BGX13P22GA-V21 - SILICON LABS

BGX13P Blue Gecko Bluetooth ® Module

Data Sheet

The BGX13P Blue Gecko Bluetooth ® Module family of serial replacement modules elim-

inates Bluetooth firmware development complexity with a serial interface that can oper-

ate as a raw data stream or control the device through a abstracted command API. The

BGX13P can facilitate a device-to-device cable replacement link or communicate with

mobile devices through the Xpress Bluetooth mobile library. The device integrates a

Bluetooth 5 compliant stack to future-proof applications as Bluetooth 5 adoption increa-

ses.

The device is targeted for applications where ultra-small size, reliable high-performance

RF, low-power consumption, and fast time-to-market are key requirements. At 12.9 ×

15.0 × 2.0 mm (W × L × H) the BGX13P module fits applications where size is a con-

straint. BGX13P also integrates a high-performance, ultra-robust antenna, which re-

quires minimal PCB, plastic, and metal clearance. The total PCB area required by

BGX13P is only 51 mm2. The BGX13P has Bluetooth, CE, full FCC, Japanese and

South Korean certifications.

BGX13P modules can be used in a wide variety of applications:

KEY FEATURES

• Bluetooth 5 low energy compliant

• Serial interface with hardware flow control

•GPIO control through command API

• Integrated antenna

• TX power up to 8 dBm

• Encrypted bonding and connectivity

• Integrated DC-DC Converter

• Onboard Bluetooth stack

• Centralized OTA through mobile app

library

• Health, sports, and wellness devices

• Industrial, home, and building automation

•Smart phone, tablet, and PC accessories

RadioBluetooth

controller

Serial interface

Command

parser

Raw data

stream

buffers

RX/TX and flow

control

Bluetooth 5

compliant

stack

Timers

OTA

manager

Radio

transceiver

Chip

antenna

Matching

network

GPIO

control

silabs.com | Building a more connected world. Preliminary Rev. 0.5

This information applies to a product under development. Its characteristics and specifications are subject to change without notice.

1. Ordering Information

Table 1.1. Ordering Information

Ordering Code Protocol Stack

Frequency Band

@ Max TX Power Antenna GPIO Packaging

BGX13P22GA-V21R Bluetooth Low

Energy

2.4 GHz @ 8 dBm Built-in 8 Reel

BGX13P22GA-V21 Bluetooth Low

Energy

2.4 GHz @ 8 dBm Built-in 8 Tray

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Ordering Information

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Table of Contents

1. Ordering Information ............................

2. Electrical Specifications ...........................5

2.1 Electrical Characteristics ..........................5

2.1.1 Absolute Maximum Ratings ........................5

2.1.2 Operating Conditions ..........................5

2.1.3 Power Consumption...........................6

2.1.4 2.4 GHz RF Transceiver Characteristics ....................7

2.1.5 Non-Volatile Configuration Storage......................8

2.1.6 General-Purpose I/O (GPIO) ........................9

3. Typical Connection Diagrams ........................10

3.1 UART Interface with Embedded Host ......................10

4. Layout Guidelines ............................11

4.1 Module Placement and Application PCB Layout Guidelines ...............11

4.2 Effect of Plastic and Metal Materials .......................12

4.3 Locating the Module Close to Human Body ....................12

4.4 2D Radiation Pattern Plots ..........................13

5. Hardware Design Guidelines ........................15

5.1 Power Supply Requirements .........................15

5.2 Reset Functions .............................15

5.3 Debug and Firmware Updates .........................15

6. Pin Definitions ..............................16

6.1 BGX13P Device Pinout ...........................16

7. Functional overview ............................ 18

7.1 Introduction ...............................18

7.2 Communication Use Cases..........................18

7.3 Embedded Interface ............................18

7.4 Command Mode and Streaming Mode ......................18

7.5 Command API ..............................19

7.6 GPIO Control ..............................19

7.7 Device Configuration ............................19

7.8 Security Features .............................19

7.9 OTA .................................19

7.10 Direct Test Mode Support ..........................19

8. Package Specifications ..........................20

8.1 BGX13P Package Marking ..........................20

8.2 BGX13P Dimensions ............................21

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8.3 BGX13P Module Footprint ..........................21

8.4 BGX13P Recommended PCB Land Pattern ....................22

9. Soldering Recommendations ........................23

9.1 Soldering Recommendations .........................23

10. Certifications ..............................24

10.1 Bluetooth ...............................24

10.2 CE .................................24

10.3 FCC .................................24

10.4 ISED Canada ..............................25

10.5 Japan ................................27

10.6 KC (South-Korea) ............................27

11. Revision History............................. 28

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2. Electrical Specifications

2.1 Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

• Typical values are based on TAMB = 25°C and VDD = 3.3 V, by production test and/or technology characterization.

