August 7, 2008
ADC10040/ADC10040Q
10-Bit, 40 MSPS, 3V, 55.5 mW A/D Converter
General Description
The ADC10040 is a monolithic CMOS analog-to-digital con-
verter capable of converting analog input signals into 10-bit
digital words at 40 Megasamples per second (MSPS). This
converter uses a differential, pipeline architecture with digital
error correction and an on-chip sample-and-hold circuit to
provide a complete conversion solution, and to minimize pow-
er consumption, while providing excellent dynamic perfor-
mance. A unique sample-and-hold stage yields a full-power
bandwidth of 400 MHz. Operating on a single 3.0V power
supply, this device consumes just 55.5 mW at 40 MSPS, in-
cluding the reference current. The Standby feature reduces
power consumption to just 13.5 mW.
The differential inputs provide a full scale selectable input
swing of 2.0 VP-P, 1.5 VP-P, 1.0 VP-P, with the possibility of a
single-ended input. Full use of the differential input is recom-
mended for optimum performance. An internal +1.2V preci-
sion bandgap reference is used to set the ADC full-scale
range, and also allows the user to supply a buffered refer-
enced voltage for those applications requiring increased ac-
curacy. The output data format is user choice of offset binary
or two’s complement.
The ADC10040Q runs on an Automotive Grade Flow and is
AEC-Q100 Grade 3 Qualified.
This device is available in the 28-lead TSSOP package and
will operate over the industrial temperature range of −40°C to
+85°C.
Features
Single +3.0V operation
Selectable 2.0 VP-P, 1.5 VP-P, or 1.0 VP-P full-scale input
swing
400 MHz −3 dB input bandwidth
Low power consumption
Standby mode
On-chip reference and sample-and-hold amplifier
Offset binary or two’s complement data format
Separate adjustable output driver supply to accommodate
2.5V and 3.3V logic families
AEC-Q100 Grade 3 Qualified
28-pin TSSOP package
Key Specifications
Resolution 10 Bits
Conversion Rate 40 MSPS
Full Power Bandwidth 400 MHz
DNL ±0.3 LSB (typ)
SNR (fIN = 11 MHz) 59.6 dB (typ)
SFDR (fIN = 11 MHz) −80 dB (typ)
Power Consumption, 40 MHz 55.5 mW
Applications
Ultrasound and Imaging
Instrumentation
Cellular Base Stations/Communications Receivers
Sonar/Radar
xDSL
Wireless Local Loops
Data Acquisition Systems
DSP Front Ends
Connection Diagram
20077801
© 2008 National Semiconductor Corporation 200778 www.national.com
ADC10040/ADC10040Q 10-Bit, 40 MSPS, 3V, 55 mW A/D Converter
Ordering Information
Industrial (−40°C TA +85°C) NS Package Top Mark Features
ADC10040CIMT 28 Pin TSSOP ADC10040CIMT
ADC10040CIMTX 28 Pin TSSOP Tape & Reel ADC10040CIMT
ADC10040QCIMTX 28 Pin TSSOP ADC10040QCIMT AEC-Q100 Grade 3 Qualified.
Automotive Grade Production Flow
ADC10040QCIMTX 28 Pin TSSOP Tape & Reel ADC10040QCIMT AEC-Q100 Grade 3 Qualified.
Automotive Grade Production Flow
Use ADC10080EVAL Evaluation Board n/a
Block Diagram
20077802
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ADC10040/ADC10040Q
Pin Descriptions and Equivalent Circuits
Pin No. Symbol Equivalent Circuit Description
ANALOG I/O
12 VIN
Inverting analog input signal. With a 1.2V reference the full-scale
input signal level is a differential 1.0 VP-P. This pin may be tied to
VCOM (pin 4) for single-ended operation.
13 VIN+
Non-inverting analog input signal. With a 1.2V reference the full-
scale input signal level is a differential 1.0 VP-P.
6VREF
Reference Voltage. This device provides an internal 1.2V
reference. This pin should be bypassed to VSSA with a 0.1 µF
monolithic capacitor. VREF is 1.20V nominal. This pin may be driven
by a 1.20V external reference if desired. Do not load this pin.
