1#
Product Family Data Sheet Rev 1.0 2015.01.06
High Voltage LED Series
Chip on Board
LC019B
Gen.2
High efficacy COB LED package,
well-suited for use in spotlight applications
Featur
es & Benefits
• Chip on Board (COB) solution makes it easy to design in
• Simple assembly reduces manufacturing cost
• Low thermal resistance
• InGaN/GaN MQW LED with long time reliability
• Completed 6,000 hours of LM-80 Testing
• ENEC certified: Integral LED Module
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
• Outdoor Illumination
2
Table of Contents
1. Characteristics ----------------------- 3
2. Product Code Information ----------------------- 6
3. Typical Characteristics Graphs ----------------------- 12
4. Outline Drawing & Dimension ----------------------- 15
5. Reliability Test Items & Conditions ----------------------- 16
6. Label Structure ----------------------- 17
7. Packing Structure ----------------------- 19
8. Precautions in Handling & Use ----------------------- 22
3
1. Characteristics
a) Absolute Maximum Rating
Item Symbol Rating Unit Condition
Ambient / Operating Temperature Ta -40 ~ +105 ºC -
Storage Temperature Tstg -40 ~ +120 ºC -
LED Junction Temperature Tj 150 ºC -
Case Temperature Tc 105 ºC *Note
Forward Current IF 980 mA -
Power Dissipation PD 36.3 W -
ESD (HBM) - ±2 kV -
ESD (MM) - ±0.5 kV -
b) Electro-optical Characteristics (IF = 540 mA, Tc = 25 ºC)
Item Unit Rank Min. Typ. Max.
Forward Voltage (VF) V YH 32.5 35.5 38.5
Color Rendering Index (Ra) -
3 70 - -
5 80 - -
7 90 - -
8 95
Thermal Resistance (junction to chip point) ºC/W - 1.5 -
Beam Angle º
- 115 -
Working Voltage for Insulation V 60
Nominal Power W 19.2
Eye Protection
Risk 1 - -
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)
2) Samsung maintains measurement toleran ce of: forward voltage = ±5 %, CRI = ±1
3) Max Tc=10 5 ℃ (at max current) is for ENEC condition. Refer to the derating curve, ‘3. Typical Characteristics Graph’
designed within the range.
4
c) Luminous Flux Characteristics (IF = 540 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux
Bin
Sorting1) @ Tc = 25 °C (lm)
Calculated Flux2) @ Tc = 85 °C (lm)
Min. Max. Min. Max.
70
3000 2F 21 2388 2714 2149 2443
22 2714 3040 2443 2736
4000 2F 21 2508 2850 2257 2565
22 2850 3192 2565 2872
5000 2F 21 2532 2877 2278 2589
22 2877 3222 2589 2900
80
2700 1G 24 2487 2650 2263 2411
25 2650 2813 2411 2560
1H 25 2650 2813 2411 2560
3000 1G 24 2646 2819 2408 2565
25 2819 2992 2565 2723
1H 25 2819 2992 2565 2723
3500
1G 23 2547 2725 2318 2480
24 2725 2904 2480 2642
1H 24 2725 2904 2480 2642
25 2904 3082 2642 2805
4000
1G 23 2621 2805 2385 2552
24 2805 2988 2552 2719
1H 24 2805 2988 2552 2719
25 2988 3172 2719 2886
5000
1G 23 2646 2831 2408 2576
24 2831 3016 2576 2745
1H 24 2831 3016 2576 2745
25 3016 3202 2745 2914
5700
1G 23 2646 2831 2408 2576
24 2831 3016 2576 2745
1H 24 2831 3016 2576 2745
25 3016 3202 2745 2914
5
c) Luminous Flux Characteristics (IF = 540 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux
Bin Sorting
1)
@ Tc = 25 °C (lm) Calculated Flux
2)
@ Tc = 85 °C (lm)
Min. Max. Min. Max.