• Radio performance numbers are measured in conducted mode, based on Silicon Laboratories reference designs using output pow-

er-specific external RF impedance-matching networks for interfacing to a 50 Ω antenna.

• Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature,

unless stated otherwise.

The BGX13P module has only one external supply pin (VDD). There are several internal supply rails mentioned in the electrical specifi-

cations, whose connections vary based on transmit power configuration. Refer to for the relationship between the module's external

VDD pin and internal voltage supply rails.

Refer to for more details about operational supply and temperature limits.

2.1.1 Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only, and functional operation of

the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure

to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and relia-

bility data, see the Quality and Reliability Monitor Report at http://www.silabs.com/support/quality/pages/default.aspx.

Table 2.1. Absolute Maximum Ratings

Parameter Symbol Test Condition Min Typ Max Unit

Storage temperature range TSTG -50 — 150 °C

Voltage on any supply pin VDDMAX -0.3 — 3.8 V

Voltage ramp rate on any

supply pin

VDDRAMPMAX — — 1 V / µs

DC voltage on any GPIO pin VDIGPIN -0.3 — VDD+0.3 V

Maximum RF level at input PRFMAX2G4 — — 10 dBm

Total current into supply pins IVDDMAX Source — — 200 mA

Total current into VSS

ground lines

IVSSMAX Sink — — 200 mA

Current per I/O pin IIOMAX Sink — — 50 mA

Source — — 50 mA

Current for all I/O pins IIOALLMAX Sink — — 200 mA

Source — — 200 mA

Junction temperature TJ-40 — 105 °C

2.1.2 Operating Conditions

The following subsections define the operating conditions for the module.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Electrical Specifications

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2.1.2.1 General Operating Conditions

Table 2.2. General Operating Conditions

Parameter Symbol Test Condition Min Typ Max Unit

Operating ambient tempera-

ture range

TA-40 25 85 °C

VDD operating supply volt-

age

VVDD 2.4 3.3 3.8 V

2.1.3 Power Consumption

Unless otherwise indicated, typical conditions are: VDD = 3.3 V. T = 25°C. Minimum and maximum values in this table represent the

worst conditions across process variation at T = 25°C.

Table 2.3. Power Consumption

Parameter Symbol Test Condition Min Typ Max Unit

Active supply current, Un-

connected, Idle

IACTIVE_IDLE Baud rate ≤ 9600 bps — 3 — µA

Baud rate > 9600 bps — 3.25 — mA

Active supply current, Adver-

tising

IACTIVE_ADV Interval = 546.25 ms, Baud rate ≤

9600 bps

— 90 — µA

Interval = 20 ms, Baud rate ≤

9600 bps

— 2 — mA

Interval = 546.25 ms, Baud rate >

9600 bps

— 3.3 — mA

Interval = 20 ms, Baud rate >

9600 bps

— 4.7 — mA

Active supply current, Con-

nected, 15 ms Interval

IACTIVE_CONN Idle, Baud Rate ≤ 9600 bps — 660 — µA

TX/RX (acknowledged) at highest

throughput, Baud Rate ≤ 9600

bps

—3.5 — mA

TX/RX (unacknowledged) at high-

est throughput, Baud Rate ≤ 9600

bps

— 4 — mA

Idle, Baud Rate > 9600 bps — 3.5 — mA

TX/RX (acknowledged) at highest

throughput, Baud Rate > 9600

bps

— 5.25 — mA

TX/RX (unacknowledged) at high-

est throughput, Baud Rate > 9600

bps

— 7 — mA

Supply current in low power

mode

ILPM Radio disabled — 3 — µA

Radio enabled, Advertising, Inter-

val = 546.25 ms

— 90 — µA

Radio enabled, Advertising, Inter-

val = 20 ms

— 2 — mA

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Electrical Specifications

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2.1.4 2.4 GHz RF Transceiver Characteristics

2.1.4.1 RF Transmitter General Characteristics for 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25°C, VDD = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center fre-

quency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 2.4. RF Transmitter General Characteristics for 2.4 GHz Band

Parameter Symbol Test Condition Min Typ Max Unit

Maximum TX power1, 2 POUTMAX — 8 — dBm

Minimum active TX Power POUTMIN CW -27 — dBm

Output power step size POUTSTEP -5 dBm< Output power < 0 dBm — 0.5 — dB

0 dBm < output power <

POUTMAX

— 0.5 — dB

Output power variation vs

supply at POUTMAX

POUTVAR_V 2.4 V < VVDD < 3.3 V — 0.05 — dB

Output power variation vs

temperature at POUTMAX

POUTVAR_T From -40 to +85 °C — 1.7 — dB

Output power variation vs RF

frequency at POUTMAX

POUTVAR_F Over RF tuning frequency range — 0.3 — dB

RF tuning frequency range FRANGE 2400 — 2483.5 MHz

Note:

1. Supported transmit power levels are determined by the ordering part number (OPN). Transmit power ratings for all devices cov-

ered in this datasheet can be found in the Max TX Power column of the Ordering Information Table.