7
4
8
VREFT
VCOM
VREFB
These pins are high impedance reference bypass pins only.
Connect a 0.1 µF capacitor from each of these pins to VSSA. These
pins should not be loaded. VCOM may be used to set the input
common mode voltage VCM.
DIGITAL I/O
1 CLK
Digital clock input. The range of frequencies for this input is
20 MHz to 40 MHz. The input is sampled on the rising edge of this
input.
15 DF DF = “1” Two’s Complement
DF = “0” Offset Binary
28 STBY This is the standby pin. When high, this pin sets the converter into
standby mode. When this pin is low, the converter is in active mode.
5IRS (Input Range
Select)
IRS = “VDDA” 2.0 VP-P input range
IRS = “VSSA” 1.5 VP-P input range
IRS = “Floating” 1.0 VP-P input range
If using both VIN+ and VIN- pins, (or differential mode), then the
peak-to-peak voltage refers to the differential voltage (VIN+ - VIN-).
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ADC10040/ADC10040Q
Pin No. Symbol Equivalent Circuit Description
16–20, 23–
27 D0–D9 Digital output data. D0 is the LSB and D9 is the MSB of the binary
output word.
ANALOG POWER
2, 9, 10 VDDA
Positive analog supply pins. These pins should be connected to a
quiet 3,0V source and bypassed to analog ground with a 0.1 µF
monolithic capacitor located within 1 cm of these pins. A 4.7 µF
capacitor should also be used in parallel.
3, 11, 14 VSSA Ground return for the analog supply.
DIGITAL POWER
22 VDDIO
Positive digital supply pins for the ADC10040’s output drivers. This
pin should be bypassed to digital ground with a 0.1 µF monolithic
capacitor located within 1 cm of this pin. A 4.7 µF capacitor should
also be used in parallel. The voltage on this pin should never
exceed the voltage on VDDA by more than 300 mV.
21 VSSIO
The ground return for the digital supply for the output drivers. This
pin should be connected to the ground plane, but not near the
analog circuitry.
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ADC10040/ADC10040Q
Absolute Maximum Ratings (Notes 1, 2)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
VDDA, VDDIO 3.9V
Voltage on Any Pin to GND −0.3V to VDDA or
VDDIO +0.3V
Input Current on Any Pin ±25 mA
Package Input Current (Note 3) ±50 mA
Package Dissipation at T = 25°C See (Note 4)
ESD Susceptibility
Human Body Model (Note 5) 2500V
Machine Model (Note 5) 250V
Soldering Temperature
Infrared, 10 sec. (Note 6) 235°C
Storage Temperature −65°C to +150°C
Operating Ratings (Notes 1, 2)
Operating Temperature Range −40°C TA +85°C
VDDA (Supply Voltage) +2.7V to +3.6V
VDDIO (Output Driver Supply
Voltage) +2.5V to VDDA
VREF 1.20V
|VSSA–VSSIO| 100 mV
Clock Duty Cycle 30 to 70 %
Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply for VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P,
STBY = 0V, External VREF = 1.20V, fCLK = 40 MHz, 50% Duty Cycle, CL = 10 pF/pin. Boldface limits apply for TA = TMIN to
TMAX: all other limits TA = 25°C. (Notes 9, 10, 11)
Symbol Parameter Conditions Min Typ Max Units
STATIC CONVERTER CHARACTERISTICS
No Missing Codes Guaranteed 10 Bits
INL Integral Non-Linearity FIN = 250 kHz, −0 dB Full
Scale −1.0 ±0.3 +1.0 LSB
DNL Differential Non-Linearity FIN = 250 kHz, −0 dB Full
Scale −0.9 ±0.3 +0.9 LSB
GE Gain Error Positive Error −1.5 +0.4 +1.9 % FS
