1 1 1
13
6 cm² Footprint only
2
3 cm²
SOT223SOT223SOT223
III
Q GND Q GND Q GND
a/2
a
0.3
a
a/2
0.3
FR4; 80
x
80
x
1.5 mm; 35 µ Cu, 5 µ Sn
A = 600 mm²; a = 24.49 mm FR4; 80
x
80
x
1.5 mm; 35 µ Cu, 5 µ Sn
A = 300 mm²; a = 17.32 mm FR4; 80
x
80
x
1.5 mm; 35 µ Cu, 5 µ Sn
Footprint only
GND
Reflow soldering
±0.1
±0.2
±0.1
0.7
4
3
21
6.5
3
acc. to
+0.2
DIN 6784
1.6
±0.1
15˚max
±0.04
0.28
7
±0.3
±0.2
3.5
0.5
0.1 max
min
B
M
0.25
B
B
2.3
4.6
A
M
0.25
3.5
1.4
1.1 1.2
1.4 4.8
Dimensions in mm
60
R
thj-a
Z
thj-a
0
80
100
120
140
K/W
180
20
40
60
80
100
120
140
K/W
180
R
thj-pin4
= 16.5 K/W
600 mm
2
300 mm
2
Footprint
164.3
81.2 68
0
A
100 200 300 400 500 600mm
2
t
p
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
s
Footprint/Dimensions
PC-Board
Finite Element Method
Diagrams
SOT223-4-2
A = 600 mm²; Ta= 298 K; Tmax = 332 K
FEM Simulation (chip area ≥2 mm²; Pv= 0.5 W; zero airflow)
Application-Boards for Rth - Measurement
Thermal Resistance Junction to Ambient Rthj-a vs.
PCB Heat Sink Area A(zero airflow)
Thermal Impedance Junction to Ambient Zthj-a vs.
Single Pulse Time tp(zero airflow)
Published by Infineon Technologies AG
Package and Thermal Information
http://www.infineon.com
A = 300 mm²; Ta= 298 K; Tmax = 339 K Footprint only; Ta= 298 K; Tmax = 380 K