2. The FCC-rated TXP for the BGM13P module family is 19 dBM. For the CE, Japan, and Korea, the maximum TXP is nominally 8

dBM. The maximum TXP for each region is reported in the formal certification test reports. The end-product manufacturer must

make sure that the country limitations are taken into account when configuring the module.

2.1.4.2 RF Receiver General Characteristics for 2.4 GHz Band

Unless otherwise indicated, typical conditions are: T = 25°C, VDD = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center fre-

quency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 2.5. RF Receiver General Characteristics for 2.4 GHz Band

Parameter Symbol Test Condition Min Typ Max Unit

RF tuning frequency range FRANGE 2400 — 2483.5 MHz

Receive mode maximum

spurious emission

SPURRX 30 MHz to 1 GHz — -57 — dBm

1 GHz to 12 GHz — -47 — dBm

Max spurious emissions dur-

ing active receive mode, per

FCC Part 15.109(a)

SPURRX_FCC 216 MHz to 960 MHz, Conducted

Measurement

— -55.2 — dBm

Above 960 MHz, Conducted

Measurement

— -47.2 — dBm

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Electrical Specifications

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2.1.4.3 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 1 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25°C, VDD = 3.3 V. DC-DC on. Crystal frequency = 38.4 MHz. RF center fre-

quency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 2.6. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band, 1 Mbps Data Rate

Parameter Symbol Test Condition Min Typ Max Unit

Sensitivity, 0.1% BER SENS Signal is reference signal1. Using

DC-DC converter.

— -94.8 — dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

— -94.4 — dBm

Note:

1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 1 Mbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

2.1.4.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Unless otherwise indicated, typical conditions are: T = 25 °C, VDD = 3.3 V. DC-DC on. Crystal frequency=38.4 MHz. RF center fre-

quency 2.45 GHz. Conducted measurement from the antenna feedpoint.

Table 2.7. RF Receiver Characteristics for Bluetooth Low Energy in the 2.4GHz Band, 2 Mbps Data Rate

Parameter Symbol Test Condition Min Typ Max Unit

Sensitivity, 0.1% BER SENS Signal is reference signal1. Using

DC-DC converter.

— -91.2 — dBm

With non-ideal signals as speci-

fied in RF-PHY.TS.4.2.2, section

4.6.1.

— -91.1 — dBm

Note:

1. Reference signal is defined 2GFSK at -67 dBm, Modulation index = 0.5, BT = 0.5, Bit rate = 2 Mbps, desired data = PRBS9;

interferer data = PRBS15; frequency accuracy better than 1 ppm.

2.1.5 Non-Volatile Configuration Storage

Table 2.8. Non-Volatile Configuration Storage

Parameter Symbol Test Condition Min Typ Max Unit

Update cycles before failure UC 10000 — — cycles

Data retention RET 10 — — years

Supply voltage during update VDD 1.62 — 3.6 V

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Electrical Specifications

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2.1.6 General-Purpose I/O (GPIO)

Table 2.9. General-Purpose I/O (GPIO)