Negative Error −1.5 −0.01 +1.9 % FS
OE Offset Error (VIN+ = VIN−) −1.4 0.12 +1.6 % FS
Under Range Output Code 0
Over Range Output Code 1023
FPBW Full Power Bandwidth (Note 16) 400 MHz
REFERENCE AND INPUT CHARACTERISTICS
VCM Common Mode Input Voltage 0.5 1.5 V
VCOM
Output Voltage for use as an input
common mode voltage (Note 8)
1.45 V
VREF Reference Voltage 1.2 V
VREFTC Reference Voltage Temperature
Coefficient
±80 ppm/°C
CIN VIN Input Capacitance (each pin to
VSSA)
4 pF
POWER SUPPLY CHARACTERISTICS
IVDDA Analog Supply Current STBY = 1 4.5 6.0 mA
STBY = 0 18 25 mA
IVDDIO Digital Supply Current (Note 14) STBY = 1, fIN = 0 Hz 0 mA
STBY = 0, fIN = 0 Hz 0.6 0.8 mA
PWR Power Consumption (Note 15) STBY = 1 13.5 18 mW
STBY = 0 55.5 77 mW
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ADC10040/ADC10040Q
DC and Logic Electrical Characteristics Unless otherwise specified, the following specifications apply
for VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.20V, fCLK = 40 MHz, 50% Duty
Cycle, CL = 10 pF/pin. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C (Notes 9, 10, 11)
Symbol Parameter Conditions Min Typ Max Units
CLK, DF, STBY, SENSE
Logical “1” Input Voltage 2 V
Logical “0” Input Voltage 0.8 V
Logical “1” Input Current +10 µA
Logical “0” Input Current −10 µA
D0–D9 OUTPUT CHARACTERISTICS
Logical “1” Output Voltage IOUT = −0.5 mA VDDIO − 0.2 V
Logical “0” Output Voltage IOUT = 1.6 mA 0.4 V
DYNAMIC CONVERTER CHARACTERISTICS (Note 13)
ENOB Effective Number of Bits
fIN = 11 MHz 9.4,
9.3
9.6 Bits
fIN = 19 MHz 9.4,
9.3
9.6 Bits
SNR Signal-to-Noise Ratio
fIN = 11 MHz 58.7,
58.1
59.6 dB
fIN = 19 MHz 58.6,
58
59.5 dB
SINAD Signal-to-Noise Ratio + Distortion
fIN = 11 MHz 58.6,
58 59.5 dB
fIN = 19 MHz 58.5,
57.8 59.4 dB
2nd HD 2nd Harmonic
fIN = 11 MHz −75.9,
−74.7 −89 dBc
fIN = 19 MHz −74.4,
−73 −86 dBc
3rd HD 3rd Harmonic
fIN = 11 MHz −69.5,
−67.5 −78 dBc
fIN = 19 MHz −68.8,
−66.7 −77 dBc
THD Total Harmonic Distortion (First 6
Harmonics)
fIN = 11 MHz −69.5,
−67.5 −78 dB
f.IN = 19 MHz −68.8,
−66.7 −77 dB
SFDR Spurious Free Dynamic Range
(Excluding 2nd and 3rd Harmonic)
fIN = 11 MHz −75.8,
−74.5 −80 dBc
fIN = 19 MHz −75.7,
−74.3 −80 dBc
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ADC10040/ADC10040Q
AC Electrical Characteristics
Unless otherwise specified, the following specifications apply for VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN =
2 VP-P (full scale), STBY = 0V, External VREF = 1.20V, fCLK = 40 MHz, 50% Duty Cycle, CL = 10 pF/pin. Boldface limits apply for
TA = TMIN to TMAX: all other limits TA = 25°C (Notes 10, 11, 12)
Symbol Parameter Conditions Min
(Note 12)
Typ
(Note 12)
Max
(Note 12) Units
CLK, DF, STBY, SENSE
fCLK1Maximum Clock Frequency 40 MHz (min)
fCLK2Minimum Clock Frequency 20 MHz
tCH Clock High Time 12.5 ns
tCL Clock Low Time 12.5 ns
tCONV Conversion Latency 6Cycles
tOD
Data Output Delay after a Rising Clock
Edge
T = 25°C 2 3.3 5 ns
1 6ns
tAD Aperture Delay 1 ns
tAJ Aperture Jitter 2 ps (RMS)
Over Range Recovery Time
Differential VIN step from
±3V to 0V to get accurate
conversion
1 Clock Cycle
tSTBY Standby Mode Exit Cycle 20 Cycles
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND = VSSA = VSSIO = 0V, unless otherwise specified.
