MASW-011029 Wideband, 75 - 100 GHz, AlGaAs SP3T PIN Diode Switch with integrated bias circuits Features Rev. V3 Functional Schematic 60 - 110 GHz Broadband Operating Frequency 1.3 dB Insertion Loss 33 dB Isolation Silicon Nitride Passivation BCB Scratch Protection Lead-Free GaAs MMIC Chip RoHS* Compliant and 260C Reflow Compatible Description The MASW-011029 is a wideband SP3T switch manufactured using MACOM's patented AlGaAs PIN Diode MMIC process, on a semi-insulating GaAs substrate. The device is fully passivated with silicon nitride and has an additional layer of BCB for scratch protection. This protective coating prevents damage to the circuit during automated or manual handling. These devices are suitable for pick and place insertion. Outline Each RF port contains DC blocking capacitors and a DC bias circuit consisting of high impedance lines and RF bypass capacitors. This device has 100 um gold plated bonding pads at all RF and DC ports. RF and DC ground backside gold plating allows conventional chip bonding techniques using 80Au/20Sn solder, Indalloy solder, or electrically conductive silver epoxy. Applications include satellite communications, millimeter-wave radar, 77 GHz automotive cruise control radar, and 94 GHz imaging in astronomy, defense, and security applications. Bondpad Configuration1,2 Ordering Information Bondpad No. Function J1 Common, RF1 (GSG) J2 Output, RF2 (GSG) Part Number Package B2 J2 Bias Control MASW-011029-14140W Waffle Pak J3 Output, RF3 (GSG) B3 J3 Bias Control J4 Output, RF4 (GSG) B4 J4 Bias Control 1. Bondpad metal is gold and backside metal is gold. 2. The backside metal must be connected to RF and DC ground. 1 * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0012625 MASW-011029 Wideband, 75 - 100 GHz, AlGaAs SP3T PIN Diode Switch with integrated bias circuits Rev. V3 Electrical Specifications: Freq. = 75 - 100 GHz, TA = 25C, +10 mA / -25 V, Z0 = 50 Parameter Units Min. Typ. Max. Insertion Loss dB -- 1.3 -- Isolation dB -- 33 -- Forward Bias, 10 mA V 1.15 -- 1.40 Blocking Capacitor Leakage Current, -25 V nA -- -- 50 Diode Leakage Current, -32 V nA -- -- 50 Switching Speed, 10% - 90% RF Voltage ns -- 2 -- Truth Table & Bias Conditions @ Low Loss State RF Inputs B2 B3 B4 J1 to J2 -4.5 V3 10 mA4 10 mA4 J1 to J3 10 mA4 -4.5 V3 10 mA4 J1 to J4 10 mA4 10 mA4 -4.5 V3 3. Minimum reverse bias voltage (VR) should be determined based on working conditions. For example, V R = -4.5 V @ 23 dBm input power. For lower applications, a less negative voltage can be used. R. Caverly and G. Hiller, Establishing the Minimum Reverse Bias for a PIN Diode in a High Power Switch, IEEE Transactions on Microwave Therory and Techniques, Vol.38,No.12, December 1990. For higher linearity the VR it may be as high as -25 V. 4. Forward bias current (IF) is set using external bias resistors (RBIAS) placed at pins B1, B2, and B3, where RBIAS = (VCC - 1.32 V) / IF. Absolute Maximum Ratings5,6 Handling Procedures Parameter Absolute Maximum Input Power 23 dBm Please observe the following precautions to avoid damage: DC Current, per diode 15 mA Static Sensitivity DC Voltage -25 V Junction Temperature7 +150C Operating Temperature -25C to +85C Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices. Storage Temperature -65C to +150C 5. Exceeding any one or combination of these limits may cause permanent damage to this device. 6. MACOM does not recommend sustained operation near these survivability limits. 7. Operating at nominal conditions with TJ +150C will ensure MTBF > 1 x 106 hours. 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0012625 MASW-011029 Wideband, 75 - 100 GHz, AlGaAs SP3T PIN Diode Switch with integrated bias circuits Rev. V3 MASW-011029 Typical Performance Curves, 75 - 100 GHz8 Isolation Insertion Loss 0.0 0 -0.5 -5 -10 -1.0 -15 -20 -2.0 S21 (dB) S21 (dB) -1.5 -2.5 -3.0 -25 -30 -35 -40 -3.5 -45 -4.0 -50 -4.5 -55 -60 -5.0 75 80 85 90 Frequency (GHz) 95 75 100 80 85 90 Frequency (GHz) 95 100 MA4GC6774 (Former Part Number) Reference Data, 60 - 75 GHz8 Isolation Insertion Loss 0.0 0 -0.5 -5 -10 -1.0 -15 -20 -2.0 S21 (dB) S21 (dB) -1.5 -2.5 -3.0 -25 -30 -35 -40 -3.5 -45 -4.0 -50 -4.5 -55 -60 -5.0 60 65 70 75 60 65 70 75 Frequency (GHz) Frequency (GHz) Return Loss, Input and Output 0 8. Measured data is highly dependent on fixturing and equipment setup. -5 -10 -15 S21 (dB) -20 -25 -30 -35 -40 -45 -50 -55 -60 60 3 65 70 75 Frequency (GHz) MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0012625 MASW-011029 Wideband, 75 - 100 GHz, AlGaAs SP3T PIN Diode Switch with integrated bias circuits Rev. V3 Solder Die Attach Wire / Ribbon Bonding All die attach and bonding methods should be compatible with gold metal. Solder which does not scavenge gold, such as 80 Au/20 Sn or Indalloy #2 is recommended. Do not expose die to a temperature greater than 300C for more than 10 seconds. Wedge thermo compression bonding may be used to attach ribbons to the RF bonding pads. Gold ribbons should be 1/4 by 3 mil sq. for lowest inductance. The same 1/4 by 3 mil sq. gold ribbon or 1 mil dia. gold wire is recommended for all DC pads. Electrically Conductive Epoxy Die Attach Assembly can be preheated to approximately 125C. Use a controlled thickness of approximately 2 mils for best electrical conductivity and lower thermal resistance. A thin epoxy fillet should be visible around the perimeter of the chip after placement. Cure epoxy per manufacturer's schedule. For extended cure times, temperatures should be kept below 150C. Outline Drawing 4 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0012625 MASW-011029 Wideband, 75 - 100 GHz, AlGaAs SP3T PIN Diode Switch with integrated bias circuits Rev. V3 MACOM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM") products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM assumes no responsibility for errors or omissions in these materials. MACOM may make changes to specifications and product descriptions at any time, without notice. MACOM makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. 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MACOM customers using or selling MACOM products for use in such applications do so at their own risk and agree to fully indemnify MACOM for any damages resulting from such improper use or sale. 5 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0012625