Parameter Symbol Test Condition Min Typ Max Unit

Input low voltage VIL GPIO pins — — VDD*0.3 V

Input high voltage VIH GPIO pins VDD*0.7 — — V

Output high voltage relative

to VDD

VOH Sourcing 3 mA, VDD ≥ 3 V,

Drive Strength = Weak

VDD*0.8 — — V

Sourcing 1.2 mA, VDD ≥ 1.62 V,

Drive Strength = Weak

VDD*0.6 — — V

Sourcing 20 mA, VDD ≥ 3 V,

Drive Strength = Strong

VDD*0.8 — — V

Sourcing 8 mA, VDD ≥ 1.62 V,

Drive Strength = Strong

VDD*0.6 — — V

Output low voltage relative to

IOVDD

VOL Sinking 3 mA, VDD ≥ 3 V,

Drive Strength = Weak

— — VDD*0.2 V

Sinking 1.2 mA, VDD ≥ 1.62 V,

Drive Strength = Weak

— — VDD*0.4 V

Sinking 20 mA, VDD ≥ 3 V,

Drive Strength = Strong

— — VDD*0.2 V

Sinking 8 mA, VDD ≥ 1.62 V,

Drive Strength = Strong

— — VDD*0.4 V

Input leakage current IIOLEAK All GPIO pins, GPIO ≤ VDD — 0.1 30 nA

I/O pin pull-up/pull-down re-

sistor

RPUD 30 40 65 kΩ

Pulse width of pulses re-

moved by the glitch suppres-

sion filter

tIOGLITCH 15 25 45 ns

Output fall time, From 70%

to 30% of VDD

tIOOF CL = 50 pF,

Drive Strength = Strong

— 1.8 — ns

CL = 50 pF,

Drive Strength = Weak

— 4.5 — ns

Output rise time, From 30%

to 70% of VDD

tIOOR CL = 50 pF,

Drive Strength = Strong

— 2.2 — ns

CL = 50 pF,

Drive Strength = Weak

— 7.4 — ns

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Electrical Specifications

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3. Typical Connection Diagrams

3.1 UART Interface with Embedded Host

The BGX13P uses the UART interface to stream data and access the command API. Typical power supply, programming/debug, and

host interface connections are shown in the figure below.

GND

RESETn

VDD

DNC

GND

GPIO0

GPIO1

GPIO2

UART_TX

UART_RX

UART_CTS

UART_RTS

GPIO3

GPIO4

DNC

GND

DNC

GPIO5

GPIO6

GPIO7

DNC

BOOT

DNC

BGX13P

RESETn

+3.3 V

Host CPU

RTS

CTS

VSS

+3.3 V

BOOT

Figure 3.1. Connection Diagram

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Typical Connection Diagrams

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4. Layout Guidelines

For optimal performance of the BGX13P (with integrated antenna), please follow the PCB layout guidelines and ground plane recom-

mendations indicated in this section.

4.1 Module Placement and Application PCB Layout Guidelines

• Place the module at the edge of the PCB, as shown in Figure 4.1 Recommended Application PCB Layout for BGX13P with Integra-

ted Antenna on page 11.

• Do not place any metal (traces, components, battery, etc.) within the clearance area of the antenna.

• Connect all ground pads directly to a solid ground plane.

• Place the ground vias as close to the ground pads as possible.

• Do not place plastic or any other dielectric material in contact with the antenna.

Place vias close to

each of the

module’s GND pads

Place vias along all PCB edges

Align module edge with PCB edge

Wireless Module

(Top View)

GND

Antenna Clearance

No metal in this area

Figure 4.1. Recommended Application PCB Layout for BGX13P with Integrated Antenna

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Layout Guidelines

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Figure 4.2 Non-optimal Module Placements for BGX13P with Integrated Antenna on page 12 shows examples of layouts that will re-

sult in severely degraded RF performance.

Figure 4.2. Non-optimal Module Placements for BGX13P with Integrated Antenna

The amount of ground plane surrounding the sides of the module will also impact the maximum RF range, as shown in Figure

4.3 Impact of GND Plane Size vs. Range for BGX13P on page 12.

Figure 4.3. Impact of GND Plane Size vs. Range for BGX13P

4.2 Effect of Plastic and Metal Materials

Do not place plastic or any other dielectric material in close proximity to the antenna.

Any metallic objects in close proximity to the antenna will prevent the antenna from radiating freely. The minimum recommended dis-

tance of metallic and/or conductive objects is 10 mm in any direction from the antenna except in the directions of the application PCB

ground planes.

4.3 Locating the Module Close to Human Body

Placing the module in contact with or very close to the human body will negatively impact antenna efficiency and reduce range.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Layout Guidelines

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4.4 2D Radiation Pattern Plots

Figure 4.4. Typical 2D Radiation Pattern – Front View

Figure 4.5. Typical 2D Radiation Pattern – Side View

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Layout Guidelines

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Figure 4.6. Typical 2D Radiation Pattern – Top View

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Layout Guidelines

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5. Hardware Design Guidelines

The BGX13P is an easy-to-use module with regard to hardware application design. The additional guidelines in this section should be

followed to guarantee optimal performance.

5.1 Power Supply Requirements

Coin cell batteries cannot withstand high peak currents (e.g. higher than 15 mA). If the peak current exceeds 15 mA, the recommenda-

tion is to place a 47 - 100 µF capacitor in parallel with the coin cell battery to improve battery life time. Note that the total current con-

sumption of the application is a combination of the radio, peripherals, and MCU current consumption, and all power consumers must be

taken into account. BGX13P should be powered by a unipolar supply voltage with nominal value of 3.3 V.

