TNY284-290
TinySwitch-4 Family
www.power.com August 2016
Energy-Efcient, Off-Line Switcher with
Line Compensated Overload Power
This Product is Covered by Patents and/or Pending Patent Applications.
Output Power Table
Product3
230 VAC ± 15% 85-265 VAC
Adapter1
Peak or
Open
Frame2
Adapter1
Peak or
Open
Frame2
TNY284P/D/K 6 W 11 W 5 W 8.5 W
TNY285P/D 8.5 W 15 W 6 W 11.5 W
TNY285K 11 W 15 W 7.5 W 11.5 W
TNY286P/D 10 W 19 W 7 W 15 W
TNY286K 13.5 W 19 W 9.5 W 15 W
TNY287P 13 W 23.5 W 8 W 18 W
TNY287D 11.5 W 23.5 W 7 W 18 W
TNY287K 18 W 23.5 W 11 W 18 W
TNY288P 16 W 28 W 10 W 21.5 W
TNY288D 14.5 W 26 W 9 W 19.5 W
TNY288K 23 W 28 W 14.5 W 21.5 W
TNY289P 18 W 32 W 12 W 25 W
TNY289K 25 W 32 W 17 W 25 W
TNY290P 20 W 36.5 W 14 W 28.5 W
TNY290K 28 W 36.5 W 20 W 28.5 W
Table 1. Output Power Table.
Notes:
1. Minimum continuous power in a typical non-ventilated enclosed adapter
measured at +50 °C ambient. Use of an external heat sink will increase power
capability.
2. Minimum peak power capability in any design or minimum continuous power
in an open frame design (see Key Applications Considerations).
3. Packages: P: DIP-8C, D: SO-8C, K: eSOP-12B. See Part Ordering Information.
Product Highlights
Lowest System Cost with Enhanced Flexibility
• 725 V rated MOSFET
• Increases BV de-rating margin
• Line compensated overload power – no additional components
• Dramatically reduces max overload variation over universal input
voltage range
• ±5% turn on UV threshold: line voltage sense with single external
resistor
• Simple ON/OFF control, no loop compensation needed
• Selectable current limit through BP/M capacitor value
• Higher current limit extends peak power or, in open frame
applications, maximum continuous power
• Lower current limit improves efciency in enclosed adapters/
chargers
• Allows optimum TinySwitch™-4 choice by swapping devices with
no other circuit redesign
• Tight I2f parameter tolerance reduces system cost
• Maximizes MOSFET and magnetics utilization
• ON-time extension – extends low-line regulation range/hold-up time
to reduce input bulk capacitance
• Self-biased: no bias winding or bias components
• Frequency jittering reduces EMI lter costs
• Pin-out simplies heat sinking to the PCB
• SOURCE pins are electrically quiet for low EMI
Enhanced Safety and Reliability Features
• Accurate hysteretic thermal shutdown protection with automatic
recovery eliminates need for manual reset
• Auto-restart delivers <3% of maximum power in short-circuit and
open loop fault conditions
• Output overvoltage shutdown with optional Zener
• Fast AC reset with optional UV external resistor
• Very low component count enhances reliability and enables
single-sided printed circuit board layout
• High bandwidth provides fast turn-on with no overshoot and
excellent transient load response
• Extended creepage between DRAIN and all other pins improves eld
reliability
EcoSmart™– Extremely Energy Efcient
• Easily meets all global energy efciency regulations
• No-load <30 mW with bias winding, <150 mW at 265 VAC without
bias winding
• ON/OFF control provides constant efciency down to very light loads
– ideal for mandatory CEC regulations and EuP standby requirements
Applications
• PC Standby and other auxiliary supplies
• DVD/PVR and other low power set top decoders
• Supplies for appliances, industrial systems, metering, etc
• Chargers/adapters for cell/cordless phones, PDAs, digital cameras,
MP3/portable audio, shavers, etc.
Figure 1. Typical Standby Application.
+ +
PI-6578-020915
Wide-Range
High-Voltage
DC Input
D
S
EN/UV
BP/M
DC
Output
TinySwitch-4
Figure 2. Package Options.
eSOP-12B (K Packag e) DIP-8C (P Package) SO-8C (D Package)
Rev. D 08/16
2
TNY284-290
www.power.com
Pin Functional Description
DRAIN (D) Pin:
This pin is the power MOSFET drain connection. It provides internal
operating current for both start-up and steady-state operation.
BYPASS/MULTI-FUNCTION (BP/M) Pin:
This pin has multiple functions:
• It is the connection point for an external bypass capacitor for the
internally generated 5.85 V supply.
• It is a mode selector for the current limit value, depending on the
value of the capacitance added. Use of a 0.1 μF capacitor results
in the standard current limit value. Use of a 1 μF capacitor results
in the current limit being reduced to that of the next smaller device
size. Use of a 10 μF capacitor results in the current limit being
increased to that of the next larger device size for TNY285-290.
• It provides a shutdown function. When the current into the bypass
pin exceeds ISD, the device latches off until the BP/M voltage
drops below 4.9 V, during a power-down or, when the UV function
is employed with external resistors connected to the BP/UV pin, by
taking the UV/EN pin current below IUV minus the reset hysteresis
(Typ. 18.75 μA). This can be used to provide an output overvolt-
age function with a Zener connected from the BYPASS/MULTI-
FUNCTIONAL pin to a bias winding supply.
Figure 3. Functional Block Diagram.
PI-6639-072115
CLOCK
OSCILLATOR
5.85 V
4.9 V
SOURCE
(S)
S
R
Q
DCMAX
BYPASS/
MULTI-FUNCTION
(BP/M)
+
-
V
ILIMIT
FAULT
PRESENT
CURRENT LIMIT
COMPARATOR
ENABLE
LEADING
EDGE
BLANKING
THERMAL
SHUTDOWN
+
-
DRAIN
(D)
REGULATOR
5.85 V
BYPASS PIN
UNDER-VOLTAGE
1.0 V + V
T
ENABLE/
UNDER-
VOLTAGE
(EN/UV)
Q
115 µA
25 µA
LINE UNDERVOLTAGE
RESET
AUTO-
RESTART
COUNTER
JITTER
1.0 V
6.4 V
BYPASS
CAPACITOR
SELECT AND
CURRENT
LIMIT STATE
MACHINE
OVP
LATCH
LINE
COMPENSATION
Figure 4. Pin Conguration.
PI-6577-021015
P Package (DIP-8C)
12 S
11 S
10 S
9 S
8 S
7 S
EN/UV 1
BP/M 2
N/C 3
N/C 4
D 6
K Package
(eSOP-12B)
Exposed Pad (On Bottom)
Internally Connected to
SOURCE Pin
D Package (SO-8C)
EN/UV 1
BP/M 2
D 4
8 S
7 S
6 S
5 S
5 S
7 S
8 S
D 4
BP/M 2
EN/UV 1
6 S
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TNY284-290
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ENABLE/UNDERVOLTAGE (EN/UV) Pin:
This pin has dual functions: enable input and line undervoltage sense.
During normal operation, switching of the power MOSFET is controlled
by this pin. MOSFET switching is terminated when a current greater
than a threshold current is drawn from this pin. Switching resumes
when the current being pulled from the pin drops to less than a
threshold current. A modulation of the threshold current reduces
group pulsing. The threshold current is between 75 μA and 115 μA.
The ENABLE/UNDERVOLTAGE pin also senses line undervoltage
conditions through an external resistor connected to the DC line
voltage. If there is no external resistor connected to this pin,
TinySwitch-4 detects its absence and disables the line undervoltage
function.
SOURCE (S) Pin:
This pin is internally connected to the output MOSFET source for
high-voltage power return and control circuit common.
TinySwitch-4 Functional Description
TinySwitch-4 combines a high-voltage power MOSFET switch with a
power supply controller in one device. Unlike conventional PWM (pulse
width modulator) controllers, it uses a simple
ON/OFF control to regulate the output voltage.
The controller consists of an oscillator, enable circuit (sense and logic),
current limit state machine, 5.85 V regulator, BYPASS/MULTI-
FUNCTION pin undervoltage, overvoltage circuit, and current limit
selection circuitry, over-temperature protection, current limit circuit,
leading edge blanking, and a 725 V power MOSFET. TinySwitch-4
incorporates additional circuitry for line undervoltage sense,
auto-restart, adaptive switching cycle on-time extension, and
frequency jitter. Figure 3 shows the functional block diagram with
the most important features.
