VUB145-16NOXT
NTC
45+46
3
24+25
~14+15
~10+11
~ 6+7
21+22 41 40 48+49
29 30
3~ Rectifier Bridge + Brake Unit + NTC
Standard Rectifier Module
Part number
VUB145-16NOXT
Backside: isolated
Features / Advantages: Applications: Package:
● Package with DCB ceramic
● Improved temperature and power cycling
● Planar passivated chips
● Very low forward voltage drop
● Very low leakage current
● NTC
● X2PT - 2nd generation Xtreme light Punch Through
● Rugged X2PT design results in:
- short circuit rated for 10 µsec.
- very low gate charge
- low EMI
- square RBSOA @ 2x Ic
● Thin wafer technology combined with X2PT design
results in a competitive low VCE(sat) and low
thermal resistance
● 3~ Rectifier with brake unit
for drive inverters
E2-Pack
● Industry standard outline
● RoHS compliant
● Soldering pins for PCB mounting
● Height: 17 mm
● Base plate: Copper
internally DCB isolated
● Advanced power cycling
● Phase Change Material available
● Isolation Voltage: V~
3600
The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and
the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The
information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns
the specific application of your product, please contact your local sales office.
Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office.
Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend
- to perform joint risk and quality assessments;
- the conclusion of quality agreements;
- to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.
Terms and Conditions of Usage
RRM
1600
I 150
FSM
1100
DAV
V=V
A
A
=
=
I
3~
Rectifier
CES
1200
Brake
Chopper
I 180
CE(sat)
1.7
C25
V= V
A
V
=
=
V
IXYS reserves the right to change limits, conditions and dimensions. 20171128gData according to IEC 60747and per semiconductor unless otherwise specified
© 2017 IXYS all rights reserved
VUB145-16NOXT
V = V
kA²s
kA²s
kA²s
kA²s
Symbol
Definition
Ratings
typ.
max.
I
R
V
IA
V
F
1.20
R0.5 K/W
R
min.
150
V
RSM
V
100T = 25°C
VJ
T = °C
VJ
mA2V = V
R
T = 25°C
VJ
I = A
F
V
T = °C
C
105
P
tot
250 WT = 25°C
C
RK/W
50
1600
max. non-repetitive reverse blocking voltage
reverse current
forward voltage drop
total power dissipation
Conditions
Unit
1.68
T = 25°C
VJ
150
V
F0
V0.87T = °C
VJ
150
r
F
5.9 mΩ
V1.13T = °C
VJ
I = A
F
V
50
1.74
I = A
F
150
I = A
F
150
threshold voltage
slope resistance for power loss calculation only
µA
125
V
RRM
V1600
max. repetitive reverse blocking voltage
T = 25°C
VJ
C
J
37
junction capacitance
V = V;400 T = 25°Cf = 1 MHz
RVJ
pF
I
FSM
t = 10 ms; (50 Hz), sine T = 45°C
VJ
max. forward surge current
T = °C
VJ
150
I²t T = 45°C
value for fusing
T = °C150
V = 0 V
R
V = 0 V
R
V = 0 V
V = 0 V
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
t = 10 ms; (50 Hz), sine
t = 8,3 ms; (60 Hz), sine
VJ
R
VJ
R
T = °C
VJ
150
1.10
1.19
4.37
4.25
kA
kA
A
kA
935
1.01
6.05
5.89
1600
DAV
d =rectangular ⅓
bridge output current
thermal resistance junction to case
thJC
thermal resistance case to heatsink
thCH
Rectifier
1700
0.10
IXYS reserves the right to change limits, conditions and dimensions. 20171128gData according to IEC 60747and per semiconductor unless otherwise specified
© 2017 IXYS all rights reserved
VUB145-16NOXT
T = 125°C
V
CES
V1200
collector emitter voltage
collector emitter saturation voltage
T = 25°C
collector current
A
180
A
C
VJ
Symbol
Definition
Ratings
typ.
max.
min.