5.2 Reset Functions

The BGX13P can be reset by three different methods: by pulling the RESET line low, by the internal watchdog timer, or by software

command. The reset state in BGX13P does not provide any power saving functionality and is not recommended as a means to con-

serve power. BGX13P has an internal system power-up reset function. The RESET pin includes an on-chip pull-up resistor and can be

left unconnected if no external reset switch or source is used.

5.3 Debug and Firmware Updates

This section contains information on debugging and firmware update methods. For additional information, refer to Section 7.9 OTA

describing firmware update behavior.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Hardware Design Guidelines

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6. Pin Definitions

6.1 BGX13P Device Pinout

GND

GPIO0

GPIO1

GPIO2

UART_TX

UART_RX

UART_RTS

GPIO4

UART_CTS

GPIO3

GND

RESET

VDD

GND

GPIO5

GPIO6

GPIO7

BOOT

Figure 6.1. BGX13P Device Pinout

The following table provides package pin connections and general descriptions of pin functionality.

For GPIOx configuration information, please see the BGX13 command API documentation.

Table 6.1. BGX13P Device Pinout

Pin Name Pin(s) Description

GND 1, 12, 20, 31 Ground

GPIO0 2 Pin with input/output functionality configured through the command API.

GPIO1 3 Pin with input/output functionality configured through the command API.

GPIO2 4 Pin with input/output functionality configured through the command API.

GPIO3 9 Pin with input/output functionality configured through the command API.

GPIO4 10 Pin with input/output functionality configured through the command API.

GPIO5 14 Pin with input/output functionality configured through the command API.

GPIO6 15 Pin with input/output functionality configured through the command API.

GPI07 16 Pin with input/output functionality configured through the command API.

UART_TX 5 Digital output

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Pin Definitions

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Pin Name Pin(s) Description

UART_RX 6 Digital input

UART_CTS 7 Digital input

UART_RTS 8 Digital output

RESETn 44

Reset input, active low. To Apply an external reset source to this pin, it is required

to only drive this pin low during reset, and let the internal pull-up ensure that reset

is released.

VDD 29 Module Power Supply.

BOOT 19 Digital input to force module entrance into DFU bootlading state. See command

API documentation for functional details.

N/C

17,

18,

21,

22,

23,

24,

25,

26,

27,

No Connect.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Pin Definitions

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7. Functional overview

7.1 Introduction

The BGX13P creates a Bluetooth 5 compliant BLE cable replacement interface, facilitating a BLE link to a second embedded device or

a mobile device. An embedded MCU controls the device and communicates across the BLE link through a serial interface and control

signals. Parameters stored in non-volatile memory and configurable through the serial interface adjust performance characteristics of

the device. Silicon Labs offers iOS and Android mobile libraries for Blue Gecko Xpress devices to speed mobile development and sim-

plify communication with the device. This library also controls OTA management, facilitating secure and reliable updates to the device’s

embedded stack.

This functional overview does not cover each command supported by the command API. The complete command API specification is

available at http://www.docs.silabs.com/bgx/1.0/

7.2 Communication Use Cases

The BGX13P family facilitates two types of BLE communication links:

• BGX-to-mobile

• BGX-to-BGX

In the BGX-to-mobile communication use case, the BGX13P operates as a peripheral that is discoverable and connectable when con-

figured to that state through either the command API or the pin states driven by the embedded MCU. Using the Xpress mobile library,

mobile applications can scan for BGX13P devices, connect, and communicate with the device in both streaming and remote command

modes, where the mobile app can execute command API functions remotely.

In the BGX-to-BGX communication use case, one BGX13P must be configured as the central and one or more other BGX devices

should be configured as a peripheral. Devices can be configured at runtime through the command API, or those settings can be saved

to non-volatile memory so that each device wakes from power-on or low power states as either a peripheral or central. For more infor-

mation on advertising and connection options, please see the command API documentation.

7.3 Embedded Interface

The BGX13P family uses a 8-N-1 USART interface for data and flow control signalling. The interface is used both for a raw data

streaming interface and a command interface, depending on additional hardware pin configuration.

UART_TX and UART_RX are defined with flow directions relative to the BGX. Bytes sent from the embedded host to the BGX use the

UART_RX pin. Bytes sent from the BGX to the embedded host appear on the UART_TX pin.

UART_CTS is a digital input that controls the state of the UART_RTS digital output on the other end of the wireless link. Assertion of a

CTS/RTS pair signals that the embedded MCU driving its respective UART_CTS is available to receive bytes.