Note 3: When the voltage at any pin exceeds the power supplies (VIN < VSSA or VIN > VDDA), the current at that pin should be limited to 25 mA. The 50 mA maximum
package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two.
Note 4: The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the
junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA)/θJA. In the 28-
pin TSSOP, θJA is 96°C/W, so PDMAX = 1,302 mW at 25°C and 677 mW at the maximum operating ambient temperature of 85°C. Note that the power dissipation
of this device under normal operation will typically be about 55.5 mW. The values for maximum power dissipation listed above will be reached only when the
ADC10040 is operated in a severe fault condition.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
Note 6: The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR) the following conditions apply: Maintain the temperature at the
top of the package body above 183°C for a minimum of 60 seconds. The temperature measured on the package body must not exceed 220°C. Only one excursion
above 183°C is allowed per reflow cycle.
Note 7: The analog inputs are protected as shown below. Input voltage magnitude up to 500 mV beyond the supply rails will not damage this device. However,
input errors will be generated if the input goes above VDDA or VDDIO and below VSSA or VSSIO.
20077807
Note 8: VCOM is a typical value, measured at room temperature. It is not guaranteed by test. Do not load this pin.
Note 9: To guarantee accuracy, it is required that |VDDA–VDDIO| 100 mV and separate bypass capacitors are used at each power supply pin.
Note 10: With the test condition for 2 VP-P differential input, the 10-bit LSB is 1.95 mV.
Note 11: Typical figures are at TA = TJ = 25°C and represent most likely parametric norms. Test limits are guaranteed to National's AOQL (Average Outgoing
Quality Level).
Note 12: Timing specifications are tested at TTL logic levels, VIL = 0.4V for a falling edge, and VIH = 2.4V for a rising edge.
Note 13: Optimum dynamic performance will be obtained by keeping the reference input in the +1.2V.
Note 14: VDDIO is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply
voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR = VDR x (C0 x f0 + C1 x f1 + C2 + f2 +....C11 x f11) where VDR is the
output driver supply voltage, Cn is the total load capacitance on the output pin, and fn is the average frequency at which the pin is toggling.
Note 15: Power consumption includes output driver power. (fIN = 0 MHz).
Note 16: The input bandwidth is limited using a capacitor between VIN and VIN+.
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ADC10040/ADC10040Q
Specification Definitions
APERTURE DELAY is the time after the rising edge of the
clock to when the input signal is acquired or held for conver-
sion.
APERTURE JITTER (APERTURE UNCERTAINTY) is the
variation in aperture delay from sample to sample. Aperture
jitter manifests itself as noise in the output.
COMMON MODE VOLTAGE (VCM) is the d.c. potential
present at both signal inputs to the ADC.
CONVERSION LATENCY See PIPELINE DELAY.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
DUTY CYCLE is the ratio of the time that a repetitive digital
waveform is high to the total time of one period. The specifi-
cation here refers to the ADC clock input signal.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02
and states that the converter is equivalent to a perfect ADC
of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency
at which the reconstructed output fundamental drops 3 dB
below its low frequency value for a full scale input.
GAIN ERROR is the deviation from the ideal slope of the
transfer function. It can be calculated as:
Gain Error = Pos. Full-Scale Error − Neg. Full-Scale Error
INTEGRAL NON LINEARITY (INL) is a measure of the de-
viation of each individual code from a line drawn from negative
full scale through positive full scale. The deviation of any given
code from this straight line is measured from the center of that
code value.
MISSING CODES are those output codes that will never ap-
pear at the ADC outputs. The ADC10040 is guaranteed not
to have any missing codes.