Conditions
Unit
140
V
V
CE(sat)
total power dissipation
500 W
collector emitter leakage current
7.5 V
turn-on delay time
230 ns
t
reverse bias safe operating area
A
V
GES
V±20
V
GEM
max. transient gate emitter voltage
T = °C
C
V
P
tot
gate emitter threshold voltage
RBSOA
300
±30
T = 125°C
T = 125°C
VJ
V
max. DC gate voltage
I
C25
I
C
T = 25°C
VJ
I = A; V = 15 V
C GE
T = 25°C
VJ
V
GE(th)
I
CES
I = mA; V = V
C GE CE
V = V ; V = 0 V
CE CES GE
I
GES
T = 25°C
VJ
gate emitter leakage current
V = ±20 V
GE
2.1
1.9
6.86
mA
0.1 mA
0.1
500
G(on)
total gate charge
V = V; V = 15 V; I = A
CE
Q
GE C
340 nC
t
t
t
E
E
d(on)
r
d(off)
f
on
off
70 ns
380 ns
230 ns
12.5 mJ
11.5 mJ
current rise time
turn-off delay time
current fall time
turn-on energy per pulse
turn-off energy per pulse
inductive load
V = V; I = A
V = ±15 V; R = Ω
CE C
GE G
V = ±15 V; R = Ω
GE G
V = V
CEK
1200
short circuit safe operating area
µs
SCSOA
10T = 125°C
VJ
V = V; V = ±15 V
CE GE
short circuit duration
t
short circuit current
I
SC
SC
R = Ω; non-repetitive
G
450 A
R
thJC
thermal resistance junction to case
K/W
V
RRM
V1200
max. repetitive reverse voltage
T = 25°C
VJ
T = 25°C
forward current
A
48
A
C
32
T = °C
C
I
F25
I
F
T = 25°C
forward voltage
V
2.75
V
VJ
1.60T = 125°C
VJ
V
F
I = A
F
T = 25°C
reverse current
mA
0.25
mA
VJ
1T = 125°C
VJ
I
RR RRM
T = 125°C
VJ
Q
I
t
rr
RM
rr
5.2 µC
50 A
300 ns
reverse recovery charge
max. reverse recovery current
reverse recovery time
V =
-di /dt = A/µs
I = A
F
F
E
rec
1.9 mJ
reverse recovery energy
R
R
thJC
thermal resistance junction to case
0.9 K/W
V = V
T = 25°C
C
T = 25°C
VJ
T = 125°C
VJ
VJ
100
4
100
100
30
30
6.8
6.8
6.8
600
720
1000
600
I
CM
1.7
R
thCH
thermal resistance case to heatsink
0.25
K/W
R
thCH
thermal resistance case to heatsink
K/W
Brake IGBT + Diode
Brake Diode
600 V
80
80
80
80
nA
V = V
CEK
1200
0.10
0.10
IXYS reserves the right to change limits, conditions and dimensions. 20171128gData according to IEC 60747and per semiconductor unless otherwise specified
© 2017 IXYS all rights reserved
VUB145-16NOXT
Ratings
XXXXXXXXXX yywwx
Logo UL Part number Date Code
2D Data Matrix
Location
Package
T
op
°C
M
D
Nm6
mounting torque
3
T
VJ
°C150
virtual junction temperature
-40
Weight g176
Symbol
Definition
typ.
max.
min.
Conditions
operation temperature
Unit
VV
t = 1 second
V
t = 1 minute
isolation voltage
mm
mm
6.0
12.0
d
Spp/App
creepage distance on surface | striking distance through air
d
Spb/Apb
terminal to backside
I
RMS
RMS current
200 A
per terminal
125-40
terminal to terminal
E2-Pack
Delivery Mode Quantity Code No.Ordering Number Marking on ProductOrdering
0 25 50 75 100 125 150
102
103
104
10
5
R
[
]
Typ. NTC resistance vs. temperature
TC[°C]
50/60 Hz, RMS; I ≤ 1 mA
ISOL
VUB145-16NOXT 521635Box 6VUB145-16NOXTStandard
3600
ISOL
T
stg
°C125
storage temperature
-40
3000
threshold voltage
V0.87
mΩ
V
0 max
R
0 max
slope resistance *
3.3
1.31
8
Equivalent Circuits for Simulation
T =
VJ
I
V
0
R
0
Rectifier Brake
Diode
150 °C
* on die level
T = 25°
resistance
kΩ
5.25
K
VJ
3375
R
25
B
25/50
54.75
temperature coefficient
Symbol
Definition
typ.
max.
min.