The baud rate of the BGX13P is a configurable parameter. For information on the process by which a baud rate change gets processed

and executed by the device, please see the command API documentation.

State control signals and visual indicators described below can be assigned to any of the GPIO pins through the command API. These

settings can be stored in non-volatile memory and take effect during the next power cycle. For information on configuration of standard

GPIO and available special function I/O available on the device, please see the command API documentation.

7.4 Command Mode and Streaming Mode

The BGX13P is designed to wake and offer optimized serial interface with hardware follow control. When operating in a peripheral role

and when flow control signals are monitored, the device may never need to leave streaming mode during operation.

However, when use cases require more advanced runtime configuration, the device can switch to command interface through pin or

escape sequence. Commands defined here can control scanning, advertising, connection state, and GPIO settings.

The command interface is also used to configure and store customizable parameters.

Streaming mode can be switched to command mode through an escape sequence of characters if the sequence has been previously

saved in the device's configuration. A comand can be issued in command mode to switch to streaming mode. Stream mode and com-

mand mode entrance can be controlled through a device port pin state, if a pin has been previously defined for that purpose.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Functional overview

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7.5 Command API

Each command begins with a command name followed by arguments, and the syntax of each command is defined in the command API

documentation.

The command interface saves settings as key-value pairs. These values can be used at runtime to modify the operational state, and

they can also be stored in non-volatile memory. Values stored in non-volatile memory function to configure the device's startup/default

state.

7.6 GPIO Control

The BGX13P offers 8 GPIO pins. These pins can be configured as state control pins or visual indicator pins. Alternatively, they can be

used as general purpose I/O pins. Digital output settings can be set and digital input state can be read through the command interface

locally or remotely through the remote command execution using the mobile libraries.

7.7 Device Configuration

Device configuration is handled through the command API, where commands are executed when the serial interface is set to operate in

command mode. These commands can also be executed remotely through the mobile library unless prohibited through previous config-

uration.

Additionally, a device configuration can be generated and saved using Simplicity Studio's Xpress Configurator tool. A generated config-

uration can be submitted to Silicon Labs through the process defined in that application. Silicon Labs will then validate the configuration

request, generate a custom orderable part number, and deliver first article samples for testing. Developers should contact sales repre-

sentatives for more information about this process. Once first article samples have been validated by the customer, this custom ordera-

ble part number can be ordered directly from Silicon Labs.

7.8 Security Features

BGX13P devices communicate with LE secure connections,establishing encrypted communication upon connection.

Device OTA requires an encrypted image signed by Silicon Laboratories. Only firmware developed, signed, and encrypted by Silicon

Labs can be bootloaded successfully on the device.

7.9 OTA

The BGX13P supports secure OTA of the embedded stack and the command interface. Images are encrypted and signed by Silicon

Laboratories. OTA can be performed through the mobile library APIs. Specific device firmware versions can be selected and program-

med through these APIs. See command API documentation for more information.

Orders of the default device OPN will ship with the latest release version of the device firmware. The firmware version is not guaranteed

to be the same for all items shipped. No firmware update for an OPN will break backwards compatibility with existing functionality, with-

in functional limits specified in this document and as noted in command API documentation.

Contact Silicon Labs technical support for information on customer factory programming options for custom OPN ordering with a speci-

fied device firmware version and for customer factory programming options.

7.10 Direct Test Mode Support

The BGX13P 's command API offers a command set that configure the device to support the Direct Test Mode (DTM) protocol as de-

fined in the Bluetooth Core Specification Version 4.2, Volume 6, part F.

See the command API for information about commands to support specific DTM test procedures.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Functional overview

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8. Package Specifications

8.1 BGX13P Package Marking

The figure below shows the module markings printed on the RF-shield.

Figure 8.1. BGX13P Package Marking

The module marking consists of:

BGX13Pxxxxxxx - Part number designation

Model: BGX13Pxxx – Model number designation

FCC ID: QOQBGM13P

IC: 5123A-BGM13P

R-CRM-BGT-BGM13Pxxx

CE Logo

Japan Logo and ID: 209-J00282

YYWWTTTT

•YY – The last 2 digits of the assembly year

• WW – The 2 digit work week when the device was assembled

• TTTT – A trace or manufacturing code. The first letter is the device revision.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Package Specifications

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8.2 BGX13P Dimensions

Figure 8.2. BGX13P Package Dimensions

8.3 BGX13P Module Footprint

The figure below shows the Module footprint and PCB dimensions.