Oscillator
The typical oscillator frequency is internally set to an average of
132 kHz. Two signals are generated from the oscillator: the maximum
duty cycle signal (DCMAX) and the clock signal that indicates the
beginning of each cycle.
The oscillator incorporates circuitry that introduces a small amount of
frequency jitter, typically 8 kHz peak-to-peak, to minimize EMI
emission. The modulation rate of the frequency jitter is set to 1 kHz
to optimize EMI reduction for both average and quasi-peak emissions.
Figure 5. Frequency Jitter.
600
0 5 10
136 kHz
128 kHz
VDRAIN
Time (µs)
PI-2741-021015
500
400
300
200
100
0
The frequency jitter should be measured with the oscilloscope
triggered at the falling edge of the DRAIN waveform. The waveform
in Figure 5 illustrates the frequency jitter.
Enable Input and Current Limit State Machine
The enable input circuit at the ENABLE/UNDERVOLTAGE pin consists
of a low impedance source follower output set at 1.2 V. The current
through the source follower is limited to 115 μA. When the current
out of this pin exceeds the threshold current, a low logic level (disable)
is generated at the output of the enable circuit, until the current out
of this pin is reduced to less than the threshold current. This enable
circuit output is sampled at the beginning of each cycle on the rising
edge of the clock signal. If high, the power MOSFET is turned on for
that cycle (enabled). If low, the power MOSFET remains off (disabled).
Since the sampling is done only at the beginning of each cycle,
subsequent changes in the ENABLE/UNDER- VOLTAGE pin voltage or
current during the remainder of the cycle are ignored.
The current limit state machine reduces the current limit by discrete
amounts at light loads when TinySwitch-4 is likely to switch in the
audible frequency range. The lower current limit raises the effective
switching frequency above the audio range and reduces the trans-
former ux density, including the associated audible noise. The state
machine monitors the sequence of enable events to determine the
load condition and adjusts the current limit level accordingly in
discrete amounts.
Under most operating conditions (except when close to no-load), the
low impedance of the source follower keeps the voltage on the
ENABLE/UNDERVOLTAGE pin from going much below 1.2 V in the
disabled state. This improves the response time of the optocoupler
that is usually connected to this pin.
5.85 V Regulator and 6.4 V Shunt Voltage Clamp
The 5.85 V regulator charges the bypass capacitor connected to the
BYPASS pin to 5.85 V by drawing a current from the voltage on the
DRAIN pin whenever the MOSFET is off. The BYPASS/MULTI-
FUNCTION pin is the internal supply voltage node. When the
MOSFET is on, the device operates from the energy stored in the
bypass capacitor. Extremely low power consumption of the internal
circuitry allows TinySwitch-4 to operate continuously from current it
takes from the DRAIN pin. A bypass capacitor value of 0.1 μF is
sufcient for both high frequency decoupling and energy storage.
In addition, there is a 6.4 V shunt regulator clamping the BYPASS/
MULTI-FUNCTION pin at 6.4 V when current is provided to the
BYPASS/MULTI-FUNCTION pin through an external resistor. This
facilitates powering of TinySwitch-4 externally through a bias winding
to decrease the no-load consumption to well below 50 mW.
BYPASS/MULTI-FUNCTION Pin Undervoltage
The BYPASS/MULTI-FUNCTION pin undervoltage circuitry disables the
power MOSFET when the BYPASS/MULTI-FUNCTION pin voltage drops
below 4.9 V in steady state operation. Once the BYPASS/MULTI-
FUNCTION pin voltage drops below 4.9 V in steady state operation, it
must rise back to 5.85 V to enable (turn-on) the power MOSFET.
Over-Temperature Protection
The thermal shutdown circuitry senses the die temperature. The
threshold is typically set at 142 °C with 75 °C hysteresis. When the
die temperature rises above this threshold the power MOSFET is
disabled and remains disabled until the die temperature falls by 75 °C,
at which point it is re-enabled. A large hysteresis of 75 °C (typical) is
provided to prevent over-heating of the PC board due to a continuous
fault condition.
Rev. D 08/16
4
TNY284-290
www.power.com
Figure 6. Auto-Restart Operation.
PI-4098-021015
02500 5000
Time (ms)
0
5
0
10
100
200
300
VDRAIN
VDC-OUTPUT
Current Limit
The current limit circuit senses the current in the power MOSFET.
When this current exceeds the internal threshold (ILIMIT), the power
MOSFET is turned off for the remainder of that cycle. The current
limit state machine reduces the current limit threshold by discrete
amounts under medium and light loads.
The leading edge blanking circuit inhibits the current limit comparator
for a short time (tLEB) after the power MOSFET is turned on. This
leading edge blanking time has been set so that current spikes
caused by capacitance and secondary-side rectier reverse recovery
time will not cause premature termination of the switching pulse.
Auto-Restart
In the event of a fault condition such as output overload, output
short-circuit, or an open loop condition, TinySwitch-4 enters into
auto-restart operation. An internal counter clocked by the oscillator
is reset every time the ENABLE/UNDERVOLTAGE pin is pulled low.
If the ENABLE/UNDERVOLTAGE pin is not pulled low for 64 ms, the
power MOSFET switching is normally disabled for 2.5 seconds (except
in the case of line undervoltage condition, in which case it is disabled
until the condition is removed). The auto-restart alternately enables
and disables the switching of the power MOSFET until the fault
condition is removed. Figure 6 illustrates auto-restart circuit
operation in the presence of an output short-circuit.
In the event of a line undervoltage condition, the switching of the
power MOSFET is disabled beyond its normal 2.5 seconds until the
line undervoltage condition ends.
Adaptive Switching Cycle On-Time Extension
Adaptive switching cycle on-time extension keeps the cycle on until
current limit is reached, instead of prematurely terminating after the
DCMAX signal goes low. This feature reduces the minimum input
voltage required to maintain regulation, extending hold-up time and
minimizing the size of bulk capacitor required. The on-time extension
is disabled during the start-up of the power supply, until the power
supply output reaches regulation.
Line Undervoltage Sense Circuit
The DC line voltage can be monitored by connecting an external
resistor from the DC line to the ENABLE/UNDERVOLTAGE pin. During
power-up or when the switching of the power MOSFET is disabled in
auto-restart, the current into the ENABLE/UNDERVOLTAGE pin must
exceed 25 μA to initiate switching of the power MOSFET. During
power-up, this is accomplished by holding the BYPASS/MULTI-
FUNCTION pin to 4.9 V while the line undervoltage condition exists.
The BYPASS/MULTI-FUNCTION pin then rises from 4.9 V to 5.85 V
when the line undervoltage condition goes away. When the switching
of the power MOSFET is disabled in auto-restart mode and a line
undervoltage condition exists, the auto-restart counter is stopped.
This stretches the disable time beyond its normal 2.5 seconds until
the line undervoltage condition ends.
The line undervoltage circuit also detects when there is no external
resistor connected to the ENABLE/UNDERVOLTAGE pin (less than
~2 μA into the pin). In this case the line undervoltage function is
disabled.
TinySwitch-4 Operation
TinySwitch-4 devices operate in the current limit mode. When
enabled, the oscillator turns the power MOSFET on at the beginning
of each cycle. The MOSFET is turned off when the current ramps up
to the current limit or when the DCMAX limit is reached. Since the
highest current limit level and frequency of a TinySwitch-4 design are
constant, the power delivered to the load is proportional to the
primary inductance of the transformer and peak primary current
squared. Hence, designing the supply involves calculating the primary
inductance of the transformer for the maximum output power
required. If the TinySwitch-4 is appropriately chosen for the power
level, the current in the calculated inductance will ramp up to current
limit before the DCMAX limit is reached.
Enable Function
TinySwitch-4 senses the ENABLE/UNDERVOLTAGE pin to determine
whether or not to proceed with the next switching cycle. The
sequence of cycles is used to determine the current limit. Once a
cycle is started, it always completes the cycle (even when the
ENABLE/UNDERVOLTAGE pin changes state half way through the
cycle). This operation results in a power supply in which the output
voltage ripple is determined by the output capacitor, amount of
energy per switch cycle and the delay of the feedback.