NEGATIVE FULL SCALE ERROR is the difference between
the input voltage (VIN+ − VIN) just causing a transition from
negative full scale to the first code and its ideal value of
0.5 LSB.
OFFSET ERROR is the input voltage that will cause a tran-
sition from a code of 01 1111 1111 to a code of 10 0000 0000.
OUTPUT DELAY is the time delay after the rising edge of the
clock before the data update is presented at the output pins.
PIPELINE DELAY (LATENCY) is the number of clock cycles
between initiation of conversion and when that data is pre-
sented to the output driver stage. Data for any given sample
is available at the output pins the Pipeline Delay plus the Out-
put Delay after the sample is taken. New data is available at
every clock cycle, but the data lags the conversion by the
pipeline delay.
POSITIVE FULL SCALE ERROR is the difference between
the actual last code transition and its ideal value of 1½ LSB
below positive full scale.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal to the rms value of the
sum of all other spectral components below one-half the sam-
pling frequency, not including harmonics or DC.
SIGNAL TO NOISE PLUS DISTORTION (S/N+D or
SINAD) Is the ratio, expressed in dB, of the rms value of the
input signal to the rms value of all of the other spectral com-
ponents below half the clock frequency, including harmonics
but excluding d.c.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the differ-
ence, expressed in dB, between the rms values of the input
signal and the peak spurious signal, where a spurious signal
is any signal present in the output spectrum that is not present
at the input.
TOTAL HARMONIC DISTORTION (THD) is the ratio, ex-
pressed in dBc, of the rms total of the first six harmonic levels
at the output to the level of the fundamental at the output. THD
is calculated as:
where f1 is the RMS power of the fundamental (output) fre-
quency and f2 through f6 are the RMS power in the first 6
harmonic frequencies.
SECOND HARMONIC DISTORTION (2ND HARM) is the dif-
ference expressed in dB, between the RMS power in the input
frequency at the output and the power in its 2nd harmonic
level at the output.
THIRD HARMONIC DISTORTION (3RD HARM) is the dif-
ference, expressed in dB, between the RMS power in the
input frequency at the output and the power in its 3rd harmonic
level at the output.
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ADC10040/ADC10040Q
Timing Diagram
20077809
FIGURE 1. Clock and Data Timing Diagram
Transfer Characteristics
20077810
FIGURE 2. Input vs. Output Transfer Characteristic
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ADC10040/ADC10040Q
Typical Performance Characteristics Unless otherwise specified, the following specifications apply:
VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.2V, fCLK = 40 MHz, fIN = 19 MHz,
50% Duty Cycle.
DNL
20077812
DNL vs. fCLK
20077815
DNL vs. Clock Duty Cycle (DC input)
20077813
DNL vs. Temperature
20077816
INL
20077814
INL vs. fCLK
20077817
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ADC10040/ADC10040Q
INL vs. Clock Duty Cycle
20077818
SNR vs. VDDIO
20077819
SNR vs. VDDA
20077820
SNR vs. fCLK
20077821
INL vs. Temperature
20077822
SNR vs. Clock Duty Cycle
20077823
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ADC10040/ADC10040Q
SNR vs. Temperature
20077824
THD vs. VDDA
20077825
THD vs. VDDIO
20077826
THD vs. fCLK
20077827
SNR vs. IRS
20077828
THD vs. IRS
20077829
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ADC10040/ADC10040Q
SINAD vs. VDDA
20077830
SINAD vs. VDDIO
20077831
THD vs. Clock Duty Cycle
20077832
SINAD vs. Clock Duty Cycle
20077833
THD vs. Temperature
20077834
SINAD vs. Temperature
20077835
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ADC10040/ADC10040Q
SINAD vs. fCLK
20077836
SFDR vs. VDDIO
20077837
SINAD vs. IRS
20077838
SFDR vs. fCLK
20077839
SFDR vs. VDDA
20077840
SFDR vs. IRS
20077841
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ADC10040/ADC10040Q
SFDR vs. Clock Duty Cycle
20077842
Spectral Response @ 11 MHz Input
20077843
SFDR vs. Temperature
20077844
Spectral Response @ 19 MHz Input
20077845
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ADC10040/ADC10040Q
Functional Description
The ADC10040 uses a pipeline architecture and has error
correction circuitry to help ensure maximum performance.