Figure 8.3. BGX13P Footprint

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Package Specifications

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8.4 BGX13P Recommended PCB Land Pattern

The figure below shows the recommended land pattern. The antenna clearance section is not required for BGX13P module versions

with a U.FL connector.

Figure 8.4. BGX13P Recommended PCB Land Pattern

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Package Specifications

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9. Soldering Recommendations

9.1 Soldering Recommendations

This section describes the soldering recommendations for the BGX13P module.

BGX13P is compatible with industrial-standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal

mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.

• Refer to technical documentations of particular solder paste for profile configurations.

• Avoid using more than two reflow cycles.

• A no-clean, type-3 solder paste is recommended.

• A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.

• Recommended stencil thickness is 0.100 mm (4 mils).

• Refer to the recommended PCB land pattern for an example stencil aperture size.

• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Soldering Recommendations

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10. Certifications

10.1 Bluetooth

The BGX13P Bluetooth Declarion ID is: 101562.

10.2 CE

The BGX13P module is in conformity with the essential requirements and other relevant requirements of the Radio Equipment Directive

(RED) (2014/53/EU).

Please note that every application using the BGX13P will need to perform the radio EMC tests on the end product, according to EN 301

489-17.

The conduced test results can be inherited from the modules test report to the test report of the end product using BGX13P. EN300328

radiated spurious emission test must be repeated with the end product assembly. Test documentation and software for the EN 300 328

radiated spurious emissions testing can be requested from Silicon Labs support.

A formal DoC is available via www.silabs.com

10.3 FCC

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and

2. This device must accept any interference received, including interference that may cause undesirable operation.

Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.

FCC RF Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-

ic operating instructions for satisfying RF exposure compliance. This transmitter meets both portable and mobile limits as demonstrated

in the RF Exposure Analysis. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter

except in accordance with FCC multi-transmitter product procedures.

OEM Responsibilities to comply with FCC Regulations:

OEM integrator is responsible for testing their end-product for any additional compliance requirements required with this module instal-

led (for example, digital device emissions, PC peripheral requirements, etc.).

• With BGX13P22 the antenna(s) must be installed such that a minimum separation distance of 9 mm is maintained between the radi-

ator (antenna) and all persons at all times.

• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter except in accord-

ance with FCC multi-transmitter product procedures.

Important Note:

In the event that the above conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC

authorization is no longer considered valid and the FCC ID cannot be used on the final product. In these circumstances, the OEM inte-

grator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

The variants of BGX13P Modules are labeled with their own FCC ID. If the FCC ID is not visible when the module is installed inside

another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed

module. In that case, the final end product must be labeled in a visible area with the following:

"Contains Transmitter Module FCC ID: QOQBGM13P"

"Contains FCC ID: QOQBGM13P"

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or

change RF related parameters in the user manual of the end product.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Certifications

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10.4 ISED Canada

ISEDC

This radio transmitter (IC: 5123A-BGM13P) has been approved by Industry Canada to operate with the antenna types listed above, with

the maximum permissible gain indicared. Antenna types not included in this list, having a gain greater than the maximum gain indicated

for that type, are strictly prohibited for use with this device.

This device complies with Industry Canada’s license-exempt RSS standards. Operation is subject to the following two conditions:

1. This device may not cause interference; and

2. This device must accept any interference, including interference that may cause undesired operation of the device

RF Exposure Statement

Exception from routine SAR evaluation limits are given in RSS-102 Issue 5.

The models BGM13P22A and BGM13P22E meet the given requirements when the minimum separation distance to human body is 20

mm.

RF exposure or SAR evaluation is not required when the separation distance is same or more than stated above. If the separation dis-

tance is less than stated above the OEM integrator is responsible for evaluating the SAR.

OEM Responsibilities to comply with IC Regulations

The BGX13P modules have been certified for integration into products only by OEM integrators under the following conditions:

• The antenna(s) must be installed such that a minimum separation distance as stated above is maintained between the radiator (an-

tenna) and all persons at all times.

• The transmitter module must not be co-located or operating in conjunction with any other antenna or transmitter.

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still respon-

sible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital

device emissions, PC peripheral requirements, etc.).

IMPORTANT NOTE

In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the ISEDC

authorization is no longer considered valid and the IC ID cannot be used on the final product. In these circumstances, the OEM integra-

tor will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate ISEDC authorization.