The ENABLE/UNDERVOLTAGE pin signal is generated on the
secondary by comparing the power supply output voltage with a
reference voltage. The ENABLE/UNDERVOLTAGE pin signal is high
when the power supply output voltage is less than the reference
voltage. In a typical implementation, the ENABLE/UNDERVOLTAGE
pin is driven by an optocoupler. The collector of the optocoupler
transistor is connected to the ENABLE/UNDERVOLTAGE pin and the
emitter is connected to the SOURCE pin. The optocoupler LED is
connected in series with a Zener diode across the DC output voltage
to be regulated. When the output voltage exceeds the target
regulation voltage level (optocoupler LED voltage drop plus Zener
voltage), the optocoupler LED will start to conduct, pulling the
ENABLE/UNDERVOLTAGE pin low. The Zener diode can be replaced
by a TL431 reference circuit for improved accuracy.
ON/OFF Operation with Current Limit State Machine
The internal clock of the TinySwitch-4 runs all the time. At the
beginning of each clock cycle, it samples the ENABLE/UNDERVOLTAGE
pin to decide whether or not to implement a switch cycle, and based
on the sequence of samples over multiple cycles, it determines the
appropriate current limit. At high loads, the state machine sets the
current limit to its highest value. At lighter loads, the state machine
sets the current limit to reduced values.
At near maximum load, TinySwitch-4 will conduct during nearly all of
its clock cycles (Figure 7). At slightly lower load, it will “skip”
additional cycles in order to maintain voltage regulation at the power
supply output (Figure 8). At medium loads, cycles will be skipped and
the current limit will be reduced (Figure 9). At very light loads, the
current limit will be reduced even further (Figure 10). Only a small
Rev. D 08/16
5
TNY284-290
www.power.com
V
EN
V
DRAIN
CLOCK
DC
MAX
I
DRAIN
PI-2749-021015
Figure 7. Operation at Near Maximum Loading. Figure 8. Operation at Moderately Heavy Loading.
Figure 9. Operation at Medium Loading.
PI-2661-021015
V
EN
V
DRAIN
CLOCK
DC
MAX
I
DRAIN
Figure 10. Operation at Very Light Load.
percentage of cycles will occur to satisfy the power consumption of
the power supply.
The response time of the ON/OFF control scheme is very fast
compared to PWM control. This provides tight regulation and
excellent transient response.
Power-Up/Down
The TinySwitch-4 requires only a 0.1 μF capacitor on the BYPASS/
MULTI-FUNCTION pin to operate with standard current limit.
Because of its small size, the time to charge this capacitor is kept to
an absolute minimum, typically 0.6 ms. The time to charge will vary
in proportion to the BYPASS/MULTI-FUNCTION pin capacitor value
when selecting different current limits. Due to the high bandwidth
of the ON/OFF feedback, there is no overshoot at the power supply
output. When an external resistor (4 MW) is connected from the
positive DC input to the ENABLE/UNDERVOLTAGE pin, the power
MOSFET switching will be delayed during power-up until the DC line
voltage exceeds the threshold (100 V). Figures 11 and 12 show the
power-up timing waveform in applications with and without an
external resistor (4 MW) connected to the ENABLE/UNDERVOLTAGE
PI-2377-021015
VEN
VDRAIN
CLOCK
DCMAX
IDRAIN
VEN
VDRAIN
CLOCK
DCMAX
IDRAIN
PI-2667-021015
Rev. D 08/16
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TNY284-290
www.power.com
Figure 13. Normal Power-Down Timing (without UV). Figure 14. Slow Power-Down Timing with Optional External (4 MW)
UV Resistor Connected to EN/UV Pin.
Figure 11. Power-Up with Optional External UV Resistor (4 MW)
Connected to EN/UV Pin.
Figure 12. Power-Up without Optional External UV Resistor
Connected to EN/UV Pin.
PI-2395-101014
02.5 5
Time (s)
0
100
200
400
300
0
100
200
VDC-INPUT
VDRAIN
01 2
Time (ms)
0
200
400
5
0
10
0
100
200
PI-2383-021015
VDC-INPUT
VBYPASS
VDRAIN
PI-2381-021015
01 2
Time (ms)
0
200
400
5
0
10
0
100
200
VDC-INPUT
VBYPASS
VDRAIN
PI-2348-021015
0.5 1
Time (s)
0
100
200
300
0
100
200
400
VDC-INPUT
VDRAIN
pin. Under start-up and overload conditions, when the conduction
time is less than 400 ns, the device reduces the switching frequency
to maintain control of the peak drain current.
During power-down, when an external resistor is used, the power
MOSFET will switch for 64 ms after the output loses regulation. The
power MOSFET will then remain off without any glitches since the
undervoltage function prohibits restart when the line voltage is low.
Figure 13 illustrates a typical power-down timing waveform. Figure 14
illustrates a very slow power-down timing waveform as in standby
applications. The external resistor (4 MW) is connected to the
ENABLE/UNDERVOLTAGE pin in this case to prevent unwanted
restarts.
No bias winding is needed to provide power to the chip because it
draws the power directly from the DRAIN pin (see Functional
Description). This has two main benets. First, for a nominal
application, this eliminates the cost of a bias winding and associated
components. Secondly, for battery charger applications, the
current-voltage characteristic often allows the output voltage to fall
close to 0 V while still delivering power. TinySwitch-4 accomplishes
this without a forward bias winding and its many associated
components. For applications that require very low no-load power
consumption (50 mW), a resistor from a bias winding to the BYPASS/
MULTI-FUNCTION pin can provide the power to the chip. The
minimum recommended current supplied is 1 mA. The BYPASS/
MULTI-FUNCTION pin in this case will be clamped at 6.4 V. This
method will eliminate the power draw from the DRAIN pin, thereby
reducing the no-load power consumption and improving full-load
efciency.
Current Limit Operation
Each switching cycle is terminated when the DRAIN current reaches
the current limit of the device. Current limit operation provides good
line ripple rejection and relatively constant power delivery independent
of input voltage.
Rev. D 08/16
7
TNY284-290
www.power.com
BYPASS/MULTI-FUNCTION Pin Capacitor
The BYPASS/MULTI-FUNCTION pin can use a ceramic capacitor as
small as 0.1 μF for decoupling the internal power supply of the
device. A larger capacitor size can be used to adjust the current limit.
For TNY285-290, a 1 μF BYPASS/MULTI-FUNCTIONAL pin capacitor
will select a lower current limit equal to the standard current limit of
the next smaller device and a 10 μF BYPASS/MULTI-FUNCTIONAL pin
capacitor will select a higher current limit equal to the standard
current limit of the next larger device. The higher current limit level
of the TNY290 is set to 850 mA typical. The TNY284 MOSFET does
not have the capability for increased current limit so this feature is
not available in this device.
85 115100 130 145 160 175 190 250 265220205 235
Input Voltage (VAC)
Maximum Over Power (W)
40
35
30
25
20
TNY290
TNY280
PI-6788-021015
Figure 15. Comparison of Maximum Overpower for TinySwitch-4 and
TinySwitch-III as a Function of Input Voltage (Data Collected from
RDK-295 20 W Reference Design).
Rev. D 08/16
8
TNY284-290
www.power.com
Applications Example
The circuit shown in Figure 16 is a low cost, high efciency, yback
power supply designed for 5 V, 4 A output from universal input using
the TNY290PG.
The supply features undervoltage lockout, primary sensed output
overvoltage latching shutdown protection, high efciency (>80%),
and very low no-load consumption (<50 mW at 265 VAC). Output
regulation is accomplished using a simple Zener reference and
optocoupler feedback.
The rectied and ltered input voltage is applied to the primary
winding of T1. The other side of the transformer primary is driven by
the integrated MOSFET in U1. Diode D1, C3, R1, and VR1 comprise
the clamp circuit, limiting the leakage inductance turn-off voltage
spike on the DRAIN pin to a safe value.
The output voltage is regulated by TL431 U2. When the output
voltage ripple exceeds the sum of the U2 (CATHODE D6) and
optocoupler LED forward drop, current will ow in the optocoupler LED.
This will cause the transistor of the optocoupler to sink current.
When this current exceeds the ENABLE pin threshold current the next
switching cycle is inhibited. When the output voltage falls below the
feedback threshold, a conduction cycle is allowed to occur and, by
adjusting the number of enabled cycles, output regulation is
maintained. As the load reduces, the number of enabled cycles
decreases, lowering the effective switching frequency and scaling
switching losses with load. This provides almost constant efciency
down to very light loads, ideal for meeting energy efciency
requirements.