Conditions
Unit
Temperature Sensor NTC
IXYS reserves the right to change limits, conditions and dimensions. 20171128gData according to IEC 60747and per semiconductor unless otherwise specified
© 2017 IXYS all rights reserved
VUB145-16NOXT
107,5
±0,3
93
±0,2
79,2
45
±0,2
32
±0,2
11
0
44 3543 42 41 40 39 38 37 36 2634 33 32 31 30 29 28 27
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19
61,74
65,55
31,26
19,83
50.31
20,6
±0,5
17
±0,5
3,5
±0,5
35,07
46,50
Vor der Montage typ. 100 µm konvex über 75 mm
Before mounting typ. 100 µm convex over 75 mm
65,55
27,45
23,64
69,36
A
D
0,8
±0,05
15° ±1°
Detail D
C
0,8
±0,2
1,2
±0,05
Detail C
15.24
11.43
7.62
11.43
25
24
23
22
21
20
11,43
7,62
11,43
0
45
46
47
50
49
48
Ø 5,5
+0,1 - 0,3
41,90
Index
Bemerkung /
Note:
-
Nichttolerierte Maße nach /
Measure without tolerances according DIN ISO 2768-T1-m
- PCB-Lochmuster / PCB hole pattern: see pin position
- Toleranz Pin-Position und PCB-Lochmuster / Tolerance of pin position and PCB hole pattern: 0.1
- Montageanleitung / Mounting instruction: www.ixys.com Application note IXAN0024
Detail A:PCB-Montage /
Mounting on PCB
- Empfohlene, selbstschneidende Schraube / Recommended, self-tapping screw: EJOT PT® (Größe / size: K25
)
- Max. Schraubenlänge / Max. screw length: PCB-Dicke / thickness + 6 mm (max. Lochtiefe /
hole depth)
- Empfohlenes Drehmoment / Recommended mounting torque:1.5 Nm
6
Detail
A
Ø 6 Ø 2,5
-0,3
Ø 2,1
-0,3
1,5 +0,3
NTC
45+46
3
24+25
~14+15
~10+11
~ 6+7
21+22 41 40 48+49
29 30
Outlines E2-Pack
IXYS reserves the right to change limits, conditions and dimensions. 20171128gData according to IEC 60747and per semiconductor unless otherwise specified
© 2017 IXYS all rights reserved
VUB145-16NOXT
0.001 0.01 0.1 1
400
500
600
700
800
900
2 3 4 5 6 7 8 9 011
10
3
10
4
0 10 20 30 40 50 60 70
0
20
40
60
80
0 20 40 60 80 100 120 140 160
1 10 100 1000 10000
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0 25 50 75 100 125 150
0
20
40
60
80
100
120
140
50Hz, 80% V
RRM
0.0 0.5 1.0 1.5 2.0
0
50
100
150
2
00
T
VJ
= 45°C
T
VJ
= 150°C
T
VJ
= 45°C
T
VJ
= 150°C
T
VJ
= 125°C
T
VJ
= 25°C
I
2
t
[A
2
s]
I
FSM
[A]
t [s]
I
F
[
A]
VF[V] t [ms]
P
tot
[
W]
I
F(AV)M
[A] T
amb
[°C]
I
dAV
[A]
T
C
[°C]
t [s]
Z
thJC
[
K/W]
R
thA
:
0.1 K/W
0.3 K/W
0.6 K/W
1.0 K/W
1.5 K/W
2.5 K/W
DC =
1
0.5
0.4
0.33
0.17
0.08
Fig. 1 Forward current vs.