90
2700 2K 23 2084 2251 1897 2048
24 2251 2481 2048 2258
3000 2K 23 2127 2297 1935 2090
24 2297 2527 2090 2299
3500 2K 23 2191 2366 1993 2153
24 2366 2596 2153 2362
4000 2K 23 2254 2435 2051 2216
24 2435 2665 2216 2425
95
2700 1F 11 1714 1905 1560 1733
12 1905 2095 1733 1907
3000 1F 11 1767 1964 1608 1787
12 1964 2160 1787 1966
3500 1F 11 1820 2023 1657 1841
12 2023 2225 1841 2025
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)
2) Calculated flux values are for reference only
3) Samsung maintains measurement toleran ce of: luminous flux = ±7 %, CRI = ±1
6
2. Product Code Information
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
S P H C W 1 H D N B 2 5 Y H R T 2 J
Digit PKG Information Code Specification
1 2 3 Samsung Package High Power SPH
4 5 Color WW Warm White (T/U/V/W Ranks)
CW Cool White (Q/R Ranks)
6 Product Version 1
7 8 Form Factor HD COB
9 Lens Type N No lens
10 Internal Code B LC019
11 Chip Type 2
12 CRI & Sorting Temperature
3 Min. 70
25 °C
5 Min. 80
7 Min. 90
8 Min 95
13 14 Forward Voltage (V) YH 32.5~38.5
15 CCT (K)
W 2700 K
Bin
Code:
WA,WB
(MacAdam
Ellipse)
V 3000 K VA, VB
(MacAdam
Ellipse)
(ANSI bin)
U 3500 K UA, UB
(
MacAdam Ellipse)
T 4000 K TA, TB
(MacAdam
Ellipse)
(ANSI bin)
R 5000 K RA
(MacAdam Ellipse)
(ANSI bin)
Q 5700 K
W, QX, QY, QZ (ANSI bin)
16 MacAdam / ANSI
2 MacAdam 2-step
3 MacAdam 3-step
T ANSI bin
17 18 Lum i no us Flu x
1F
Bin
Code:
11, 12 (95 CRI)
1G 23, 24, 25 (80 CRI)
1H 24, 25 (80 CRI)
2F 21, 22 (70 CRI)
2K 23, 24 (90 CRI)
7
a) Binning Structure (IF = 540 mA , Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K) Product Code VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
70
3000 SPHWW1HDNB23YHVT2F YH VT VW, VX
VY, VZ 2F
21
2388 ~ 2714
22
2714 ~ 3040
4000 SPHWW1HDNB23YHTT2F YH TT TW, TX
TY, TZ 2F
21
2508 ~ 2850
22
2850 ~ 3192
5000 SPHCW1HDNB23YHRT2F YH RT RW, RX
RY, RZ 2F
21
2532 ~ 2877
22
2877 ~ 3222
80
2700
SPHWW1HDNB25YHW21G YH W2 WB 1G
24
2487 ~ 2650
25
2650 ~ 2813
SPHWW1HDNB25YHW31G YH W3 WA, WB 1G
24
2487 ~ 2650
25
2650 ~ 2813
SPHWW1HDNB25YHW21H
YH
W2
WB
1H
25
2650 ~ 2813
SPHWW1HDNB25YHW31H
YH
W3
WA, WB
1H
25
2650 ~ 2813
3000
SPHWW1HDNB25YHV21G YH V2 VB 1G
24
2646 ~ 2819
25
2819 ~ 2992
SPHWW1HDNB25YHV31G YH V3 VA, VB 1G
24
2646 ~ 2819
25
2819 ~ 2992
SPHWW1HDNB25YHV21H
YH
W2
WB
1H
25
2819 ~ 2992
SPHWW1HDNB25YHV31H
YH
W3
WA, WB
1H
25
2819 ~ 2992
3500
SPHWW1HDNB25YHU21G YH U2 UB 1G
23
2547 ~ 2725
24
2725 ~ 2904
SPHWW1HDNB25YHU31G YH U3 UA, UB 1G
23
2547 ~ 2725
24
2725 ~ 2904
SPHWW1HDNB25YHU21H YH U2 UB 1H
24
2725 ~ 2904
25
2904 ~ 3082
SPHWW1HDNB25YHU31H YH U3 UA, UB 1H
24