Differential analog input signals are digitized to 10 bits. In dif-
ferential mode , each analog input signal should have a peak-
to-peak voltage equal to 1.0V, 0.75V or 0.5V, depending on
the state of the IRS pin (pin 5), and be centered around VCM
and be 180° out of phase with each other. If single ended
operation is desired, VIN- may be tied to the VCOM pin (pin 4).
A single ended input signal may then be applied to VIN+, and
should have an average value in the range of VCM. The signal
amplitude should be 2.0V, 1.5V or 1.0V peak-to-peak, de-
pending on the state or the IRS pin (pin 5).
Applications Information
1.0 ANALOG INPUTS
The ADC10040 has two analog signal inputs, VIN+ and VIN−.
These two pins form a differential input pair. There is one
common mode pin VCOM that may be used to set the common
mode input voltage.
1.1 REFERENCE PINS
The ADC10040 is designed to operate with an internal or ex-
ternal 1.2V reference. The internal 1.2V reference is the
defualt condition. If an external voltage is applied to the
VREF pin, then that voltage is used for the reference. The
VREF pin should be bypassed to ground with a 0.1 µF capacitor
placed close to the pin. Do not load this pin when using the
internal reference.
The voltages at VCOM, VREFT, and VREFB are derived from the
reference voltage. These pins are made available for bypass
purposes only. These pins should each be bypassed to
ground with a 0.1 µF capacitor placed close to the pin. It is
very important that all grounds associated with the reference
voltage and the input signal make connection to the analog
ground plane at a single point to minimize the effects of noise
currents in the ground path. DO NOT LOAD these pins.
1.2 VCOM PIN
This pin supplies a voltage for possible use to set the common
mode input voltage. This pin may also be connected to VIN-,
so that VIN+ may be used as a single ended input. These pins
should be bypassed with at least a 0.1uF capacitor. Do not
load this pin.
1.3 SIGNAL INPUTS
The signal inputs are VIN+ and VIN−. The input signal ampli-
tude is defined as VIN+ − VIN− and is represented schemati-
cally in Figure 3:
20077847
FIGURE 3. Input Voltage Waveforms for a 2VP-P
differential Input
20077848
FIGURE 4. Input Voltage Waveform for a 2VP-P Single
Ended Input
A single ended input signal is shown in Figure 4.
The internal switching action at the analog inputs causes en-
ergy to be output from the input pins. As the driving source
tries to compensate for this, it adds noise to the signal. To
minimize the effects of this, use 18 series resistors at each
of the signal inputs with a 25 pF capacitor across the inputs,
as shown in Figure 5. These components should be placed
close to the ADC because the input pins of the ADC is the
most sensitive part of the system and this is the last opportu-
nity to filter the input. The two 16 resistors and the 24 pF
capacitor, together with the 4 pF ADC input capacitance, form
a low-pass filter with a -3 dB frequency of 177 MHz.
1.4 CLK PIN
The CLK signal controls the timing of the sampling process.
Drive the clock input with a stable, low jitter clock signal in the
frequency range indicated in the AC Electrical Characteristics
Table with rise and fall times of less than 2 ns. The trace car-
rying the clock signal should be as short as possible and
should not cross any other signal line, analog or digital, not
even at 90°. The CLK signal also drives an internal state ma-
chine. If the CLK is interrupted, or its frequency is too low, the
charge on internal capacitors can dissipate to the point where
the accuracy of the output data will degrade. This is what limits
the lowest sample rate. The duty cycle of the clock signal can
affect the performance of any A/D Converter. Because
achieving a precise duty cycle is difficult, the ADC10040 is
designed to maintain performance over a range of duty cy-
cles. While it is specified and performance is guaranteed with
a 50% clock duty cycle, performance is typically maintained
with minimum clock low and high times indicated in the AC
Electrical Characteristics Table. Both minimum high and low
times may not be held simultaneously.