As the TinySwitch-4 devices are completely self-powered, there is no
requirement for an auxiliary or bias winding on the transformer.
However by adding a bias winding, the output overvoltage protection
feature can be congured, protecting the load against open feedback
loop faults.
When an overvoltage condition occurs, such that bias voltage
exceeds the sum of VR2 and the BYPASS/MULTIFUNCTION (BYPASS/
MULTI-FUNCTIONAL) pin voltage, current begins to ow into the
BYPASS/MULTI-FUNCTIONAL pin. When this current exceeds ISD the
internal latching shutdown circuit in TinySwitch-4 is activated. This
condition is reset when the ENABLE/UNDERVOLTAGE pin current
owing through R12 and R13 drop below 18.75 μA each AC line
half-cycle. The conguration of Figure 16 is therefore non-latching for
an overvoltage fault. Latching overvoltage protection can be
achieved by connecting R12 and R13 to the positive terminal of C2,
at the expense of higher standby consumption. In the example
shown, on opening the loop, the OVP trips at an output of 17 V.
For lower no-load input power consumption, the bias winding may
also be used to supply the TinySwitch-4 device. Resistor R4 feeds
current into the BYPASS/MULTI-FUNCTIONAL pin, inhibiting the
internal high-voltage current source that normally maintains the
BYPASS/MULTI-FUNCTIONAL pin capacitor voltage (C7) during the
internal MOSFET off-time. This reduces the no-load consumption of
this design from 140 mW to 40 mW at 265 VAC.
Undervoltage lockout is congured by R5 connected between the DC
bus and ENABLE/UNDERVOLTAGE pin of U1. When present, switching
is inhibited until the current in the ENABLE/UNDERVOLTAGE pin
Figure 16. TNY290PG, 5 V, 4 A Universal Input Power Supply.
D
S
EN/UV
BP/M
90 - 295
VAC
5 V, 4 A
RTN
PI-6559-021015
R12
2 M
Ω
R13
2 M
Ω
R15
1.5 M
Ω
1/8 W
C9
10
µ
F
16 V C11
2.2
µ
F
50 V
R14
3.3 k
Ω
1/8 W
R8
1 k
Ω
1/8 W
R7
10 k
Ω
1%
R2
8.2
Ω
R3
4.7
Ω
1/2 W
R9
47
Ω
R4
30 k
Ω
1/8 W
R6
10 k
Ω
1%
R1
22
Ω
1/2 W
D1
UF4006-E3
D3
1N4937
U2
TL431
VR2
1N5254
27 V
VR1
P6KE150A
TinySwitch-4
U1
TNY290PG
U3
PC817
In a PC standby application input stage
will be part of main power supply input
D4
STPS30L60CT
RT1
6
Ω
F1
5 A
C3
2.2 nF
1 kV
BR1
2KBP10M
1000 V
C2
68 µF
450 V
C4
100 µF
50 V
C8
1000 µF
10 V
L1
10 mH
L2
2.2 µH
C5
1.5 nF
100 V
C6, C7
1500 µF
10 V
C10
47 nF
100 V
C13
2.2 nF
250 VAC
1 9,10
7,8
T1
EE22
4
5
3
C1
100 nF
275 VAC
C16
100 nF
100 V
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exceeds 25 μA. This allows the start-up voltage to be programmed
within the normal operating input voltage range, preventing glitching
of the output under abnormal low voltage conditions and also on
removal of the AC input.
In addition to the simple input pi lter (C1, L1, C2) for differential
mode EMI, this design makes use of E-Shield™ shielding techniques
in the transformer to reduce common mode EMI displacement
currents, and R2 and C4 as a damping network to reduce high
frequency transformer ringing. These techniques, combined with the
frequency jitter of TNY288, give excellent conducted and radiated
EMI performance with this design achieving >12 dBμV of margin to
EN55022 Class B conducted EMI limits.
For design exibility the value of C7 can be selected to pick one of
the 3 current limits options in U1. This allows the designer to select
the current limit appropriate for the application.
• Standard current limit (ILIMIT) is selected with a 0.1 μF BYPASS/
MULTI-FUNCTIONAL pin capacitor and is the normal choice for
typical enclosed adapter applications.
• When a 1 μF BYPASS/MULTI-FUNCTIONAL pin capacitor is used,
the current limit is reduced (ILIMITr ed or ILIMIT-1) offering reduced RMS
device currents and therefore improved efciency, but at the
expense of maximum power capability. This is ideal for thermally
challenging designs where dissipation must be minimized.
• When a 10 μF BYPASS/MULTI-FUNCTIONAL pin capacitor is used,
the current limit is increased (ILIMITinc or ILIMIT+1), extending the
power capability for applications requiring higher peak power or
continuous power where the thermal conditions allow.
Further exibility comes from the current limits between adjacent
TinySwitch-4 family members being compatible. The reduced current
limit of a given device is equal to the standard current limit of the
next smaller device and the increased current limit is equal to the
standard current limit of the next larger device.
Key Application Considerations
TinySwitch-4 vs. TinySwitch-III
Table 2 compares the features and performance differences between
TinySwitch-4 and TinySwitch-III. TinySwitch-4 is pin compatible to
TinySwitch-III with improved features. It requires minimum design
effort to adapt into a new design. In addition to the feature
enhancement, TinySwitch-4 offers two new packages; eSOP-12B (K)
and SO-8C (D) to meet various application requirements.
TinySwitch-4 Design Considerations
Output Power Table
The data sheet output power table (Table 1) represents the minimum
practical continuous output power level that can be obtained under
the following assumed conditions:
1. The minimum DC input voltage is 100 V or higher for 85 VAC
input, or 220 V or higher for 230 VAC input or 115 VAC with a
voltage doubler. The value of the input capacitance should be
sized to meet these criteria for AC input designs.
2. Efciency of 75%.
3. Minimum data sheet value of I2f.
4. Transformer primary inductance tolerance of ±10%.
5. Reected output voltage (VOR) of 135 V.
6. Voltage only output of 12 V with a fast PN rectier diode.
7. Continuous conduction mode operation with transient KP* value
of 0.25.
8. Increased current limit is selected for peak and open frame
power columns and standard current limit for adapter columns.
9. The part is board mounted with SOURCE pins soldered to a
sufcient area of copper and/or a heat sink is used to keep the
SOURCE pin temperature at or below 110 °C.
10. Ambient temperature of 50 °C for open frame designs and 40 °C
for sealed adapters.
*Below a value of 1, KP is the ratio of ripple to peak primary current.
To prevent reduced power capability due to premature termination of
switching cycles a transient KP limit of ≥0.25 is recommended. This
prevents the initial current limit (IINIT) from being exceeded at
MOSFET turn-on.
For reference, Table 3 provides the minimum practical power
delivered from each family member at the three selectable current
limit values. This assumes open frame operation (not thermally
limited) and otherwise the same conditions as listed above. These
numbers are useful to identify the correct current limit to select for a
given device and output power requirement.
Overvoltage Protection
The output overvoltage protection provided by TinySwitch-4 uses an
internal latch that is triggered by a threshold current of approximately
5.5 mA into the BYPASS/MULTI-FUNCTIONAL pin. In addition to an
internal lter, the BYPASS/MULTI-FUNCTIONAL pin capacitor forms an
external lter providing noise immunity from inadvertent triggering.
For the bypass capacitor to be effective as a high frequency lter, the
capacitor should be located as close as possible to the SOURCE and
BYPASS/MULTI-FUNCTIONAL pins of the device.
Table 2. Comparisons Between TinySwitch-III and TinySwitch-4.
