RoHS
EH1545SJETTS-19.440M
EH15 45 SJ ET TS -19.440M
Series
RoHS Compliant 3.3V Plastic J-Lead SMD LVCMOS
High Frequency Oscillator
Frequency Tolerance/Stability
±50ppm Maximum
Package
Operating Temperature Range
-40°C to +85°C
Nominal Frequency
19.440MHz
Pin 1 Connection
Tri-State (High Impedance)
Duty Cycle
50 ±10(%)
ELECTRICAL SPECIFICATIONS
Nominal Frequency 19.440MHz
Frequency Tolerance/Stability ±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the
Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year Aging at 25°C,
Shock, and Vibration)
Aging at 25°C ±5ppm/year Maximum
Operating Temperature Range -40°C to +85°C
Supply Voltage 3.3Vdc ±0.3Vdc
Input Current 35mA Maximum (No Load)
Output Voltage Logic High (Voh) 2.7Vdc Minimum, IOH = -8mA
Output Voltage Logic Low (Vol) 0.5Vdc Maximum, IOL = +8mA
Rise/Fall Time 6nSec Maximum (Measured at 20% to 80% of waveform)
Duty Cycle 50 ±10(%) (Measured at 50% of waveform)
Load Drive Capability 30pF Maximum
Output Logic Type CMOS
Pin 1 Connection Tri-State (High Impedance)
Tri-State Input Voltage (Vih and Vil) 70% of Vdd Minimum to enable output, 20% of Vdd Maximum to disable output, No Connect to enable
output.
Absolute Clock Jitter ±250pSec Maximum, ±100pSec Typical
One Sigma Clock Period Jitter ±50pSec Maximum, ±40pSec Typical
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007, Condition A
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 2/17/2010 | Page 1 of 4
EH1545SJETTS-19.440M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
MARKING
ORIENTATION
9.8
MAX
14.0
MAX
12
3
4
4.7
MAX
0.25 MIN
5.080
±0.203
7.620
±0.203
0.510 ±0.203
PIN CONNECTION
1 Tri-State (High
Impedance)
2 Ground
3 Output
4 Supply Voltage
LINE MARKING
1ECLIPTEK
219.440M
3PXXYZZ
P=Configuration Designator
XX=Ecliptek Manufacturing
Code
Y=Last Digit of the Year
ZZ=Week of the Year
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
5.8
3.81
1.27 (X4)
3.0 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 2/17/2010 | Page 2 of 4
EH1545SJETTS-19.440M
OUTPUT DISABLE
(HIGH IMPEDANCE
STATE)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80% of Waveform
50% of Waveform
20% of Waveform
Fall
Time
Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUT TRI-STATE INPUT
Supply
Voltage
(VDD)
Test Circuit for CMOS Output
Output
No Connect
or Tri-State
Ground
+ +
+_
__
Power
Supply 0.01µF
(Note 1) 0.1µF
(Note 1) CL
(Note 3)
Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency
ceramic bypass capacitor close to the package ground and VDD pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth
(>300MHz) passive probe is recommended.
Note 3: Capacitance value CL includes sum of all probe and fixture capacitance.
Voltage
Meter
Current
Meter
Oscilloscope Frequency
Counter
Probe
(Note 2)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 2/17/2010 | Page 3 of 4
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EH1545SJETTS-19.440M
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev D 2/17/2010 | Page 4 of 4