2725 ~ 2904
25
2904 ~ 3082
4000
SPHWW1HDNB25YHT21G YH T2 TB 1G
23
2621 ~ 2805
24
2805 ~ 2988
SPHWW1HDNB25YHT31G YH T3 TA, TB 1G
23
2621 ~ 2805
24
2805 ~ 2988
SPHWW1HDNB25YHT21H YH T2 TB 1H
24
2805 ~ 2988
25
2988 ~ 3172
SPHWW1HDNB25YHT31H YH T3 TA, TB 1H
24
2805 ~ 2988
25
2988 ~ 3172
5000
SPHCW1HDNB25YHR31G YH R3 RA 1G
23
2646 ~ 2831
24
2831 ~ 3016
SPHCW1HDNB25YHRT1G YH RT RW, RX,
RY, RZ 1G
23
2646 ~ 2831
24
2831 ~ 3016
SPHCW1HDNB25YHR31H YH R3 RA 1H
24
2831 ~ 3016
25
3016 ~ 3202
SPHCW1HDNB25YHRT1H YH RT RW, RX,
RY, RZ 1H
24
2831 ~ 3016
25
3016 ~ 3202
5700
SPHCW1HDNB25YHQT1G YH QT QW, QX
QY, QZ 1G
23
2646 ~ 2831
24
2831 ~ 3016
SPHCW1HDNB25YHQT1H YH QT QW, QX
QY, QZ 1H
24
2831 ~ 3016
25
3016 ~ 3202
8
a) Binning Structure (IF = 540 mA, Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K) Product Code VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
90
2700
SPHWW1HDNB27YHW22K YH W2 WB 2K
23
2084 ~ 2251
24
2251 ~ 2481
SPHWW1HDNB27YHW32K YH W3 WA, WB 2K
23
2084 ~ 2251
24
2251 ~ 2481
3000
SPHWW1HDNB27YHV22K YH V2 VB 2K
23
2127 ~ 2297
24
2297 ~ 2527
SPHWW1HDNB27YHV32K YH V3 VA, VB 2K
23
2127 ~ 2297
24
2297 ~ 2527
3500
SPHWW1HDNB27YHU22K YH U2 UB 2K
23
2191 ~ 2366
24
2366 ~ 2596
SPHWW1HDNB27YHU32K YH U3 UA, UB 2K
23
2191 ~ 2366
24
2366 ~ 2596
4000
SPHWW1HDNB27YHT22K YH T2 TB 2K
23
2254 ~ 2435
24
2435 ~ 2665
SPHWW1HDNB27YHT32K YH T3 TA, TB 2K
23
2254 ~ 2435
24
2435 ~ 2665
95
2700
SPHWW1HDNB28YHW21F YH W2 WB 1F
11
1714 ~ 1905
12
1905 ~ 2095
SPHWW1HDNB28YHW31F YH W3 WA,WB 1F
11
1714 ~ 1905
12
1905 ~ 2095
3000
SPHWW1HDNB28YHV21F YH V2 VB 1F
11
1767 ~ 1964
12
1964 ~ 2160
SPHWW1HDNB28YHV31F YH V3 VA,VB 1F
11
1767 ~ 1964
12
1964 ~ 2160
3500
SPHWW1HDNB28YHU21F YH U2 UB 1F
11
1820 ~ 2023
12
2023 ~ 2225
SPHWW1HDNB28YHU31F YH U3 UA,UB 1F
11
1820 ~ 2023
12
2023 ~ 2225
9
b) Chromaticity Region & Coordinates (IF = 540 mA, Ta = 25 ºC)
Region CIE x CIE y Region CIE x CIE y
Region CIE x CIE y Region CIE x CIE y
V rank (3000 K)
T rank (4000 K)
VW
0.4223 0.399
VY
0.4345 0.4033
TW
0.3736 0.3874
TY
0.3871 0.3959
0.4345 0.4033 0.4468 0.4077
0.3871 0.3959 0.4006 0.4044
0.4431 0.4213 0.4562 0.4260
0.3828 0.3803 0.3952 0.388
0.4299 0.4165 0.4431 0.4213
0.3703 0.3726 0.3828 0.3803
VX
0.4223 0.399
VZ
0.4260 0.3854
TX
0.3703 0.3726
TZ
0.3828 0.3803
0.4147 0.3814 0.4373 0.3893
0.3828 0.3803 0.3952 0.388
0.4260 0.3854 0.4468 0.4077
0.3784 0.3647 0.3898 0.3716
0.4345 0.4033 0.4345 0.4033
0.367 0.3578 0.3784 0.3647
R rank (5000 K)
Q rank (5700 K)
RW
0.3376 0.3616
RY
0.3463 0.3687
QW
0.3207 0.3462
QY
0.3290 0.3538
0.3463 0.3687 0.3551 0.3760
0.3290 0.3538 0.3376 0.3616