Function TinySwitch-III TinySwitch-4
BVDSS 700 V 725 V
Line Compensated OCP N/A Yes
Typical OCP Change from
85 VAC to 265 VAC >40% <15%
UV Threshold 25 μA ±10% 25 μA ±5%
VBP Reset Voltage 2.6 V Typical 3.0 V Typical
Packages DIP-8C (P),
SMD-8C (G)
DIP-8C (P),
eSOP-12B (K),
SO-8C (D)
Peak Output Power Table
Product
230 VAC ± 15% 85-265 VAC
ILIMIT-1 ILIMIT ILIMIT+1 ILIMIT-1 ILIMIT ILIMIT+1
TNY284P 9.1 W 10.9 W 9.1 W 7.1 W 8.5 W 7.1 W
TNY285P 10.8 W 12 W 15.1 W 8.4 W 9.3 W 11.8 W
TNY286P 11.8 W 15.3 W 19.4 W 9.2 W 11.9 W 15.1 W
TNY287P 15.1 W 19.6 W 23.7 W 11.8 W 15.3 W 18.5 W
TNY288P 19.4 W 24 W 28 W 15.1 W 18.6 W 21.8 W
TNY289P 23.7 W 28.4 W 32.2 W 18.5 W 22 W 25.2 W
TNY290P 28 W 32.7 W 36.6 W 21.8 W 25.4 W 28.5 W
Table 3. Minimum Practical Power at Three Selectable Current Limit Levels.
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For best performance of the OVP function, it is recommended that a
relatively high bias winding voltage is used, in the range of 15 V - 30 V.
This minimizes the error voltage on the bias winding due to leakage
inductance and also ensures adequate voltage during no-load
operation from which to supply the BYPASS/MULTI-FUNCTIONAL pin
for reduced no-load consumption.
Selecting the Zener diode voltage to be approximately 6 V above the
bias winding voltage (28 V for 22 V bias winding) gives good OVP
performance for most designs, but can be adjusted to compensate
for variations in leakage inductance. Adding additional ltering can
be achieved by inserting a low value (10 W to 47 W) resistor in series
with the bias winding diode and/or the OVP Zener as shown by R7 and
R3 in Figure 16. The resistor in series with the OVP Zener also limits
the maximum current into the BYPASS/MULTI-FUNCTIONAL pin.
Reducing No-load Consumption
As TinySwitch-4 is self-powered from the BYPASS/MULTI-
FUNCTIONAL pin capacitor, there is no need for an auxiliary or bias
winding to be provided on the transformer for this purpose. Typical
no-load consumption when self-powered is <150 mW at 265 VAC
input. The addition of a bias winding can reduce this down to <50 mW
by supplying the TinySwitch-4 from the lower bias voltage and
inhibiting the internal high-voltage current source. To achieve this,
select the value of the resistor (R8 in Figure 16) to provide the data
sheet DRAIN supply current. In practice, due to the reduction of the
bias voltage at low load, start with a value equal to 40% greater than
the data sheet maximum current, and then increase the value of the
resistor to give the lowest no-load consumption.
Audible Noise
The cycle skipping mode of operation used in TinySwitch-4 can
generate audio frequency components in the transformer. To limit
this audible noise generation the transformer should be designed
such that the peak core ux density is below 3000 Gauss (300 mT).
Following this guideline and using the standard transformer production
technique of dip varnishing practically eliminates audible noise.
Vacuum impregnation of the transformer should not be used due to
the high primary capacitance and increased losses that result. Higher
ux densities are possible, however careful evaluation of the audible
noise performance should be made using production transformer
samples before approving the design.
Ceramic capacitors that use dielectrics such as Z5U, when used in
clamp circuits, may also generate audio noise. If this is the case, try
replacing them with a capacitor having a different dielectric or
construction, for example a lm type.
TinySwitch-4 Layout Considerations
Layout
See Figure 17 for a recommended circuit board layout for TinySwitch-4.
Single Point Grounding
Use a single point ground connection from the input lter capacitor to
the area of copper connected to the SOURCE pins.
Bypass Capacitor (CBP)
The BYPASS/MULTI-FUNCTIONAL pin capacitor must be located
directly adjacent to the BYPASS/MULTI-FUNCTIONAL and SOURCE
pins.
If a 0.1 μF bypass capacitor has been selected it should be a high
frequency ceramic type (e.g. with X7R dielectric). It must be placed
directly between the ENABLE and SOURCE pins to lter external noise
entering the BYPASS pin. If a 1 μF or 10 μF bypass capacitor was
selected then an additional 0.1 μF capacitor should be added across
BYPASS and SOURCE pins to provide noise ltering (see Figure 17).
ENABLE/UNDERVOLTAGE Pin
Keep traces connected to the ENABLE/UNDERVOLTAGE pin short and,
as far as is practical, away from all other traces and nodes above
source potential including, but not limited to, the bypass, drain and
bias supply diode anode nodes.
Primary Loop Area
The area of the primary loop that connects the input lter capacitor,
transformer primary and TinySwitch-4 should be kept as small as
possible.
Primary Clamp Circuit
A clamp is used to limit peak voltage on the DRAIN pin at turn-off.
This can be achieved by using an RCD clamp or a Zener (~200 V) and
diode clamp across the primary winding. To reduce EMI, minimize
the loop from the clamp components to the transformer and
TinySwitch-4.
Thermal Considerations
The SOURCE pins are internally connected to the IC lead frame and
provide the main path to remove heat from the device. Therefore all
the SOURCE pins should be connected to a copper area underneath
the TinySwitch-4 to act not only as a single point ground, but also as
a heat sink. As this area is connected to the quiet source node, this
area should be maximized for good heat sinking. Similarly for axial
output diodes, maximize the PCB area connected to the cathode.
Y Capacitor
The placement of the Y capacitor should be directly from the primary
input lter capacitor positive terminal to the common/ return terminal
of the transformer secondary. Such a placement will route high
magnitude common mode surge currents away from the TinySwitch-4
device. Note – if an input π (C, L, C) EMI lter is used then the
inductor in the lter should be placed between the negative terminals
of the input lter capacitors.
Optocoupler
Place the optocoupler physically close to the TinySwitch-4 to
minimizing the primary-side trace lengths. Keep the high current,
high-voltage drain and clamp traces away from the optocoupler to
prevent noise pick up.
Output Diode
For best performance, the area of the loop connecting the secondary
winding, the output diode and the output lter capacitor, should be
minimized. In addition, sufcient copper area should be provided at
the anode and cathode terminals of the diode for heat sinking. A
larger area is preferred at the quiet cathode terminal. A large anode
area can increase high frequency radiated EMI.
PC Board Leakage Currents
TinySwitch-4 is designed to optimize energy efciency across the
power range and particularly in standby/no-load conditions. Current
consumption has therefore been minimized to achieve this performance.
The ENABLE/UNDERVOLTAGE pin under-voltage feature for example
has a low threshold (~1 μA) to detect whether an undervoltage
resistor is present.
Parasitic leakage currents into the ENABLE/UNDERVOLTAGE pin are
normally well below this 1 μA threshold when PC board assembly is in
a well controlled production facility. However, high humidity conditions
together with board and/or package contamination, either from
no-clean ux or other contaminants, can reduce the surface resistivity
enough to allow parasitic currents >1 μA to ow into the ENABLE/
UNDERVOLTAGE pin. These currents can ow from higher voltage
exposed solder pads close to the ENABLE/UNDERVOLTAGE pin such
as the BYPASS/MULTI-FUNCTIONAL pin solder pad preventing
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the design from starting up. Designs that make use of the under-
voltage lockout feature by connecting a resistor from the high-voltage
rail to the ENABLE/UNDERVOLTAGE pin are not affected.
If the contamination levels in the PC board assembly facility are
unknown, the application is open frame or operates in a high pollution
degree environment and the design does not make use of the under-
voltage lockout feature, then an optional 390 kW resistor should be
added from ENABLE/UNDERVOLTAGE pin to SOURCE pin to ensure that
the parasitic leakage current into the ENABLE/UNDERVOLTAGE pin is
well below 1 μA.
Note that typical values for surface insulation resistance (SIR) where
no-clean ux has been applied according to the suppliers’ guidelines
are >>10 MW and do not cause this issue.
Quick Design Checklist
As with any power supply design, all TinySwitch-4 designs should be
veried on the bench to make sure that component specications are
not exceeded under worst case conditions. The following minimum
set of tests is strongly recommended:
Figure 17. Recommended Circuit Board Layout for TinySwitch-4 with Undervoltage Lock Out Resistor.
1. Maximum drain voltage – Verify that VDS does not exceed 675 V
at highest input voltage and peak (overload) output power. The
50 V margin to the 725 V BVDSS specication gives margin for
design variation.
2. Maximum drain current – At maximum ambient temperature,
maximum input voltage and peak output (overload) power, verify
drain current waveforms for any signs of transformer saturation
and excessive leading edge current spikes at start-up. Repeat
under steady-state conditions and verify that the leading edge
current spike event is below ILIMIT(MIN) at the end of the tLEB(MIN).