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ADC10040/ADC10040Q
1.5 STBY PIN
The STBY pin, when high, holds the ADC10040 in a power-
down mode to conserve power when the converter is not
being used. The power consumption in this state is 13.5 mW.
The output data pins are undefined in this mode. Power con-
sumption during power-down is not affected by the clock
frequency, or by whether there is a clock signal present. The
data in the pipeline is corrupted while in the power down.
1.6 DF PIN
The DF (Data Format) pin, when high, forces the ADC10040
to output the 2’s complement data format. When DF is tied
low, the output format is offset binary.
1.7 IRS PIN
The IRS (Input Range Select) pin defines the input signal am-
plitude that will produce a full scale output. The table below
describes the function of the IRS pin.
TABLE 1. IRS Pin Functions
IRS Pin Full-Scale Input
VDDA 2.0VP-P
VSSA 1.5VP-P
Floating 1.0VP-P
1.8 OUTPUT PINS
The ADC10040 has 10 TTL/CMOS compatible Data Output
pins. The offset binary data is present at these outputs while
the DF and STBY pins are low. Be very careful when driving
a high capacitance bus. The more capacitance the output
drivers must charge for each conversion, the more instanta-
neous digital current flows through VDDIO and VSSIO. These
large charging current spikes can cause on-chip noise and
couple into the analog circuitry, degrading dynamic perfor-
mance. Adequate bypassing, limiting output capacitance and
careful attention to the ground plane will reduce this problem.
Additionally, bus capacitance beyond the specified
10 pF/pin will cause tOD to increase, making it difficult to prop-
erly latch the ADC output data. The result could be an appar-
ent reduction in dynamic performance. To minimize noise due
to output switching, minimize the load currents at the digital
outputs. This can be done by minimizing load capacitance
and by connecting buffers between the ADC outputs and any
other circuitry, which will isolate the outputs from trace and
other circuit capacitances and limit the output currents, which
could otherwise result in performance degradation. Only one
driven input should be connected to the ADC output pins.
While the tOD time provides information about output timing,
a simple way to capture a valid output is to latch the data on
the rising edge of the conversion clock.
1.9 APPLICATION SCHEMATICS
The following figures show simple examples of using the
ADC10040. The ADC10040 performs best with a differential
input signal.
1.9.1 Narrow Band A.C. Signals
Figure 5 shows a typical circuit for an AC coupled, differen-
tially driven input. The 16 resistors and 24 pF capacitor,
together with the 4 pF input capacitance of the ADC10040,
provides a −3dB input bandwidth of 177 MHz, while the 0.1µF
capacitor at VCOM stabilizes the common move voltage at the
transformer center tap.
17 www.national.com
ADC10040/ADC10040Q
20077849
FIGURE 5. A Simple Application Using a Differential Signal Source
1.9.2 D.C. Applications
For very low frequency and DC input applications, a d.c. cou-
pled amplifier or buffer may be needed, especially when the
input is single-ended and the advantages of a differential input
signal is desired. Figure 6 shows the input drive circuit that
can be used to replace the transformer of Figure 5. The
LMH6550 provides excellent performance and is well-suited
for this application. The common mode output voltage of the
LMH6550 is the same as its VCM input.
20077851
FIGURE 6. Using the LMH6550 for DC and wideband
applications
1.9.3 Single Ended Applications
Performance of the ADC10040 with a single-ended input is
not as good as its performance with a differential input. How-
ever, if the lower performance is adequate, the circuit of
Figure 7 shows an acceptable method of driving the analog
input.
www.national.com 18
ADC10040/ADC10040Q
20077850
FIGURE 7. A Simple Application Using a Single Ended Signal Source
19 www.national.com
ADC10040/ADC10040Q
Physical Dimensions inches (millimeters) unless otherwise noted
28-Lead TSSOP Package
Ordering Number ADC10040CIMT, ADC10040QCIMT
NS Package Number MTC28
www.national.com 20
ADC10040/ADC10040Q
Notes
21 www.national.com
ADC10040/ADC10040Q
Notes
ADC10040/ADC10040Q 10-Bit, 40 MSPS, 3V, 55 mW A/D Converter
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