End Product Labeling

The BGX13P module is labeled with its own IC ID. If the IC ID is not visible when the module is installed inside another device, then the

outside of the device into which the module is installed must also display a label referring to the enclosed module. In that case, the final

end product must be labeled in a visible area with the following:

“Contains Transmitter Module IC: 5123A-BGM13P ”

“Contains IC: 5123A-BGM13P”

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module or

change RF related parameters in the user manual of the end product.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Certifications

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ISEDC (Français)

Industrie Canada a approuvé l’utilisation de cet émetteur radio (IC: 5123A-BGM13P) en conjonction avec des antennes de type dipo-

laire à 2.14dBi ou des antennes embarquées, intégrée au produit. L’utilisation de tout autre type d’antenne avec ce composant est pro-

scrite.

Ce composant est conforme aux normes RSS, exonérées de licence d'Industrie Canada. Son mode de fonctionnement est soumis aux

deux conditions suivantes:

1. Ce composant ne doit pas générer d’interférences.

2. Ce composant doit pouvoir est soumis à tout type de perturbation y compris celle pouvant nuire à son bon fonctionnement.

Déclaration d'exposition RF

L'exception tirée des limites courantes d'évaluation SAR est donnée dans le document RSS-102 Issue 5.

Les modules BGM13P22A and BGM13P22E répondent aux exigences requises lorsque la distance minimale de séparation avec le

corps humain est de 20 mm.

La déclaration d’exposition RF ou l'évaluation SAR n'est pas nécessaire lorsque la distance de séparation est identique ou supérieure à

celle indiquée ci-dessus. Si la distance de séparation est inférieure à celle mentionnées plus haut, il incombe à l'intégrateur OEM de

procédé à une évaluation SAR.

Responsabilités des OEM pour une mise en conformité avec le Règlement du Circuit Intégré

Le module BGX13P a été approuvé pour l'intégration dans des produits finaux exclusivement réalisés par des OEM sous les conditions

suivantes:

• L'antenne (s) doit être installée de sorte qu'une distance de séparation minimale indiquée ci-dessus soit maintenue entre le radiateur

(antenne) et toutes les personnes avoisinante, ce à tout moment.

• Le module émetteur ne doit pas être localisé ou fonctionner avec une autre antenne ou un autre transmetteur que celle indiquée

plus haut.

Tant que les deux conditions ci-dessus sont respectées, il n’est pas nécessaire de tester ce transmetteur de façon plus poussée. Ce-

pendant, il incombe à l’intégrateur OEM de s’assurer de la bonne conformité du produit fini avec les autres normes auxquelles il pour-

rait être soumis de fait de l’utilisation de ce module (par exemple, les émissions des périphériques numériques, les exigences de pé-

riphériques PC, etc.).

REMARQUE IMPORTANTE

ans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou co-implantation avec un autre émetteur), l'au-

torisation ISEDC n'est plus considérée comme valide et le numéro d’identification ID IC ne peut pas être apposé sur le produit final.

Dans ces circonstances, l'intégrateur OEM sera responsable de la réévaluation du produit final (y compris le transmetteur) et de l'ob-

tention d'une autorisation ISEDC distincte.

Étiquetage des produits finis

Les modules BGX13P sont étiquetés avec leur propre ID IC. Si l'ID IC n'est pas visible lorsque le module est intégré au sein d'un autre

produit, cet autre produit dans lequel le module est installé devra porter une étiquette faisant apparaitre les référence du module inté-

gré. Dans un tel cas, sur le produit final doit se trouver une étiquette aisément lisible sur laquelle figurent les informations suivantes:

“Contient le module transmetteur: 5123A-BGM13P ”

“Contient le circuit: 5123A-BGM13P”

L'intégrateur OEM doit être conscient qu’il ne doit pas fournir, dans le manuel d’utilisation, d'informations relatives à la façon d'installer

ou de d’enlever ce module RF ainsi que sur la procédure à suivre pour modifier les paramètres liés à la radio.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Certifications

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10.5 Japan

The BGX13P is certified in Japan with certification number 209-J00282.

Important

The module is not labeled with Japan certification mark and ID because of the small physical size. A manufacturer who integrates a

radio module in their host equipment must place the certification mark and certification number on the outside of the host equipment.

The certification mark and certification number must be placed close to the text in the Japanese language which is provided below.

Translation:

“This equipment contains specified radio equipment that has been certified to the Technical Regulation Conformity Certification under

the Radio Law.”

10.6 KC (South-Korea)

BGX13P has certification in South-Korea.

Certification number: TBD

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Certifications

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11. Revision History

Revision 0.5

August 2018

• Public Release

Revision 0.1

July 2018

•Initial Release.

BGX13P Blue Gecko Bluetooth ® Module Data Sheet

Revision History

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Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or

intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"

parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes

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information. Silicon Labs shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted

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