Under all conditions, the maximum drain current should be below
the specied absolute maximum ratings.
3. Thermal Check – At specied maximum output power, minimum
input voltage and maximum ambient temperature, verify that the
temperature specications are not exceeded for TinySwitch-4,
transformer, output diode, and output capacitors. Enough
thermal margin should be allowed for part-to-part variation of the
RDS(ON) of TinySwitch-4 as specied in the data sheet. Under
low-line, maximum power, a maximum TinySwitch-4 SOURCE pin
temperature of 110 °C is recommended to allow for these
variations.
TOP VIEW
PI-6651-021015
Opto-
coupler
+
-
High-Voltage
+- DC
OUT
Input Filter Capacitor
*CHF/CBP
Output
Rectifier
CBP
Safety Spacing
T
r
a
n
s
f
o
r
m
e
r
PRI
SEC
BIAS
D
Output Filter
Capacitor
*CHF is a 0.1 µF high frequency noise bypass capacitor (the high frequency 0.1 µF capacitor eliminates need for CBP if ILIMIT selection requires 0.1 µF).
Maximize hatched copper
areas ( ) for optimum
heat sinking
BP/M
EN/
UV
Y1-
Capacitor
S
S
S
S
PRI
BIAS
TinySwitch-4
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Absolute Maximum Ratings1,4
DRAIN Voltage .........................................................-0.3 V to 725 V
DRAIN Peak Current: TNY284 ...............................400 (750) mA2
TNY285 ............................. 560 (1050) mA2
TNY286 .............................720 (1350) mA2
TNY287 .............................880 (1650) mA2
TNY288 ........................... 1040 (1950) mA2
TNY289 ........................... 1200 (2250) mA2
TNY290 ........................... 1360 (2550) mA2
EN/UV Voltage ............................................................ -0.3 V to 9 V
EN/UV Current ....................................................................100 mA
BP/M Voltage .............................................................. -0.3 V to 9 V
Storage Temperature ..............................................-65 °C to 150 °C
Maximum Junction Temperature3 ..............................-40 °C to 150 °C
Lead Temperature4 ................................................................260 °C
Notes:
1. All voltages referenced to SOURCE, TA = 25 °C.
2. The higher peak DRAIN current is allowed while the DRAIN voltage
is simultaneously less than 400 V.
3. Normally limited by internal circuitry.
4. 1/16 in. from case for 5 seconds.
5. Maximum ratings specied may be applied one at a time, without
causing permanent damage to the product. Exposure to Absolute
Rating conditions for extended periods of time may affect product
reliability.
Thermal Resistance
Thermal Resistance: P Package:
(qJA) ...................................... 70 °C/W2; 60 °C/W3
(qJC)1 ......................................................11 °C/W
D Package:
(qJA) .................................... 100 °C/W2; 80 °C/W3
(qJC)1 ......................................................30 °C/W
K Package:
(qJA) ............................ .......... 45 °C/W2; 38 °C/W3
(qJC)4 ......................................................... 2 °C/W
Notes:
1. Measured on the SOURCE pin close to the plastic interface.
2. Soldered to 0.36 sq. in. (232 mm2), 2 oz. (610 g/m2) copper clad.
3. Soldered to 1 sq. in. (645 mm2), 2 oz. (610 g/m2) copper clad.
4. The case temperature is measured at the bottom-side exposed pad.
Parameter Symbol
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 18
(Unless Otherwise Specied)
Min Typ Max Units
Control Functions
Output Frequency
in Standard Mode fOSC
TJ = 25 °C
See Figure 5
Average 124 132 140
kHz
Peak-to-peak Jitter 8
Maximum Duty Cycle DCMAX S1 Open 62 67 %
EN/UV Pin Upper
Turnoff Threshold
Current
IDIS -150 -122 -90 μA
EN/UV Pin Voltage VEN
IEN/UV = 25 μA1.8 2.2 2.6
V
IEN/UV = -25 μA0.8 1.2 1.6
DRAIN Supply Current
IS1
EN/UV Current > IDIS
(MOSFET Not Switching) See Note A 330 μA
IS2
EN/UV Open
(MOSFET
Switching at fOSC)
See Note B
TNY284 360 400
μA
TNY285 410 440
TNY286 430 470
TNY287 510 550
TNY288 615 650
TNY289 715 800
TNY290 875 930
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Parameter Symbol
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 18
(Unless Otherwise Specied)
Min Typ Max Units
Control Functions (cont.)
BP/M Pin
Charge Current
ICH1
VBP/M = 0 V, TJ = 25 °C
See Note C, D -6.5 -4.5 -2.5
mA
ICH2
VBP/M = 4 V, TJ = 25 °C
See Note C, D -4.7 -2.8 -1.4
BP/M Pin Voltage VBP/M See Note C 5.6 5.85 6.3 V
BP/M Pin
Voltage Hysteresis VBP/MH 0.80 0.95 1.20 V
BP/M Pin
Shunt Voltage VSHUNT IBP = 2 mA 6.0 6.4 6.85 V
EN/UV Pin Line Under-
voltage Threshold ILUV TJ = 25 °C 23.75 25 26.25 μA
EN/UV Pin – Reset
Hysteresis (Following
Latch Off with BP/M Pin
Current >ISD)
TJ = 25 °C
See Note G 3 5 8 μA
Circuit Protection
Standard Current Limit
(BP/M Capacitor =
0.1 μF) See Note D
ILIMIT
di/dt = 50 mA/μs
TJ = 25 °C
See Note E
TNY284P/D/K 233 250 267
mA
di/dt = 55 mA/μs
TJ = 25 °C
See Note E
TNY285P/D/K 256 275 294
di/dt = 70 mA/μs
TJ = 25 °C
See Note E
TNY286P/D/K 326 350 374
di/dt = 90 mA/μs
TJ = 25 °C
See Note E
TNY287P/D/K 419 450 481
di/dt = 110 mA/μs
TJ = 25 °C
See Note E
TNY288P/D/K 512 550 588
di/dt = 130 mA/μs
TJ = 25 °C
See Note E
TNY289P/K 605 650 695
di/dt = 150 mA/μs
TJ = 25 °C
See Note E
TNY290P/K 698 750 802
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Parameter Symbol
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 18
(Unless Otherwise Specied)
Min Typ Max Units
Circuit Protection (cont.)
Reduced Current Limit
(BP/M Capacitor =
1 μF) See Note D
ILIMI Tre d
di/dt = 42 mA/μs
TJ = 25 °C
See Note E
TNY284P/D/K 196 210 233
mA
di/dt = 50 mA/μs
TJ = 25 °C
See Note E
TNY285P/D/K 233 250 277
di/dt = 55 mA/μs
TJ = 25 °C
See Notes E
TNY286P/D/K 256 275 305
di/dt = 70 mA/μs
TJ = 25 °C
See Notes E
TNY287P/D/K 326 350 388
di/dt = 90 mA/μs
TJ = 25 °C
See Notes E
TNY288P/D/K 419 450 499
di/dt = 110 mA/μs
TJ = 25 °C
See Notes E
TNY289P/K 512 550 610
di/dt = 130 mA/μs
TJ = 25 °C
See Notes E
TNY290P/K 605 650 721
Increased Current Limit
(BP/M Capacitor =
10 μF) See Note D
ILIMITinc
di/dt = 42 mA/μs
TJ = 25 °C
See Notes E, F
TNY284P/D/K 196 210 233
mA
di/dt = 70 mA/μs
TJ = 25 °C
See Notes E
TNY285P/D/K 326 350 388
di/dt = 90 mA/μs
TJ = 25 °C
See Notes E
TNY286P/D/K 419 450 499
di/dt = 110 mA/μs
TJ = 25 °C
See Notes E
TNY287P/D/K 512 550 610
di/dt = 130 mA/μs
TJ = 25 °C
See Notes E
TNY288P/D/K 605 650 721
di/dt = 150 mA/μs
TJ = 25 °C
See Notes E
TNY289P/K 698 750 833
di/dt = 170 mA/μs
TJ = 25 °C
See Notes E
TNY290P/K 791 850 943
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Parameter Symbol
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 18
(Unless Otherwise Specied)
Min Typ Max Units
Circuit Protection (cont.)