voltage drop per diode
Fig. 2 Surge overload current
vs. time per diode
Fig. 3 I
2
t vs. time per diode
Fig. 4 Power dissipation vs. forward current
and ambient temperature per diode
Fig. 5 Max. forward current vs.
case temperature per diode
Fig. 6 Transient thermal impedance junction to case vs. time per diode
DC =
1
0.5
0.4
0.33
0.17
0.08
Constants for Z
thJC
calculation:
i R
th
(K/W) t
i
(s)
1 0.040 0.004
2 0.003 0.010
3 0.140 0.030
4 0.120 0.300
5 0.197 0.080
Rectifier
IXYS reserves the right to change limits, conditions and dimensions. 20171128gData according to IEC 60747and per semiconductor unless otherwise specified
© 2017 IXYS all rights reserved
VUB145-16NOXT
0.001 0.01 0.1 1
0.01
0.1
1
0.0 0.5 1.0 1.5 2.0 2.5
0
10
20
30
40
50
60
6 7 8 9 10 11 12 13
0
50
100
150
200
I
C
[A]
t
[ns]
V
F
[V]
t [s]
Z
thJC
[K/W]
Fig.2 Typ. output characteristics
IGBT
Fig. 3 Typ. transfer charact.
IGBT
Fig. 6 Typ. forward characteristics
Diode
Fig. 9 Transient thermal
resistance junction to case
0.0 0.5 1.0 1.5 2.0 2.5 3.0
0
50
100
150
200
I
C
[A]
V
CE
[V]
Fig.1 Output characteristics IGBT
0 1 2 3 4
0
50
100
150
200
I
C
[A]
V
CE
[V] V
GE
[V]
4 8 12 16 20 24
0.0
0.5
1.0
1.5
2.0
2.5
0
25
50
75
100
125
0 10 20 30 40 50 60
0
20
40
60
80
0
2
4
6
8
I
F
[A]
I
rr
E
rec
E
rec
[mJ]
R
G
[Ohm]
Fig. 7 Typ. reverse recovery
c
h
a
r
a
c
t
e
r
i
s
t
i
c
s
D
i
o
d
e
Fig. 8 Typ. reverse recovery
characteristics Diode
0 50 100 150 200
0
10
20
30
40
50
0
100
200
300
400
500
E
off
[mJ]
I
C
[A]
Fig. 5 Typ. turn-off energy & switch.
times vs. collector current
0 50 100 150 200
0
100
200
300
400
0
10
20
30
40
E
on
[
mJ]
I
C
[A]
t
d(on)
E
on
Fig. 4 Typ. turn-on energy & switch.
times vs. collector current
t
r
t
r
[ns]
E
rec
[
mJ]
I
rr
[A] I
rr
[A]
25°C
125°C
9 V
11 V
13 V
25°C
125°C
E
off
t
f
t
d(off)
I
F
[A]
25°C
125°C
E
rec
I
rr
V
CE
= 20 V
V
GE
= 19 V
17 V
15 V
T
VJ
= 125°C
V
R
= 600 V
I
F
= 30 A
Diode
IGBT
T
VJ
= 150°C
Diode
R
i
t
i
0.365 0.0050
0.180 0.0003
0.255 0.0397
0.100 0.1000
IGBT
Riti
0.050 0.0010
0.035 0.0100
0.120 0.0300
0.045 0.0800
R
G
= 6.8 Ohm
V
CE
= 600 V
V
GE
= ±15 V
T
VJ
= 125°C
R
G
= 6.8 Ohm
V
CE
= 600 V
V
GE
= ±15 V
T
VJ
= 125°C
R
G
= 6.8 Ohm
V
R
= 600 V
T
VJ
= 125°C
Brake IGBT + Diode
IXYS reserves the right to change limits, conditions and dimensions. 20171128gData according to IEC 60747and per semiconductor unless otherwise specified
© 2017 IXYS all rights reserved
