Package and Thermal Information SOT223-4-2 Footprint/Dimensions 1.6 0.1 6.50.2 3 0.1 B 0.1 max 3.5 0.5 min 4.8 1.2 1.1 1.4 1 2 3.5 0.2 1.4 +0.2 acc. to DIN 6784 15max GND 4 7 0.3 B 3 0.280.04 2.3 0.70.1 4.6 Reflow soldering 0.25 PC-Board M A 0.25 M Dimensions in mm B Application-Boards for Rth - Measurement SOT223 SOT223 SOT223 a/2 2 3 cm 3 Footprint only a/2 a a 1 6 cm 0.3 I 0.3 Q GND I 1 Q GND I 1 FR4; 80 x 80 x 1.5 mm; 35 Cu, 5 Sn A = 600 mm; a = 24.49 mm Q GND 1 FR4; 80 x 80 x 1.5 mm; 35 Cu, 5 Sn A = 300 mm; a = 17.32 mm FR4; 80 x 80 x 1.5 mm; 35 Cu, 5 Sn Footprint only FEM Simulation (chip area 2 mm; Pv = 0.5 W; zero airflow) Finite Element Method A = 600 mm; Ta = 298 K; Tmax = 332 K A = 300 mm; Ta = 298 K; Tmax = 339 K Footprint only; Ta = 298 K; Tmax = 380 K Diagrams Thermal Resistance Junction to Ambient Rthj-a vs. PCB Heat Sink Area A (zero airflow) Rthj-a 180 K/W 164.3 Rthj-pin4 = 16.5 K/W Zthj-a 140 140 Footprint 300 mm 2 600 mm 2 120 100 120 80 100 60 40 81.2 80 60 180 K/W Thermal Impedance Junction to Ambient Zthj-a vs. Single Pulse Time tp (zero airflow) 68 0 100 200 300 400 500 mm 2 600 A Published by Infineon Technologies AG 20 0 -3 10 10-2 10-1 100 101 102 tp s 103 http://www.infineon.com