 to 2.2 V. The value of CAP- TI is given by:

= 2.63 tm (C in nF ; t in ms)

Example: If after switching off, the voltage from a motor winding is reduced, in 3.5 ms, to within 20 mV (the offset of the

EMF comparator), then the value of the required timing capacitor is given by:

C = 2.63 x 3.5 = 9.2 (choose 10 nF)

Typical voltage waveforms are illustrated by Fig. 8.

voltoge

on CAP- TI

MKAI34

If the chosen value of CAP- TI is too small, then oscillations can occur in certain positions of a blocked rotor. If the chosen value is too large, then it is

possible that the motor may run in the reverse direction (synchronously with little torque).

Fig.8 Typical CAP- TI and VMOT1 voltage waveforms in normal running mode.

November 96 14/19

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

OTHER DESIGN ASPECTS

There are other design aspects concerning the application of the TDA5240T besides the commutation function. They are:

.Generation of the tacho signal FG

.Built-in interface for a PG sensor.

.Reliability .

FG SIGNAL

The FG signal is generated in the TDA5240T by using the zero-crossing of the motor EMF from the three motor windings.

Every zero-crossing in a (star connected) motor winding is used to toggle the FG output signal. The FG frequency is

therefore half the commutation frequency. All transitions indicate the detection of a zero-crossing (except for PG). The

negative-going edges are called FG pulses because they generate an interrupt in a controlling microprocessor.

The accuracy of the FG output signal Oitter) is very good. This accuracy depends on the symmetry of the motor's

electromagnetic construction, which also effects the satisfactory functioning of the motor itself.

Two FG frequencies are given out: 6 times the number of poles pairs or 3 times the number of poles pairs. A pull-up

resistor must be connected to PGFG outputs

Example: A three phase motor with 6 magnetic pole-pairs at 1500 rpm and with a full-wave drive has a commutation

frequency of 25 x 6 x 6 = 900 Hz, and generates a tacho signal of 450 Hz.

PG SIGNAL

The accuracy of the PG signal in applications such as VCR must be high (phase information. This accuracy is obtained

by combining the accurate FG signal with the PG signal by using a wide tolerance external PG sensor. The external PG

signal (PGIN) is only used as an indicator to select a particular FG pulse. This pulse differs from the other FG pulses in

that a ahort LOW-time of 15 ~s after a HIGH to LOW transition. All other FG pulses have a 50% duty factor (see Fig. 9).

toleronce on PG IN

vAv vAv

PG IN

MOT3

PG/FG~~~~ ~

Fig.9 Timing of the FG and PG signals

RELIABILITY

It is necessary to protect high current circuits and the output stages are protected in two ways:

15/19

November 96

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

.Current limiting of the 'lower' output transistors. The 'upper' output transistors use the same base current as the

conducting 'lower' transistor (+15%). This means that the current to and from the output stages is limited.

.Thermal protection of the six output transistors is achieved by each transistor having a thermal sensor that is active

when the transistor is switched on. The transistors are switched off when the local temperature becomes too high.

16/19

November 96

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

PACKAGE OUTliNE

0.9 (4x)

0.4

IJ r-,OODP D

20 11

2.45 0.3

2.25 0.1

1.1

1.0

, 0.32

0.23

-,-J

2065

2035

pin 1 ;B -

index 1.1

..,\ 0.5 * OtO 8°

~MBC234

[] [] DIJ L

0.49 j 8

0.36 (20x)

Dimensions in mm

Fig.10 20-pin small-outline; plastic (SO20L;SOT163A).

17/19

November 96

Philips Semiconductors Product specification

Brushless DC motor drive circuit TDA5240T

SOLDERING

Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and

surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for

surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often

used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

"IC Package Databook" (order code 9398 652 90011 ).

Reflow soldering

Reflow soldering techniques are suitable for all sa packages.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the

printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between

50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

Wave soldering

Wave soldering techniques can be used for all sa packages if the following conditions are observed:

.A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique

should be used.

.The longitudinal axis of the package footprint must be parallel to the solder flow-

.The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 oC, and maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 oC within 6 seconds. Typical dwell time is 4 seconds at 250 oC.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally- opposite end leads. Use only a low voltage soldering iron (less

than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a

dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

18/19

November 96

Philips Semiconductors Product specification

TDA5240TBrushless DC motor drive circuit

yyyy mmm dd 1

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one

or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or

at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended

periods may af fect device reliability.

Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips

Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or

modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can

reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications

do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.

Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard

cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless

otherwise specified.

Contact information

For additional information please visit

http://www.semiconductors.philips.com. Fax: +31 40 27 24825

For sales offices addresses send e-mail to:

sales.addresses@www.semiconductors.philips.com.

 Koninklijke Philips Electronics N.V. 1996

Date of release: 11-96

Document order number: 9397 750 08756





Data sheet status[1]

Objective

specification

Preliminary

specification

Product

specification

Product

status[2]

Development

Qualification

Production

Definitions

This data sheet contains data from the objective specification for product development.

Philips Semiconductors reserves the right to change the specification in any manner without notice.

This data sheet contains data from the preliminary specification. Supplementary data will be

published at a later date. Philips Semiconductors reserves the right to change the specification

without notice, in order to improve the design and supply the best possible product.

This data sheet contains data from the product specification. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply.

Changes will be communicated according to the Customer Product/Process Change Notification

(CPCN) procedure SNW-SQ-650A.

Data sheet status

[1] Please consult the most recently issued data sheet before initiating or completing a design.

[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL

http://www.semiconductors.philips.com.