Power Coefcient I2f
Standard Current
Limit, I2f = ILIMIT(TYP)
2
× fOSC(TYP)
TJ = 25 °C
TNY284-290 0.9 ×
I2fI2f1.12 ×
I2f
A2Hz
Reduced Current Limit,
I2f = ILIMI Tre d(TYP)
2
× fOSC(TYP)
TJ = 25 °C
TNY284-290 0.9 ×
I2fI2f1.16 ×
I2f
Increased Current Limit,
I2f = ILIMITinc(TYP)
2
× fOSC(TYP)
TJ = 25 °C
TNY284-290 0.9 ×
I2fI2f1.16 ×
I2f
Initial Current Limit IINIT
See Figure 21
TJ = 25 °C,
See Note G
TNY284-287 0.77 ×
ILIMIT(MIN)
mA
See Figure 22
TJ = 25 °C,
See Note G
TNY288-290 0.725 ×
ILIMIT(MIN)
Leading Edge
Blanking Time tLEB
TJ = 25 °C
See Note G 170 215 ns
Current Limit Delay tILD
TJ = 25 °C
See Note G, H 150 ns
Thermal Shutdown
Temperature TSD 135 142 150 °C
Thermal Shutdown
Hysteresis TSDH 75 °C
BP/M Pin Shutdown
Threshold Current ISD 46.5 9mA
BP/M Pin Power-Up
Reset Threshold Voltage VBP/M(RESET) 1.6 3.0 3.6 V
Output
ON-State
Resistance RDS(ON)
TNY284
ID = 25 mA
TJ = 25 °C 28 32
W
TJ = 100 °C 42 48
TNY285
ID = 28 mA
TJ = 25 °C 19 22
TJ = 100 °C 29 33
TNY286
ID = 35 mA
TJ = 25 °C 14 16
TJ = 100 °C 21 24
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Parameter Symbol
Conditions
SOURCE = 0 V; TJ = -40 to 125 °C
See Figure 18
(Unless Otherwise Specied)
Min Typ Max Units
Output (cont.)
ON-State
Resistance RDS(ON)
TNY287
ID = 45 mA
TJ = 25 °C 7.8 9.0
W
TJ = 100 °C 11.7 13.5
TNY288
ID = 55 mA
TJ = 25 °C 5.2 6.0
TJ = 100 °C 7.8 9.0
TNY289
ID = 65 mA
TJ = 25 °C 3.9 4.5
TJ = 100 °C 5.8 6.7
TNY290
ID = 75 mA
TJ = 25 °C 2.6 3.0
TJ = 100 °C 3.9 4.5
OFF-State Drain
Leakage Current
IDSS1
VBP/M = 6.2 V
VEN/UV = 0 V
VDS = 560 V
TJ = 125 °C
See Note I
TNY284-286 50
μATNY287-288 100
TNY289-290 200
IDSS2
VBP/M = 6.2 V
VEN/UV = 0 V
VDS = 375 V,
TJ = 50 °C
See Note G, I
15
Breakdown Voltage BVDSS
VBP = 6.2 V, VEN/UV = 0 V,
See Note J, TJ = 25 °C 725 V
DRAIN Supply Voltage 50 V
Auto-Restart
ON-Time at fOSC
tAR
TJ = 25 °C
See Note K 64 ms
Auto-Restart
Duty Cycle DCAR TJ = 25 °C 3 %
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NOTES:
A. IS1 is an accurate estimate of device controller current consumption at no-load, since operating frequency is so low under these conditions.
Total device consumption at no-load is the sum of IS1 and IDSS2.
B. Since the output MOSFET is switching, it is difcult to isolate the switching current from the supply current at the DRAIN. An alternative is
to measure the BYPASS/MULTI-FUNCTIONAL pin current at 6.1 V.
C. BYPASS/MULTI-FUNCTIONAL pin is not intended for sourcing supply current to external circuitry.
D. To ensure correct current limit it is recommended that nominal 0.1 μF / 1 μF / 10 μF capacitors are used. In addition, the BP/M capacitor
value tolerance should be equal or better than indicated below across the ambient temperature range of the target application. The
minimum and maximum capacitor values are guaranteed by characterization.
E. For current limit at other di/dt values, refer to Figure 25.
F. TNY284 does not have an increased current limit value, but with a 10 μF BYPASS/MULTI-FUNCTIONAL pin capacitor the current limit is the
same as with a 1 μF BYPASS/MULTI-FUNCTIONAL pin capacitor (reduced current limit value).
G. This parameter is derived from characterization.
H. This parameter is derived from the change in current limit measured at 1X and 4X of the di/dt shown in the ILIMIT specication.
I. IDSS1 is the worst-case OFF-state leakage specication at 80% of BVDSS and maximum operating junction temperature. IDSS2 is a typical
specication under worst-case application conditions (rectied 265 VAC) for no-load consumption calculations.
J. Breakdown voltage may be checked against minimum BVDSS specication by ramping the DRAIN pin voltage up to but not exceeding
minimum BVDSS.
K. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to frequency).
Nominal BP/M
Pin Cap Value
Tolerance Relative to Nominal
Capacitor Value
Min Max
0.1 μF-60% +10 0%
1 μF-50% +10 0%
10 μF-50% NA
Rev. D 08/16
18
TNY284-290
www.power.com
PI-4079-021015
0.1 µF
10 V
50 V
470 Ω
5 ΩS2
470 Ω
NOTE: This test circuit is not applicable for current limit or output characteristic measurements.
S D
EN/UV
S
SBP/M
S
150 V
S1
2 MΩ
DRAIN
VOLTAGE
HV
0 V
PI-2048-021015
10%
90% 90%
t1
t2
D =
t1
t2
PI-2364-021015
EN/UV
tP
tEN/UV
DCMAX
tP = 1
fOSC
VDRAIN
(internal signal)
Figure 18. General Test Circuit.
Figure 19. Duty Cycle Measurement. Figure 20. Output Enable Timing.
TON (µs)
Current Limit (Normalized)
1.10
1.00
0.95
1.05
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0 1 2 3 4 5 6
PI-6803-021015
Typical
Minimum
Maximum
TJ = 25 °C
Figure 21. Current Limit vs. TON
for TNY284~287. Figure 22. Current Limit vs. TON
for TNY288~290.
TON (µs)
Current Limit (Normalized)
1.10
1.00
0.95
1.05
0.90
0.85
0.80
0.75
0.70
0.65
0.60
0 1 2 3 4 5 6
PI-6804-021015
Typical
Minimum
Maximum
TJ = 25 °C
Typical Performance Characteristics
Rev. D 08/16
19
TNY284-290
www.power.com
Figure 24. Standard Current Limit vs. Temperature.
Figure 26. Output Characteristic.
Figure 27. C
OSS
vs. Drain Voltage.
Figure 25. Standard Current Limit vs. di/dt.
Figure 28. Drain Capacitance Power.
Drain Voltage (V)
Drain Capacitance (pF)
PI-6771-021015
1 100 200 300 400 500 600
1
10
100
1000
TNY284 1.0
TNY285 1.5
TNY286 2.0
TNY287 3.5
TNY288 5.6
TNY289 7.9
TNY290 11.2
Scaling Factors:
Drain Voltage (V)
Power (mW)
PI-6772-021015
0 100 200 300 400 500 600
0
10
20
30
40
TNY284 1.0
TNY285 1.5
TNY286 2.0
TNY287 3.5
TNY288 5.6
TNY289 7.9
TNY290 11.2
Scaling Factors:
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
1 2 3 4
Normalized di/dt
PI-6785-021015
Normalized Current Limit
(See Figure 21)
TNY284 50 mA/µs
TNY285 55 mA/µs
TNY286 70 mA/µs
TNY287 90 mA/µs
TNY288 110 mA/µs
TNY289 130 mA/µs
TNY290 150 mA/µs
Normalized
di/dt = 1
Note: For the
normalized current
limit value, use the
typical current limit
specified for the
appropriate BP/M
capacitor.
DRAIN Voltage (V)
300
250
200
100
50
150
0
0 2 4 6 8 10
TCASE=25 °C
TCASE=100 °C
PI-6786-021015
TNY284 1.0
TNY285 1.5
TNY286 2.0
TNY287 3.5
TNY288 5.6
TNY289 7.9
TNY290 11.2
Scaling Factors:
Temperature (C)
Standard Current Limit
(Normalized to 25
°C)
1.05
1.00
95
90
85
80
-40 0-20 20 40 60 80 100 120
PI-6787-021015
Figure 23. Breakdown vs. Temperature.