0.3451 0.3554 0.3533 0.3620
0.3290 0.3417 0.3371 0.3490
0.3371 0.3490 0.3451 0.3554
0.3215 0.3350 0.3290 0.3417
RX
0.3371 0.3490
RZ
0.3451 0.3554
QX
0.3215 0.3350
QZ
0.3290 0.3417
0.3451 0.3554 0.3533 0.3620
0.3290 0.3417 0.3371 0.3490
0.3440 0.3428 0.3515 0.3487
0.3290 0.3300 0.3366 0.3369
0.3366 0.3369 0.3440 0.3428
0.3222 0.3243 0.3290 0.3300
10
b) Chromaticity Region & Coordinates (IF = 540 mA, Ta = 25 ºC)
MacAdam Ellipse (WA, WB) MacAdam Ellipse (VA, VB)
Step C IE x C IE y θ a b Step C IE x C IE y θ a b
2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027
3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041
MacAdam Ellipse (UA, UB) MacAdam Ellipse (TA, TB)
Step C IE x C IE y θ a b Step C IE x C IE y θ a b
2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027
3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040
MacAdam Ellipse (RA)
Step C IE x C IE y θ a b
3-step 0.3447 0.3553 59.62 0.0082 0.0035
Note:
Samsung maintai ns me asur e ment t ole ran ce of: Cx, Cy = ±0.005
θ
CIE x,y
11
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 540 mA, Tc = 25 ºC)
CCT: 2700 K CCT: 3000 K
CCT: 3500 K CCT: 4000 K
CCT: 5000 K CCT: 5700 K
12
b) Forwa rd Current Characteristics (Tc = 25 ºC)
c) Temperature Characteristics (IF = 540 mA)
d) Color Shif t Characteristics Tc = 25 ºC IF = 540 mA
13
e) Derating Curve
f) Beam Angle Characteristics (IF = 540 mA, Tc = 25 ºC)
14
4. Outline Drawing & Dimension
Item Dimension Tolerance Unit
Length 17.0 ±0.15 mm
Width 17.0 ±0.15 mm
Height 1.50 ±0.20 mm
Light Emitting Surface (LES) Diameter 12.4 ±0.15 mm
Note: Denoted produ ct information above is only an example
( 19W8027 : 19W, CRI80+, 2700K )
Tc point
1. Unit: mm
2. Tolerance: ± 0.15 mm
1. Unit: mm
2. Tolerance: ± 0.2 mm
Note
15
5. Reliability Test Items & Conditions
a) Test Items
Test Item Test Condition Test Hour / Cycle
Room Temperature
Life Test 25 ºC, IF = max 1000 h
High Temperature
Humidity Life Test 85 ºC, 85 % RH, DC Derating, IF = max 1000 h
High Temperature
Life Test
105 ºC, DC Derating, IF = max 1000 h
Low Temperature
Life Test -40 ºC, DC 980 mA 1000 h
High Temperature
Storage 120 ºC 1000 h
Low Temperature
Storage -40 ºC 1000 h
Thermal Shock -45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change in 5 min 200 cycles
Temperature Cycle
On/Off Test -40 ºC / 85 ºC each 20 min, 100 min transfer
power on/ off each 5 min, DC 54 0 mA 100 cycles
Temperature Humidity
Storage Test -10 ºC ↔ 25 ºC, 95 % RH ↔ 85 ºC, 95 % RH
(24 h / cycle) 100 cycles
ESD (HBM)
R
1
: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
5 times
ESD (MM)
R
1