1.1
1.0
0.9
-50 -25 0 25 50 75 100 125 150
Junction Temperature (°C)
Breakdown Voltage
(Normalized to 25
°C)
PI-2213-020515
Typical Performance Characteristics (cont.)
Rev. D 08/16
20
TNY284-290
www.power.com
1.2
1.0
0.8
0.6
0.4
0.2
0
-50 -25 0 25 50 75 100 125
Junction Temperature (°C)
PI-4281-021015
Under-Voltage Threshold
(Normalized to 25
°C)
Figure 29. Undervoltage Threshold vs. Temperature.
Typical Performance Characteristics (cont.)
Rev. D 08/16
21
TNY284-290
www.power.com
Notes:
1. Package dimensions conform to JEDEC specification
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)
package with .300 inch row spacing.
2. Controlling dimensions are inches. Millimeter sizes are
shown in parentheses.
3. Dimensions shown do not include mold flash or other
protrusions. Mold flash or protrusions shall not exceed
.006 (.15) on any side.
4. Pin locations start with Pin 1, and continue counter-clock-
wise to Pin 8 when viewed from the top. The notch and/or
dimple are aids in locating Pin 1. Pin 3 is omitted.
5. Minimum metal to metal spacing at the package body for
the omitted lead location is .137 inch (3.48 mm).
6. Lead width measured at package body.
7. Lead spacing measured with the leads constrained to be
perpendicular to plane T.
.008 (.20)
.015 (.38)
.300 (7.62) BSC
(NOTE 7)
.300 (7.62)
.390 (9.91)
.356 (9.05)
.387 (9.83)
.240 (6.10)
.260 (6.60)
.125 (3.18)
.145 (3.68)
.057 (1.45)
.068 (1.73)
.118 (3.00)
.140 (3.56)
.015 (.38)
MINIMUM
.048 (1.22)
.053 (1.35)
.100 (2.54) BSC
.014 (.36)
.022 (.56)
-E-
Pin 1
SEATING
PLANE
-D-
-T-
P08C
PDIP-8C (P Package)
PI-3933-081716
D S .004 (.10)
⊕
T E D S .010 (.25) M
⊕
(NOTE 6)
.137 (3.48)
MINIMUM
Rev. D 08/16
22
TNY284-290
www.power.com
PI-4526-012315
D07C
3.90 (0.154) BSC
Notes:
1. JEDEC reference: MS-012.
2. Package outline exclusive of mold flash and metal burr.
3. Package outline inclusive of plating thickness.
4. Datums A and B to be determined at datum plane H.
5. Controlling dimensions are in millimeters. Inch dimensions
are shown in parenthesis. Angles in degrees.
0.20 (0.008) C
2X
14
5
8
26.00 (0.236) BSC
D
4
A
4.90 (0.193) BSC
2
0.10 (0.004) C
2X
D
0.10 (0.004) C2X
A-B
1.27 (0.050) BSC
7X 0.31 - 0.51 (0.012 - 0.020)
0.25 (0.010) MC A-B D
0.25 (0.010)
0.10 (0.004)
(0.049 - 0.065)
1.25 - 1.65
1.75 (0.069)
1.35 (0.053)
0.10 (0.004) C
7X
C
H
o
1.27 (0.050)
0.40 (0.016)
GAUGE
PLANE
0 - 8
1.04 (0.041) REF 0.25 (0.010)
BSC
SEATING
PLANE
0.25 (0.010)
0.17 (0.007)
DETAIL A
DETAIL A
C
SEATING PLANE
Pin 1 ID
B
4
+
++
4.90 (0.193)
1.27 (0.050) 0.60 (0.024)
2.00 (0.079)
Reference
Solder Pad
Dimensions
+
SO-8C (D Package)
Rev. D 08/16
23
TNY284-290
www.power.com
SIDE VIEW END VIEW
11×
2
7
7
PI-5748a-020515
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimensions noted are determined at the outermost
extremes of the plastic body exclusive of mold flash,
tie bar burrs, gate burrs, and interlead flash, but
including any mismatch between the top and bottom of
the plastic body. Maximum mold protrusion is 0.007
[0.18] per side.
3. Dimensions noted are inclusive of plating thickness.
4. Does not include interlead flash or protrusions.
5. Controlling dimensions in inches [mm].
6. Datums A and B to be determined at Datum H.
7. Exposed pad is nominally located at the centerline of
Datums A and B. “Max” dimensions noted include both
size and positional tolerances.
eSOP-12B (K Package)
B
C
C
H
TOP VIEW BOTTOM VIEW
Pin #1 I.D.
(Laser Marked)
0.023 [0.58]
0.018 [0.46]
0.006 [0.15]
0.000 [0.00]
0.098 [2.49]
0.086 [2.18]
0.092 [2.34]
0.086 [2.18]
0.032 [0.80]
0.029 [0.72]
Seating
Plane
Detail A
Seating plane to
package bottom
standoff
0.034 [0.85]
0.026 [0.65]
0.049 [1.23]
0.046 [1.16]
3 4
0.460 [11.68]
0.400 [10.16]
0.070 [1.78]
0.306 [7.77]
Ref.
2
0.350 [8.89]
0.010 [0.25]
Ref.
Gauge
Plane
Seating Plane
0.055 [1.40] Ref.
0.010 [0.25]
0.059 [1.50]
Ref, Typ 0.225 [5.72]
Max.
0.019 [0.48]
Ref.
0.022 [0.56]
Ref.
0.020 [0.51]
Ref.
0.028 [0.71]
Ref.
0.325 [8.26]
Max.
0.356 [9.04]
Ref.
0.059 [1.50]
Ref, Typ
0.120 [3.05] Ref
0.010 (0.25) M C A B
11×
0.016 [0.41]
0.011 [0.28]
3
DETAIL A (Scale = 9X)
0.008 [0.20] C
2X, 5/6 Lead Tips
0.004 [0.10] C
0.004 [0.10] C A 2X
0.004 [0.10] C B
0 -
° 8°
123 4 6 6 1
7 12
2X
0.217 [5.51]
0.321 [8.15]
0.429 [10.90]
0.028 [0.71]
0.067 [1.70] Land Pattern
Dimensions
11
12
10
9
8
7
2
1
3
4
6
Rev. D 08/16
24
TNY284-290
www.power.com
Part Ordering Information
• TinySwitch Product Family
• TNY-4 Series Number
• Package Identier
P Plastic DIP-8C
D SO-8C
K eSOP-12B
• Lead Finish
G RoHS compliant and Halogen Free
• Tape & Reel and Other Options
Blank Standard Conguration
TL Tape & Reel, 1000 pcs min./mult.
TNY 288 P G - TL
Rev. D 08/16
25
TNY284-290
www.power.com
Notes
For the latest updates, visit our website: www.power.com
Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations
does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY
HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY,
FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS.
Patent Information
The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one
or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of
Power Integrations patents may be found at www.power.com. Power Integrations grants its customers a license under certain patent rights as set
forth at http://www.power.com/ip.htm.
Life Support Policy
POWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:
1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose
failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in signicant injury or
death to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or system, or to affect its safety or effectiveness.
The PI logo, TOPSwitch, TinySwitch, SENZero, SCALE-iDriver, Qspeed, PeakSwitch, LYTSwitch, LinkZero, LinkSwitch, InnoSwitch, HiperTFS,
HiperPFS, HiperLCS, DPA-Switch, CAPZero, Clampless, EcoSmart, E-Shield, Filterfuse, FluxLink, StakFET, PI Expert and PI FACTS are trademarks of
Power Integrations, Inc. Other trademarks are property of their respective companies. ©2016, Power Integrations, Inc.
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Power Integrations Worldwide Sales Support Locations
Revision Notes Date
A Initial Release. 09/12
B Added TNY288DG package. Updated TNY287K and TNY288D Peak or Open Frame values in Table 1. 08/13
C Corrected IINIT parameter on page 15. Updated with new Brand Style. 02/15
CMinor correction made to Functional Block Diagram. 07/15
D Updated PDIP-8C (P Package) per PCN-16232. 08/16
Mouser Electronics
Authorized Distributor
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TNY286DG-TL TNY288DG TNY288DG-TL TNY285KG-TL TNY287KG-TL TNY289KG-TL TNY285DG-TL
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