: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.5 kV
5 times
Vibration Test 20 ~ 80 Hz (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer 4 times
Mechanical Shock Test 1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides) 5 times
Salt Spray Test 35 ºC, 5 % salt water
8 h spray, 16 h dwell 2 cycles
b) Criteria for Judging the Damage
Item Symbol Test Condition
(Tc = 25 ºC)
Limit
Min. Max.
Forward Voltage VF IF = 540 mA L.S.L. * 0.9 U.S.L. * 1.1
Lumino us Flu x Φv IF = 540 mA L.S.L * 0.7 U.S.L * 1.3
16
6. Label Structure
a) Label Structure
Note: Denoted rank code and product code above is only an example (see description on page 5)
Rank Code:
ⓐⓑ: Forward Voltage rank (refer to page 6-7)
ⓒⓓ: Chromaticity bin (refer to page 8-9)
ⓔⓕ: Luminous Flux bin (refer to page 6-7)
Aluminum Bag & Inner Box Outer Box
17
b) Lot Number
The lot number is composed of the following characters:
●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS
● : Production site (S: Giheung, Korea, G: Tianjin, C hina)
◎ : L (LED)
◇
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
◆ : Year (Y: 2014, Z: 2015 , A: 2016, …)
□ : Month (1~9, A, B, C)
■ : Day (1~9, A, B~V)
△△△ : Product serial number (001 ~ 009)
▲▲▲
: Tray number (001 ~ 999)
18
7. Packing Structure
Packing material Max. quantity
in pcs of COB
Dimension (mm)
Length
Width
Height
Tolerance
Tray 60 322.6 135.9 10.8 1.0
Aluminum Bag 480 (8 trays) 450 230 - 10
PE Foam Pad - 280 130 10 2
Inner Box 480 (1 aluminum bag) 338 148 55 2
Outer Box 1,920 (4 i nn er bo xes) 351 308 120 5
Pallet 107,520 (56 outer boxe s) 1000 1000 130 10
a) Packing Structure
BODY
TRAY
PE-FOAM
8ea
0ea
6ea
1ea
4ea
2ea
2ea
3ea
Cover Tray(1pcs)
HUMIDITY INDICATOR
(Do not use Cobalt Dichloride.)
Body Tray(8pcs)
Taping (Taping Strength : feebly)
Material is PET(Antistatic) 10(5) ~ 10(9) ohm/sq
SILICA GEL(5g)
(Do not use Cobalt Dichloride.)
MBB bag
Heat Sealing
8body + 1cover tray / MBB bag
(MBB-BAG : Heat Sealing)
4 inner-box / Out-box
19
b) Tray
①
COVER
②
BODY
20
c) Aluminum Vinyl Packing Bag
d) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag
21
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it
may cause da mag e or ev en d estr u cti on t o LE D d ev ice s. D a mage d LEDs may show some unus ual charac teri sti cs su ch a s
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
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Specifications and designs are subject to change without notice. Non-metric
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KOREA
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